KR200409072Y1 - cooling apparatus of suscepter for semiconductor and liquid circuit displayLCD panel manufacturing device - Google Patents

cooling apparatus of suscepter for semiconductor and liquid circuit displayLCD panel manufacturing device Download PDF

Info

Publication number
KR200409072Y1
KR200409072Y1 KR2020050032242U KR20050032242U KR200409072Y1 KR 200409072 Y1 KR200409072 Y1 KR 200409072Y1 KR 2020050032242 U KR2020050032242 U KR 2020050032242U KR 20050032242 U KR20050032242 U KR 20050032242U KR 200409072 Y1 KR200409072 Y1 KR 200409072Y1
Authority
KR
South Korea
Prior art keywords
cooling
susceptor
cooling water
inlet
semiconductor
Prior art date
Application number
KR2020050032242U
Other languages
Korean (ko)
Inventor
노기래
Original Assignee
노기래
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 노기래 filed Critical 노기래
Priority to KR2020050032242U priority Critical patent/KR200409072Y1/en
Application granted granted Critical
Publication of KR200409072Y1 publication Critical patent/KR200409072Y1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 고안은 진공챔버내에 제공되어 웨이퍼(wafer) 또는 유리기판(glass) 등의 피처리물을 고정하는 서셉터(susceptor)의 냉각을 효과적으로 이룰 수 있도록 한 냉각장치에 관한 것으로서, 서셉터본체의 내부에 히터가 내장되고, 본체의 표면에 피처리물이 고정되는 서셉터를 구성함에 있어서, 상기 서셉터 본체내를 순환하며 입구와 출구를 갖는 냉각유로와, 냉각유로의 입구와 연결되며, 상기 출구로 배출되는 냉각수를 회수하는 냉각수탱크와, 냉각수탱크내의 냉각수를 선택적으로 펌핑하여 입구를 통해 공급하는 순환펌프와, 순환펌프를 제어하는 제어부를 포함하는 서셉터의 냉각장치를 제공하여, 냉각지연으로 인한 설비의 정지시간을 최소화할 수 있게 되는 것은 물론 냉각작용을 통해 적정온도를 유지하여 챔버내부의 이상고온을 미연에 방지하므로 부품의 열화 및 웨이퍼 등의 피처리물 손상을 방지할 수 있는 효과를 갖는다. The present invention relates to a cooling device provided in a vacuum chamber to effectively cool a susceptor for fixing a workpiece such as a wafer or a glass substrate, and the inside of the susceptor body. In constructing a susceptor in which a heater is built in and a workpiece is fixed on a surface of the main body, a cooling passage having an inlet and an outlet and circulating in the susceptor body is connected to an inlet of the cooling passage, It provides a cooling device of the susceptor including a cooling water tank for recovering the cooling water discharged to the cooling water, a circulation pump for selectively pumping the cooling water in the cooling water tank and supplying it through the inlet, and a control unit for controlling the circulation pump. In addition to minimizing the downtime of the equipment, the cooling system maintains the proper temperature and prevents abnormal high temperatures inside the chamber. It has an effect of capable of preventing an object to be treated, such as degradation and damage the wafer.

반도체, 액정패널, 진공챔버, 서셉터, 냉각 Semiconductor, liquid crystal panel, vacuum chamber, susceptor, cooling

Description

반도체 및 액정패널 제조설비용 서셉터의 냉각장치{cooling apparatus of suscepter for semiconductor and liquid circuit display(LCD) panel manufacturing device}Cooling apparatus of suscepter for semiconductor and liquid circuit display (LCD) panel manufacturing device

도 1은 일반적인 반도체 설비의 진공챔버의 구성을 보인 개략 단면도1 is a schematic cross-sectional view showing the configuration of a vacuum chamber of a general semiconductor equipment

도 2는 본 고안에 따른 서셉터의 바람직한 실시예의 구성을 보인 개략도Figure 2 is a schematic diagram showing the configuration of a preferred embodiment of the susceptor according to the present invention

도 3은 본 고안에 따른 서셉터의 바람직한 실시예의 구성을 보인 저면도Figure 3 is a bottom view showing the configuration of a preferred embodiment of the susceptor according to the present invention

<도면의 주요부분에 대한 부호의 간단한 설명><Brief description of symbols for the main parts of the drawings>

10: 진공챔버 20: 서셉터10: vacuum chamber 20: susceptor

22: 히터 50: 냉각유로22: heater 50: cooling flow path

52: 입구 54: 출구52: inlet 54: outlet

58: 냉각수탱크 60: 순환펌프58: cooling water tank 60: circulation pump

62: 제어부 Ｗ: 피처리물62: control unit iv: workpiece

본 고안은 반도체 또는 액정패널 제조설비용 서셉터의 냉각장치에 관한 것으로서, 더욱 상세하게는 진공챔버내에 제공되어 웨이퍼(wafer) 또는 유리기판(glass) 등의 피처리물을 고정하는 서셉터(susceptor)의 냉각을 효과적으로 이룰 수 있도록 한 냉각장치에 관한 것이다.The present invention relates to a cooling device for a susceptor for a semiconductor or liquid crystal panel manufacturing facility, and more particularly, a susceptor provided in a vacuum chamber to fix an object such as a wafer or a glass substrate. The present invention relates to a cooling device that can effectively achieve cooling.

일반적으로 웨이퍼는 집적회로(IC)를 만들기 위한 반도체 물질의 단결정을 성장시킨 기둥 모양의 인곳(Ingot)을 얇게 잘라서 원판 모양으로 만든 것으로서, 표면에 증착, 식각등 여러 가지 공정의 표면처리를 수행하게 된다. In general, a wafer is a disk-shaped ingot formed by thinly cutting a column-shaped ingot in which a single crystal of a semiconductor material for making an integrated circuit (IC) is formed. The wafer is subjected to surface treatment of various processes such as deposition and etching on the surface. do.

또한, 액정패널은 액정표시장치의 중요한 요소로서, 전기적 신호를 통해 화상을 디스플레이 한다. 액정패널 또한, 간단히 유리등의 투명기판 일면에 각각 전계생성전극을 포함하는 여러 가지 전기적 소자가 설치된 상부기판과 하부기판을 구비한 후, 이들 전극이 서로 마주보도록 배치하여 그 사이에 액정을 충진한 구성을 가지고 있다. 이때 상, 하부기판 각각에 포함되는 전계생성전극 및 여러 가지 전기적 소자들은 통상 투명기판 상면으로 박막을 증착한 후 이를 식각하여 패터닝(patterning)하는 과정을 수 차례 반복하여 구현된다.In addition, the liquid crystal panel is an important element of the liquid crystal display, and displays an image through an electrical signal. The liquid crystal panel also includes an upper substrate and a lower substrate on which one surface of a transparent substrate, such as glass, is equipped with various electrical elements, each of which includes an electric field generating electrode, and is arranged so that the electrodes face each other to fill the liquid crystal therebetween. Has a configuration. In this case, the field generating electrode and various electrical elements included in each of the upper and lower substrates are repeatedly formed by repeatedly depositing a thin film on the upper surface of the transparent substrate and then etching and patterning the thin film.

이와 같은 웨이퍼나 유리기판상에 박막의 증착이나 식각 등의 공정은 주로 진공 챔버(chamber)에서 진행되는 것이 일반적이다.Such a process of depositing or etching a thin film on a wafer or a glass substrate is generally performed in a vacuum chamber.

도 1에는 종래의 진공 챔버의 일례를 도시하고 있다. 챔버(10)의 내부에 피처리물(Ｗ)이 안착 고정되는 서셉터(20)가 배치되어 있다. 서셉터(20)의 내부에는 히터(22)가 내장되어 서셉터(20)를 전체적으로 고르게 가열이 이루어지도록 구성된다. 한편, 피처리물(Ｗ)은 섀도우 프레임(24)에 의해 서셉터(20)상에 견고히 지지된다. 서셉터의 주변에는 피처리물을 상승시키는 복수의 리프트핀(21)이 설치된다. 진공챔버(10)의 상부에는 처리가스를 공급하는 가스공급수단(30) 및 가스를 확산시키는 디퓨져(40)가 설치된다.　1 shows an example of a conventional vacuum chamber. The susceptor 20 in which the to-be-processed object is seated and fixed in the chamber 10 is arrange | positioned. The heater 22 is built in the susceptor 20 so that the entire susceptor 20 is heated evenly. On the other hand, the object to be processed is firmly supported on the susceptor 20 by the shadow frame 24. In the vicinity of the susceptor, a plurality of lift pins 21 for raising the workpiece are provided. The upper part of the vacuum chamber 10 is provided with a gas supply means 30 for supplying a processing gas and a diffuser 40 for diffusing the gas.

그러나 상기와 같은 종래와 같은 구성을 갖는 진공챔버는 서셉터(20)의 열로 인해 내부 부품의 열화시 부품의 교환시간이 지연되는 문제를 갖고 있었다. However, the vacuum chamber having the conventional configuration as described above has a problem that the replacement time of the component is delayed when the internal component deteriorates due to the heat of the susceptor 20.

진공챔버의 내부는 많은 부품들로 구성되어 있는바 히터의 지속적인 가열로 인해 이들 부품이 열화가 진행된다. 따라서 주기적으로 새로운 부품으로의 교체작업이 요구되는데, 이때 교환작업은 챔버내부가 충분히 냉각될 때까지 기다려야만 작업이 가능한 실정이었다. 이는 챔버내부가 히터의 열로 인해 고온상태를 유지하기 때문이다. 그러나 종래에는 통상 자연냉각을 이루게 되므로 냉각에 소요되는 시간이 지연되고 그로인해 설비의 가동시간이 줄어들게 되므로 이는 생산성이 저하되는 요인으로 작용하고 있었다. The interior of the vacuum chamber is made up of many parts, and these parts deteriorate due to the continuous heating of the heater. Therefore, periodic replacement of new parts is required. At this time, the replacement operation is only possible until the chamber is sufficiently cooled. This is because the inside of the chamber maintains a high temperature due to the heat of the heater. However, in the past, the cooling time is usually delayed, and thus the operating time of the equipment is reduced, thereby reducing the productivity.

또한, 종래의 챔버구조는 챔버내부에 이상고온이 발생하게 되면 히터를 정지시키는 것 이외에 이에 대처할 만한 마땅한 수단이 제공되어 있지 않으므로 고온으로 인한 부품의 열화가 빠르게 진행되는 것은 물론 피처리물의 손상을 초래하는 문제가 수반되고 있었다. In addition, the conventional chamber structure does not provide a proper means to cope with the stop of the heater when the abnormal high temperature occurs inside the chamber, so that deterioration of the components due to high temperature proceeds quickly and damages the workpiece. It was accompanied by problem.

이에 본 고안은 상기와 같은 제반 문제점을 감안하여 안출된 것으로서, 그 목적은 서셉터의 냉각을 신속히 이루어지도록 하여 부품교환작업을 신속히 이루도록 하여 가동률를 높이고 생산성을 향상시킬 수 있는 서셉터의 냉각장치를 제공함에 있다,The present invention has been made in view of the above-mentioned problems, the purpose is to provide a cooling device of the susceptor to increase the operation rate and improve the productivity by making the replacement of the work quickly by the cooling of the susceptor quickly made. Is in,

본 고안의 다른 목적은 챔버내부의 이상고온을 미연에 방지하여 부품열화를 최소화 할 수 있는 서셉터의 냉각장치를 제공함에 있다.Another object of the present invention is to provide a susceptor cooling device capable of minimizing component degradation by preventing abnormal high temperatures in the chamber.

이러한 본 고안의 목적은 서셉터본체의 내부에 히터가 내장되고, 본체의 표면에 피처리물이 고정되는 서셉터를 구성함에 있어서, 상기 서셉터 본체내를 순환하며 입구와 출구를 갖는 냉각유로와, 냉각유로의 입구와 연결되며, 상기 출구로 배출되는 냉각수를 회수하는 냉각수탱크와, 냉각수탱크내의 냉각수를 선택적으로 펌핑하여 입구를 통해 공급하는 순환펌프와, 순환펌프를 제어하는 제어부를 포함하는 서셉터의 냉각장치에 의해 달성될 수 있다.The purpose of the present invention is to provide a susceptor in which a heater is built in the susceptor body and a workpiece is fixed to the surface of the main body, the cooling passage having an inlet and an outlet circulating in the susceptor body and And a cooling water tank connected to an inlet of the cooling flow path, a cooling water tank for recovering the cooling water discharged to the outlet, a circulation pump for selectively pumping the cooling water in the cooling water tank and supplying it through the inlet, and a control unit controlling the circulation pump. It can be achieved by the cooling device of the acceptor.

상기 냉각유로는 히터와 인접하여 나란하게 배치되는 것이 바람직하다.The cooling passage is preferably arranged side by side adjacent to the heater.

이하 본 고안의 바람직한 실시예를 첨부된 도면을 참고하여 보다 구체적으로 살펴보면 다음과 같다.Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 2 및 도 3에는 본 고안의 바람직한 실시예로서, 도 2는 본 고안에 따른 단면도이고, 도 3은 서셉터를 하부에서 도시한 저면도이다. 종래와 동일한 구성에 대해서는 상세한 설명을 생략하고 부호는 동일하게 부여하여 설명한다.2 and 3 as a preferred embodiment of the present invention, Figure 2 is a cross-sectional view according to the present invention, Figure 3 is a bottom view showing the susceptor from the bottom. Detailed description of the same configurations as those in the prior art is omitted, and the same reference numerals are used to describe the same components.

이에 따르면, 본 고안은 서셉터(20)의 내부에 히터(22)가 내장되고, 그 표면에 피처리물(W)이 고정되어 있다. According to this, according to the present invention, the heater 22 is built in the susceptor 20, and the object W is fixed to the surface thereof.

본 고안은 상기 서셉터(20)내에 냉각유로(50)가 형성되어 있다. 냉각유로(50)는 입구(52)와 출구(54)를 갖으며, 이들 출구와 입구는 인접하여 구성되는 것이 바람직 하다. In the present invention, the cooling passage 50 is formed in the susceptor 20. The cooling passage 50 has an inlet 52 and an outlet 54, and these outlets and inlets are preferably configured to be adjacent to each other.

챔버(10)의 외측에는 냉각유로(50)의 입구(52)와 연결되며, 출구(54)로 배출되는 냉각수를 회수하는 냉각수탱크(58)가 제공된다. 냉각수 탱크(58)는 통상의 냉각수의 냉각수단을 갖추는 것이 바람직하다. 즉, 응축기 또는 냉각팬 등을 예로 들을 수 있다. 냉각수탱크(58)와 입.출구(52)(54)의 연결수단은 유연성을 갖는 파이프(56)(57)를 이용하는 것이 바람직하다.The outer side of the chamber 10 is provided with a cooling water tank 58 connected to the inlet 52 of the cooling flow path 50 and recovering the cooling water discharged to the outlet 54. The cooling water tank 58 is preferably provided with cooling means for ordinary cooling water. That is, a condenser, a cooling fan, etc. are mentioned as an example. The connection means of the coolant tank 58 and the inlet and outlet ports 52 and 54 preferably uses pipes 56 and 57 having flexibility.

한편, 냉각수탱크(58)로부터 입구(52)로 연결되는 연결파이프(56)상에는 냉각수탱크(58)내의 냉각수를 선택적으로 펌핑하여 입구(52)를 통해 공급하는 순환펌프(60)가 설치되어 있다.On the other hand, on the connecting pipe 56 connected from the cooling water tank 58 to the inlet 52, a circulation pump 60 for selectively pumping the cooling water in the cooling water tank 58 and supplying it through the inlet 52 is provided. .

본 고안은 순환펌프(60)를 제어하는 제어부(62)를 포함한다. 제어부(62)는 작업자에 의해 선택제어되는 것으로서, 조정실(도시되지 않음)에 별도로 설치되는 것이 바람직하다. The present invention includes a control unit 62 for controlling the circulation pump (60). The control unit 62 is selectively controlled by an operator, and is preferably separately installed in an adjustment room (not shown).

본 고안에 따르면, 상기 냉각유로(50)는 히터(22)의 인접하여 나란하게 배치되는 것이 바람직하다. 히터의 인접부가 비교적 고온을 유지하므로 이렇게 하는 것이 냉각효율을 향상시키는 데에 효과적이다.According to the present invention, the cooling passage 50 is preferably arranged side by side adjacent to the heater 22. This is effective for improving the cooling efficiency since the adjacent part of the heater is kept relatively high.

이러한 구성을 갖는 본 고안은 부품 교환을 필요로 하는 경우에는 제어부(62)를 조작하여 순환펌프(60)를 구동시키게 되면 냉각수탱크(58)내의 냉각수가 입구(52)를 통해 유입되어 냉각유로(50)를 통해 회류하는 과정에서 서셉터(20)의 열을 회수하게 되고 이는 다시 출구(54)로 배출되어 냉각수 탱크로 배출되어진다. 회수된 냉각수는 냉각수탱크(58)를 거치는 과정에서 열을 방출하고 다시 냉각유로로 공급 순환 되며 냉각작용을 이루게 된다. 따라서 본 고안은 서셉터의 냉각을 촉진시키고 나아가 챔버의 냉각에 필요한 시간을 줄이므로 설비가동시간을 늘려 생산성을 향상시킬 수 있게 된다.In the present invention having such a configuration, when parts replacement is required, when the circulating pump 60 is operated by operating the control unit 62, the coolant in the coolant tank 58 is introduced through the inlet 52 to provide a coolant flow path ( In the process of recirculating through 50, the heat of the susceptor 20 is recovered, which is discharged to the outlet 54 and discharged to the cooling water tank. The recovered cooling water releases heat in the course of passing through the cooling water tank 58 and is circulated to the cooling flow path again to achieve a cooling operation. Therefore, the present invention accelerates the cooling of the susceptor and further reduces the time required for cooling the chamber, thereby increasing the equipment uptime, thereby improving productivity.

또한 본 고안은 챔버 내의 온도와 연계하여 제어부가 자동으로 작동되도록 함으로서 챔버의 이상고온의 방지와 함께 즉각적인 냉각이 가능하게 되므로 이상고온으로 인한 부품의 열화 및 피처리물의 손상을 미연에 방지할 수 있다. In addition, the present invention enables the controller to automatically operate in conjunction with the temperature in the chamber, thereby enabling immediate cooling along with the prevention of abnormal high temperatures of the chamber, thereby preventing deterioration of components and damage of the workpiece due to abnormal high temperatures. .

이상에서 설명한 본 고안에 따른 서셉터의 냉각장치의 실시예는 여기에 한정되지 않으며, 본 고안의 보호범위를 확장하지 않는 범위내에서 당업자에 의해 예상되는 단순한 설계의 변경 및 등가물의 치환 등이 고려되어야 한다. The embodiment of the susceptor cooling device according to the present invention described above is not limited thereto, and simple design changes and replacement of equivalents, which are expected by those skilled in the art, are not limited to the scope of the present invention. Should be.

이상에서 살펴본 바와 같이 본 고안에 따른 서셉터는 히터의 주위를 따라 냉각유로를 구성하고, 여기에 필요에 따라 냉매를 적절하게 회류시키므로써 서셉터를 신속하게 냉각시킬 수 있게 되므로 냉각지연으로 인한 설비의 정지시간을 최소화할 수 있게 되는 것은 물론 냉각작용을 통해 적정온도를 유지하여 챔버내부의 이상고온을 미연에 방지하므로 부품의 열화 및 웨이퍼 등의 피처리물 손상을 방지할 수 있는 효과를 갖는다. As described above, the susceptor according to the present invention constitutes a cooling passage along the circumference of the heater, and the susceptor can be quickly cooled by appropriately circulating the refrigerant as necessary, so that the susceptor can be quickly cooled. In addition to minimizing the down time of the cooling process, by maintaining the proper temperature through the cooling action to prevent the abnormal high temperature in the chamber in advance, it has the effect of preventing the deterioration of the components and damage of the workpiece.

Claims (2)

서셉터본체의 내부에 히터가 내장되고, 본체의 표면에 피처리물이 고정되는 서셉터를 구성함에 있어서, In constructing a susceptor in which a heater is built in the susceptor body and the object to be fixed is fixed to the surface of the main body, 상기 서셉터 본체내를 순환하며 입구와 출구를 갖는 냉각유로와,A cooling passage circulating in the susceptor body and having an inlet and an outlet; 냉각유로의 입구와 연결되며, 상기 출구로 배출되는 냉각수를 회수하는 냉각수탱크와,A cooling water tank connected to an inlet of a cooling channel and recovering cooling water discharged to the outlet; 냉각수탱크내의 냉각수를 선택적으로 펌핑하여 입구를 통해 공급하는 순환펌프와,A circulation pump for selectively pumping the coolant in the coolant tank and supplying it through the inlet; 순환펌프를 제어하는 제어부를 포함하는 것을 특징으로 하는 반도체 및 액정패널 제조설비용 서셉터의 냉각장치.Cooling apparatus for a susceptor for semiconductor and liquid crystal panel manufacturing equipment comprising a control unit for controlling the circulation pump. 제 1항에 있어서, 상기 냉각유로는 히터와 인접하여 나란하게 배치되는 것을 특징으로 하는 반도체 및 액정패널 제조설비용 서셉터의 냉각장치.2. The apparatus of claim 1, wherein the cooling flow path is disposed in parallel with the heater.
KR2020050032242U 2005-11-15 2005-11-15 cooling apparatus of suscepter for semiconductor and liquid circuit displayLCD panel manufacturing device KR200409072Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2020050032242U KR200409072Y1 (en) 2005-11-15 2005-11-15 cooling apparatus of suscepter for semiconductor and liquid circuit displayLCD panel manufacturing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2020050032242U KR200409072Y1 (en) 2005-11-15 2005-11-15 cooling apparatus of suscepter for semiconductor and liquid circuit displayLCD panel manufacturing device

Publications (1)

Publication Number Publication Date
KR200409072Y1 true KR200409072Y1 (en) 2006-02-20

Family

ID=41759450

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2020050032242U KR200409072Y1 (en) 2005-11-15 2005-11-15 cooling apparatus of suscepter for semiconductor and liquid circuit displayLCD panel manufacturing device

Country Status (1)

Country Link
KR (1) KR200409072Y1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160109343A (en) 2015-03-11 2016-09-21 (주)티티에스 Suscepter and temperature variable apparatus of susceptor
WO2022010080A1 (en) * 2020-07-06 2022-01-13 삼성디스플레이 주식회사 Element alignment chamber and method for manufacturing display device by using same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160109343A (en) 2015-03-11 2016-09-21 (주)티티에스 Suscepter and temperature variable apparatus of susceptor
WO2022010080A1 (en) * 2020-07-06 2022-01-13 삼성디스플레이 주식회사 Element alignment chamber and method for manufacturing display device by using same

Similar Documents

Publication Publication Date Title
TWI848148B (en) Substrate processing device
KR100802667B1 (en) Upper electrode, plasma processing apparatus and method, and recording medium having a control program recorded therein
KR100757545B1 (en) Upper electrode and plasma processing apparatus
JP6812224B2 (en) Board processing equipment and mounting table
US8741065B2 (en) Substrate processing apparatus
JPH11204442A (en) Single wafer heat treatment device
KR20130023193A (en) Apparatus for radial delivery of gas to a chamber and methods of use thereof
US8623173B2 (en) Substrate processing apparatus having electrode member
KR20190016664A (en) Led heater
KR200409072Y1 (en) cooling apparatus of suscepter for semiconductor and liquid circuit displayLCD panel manufacturing device
US11670513B2 (en) Apparatus and systems for substrate processing for lowering contact resistance
KR100920399B1 (en) cooling block and substrate processing apparatus including the cooling block
KR101729728B1 (en) Recirculation Cooling Unit and Heat Treatment Apparatus Having the Same
KR102071558B1 (en) Substrate treatment apparatus and substrate treatment method
KR100768899B1 (en) Heating apparatus for semiconductor wafers and glass substrates
JP4969127B2 (en) Substrate processing equipment
KR20100030783A (en) Plasma treatment apparatus
KR20090028343A (en) Electrode member and substrate processing apparatus including the electrode member
KR101381208B1 (en) Thin film treatment apparatus
JP2004023060A (en) Substrate processing device
KR20190048381A (en) Chamber for Processing a Semi-conductor Substrate
JP2006222214A (en) Heat treatment apparatus
TWI767166B (en) Capacitively coupled plasma processor and method for adjusting temperature thereof
JP2010135447A (en) Cooling block and substrate treatment apparatus including the same
KR101317333B1 (en) Boat For Preventing Substrate Warpage

Legal Events

Date Code Title Description
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20070209

Year of fee payment: 3

LAPS Lapse due to unpaid annual fee