KR200405787Y1 - Polymer PTC thermister and metal foil for electrode of polymer PTC thermistor - Google Patents
Polymer PTC thermister and metal foil for electrode of polymer PTC thermistor Download PDFInfo
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Abstract
폴리머 PTC 소자는 도전성 고분자 중합체와 금속박 전극 및 리드(플레이트 또는 와이어 단자)로 구성되는데, 본 고안은 도전성 고분자 중합체와의 접착력을 향상시키기 위해, 실란커플링제를 도포한 금속박과 실란커플링제를 도포한 금속박을 전극으로 사용하는 폴리머 PTC 소자를 제공한다.The polymer PTC device is composed of a conductive polymer polymer, a metal foil electrode, and a lead (plate or wire terminal). In order to improve adhesion between the conductive polymer polymer and the conductive polymer polymer, the present invention includes a metal foil coated with a silane coupling agent and a silane coupling agent. A polymer PTC device using a metal foil as an electrode is provided.
PTC, 금속박, 전해동박, 압연동박, 전해니켈박, 실란커플링제 PTC, metal foil, electrolytic copper foil, rolled copper foil, electrolytic nickel foil, silane coupling agent
Description
도 1은 폴리머 PTC 소자의 구조.1 is a structure of a polymer PTC device.
도 2는 종래의 기술로 제작된 전극용 금속박의 단면구조.Figure 2 is a cross-sectional structure of the metal foil for electrodes produced by the prior art.
도 3은 실란커플링제가 도포된 금속박 단면.3 is a cross-sectional view of a metal foil coated with a silane coupling agent.
폴리머 PTC 소자는 정온계수(Positive Temperature Coefficient)특성을 갖는 도전성 고분자 중합체를 사용하여 제작한, 전기 전자 회로의 과전류를 차단하는 회로보호용 소자이다.The polymer PTC device is a circuit protection device which cuts off the overcurrent of an electric / electronic circuit produced by using a conductive polymer having a positive temperature coefficient.
폴리머 PTC 소자는 도 1과 같은 구조로 이루어져 있다. 도1의 101은 가공하여 시트화한 도전성 고분자 중합체, 102는 금속박 전극, 103은 리드이다. The polymer PTC device has a structure as shown in FIG. 1, 101 is a conductive polymer sheet processed and sheeted, 102 is a metal foil electrode, and 103 is a lead.
폴리머 PTC 소자의 구성요소중 도전성 고분자 중합체는 폴리올레핀계 수지와 각종 첨가제 및 카본블랙을 혼합하여, 100∼250 ℃ 온도에서 시트로 제작하고, 금속박은 니켈도금 전해동박, 니켈도금 압연동박 및 전해니켈박등이 사용되며, 리드는 니켈도금 전해동박, 니켈도금 압연동박, 전해니켈박, 니켈도금 동선 및 니켈선 등을 플레이트 또는 와이어 형태를 사용한다.Among the components of the polymer PTC device, the conductive polymer polymer is mixed with polyolefin resin, various additives, and carbon black to produce a sheet at a temperature of 100 to 250 ° C. The metal foil is nickel plated electrolytic copper foil, nickel plated rolled copper foil, and electrolytic nickel foil. This is used, the lead is nickel plated electrolytic copper foil, nickel plated rolled copper foil, electrolytic nickel foil, nickel plated copper wire and nickel wire and the like using a plate or wire form.
본 고안은 폴리머 PTC 소자와 전극으로 사용하는 금속박에 대한 것으로, 종래의 폴리머 PTC 소자 전극용 금속박은 미국특허 제4,689,475호, 미국특허 제4,800,253호, 국제출원공개 WO/95/34081 및 실용 제200323075호에서 제시되었으며, 제시된 기술중 니켈도금 전해동박이 전극용 금속박으로 제품화되어 사용되고 있다.The present invention relates to a polymer PTC element and a metal foil used as an electrode, and the metal foil for a conventional polymer PTC element electrode is disclosed in US Patent Nos. 4,689,475, US Patent No. 4,800,253, International Application Publication WO / 95/34081 and Utility 200323075. The nickel-plated electrolytic copper foil has been commercialized and used as a metal foil for electrodes.
도 2는 종래 기술로 제작된 전극용 금속박의 단면구조를 나타낸다. 도 2는 전해동박을 모재로 사용하여 제조한 금속박을 나타낸 것이며, 도 2의 201은 모재층, 202는 중간층으로 니켈도금층, 203은 누들층으로 니켈도금층, 204는 보호층으로 니켈도금층이다. 또한 금속박은 도 2에서와 같이, 면이 평평한 샤이니(Shiny)면과 요철형태의 매트(matte)면으로 구성되며, 도전성 고분자 중합체와의 합지접합시, 매트면과 접합이 이루어진다. 2 shows a cross-sectional structure of a metal foil for electrodes produced in the prior art. Figure 2 shows a metal foil manufactured using an electrolytic copper foil as a base material, 201 of Figure 2 is a base material layer, 202 is a nickel plated layer as an intermediate layer, 203 is a nickel plated layer as a noodle layer, 204 is a nickel plated layer as a protective layer. In addition, the metal foil, as shown in Figure 2, is composed of a shiny surface (Shiny) surface and the concave-convex matte surface, when the bonding with the conductive polymer polymer, the mat surface and the bonding is made.
종래의 기술중 도 2에서와 같이 매트면의 표면이 니켈 도금층으로 이루어진 금속박은, 니켈도금을 통해 동의 부식과 반응을 억제하는 우수한 특성을 나타내지만, 반대로 니켈의 낮은 반응성으로 인해 도전성 고분자 중합체와 합지접합시, 접착력이 금속박 매트면의 누들층에 의한 앵커링(Anchoring)효과에 의존한다. 따라서 도전성 고분자 중합체와의 합지접합시, 접착력에 한계가 있으며, 이로 인하여 반복사용시 열적 충격에 의한 접착력 및 전기전도도 특성이 나빠지는 문제점이 있다.In the prior art, as shown in FIG. 2, the metal foil having the matt surface of the nickel plated layer exhibits excellent characteristics of suppressing copper corrosion and reaction through nickel plating. However, due to the low reactivity of nickel, the metal foil is laminated with the conductive polymer polymer. At the time of joining, the adhesive force depends on the anchoring effect by the noodle layer on the metal foil mat surface. Therefore, when laminating with the conductive polymer polymer, there is a limit in the adhesive strength, and thus there is a problem that the adhesive strength and electrical conductivity properties due to thermal shock deteriorates when repeated use.
본 고안은 폴리머 PTC 소자에서, 도전성 고분자 중합체와 금속박 사이의 접착력을 향상시키기 위하여, 실란커플링제를 도포한 금속박 및 그 금속박을 전극으로 사용하는 폴리머 PTC 소자를 제공하고자 한다.The present invention aims to provide a metal PTC coated with a silane coupling agent and a polymer PTC device using the metal foil as an electrode in order to improve the adhesion between the conductive polymer polymer and the metal foil in the polymer PTC device.
본 고안은 종래 기술의 문제점을 해결하기 위한 것으로서, 금속박의 표면에 실란커플링제를 도포하여, 폴리머 PTC 소자의 제조 및 사용시, 발생할 수 있는 열충격에도 접착력을 유지할 수 있는 금속박 및 그 금속박을 전극으로 사용한 폴리머 PTC 소자를 제공한다.The present invention is to solve the problems of the prior art, by applying a silane coupling agent on the surface of the metal foil, using a metal foil and the metal foil that can maintain the adhesive force to the thermal shock that may occur during the production and use of the polymer PTC device as an electrode A polymer PTC device is provided.
실란커플링제는 유기 실리콘 화합물로서, 다양한 기능을 제공한다. 특히, 무기질표면을 개질하여 무기질표면과 유기질표면의 접착력을 높이는 특성을 가지고 있다. Silane coupling agents are organosilicon compounds that provide a variety of functions. In particular, it has the property of improving the adhesion between the inorganic surface and the organic surface by modifying the inorganic surface.
대한민국 공개특허 특03-0033449호는 인쇄회로기판에서, 에폭시계 수지함침 절연기판과 전해동박의 접착성을 높이기 위해 3-아미노프로필트리에톡시실란(3-aminopropyltriethoxysilane)과 비닐트리 에톡시 실란(vinyltriethoxysilane)을 혼합하여 도포한 표면처리 방법을 제시하였다. Korean Patent Laid-Open Publication No. 03-0033449 discloses 3-aminopropyltriethoxysilane and vinyltriethoxysilane to increase the adhesion between an epoxy resin-impregnated insulating substrate and an electrolytic copper foil in a printed circuit board. It was presented a method of surface treatment by mixing the coating.
그러나 폴리머 PTC 소자의 경우, 전도성 고분자 중합체가 반응성이 낮은, 폴리올레핀계 수지를 기본조성으로 하고, 금속박의 접착면이, 반응성이 적은 니켈층으로 되어있기 때문에, 상기의 방법을 사용하는 경우, 접착력 향상의 효과를 기대할 수 없다.However, in the case of the polymer PTC device, since the conductive polymer polymer has a low reactivity polyolefin-based resin as a basic composition, and the adhesive surface of the metal foil is made of a nickel layer having low reactivity, the adhesive force is improved when the above method is used. Can not expect the effect of.
본 고안에서는 금속박과 전도성 고분자 중합체와의 접착력을 향상시키기 하 여, 폴리에틸렌과 같은 폴리올레핀계 수지와 반응성이 우수한 비닐트리메톡시실란(Vinyltrimethoxysilane)을 도포한 금속박을 제공한다. 실란커플링제는 카본과의 반응성이 없기 때문에, 전기전도도에는 영향을 미치지 않으면서 접착력을 향상할 수 있다.The present invention improves the adhesion between the metal foil and the conductive polymer, to provide a metal foil coated with vinyl trimethoxysilane (Vinyltrimethoxysilane) excellent in reactivity with a polyolefin resin such as polyethylene. Since the silane coupling agent has no reactivity with carbon, the adhesion can be improved without affecting the electrical conductivity.
실란커플링제는 중량비 0.1∼10%로 순수와 혼합하여 수용액 상태로 사용하는데, 실란커플링제 수용액을 단독적으로, 또는 실란커플링제 수용액에 도전성 재료, 특히 카본블랙 분말등을 수용액에 분산시켜 금속박 표면에 도포후 건조한다.The silane coupling agent is mixed with pure water in a weight ratio of 0.1 to 10% and used as an aqueous solution.The silane coupling agent aqueous solution is used alone or in an aqueous solution of the silane coupling agent, and a conductive material, especially carbon black powder, is dispersed in the aqueous solution to the surface of the metal foil. Dry after application.
도 3은 실란커플링제가 도포된 금속박의 단면을 나타낸 것이다. 도 3의 301은 금속박 모재층, 302는 니켈도금층, 303은 실란커플링제 도포층을 나타낸다.3 shows a cross section of a metal foil coated with a silane coupling agent. 3, 301 shows a metal foil base material layer, 302 shows a nickel plated layer, and 303 shows a silane coupling agent coating layer.
본 고안에 의한, 실란커플링제 도포를 하기 위한 실란커플링제 수용액의 실시예를 설명한다. The Example of the silane coupling agent aqueous solution for apply | coating a silane coupling agent by this invention is demonstrated.
실시예 1Example 1
비닐트리메톡시실란(Vinyltrimethoxysilane)을 중량비 0.1∼10%로 순수와 혼합하여 30분이상 교반하면서 pH를 조절한다. pH는 실란커플링제가 안정한 영역으로 맞추는 것이 중요하다. pH는 약산성인 3.5∼6.5사이가 적당하다. Vinyltrimethoxysilane (Vinyltrimethoxysilane) is mixed with pure water in a weight ratio of 0.1 to 10% to adjust the pH while stirring for 30 minutes or more. It is important to adjust the pH to a region where the silane coupling agent is stable. The pH is suitably between 3.5 and 6.5, which is slightly acidic.
실시예 2Example 2
비닐트리메톡시실란(Vinyltrimethoxysilane)을 중량비 0.1∼10%와 N-(2-아미노에틸)-3-아미노프로필트리메톡시실란(N-(20Aminoethyl)-3-aminopropyltrimethoxy silane)을 중량비 0.1∼10%로 순수와 혼합하여 30분이상 교반후 사용한다.0.1 to 10% by weight of vinyltrimethoxysilane and 0.1 to 10% by weight of N- (2-aminoethyl) -3-aminopropyltrimethoxysilane (N- (20Aminoethyl) -3-aminopropyltrimethoxysilane) After mixing with pure water for 30 minutes or more, use.
실시예 3Example 3
비닐트리메톡시실란(Vinyltrimethoxysilane)을 중량비 0.1∼10%로 순수와 혼합하여 30분이상 교반하면서 pH를 조절 후, 카본블랙을 중량비 0.1∼1%로 혼합하여 30분 교반하여 카본블랙을 수용액 중에 분산 시킨다. pH는 약산성인 3.5∼6.5사이가 적당하며, 카본블랙이 침전되지 않도록 도포공정중에도 계속 교반한다.After mixing vinyltrimethoxysilane with pure water at a weight ratio of 0.1 to 10% and stirring for 30 minutes or more, the pH is adjusted while mixing carbon black at a weight ratio of 0.1 to 1% and stirring for 30 minutes to disperse carbon black in an aqueous solution. Let's do it. The pH is suitably between 3.5 and 6.5, which is slightly acidic, and the stirring is continued during the coating process so that carbon black does not precipitate.
실시예 4Example 4
비닐트리메톡시실란(Vinyltrimethoxysilane)을 중량비 0.1∼10%와 N-(2-아미노에틸)-3-아미노프로필트리메톡시실란(N-(20Aminoethyl)-3-aminopropyltrimethoxy silane)을 중량비 0.1∼10%로 순수와 혼합하여 30분이상 교반후 사용한 후 카본블랙을 중량비 0.1∼1% %로 혼합하여 30분 교반하여 카본블랙을 수용액 중에 분산 시킨다. 카본블랙이 침전되지 않도록 도포공정중에도 계속 교반한다0.1 to 10% by weight of vinyltrimethoxysilane and 0.1 to 10% by weight of N- (2-aminoethyl) -3-aminopropyltrimethoxysilane (N- (20Aminoethyl) -3-aminopropyltrimethoxysilane) After mixing with pure water and stirring for 30 minutes or more, the carbon black is mixed in a weight ratio of 0.1 to 1 %% and stirred for 30 minutes to disperse the carbon black in an aqueous solution. Continue stirring during the application process to prevent carbon black from settling
본 고안이 제공하는, 금속박을 사용하여 제작하는 폴리머 PTC 소자는, 니켈도금 금속박을 사용하여 제작한 폴리머 PTC 소자에 비해 접착강도가 5 ∼ 20 % 정도 향상된다. 그러나 접착강도는 니켈도금층의 누들의 형태에 따라 다소간의 차이가 있다.The polymer PTC device produced using the metal foil provided by the present invention improves the adhesive strength by about 5 to 20% compared to the polymer PTC device produced using the nickel plated metal foil. However, the adhesive strength is somewhat different depending on the shape of the noodle of the nickel plated layer.
특히, 접착강도를 높이기 위하여 누들의 크기가 큰 경우, 폴리머 PTC 소자의 성형과정에서 누들이 부러져서 도전성 고분자 중합체 내에 혼입되어 PTC 특성을 방해하는 요소로 작용 할 수 있으며, 누들의 크기가 작은 경우에 원하는 만큼의 접착력을 얻을 수 없다. In particular, when the size of the noodle is large in order to increase the adhesive strength, the noodle is broken during the molding process of the polymer PTC element and incorporated into the conductive polymer polymer, which may act as an element that interferes with the PTC characteristics. You can not get as much adhesion.
본 고안이 제공하는 금속박은 누들층의 차이에 의한 접착강도의 변화를 최소 화 할 수 있으며, 실란커플링제의 작용에 의해 균일한 접착이 이루어지게 되므로, 전기전도도 또한 안정되고 균일한 값을 유지할 수 있다.The metal foil provided by the present invention can minimize the change of the adhesive strength due to the difference of the noodle layer, and since the uniform adhesion is made by the action of the silane coupling agent, the electrical conductivity can also be kept stable and uniform. have.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100985965B1 (en) * | 2010-01-20 | 2010-10-06 | 이기철 | Manufacturing method of polymer ptc thermistor which has fast recovery time back to post trip resistance level |
KR100985952B1 (en) * | 2010-01-20 | 2010-10-06 | 이기철 | Polymer ptc thermistor and thereof |
-
2005
- 2005-09-12 KR KR2020050026166U patent/KR200405787Y1/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100985965B1 (en) * | 2010-01-20 | 2010-10-06 | 이기철 | Manufacturing method of polymer ptc thermistor which has fast recovery time back to post trip resistance level |
KR100985952B1 (en) * | 2010-01-20 | 2010-10-06 | 이기철 | Polymer ptc thermistor and thereof |
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