KR20040106657A - The position perception apparatus of wafer from the semiconductor device fabricating equipment and controlling method using the same - Google Patents

Abstract

PURPOSE: A position perception apparatus of a wafer in semiconductor fabrication equipment and a controlling method using the same are provided to sense and correct an alignment error of a wafer by using a camera. CONSTITUTION: A chuck(38) is used for supporting a wafer which is inserted into an inside of a process chamber(30) by a robot. A camera(34) is used for photographing a loading state of the wafer on the chuck. A database includes image data related to a normal position of the wafer to a processing position. A controller is used for receiving an image signal from the camera, comparing the image signal of the camera with the image data of the database, and controlling each driving state of components according to the compared result.

Description

The position perception apparatus of wafer from the semiconductor device fabricating equipment and controlling method using the same}

The present invention prevents damage, breakage, and contamination of the wafer and the manufacturing equipment by stopping the process and then proceeding with the process of placing the wafer when the wafer is out of the set position according to the process in the semiconductor device manufacturing equipment. The present invention relates to a wafer position state sensing device and a control method using the same in a semiconductor device manufacturing facility.

In general, a semiconductor device is formed by selectively and repeatedly performing a process such as photographing, etching, diffusion, ion implantation, chemical vapor deposition, and metal deposition on a wafer. Thus, a wafer until the semiconductor device is formed is mounted in a cassette. Not only is it transferred to a manufacturing facility that performs each unit process, but is also transferred between a cassette located in a manufacturing facility that performs each unit process and a process execution position.

The transfer of such wafers ultimately results in accurate and stable positioning at the process execution position of each semiconductor device manufacturing facility that performs each unit process. Otherwise, defects and physical defects of the wafers may occur. This results in damage or breakage of the wafer and contamination of the manufacturing equipment.

Herein, a configuration relating to a state in which the wafer is placed on a portion where the wafer is required to be accurately placed at a set position including the process performing position in the semiconductor device manufacturing facility will be described with reference to the accompanying drawings.

Prior to this description, there will be various examples of semiconductor device manufacturing facilities in which a problem occurs due to a poor positional state of a wafer, but the accompanying drawings show an example of an end station of an ion implantation facility among the semiconductor device manufacturing facilities described above. It will be apparent that the technical idea of the present invention is not limited to the accompanying drawings.

Referring to FIGS. 1 and 2, there is a process chamber 10 which achieves a high level of vacuum atmosphere, and the process chamber 10 is a disk assembly capable of high-speed rotation with a plurality of wafers W mounted therein. (12) is provided. In addition, the disk assembly 12 described above is provided with a plurality of pads 14 for sequentially supporting the wafer (W) to be injected from one side of the process chamber 10.

In this case, the pad 14 is provided with a fence 14 which indicates the set position in response to the placement of the wafer W, and through the hole 18 extending downward to the opposite side of the fence 14. The protruding pin 20 constitutes a structure in which the side portion of the wafer W placed on the pad 14 is pushed and fixed in the direction of the fence 14.

In more detail, as shown in FIG. 4A, the wafer W is placed in close contact with the auxiliary pad 22 provided on the upper surface of the pad 14, and the pin 20 described above is a hole ( At the lower periphery of 18), an elastic force is applied from a spring 24 supported by a fixture such as a bracket to press the wafer W in the direction of the fence 14. And the pin 20 is engaged with the lever 26 which is influenced by the elastic force of the spring 24 mentioned above, This lever 26 pusher 28 which drives up / down from the lower part of the pad 14. Contact with the spring 24 to transmit the elastic force and the relative force to the pin (20).

In this configuration, as shown in FIG. 4B, when the elastic force of the spring 24 through the pin 20 is insufficient, the state in which the wafer W adheres to the auxiliary pad 22 is the elastic force of the spring 24. In the case of the above operation, there is a case where the force for supporting the wafer W is insufficient or insufficient between the pin 20 and the fence 14, such as when the pusher 28 is not sufficiently lowered.

In addition, as illustrated in FIG. 4C, the wafer (when the wafer W is placed on the pad 14 may be in error or the elastic force of the spring 24 through the pin 20 may be excessively applied. The case where one side of W) is in the state mounted on the fence 14 upper part is issued.

As described above, the state in which the wafer W is not sufficiently fixed, that is, an abnormally placed state with respect to the set position of the pad 14 is changed from the disk assembly 12 to the wafer W in the before and after process. ) As well as collision with other components cause damage or damage to the configuration of each part of the manufacturing equipment including the wafer (W), in addition to the foreign matter such as particles in the process chamber 10 due to damage Has the problem of being contaminated.

An object of the present invention is to solve the problems according to the prior art described above, in the semiconductor device manufacturing equipment, if the wafer deviated from the set position according to the process performed, the process proceeds to stop the process, and then the alignment process The present invention provides a device for detecting a position state of a wafer and a control method using the same in a semiconductor device manufacturing facility for preventing damage, damage, and contamination of the wafer and the manufacturing facility.

FIG. 1 is a partial cutaway perspective view illustrating an ion implantation facility in a typical semiconductor device manufacturing facility for explaining a loading relationship of a wafer, for example.

FIG. 2 is a plan view schematically illustrating a configuration of a portion where the wafer illustrated in FIG. 1 is placed.

FIG. 3 is an enlarged plan view of a part III of FIG. 2.

4A to 4B are cross-sectional views illustrating a state of a wafer with reference to the IV-IV line of FIG. 3.

5 is a partial cutaway perspective view schematically illustrating a configuration of a wafer position state sensing apparatus of a semiconductor device manufacturing apparatus according to an embodiment of the present invention.

6A or 6B is a plan view illustrating an abnormally positioned wafer state image through a camera.

7 is a flowchart illustrating a positional state detection of a wafer and a control relationship of a manufacturing facility through the same according to an embodiment of the present invention.

8 is a flowchart illustrating a positional state detection of a wafer and a control relationship of a manufacturing facility through the same according to another embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

10, 30: process chamber 12: disk assembly

14: pad 16: fence

18: hole 20: finger

22: auxiliary pad 24: spring

26: lever 28: pusher

32: projection window 34: camera

36: lighting unit 38: chuck

40: display unit

Features according to an embodiment of the present invention for achieving the above object, the chuck for supporting the wafer is introduced into the process chamber by the robot; A camera for photographing the laid state of the wafer relative to the chuck; A database for storing an image of a normal position state of a wafer with respect to the process performing position; And a controller for receiving an image signal detected from the camera, comparing the image signal with the image stored in the database to determine the alignment state of the wafer, and controlling the driving of each component including whether the process is in progress. .

A control method of a semiconductor device manufacturing facility using such a configuration includes a chuck supporting and supporting a wafer transferred by a robot; A camera for photographing the laid state of the wafer relative to the chuck; A database storing an image of a normal position state of the wafer relative to the chuck; Receiving an image signal detected from the camera, and compares it with the image stored in the database to determine the alignment state of the wafer, and from this it comprises a controller for controlling the driving of each component configuration in accordance with the progress of the process Photographing a state of placing a wafer on the chuck; Comparing the photographed video image with a video image stored in a database; And determining whether the current position state of the wafer is normal from the comparison of the two image images.

On the other hand, a feature according to another embodiment of the present invention for achieving the above object is a chuck supporting the wafer transferred by the robot; A camera for photographing the laid state of the wafer relative to the chuck; A display portion provided on the chuck to facilitate identification of the position state of the wafer through the camera by exposing or covering the wafer by deviating from the set position; And a controller that receives the image signal detected from the camera and controls driving of each component according to the progress of the process by determining whether the display unit is exposed or covered.

In addition, a control method of a semiconductor device manufacturing facility using the above-described other embodiment includes: a chuck supporting and supporting a wafer transferred by a robot; A camera for photographing the laid state of the wafer relative to the chuck; A display unit provided on the chuck to facilitate identification of the position state of the wafer through the camera by exposing or covering the wafer by the wafer from the set position; A controller for receiving an image signal detected from the camera, determining whether the display unit is exposed or obstructed to determine a position state of the wafer, and controlling a driving of each component configuration according to the progress of the process therefrom; Photographing a state where the wafer is placed on the substrate; And determining whether the wafer is in a current position state by checking whether the display unit is exposed or covered from the captured image image.

Hereinafter, an apparatus for detecting a position state of a wafer and a control method using the same in a semiconductor device manufacturing apparatus according to an exemplary embodiment of the present invention will be described with reference to the accompanying drawings.

5 is a partial cutaway perspective view schematically illustrating a configuration of a wafer position state sensing apparatus of a semiconductor device manufacturing apparatus according to an embodiment of the present invention, and FIG. 6A or 6B is a plan view illustrating an abnormally positioned wafer state image through a camera; 7 and 8 are flow charts for explaining the positional state detection of the wafer according to each embodiment of the present invention and the control relationship of the manufacturing equipment through the same, the same reference numerals are given to the same parts as in the prior art, and accordingly Detailed description will be omitted.

In the configuration of the embodiment according to the present invention, as shown in Fig. 5, there is a chuck 38 supporting and supporting the bottom surface of the wafer W placed by a transfer device such as a robot (not shown). ), A camera 34 which photographs the position of the wafer W placed on the upper surface of the chuck 38 and applies the video signal to the controller.

In addition, the upper portion of the above-described chuck 38 illuminates the area where the wafer W is placed, i.e., its surroundings including the chuck 38 so as to effectively photograph the camera 34 with respect to the position of the wafer W. The lighting unit 36 is further provided.

Here, as described above, when the chuck 38 for supporting the wafer W is inside the process chamber 10 to produce a high level vacuum pressure atmosphere or high electromagnetic energy atmosphere and ionization or specific gas atmosphere. That is, it may be difficult to install the camera 34 inside the process chamber 10 described above.

At this time, the above-described camera 34 is to be installed on the outside of the process chamber 10, and the side wall portion of the process chamber 10 between the portion where the photographing is required and the camera 34 is internal from the outside of the process chamber 10. It can be made of a configuration having a projection window 32 to be able to check the position of the wafer (W).

In addition, it is preferable to configure a portion where the wafer W is placed through the projection window 32 described above from the outside of the illumination unit 36 or the process chamber 10 described above.

On the other hand, the controller is in connection with a database (not shown) that stores the image image of the state where the wafer W is normally placed at the target position, and the current state of the position of the wafer w received from the camera 34 is received. The image is compared with the image image stored in the database to determine whether or not the current state of the wafer (W) position is defective, and based on this to control the driving of each component configuration related to the transfer and processing of the wafer (W).

In addition to the above configuration, the wafer W, which is determined to be an alignment error, is transferred to the position spaced apart from the outside of the chuck 38 or the process chamber 10 as described above, from the drawing by the drive of each component including the robot. And an alignment part (not shown) which enables the relational configuration including the robot to be transferred back to the set position of the chuck 38.

Looking at the process according to the transfer of the wafer from such a configuration, as shown in Figure 7, when the wafer (w) loading position relative to the already set position, that is, the chuck 38 (ST102) the camera located opposite the rm ( 34 photographs the position state of the wafer W from the illumination of the illumination part 36 (ST104). In addition, the camera 34 applies the captured video image to the controller, and the controller receives the video image signal of the camera 34 and compares whether or not it is in the same position as the video image stored in the database by an overlap method. (ST106) The position state of the wafer W is determined by checking whether there is a difference between these two video images (ST108).

At this time, if it is determined that the position of the wafer W placed on the chuck 38 is normal, the process proceeds continuously (ST110) and unloading (ST130) such as the transfer or the process to the wafer W, and As a result, when it is determined that the wafer W is in an abnormal state, it is displayed or output to a normal output means so that an operator can check the matter (ST120).

And, as described above, when it is determined that the wafer W is located poorly, the controller stops further wafer W transfer or process progress, and the operator places the wafer W at that position from the above-described output. It is determined whether the withdrawal is possible, and the wafer W is taken out by maintaining in a corresponding environment (ST122) to align the wafer W through the alignment unit (ST124), and then the loading position is again.

On the other hand, the configuration of another embodiment of the present invention, there is a chuck 38 supporting the bottom surface of the wafer (W), which is loaded by a transfer device such as a robot (not shown), and the chuck (38) above the chuck (38). 38) A camera 34 which photographs the position of the wafer W placed on the upper surface and applies the video signal to the controller is provided.

In addition, the upper portion of the above-described chuck 38 illuminates the area where the wafer W is placed, i.e., its surroundings including the chuck 38 so as to effectively photograph the camera 34 with respect to the position of the wafer W. The lighting unit 36 is further provided.

In addition, the chuck 38 includes a display portion 40 exposed or covered by the wafer W placed on the upper surface of the chuck 38, and the camera 34 for this is as shown in FIG. 6A or 6B. Likewise, unlike the other components, the exposed portion of the display portion 40 may be exposed or obscured when the wafer W is positioned.

In addition, when the above-described chuck 38 is inside the process chamber 10 to produce a high level of vacuum atmosphere or electromagnetic energy atmosphere and ionization or specific gas atmosphere, that is, the camera ( 34) It may be difficult to install.

At this time, the above-described camera 34 is to be installed on the outside of the process chamber 10, and the side wall portion of the process chamber 10 between the portion where the photographing is required and the camera 34 is internal from the outside of the process chamber 10. It can be made of a configuration having a projection window 32 to be able to check the position of the wafer (W).

In addition, it is preferable to configure a portion where the wafer W is placed through the projection window 32 described above from the outside of the illumination unit 36 or the process chamber 10 described above.

On the other hand, the controller memorizes the shape of the display portion 40 from the state where the wafer W is normally placed at the target position, and when the shape change of the display portion 40 occurs due to the position of the wafer W, the controller stores the shape of the display portion 40. Based on the difference, it is determined that the defective position of the wafer W is determined, and based on this, the driving of each component configuration related to the transfer and the process of the wafer W is controlled.

In addition to the above configuration, the wafer W, which is determined to be an alignment error, is transferred to the position spaced apart from the outside of the chuck 38 or the process chamber 10 as described above, from the drawing by the drive of each component including the robot. And it comprises a structure which further includes the alignment part which enables this relationship structure including a robot to be conveyed back to the setting position of the chuck 38.

Looking at the process according to the transfer of the wafer from such a configuration, as shown in Figure 8, when the wafer (w) is loaded in the already set position, that is, the chuck 38 (ST202) the camera located opposite the top ( 34 photographs the position state of the wafer W from the illumination of the illumination part 36 (ST204). At this time, the camera 34 applies the captured video image to the controller, and the controller receives the video image signal of the camera 34 so that the shape of the display unit 40 is different from the shape stored, that is, due to the wafer W. The position state of the wafer W is determined by checking whether the display unit 40 is exposed or covered (ST206), and checking whether there is a difference between the two video images (ST208).

At this time, if it is determined that the position of the wafer W placed on the chuck 38 is normal, the process proceeds continuously (ST210) and unloading (ST230), such as transfer or process to the wafer W, and relative As a result, if it is determined that the wafer W is in an abnormal state, it is displayed or output to a normal output means so that an operator can check the matter (ST220).

And, as described above, when it is determined that the wafer W is located poorly, the controller stops further wafer W transfer or process progress, and the operator places the wafer W at that position from the above-described output. It is determined whether the withdrawal is possible, and the wafer W is taken out by maintaining in a corresponding environment (ST222) to align the wafer W through the alignment unit (ST224), and then the loading position is again.

As shown in each of the above embodiments, the wafer W is abnormally located and the wafer W is corrected and then the process proceeds again so that the wafer W may be damaged or broken and broken due to the bad position. It is possible to reduce the possibility of contamination of manufacturing facilities including (W).

On the other hand, the above description refers to the configuration of the process chamber 10 in the end station portion of the ion implantation equipment and the chucking means of the wafer (W) including the disk assembly 12 and the pad therein, but performing the etching process It can be applied to the configuration of the electrostatic chuck to maintain the temperature condition of the wafer in the chamber, or to the chuck of other manufacturing equipment corresponding thereto, and also to the part where the handover is made according to the transfer of the wafer. Is a matter of course.

Therefore, according to the present invention, the wafer is placed out of the set position prior to performing the process, so that the recognition of misalignment through the camera and the alignment correction through the process may be performed, thereby causing damage and damage to the wafer and the manufacturing equipment. And contamination is prevented.

Although the present invention has been described in detail only with respect to specific embodiments, it will be apparent to those skilled in the art that modifications and variations can be made within the scope of the technical idea of the present invention, and such modifications or changes belong to the claims of the present invention. something to do.

Claims (14)

A chuck supporting and supporting a wafer introduced into the transfer process chamber by a robot; A camera for photographing the laid state of the wafer relative to the chuck; A database for storing an image of a normal position state of a wafer with respect to the process performing position; And A semiconductor comprising a controller for receiving an image signal detected from the camera, comparing the image signal with the image stored in the database to determine the alignment state of the wafer, and controlling the driving of each component including whether the process is in progress. Device for detecting position status of wafers in device manufacturing facilities. The method of claim 1, The chuck is located inside the process chamber defining a closed atmosphere, the camera is installed outside the process chamber, and the side wall of the process chamber is provided with a projection window so as to check the position of the wafer on the chuck through the camera. Device for detecting the position of the wafer in the semiconductor device manufacturing equipment characterized in that. The method of claim 1, And a lighting unit for illuminating a peripheral position of the wafer with respect to the chuck, wherein the wafer is in the semiconductor device manufacturing facility. The method of claim 2 or 3, And the illumination unit illuminates the projection window outside the process chamber through the projection window. The method of claim 1, At the position spaced apart from the chuck, a wafer having an alignment error is received from the drawing by the drive of each component including the robot, and aligned, and the alignment unit further takes over the robot and transfers the wafer to the set position of the chuck. Device for detecting the position of the wafer in the semiconductor device manufacturing facility, characterized in that. A chuck supporting and supporting the wafer transferred by the robot; A camera for photographing the laid state of the wafer relative to the chuck; A database storing an image of a normal position state of the wafer relative to the chuck; Receiving an image signal detected from the camera, and compares it with the image stored in the database to determine the alignment state of the wafer, and from this it comprises a controller for controlling the driving of each component configuration in accordance with the progress of the process , Photographing a state where a wafer is placed on the chuck; Comparing the photographed video image with a video image stored in a database; And And determining whether the current position of the wafer is normal from the comparison of the two image images. The method of claim 6, And an alignment portion for aligning the wafer at a position spaced apart from the chuck, drawing the wafer by driving each component including the robot from the abnormally positioned wafer, aligning the wafer through the alignment portion, and transferring the wafer to the chuck. The control method of the semiconductor device manufacturing equipment, characterized in that further comprising the step of placing in a set position. A chuck supporting and supporting the wafer transferred by the robot; A camera for photographing the laid state of the wafer relative to the chuck; A display unit provided on the chuck to facilitate identification of the position state of the wafer through the camera by exposing or covering the wafer by the wafer from the set position; And Receiving an image signal detected by the camera, and the controller to control the driving of the configuration of each part according to the progress of the process in accordance with the determination of the display portion of the display unit is detected, the position state of the wafer in the semiconductor device manufacturing facility Device. The method of claim 8, The chuck is located inside the process chamber defining a closed atmosphere, the camera is installed outside the process chamber, and the side wall of the process chamber is provided with a projection window so as to check the position of the wafer on the chuck through the camera. Device for detecting the position of the wafer in the semiconductor device manufacturing equipment characterized in that. The method of claim 8, And a lighting unit for illuminating a peripheral position of the wafer with respect to the chuck, wherein the wafer is in the semiconductor device manufacturing facility. The method according to claim 9 or 10, And the illumination unit is configured to illuminate through the projection window outside the process chamber. The method of claim 8, At the position spaced apart from the chuck, a wafer having an alignment error is received from the drawing by the driving of the respective components including the robot and aligned, and the alignment unit further takes over the robot and transfers the wafer to the set position of the chuck. Device for detecting the position of the wafer in the semiconductor device manufacturing facility, characterized in that. A chuck supporting and supporting the wafer transferred by the robot; A camera for photographing the laid state of the wafer relative to the chuck; A display unit provided on the chuck to facilitate identification of the position state of the wafer through the camera by exposing or covering the wafer by the wafer from the set position; A controller for receiving an image signal detected from the camera, determining whether the display unit is exposed or obstructed to determine a position state of the wafer, and controlling a driving of each component configuration according to the progress of the process therefrom; Photographing a state where a wafer is placed on the chuck; And determining whether the wafer is in a current position state by checking whether the display unit is exposed or covered from the captured image image. The method of claim 13, And an alignment portion for aligning the wafer at a position spaced apart from the chuck, drawing the wafer by driving each component including the robot from the abnormally positioned wafer, aligning the wafer through the alignment portion, and transferring the wafer to the chuck. The control method of the semiconductor device manufacturing equipment, characterized in that further comprising the step of placing in a set position.