KR20040104960A - Position detection mark, mark identification method, position detection method, exposure method, and position information detection method - Google Patents

Abstract

The present invention provides a position detection mark that can reliably detect a mark of a detection object even when a large number of similar marks exist in proximity to a mark to be detected. The position detecting mark 10 formed on the photosensitive substrate P and used when the positional information of the photosensitive substrate P is detected by the alignment optical system 9 is observed by the alignment optical system 9 so that the control device ( The alignment mark 1 for outputting the position information to the CONT, the alignment mark 1 and the predetermined positional relationship, and are arranged by combining three types of four patterns to represent 34 types of information. 2) is provided.

Description

Position detection mark, mark identification method, position detection method, exposure method, and position information detection method {POSITION DETECTION MARK, MARK IDENTIFICATION METHOD, POSITION DETECTION METHOD, EXPOSURE METHOD, AND POSITION INFORMATION DETECTION METHOD}

Technical Field

The present invention provides a position detecting mark formed on an object and used when detecting positional information of the object, a mark identification method and mark detection method for identifying a specific mark from a plurality of marks, and a pattern exposed on a substrate. An exposure method and a position information detection method.

Background

Microdevices, such as a semiconductor element and a liquid crystal display element, are manufactured by repeating each process, such as a film formation process, an exposure process process, an etching process process, multiple times, and laminating | stacking a some pattern on a board | substrate. In an exposure process, the exposure apparatus which transfers the pattern formed in the mask on the board | substrate with which the photosensitive agent was apply | coated is used. The exposure apparatus has a mask stage for supporting two-dimensionally moving masks and a substrate stage for supporting two-dimensionally moving photosensitive substrates, and transfers the mask pattern onto the photosensitive substrate while sequentially moving the mask stage and the substrate stage. In the exposure process, it is necessary to superimpose the image of the pattern to be laminated next with respect to the pattern already formed on the substrate, so that alignment of the short region on the substrate with the mask having the pattern of the next layer (positioning) Is executed.

Usually, in the substrate alignment process, pre-alignment processing, which is a preliminary alignment when the substrate is loaded onto the substrate stage, and two or three search marks formed on the substrate while the substrate is supported by the substrate stage The search alignment processing to roughly align using the same, and the fine alignment processing to precisely align the substrate using the results of the search alignment processing are executed. Among these, in the fine alignment process, the deviation or rotation of the two-dimensional direction (plane direction, XY direction) of the substrate with respect to the reference position is determined from the result of the search alignment, and the design of each shot area (alignment mark) is based on these. Fine alignment of the substrate by correcting the position (measurement value or calculated value) used for pattern transfer in the image position or the previous layer, and using this correction position to guide the alignment mark into the measurement area of the alignment optical system and detect it. Is running.

Here, as a fine alignment method, there is an EGA (Enhanced Global Allignment) system, in addition to a die-by-die alignment system that detects an alignment mark for each shot region on the substrate and performs alignment with a pattern transferred onto the substrate. . The EGA method detects positions of alignment marks respectively attached to at least three shot regions (which are called sample shot regions) selected from a plurality of shot regions on a substrate, and detects the actual position and design position of the alignment shot region (or its The position of each shot region on the substrate is statistically calculated by the approximate calculation process using the correction position. As a result, the substrate is sequentially moved in accordance with the calculated position, and transferred to each of the plurality of shot regions in a state where the pattern of the mask of the next layer is properly aligned. The measurement area of the alignment optical system is set around the design position of the search mark in the search alignment process, and is set around the design position of the alignment mark or the correction position thereof in the fine alignment process. The alignment optical system detects a mark in the measurement area.

By the way, for example, in the manufacture of a semiconductor device, an alignment mark may be shifted for each layer to be transferred, and in this case, if the alignment mark used in the previous layer (or the previous layer) is recognizable through the upper layer, the alignment to be detected is an alignment. A mark of the same kind (a mark of the previous layer) is present in proximity to the mark. If alignment marks are present in close proximity, even if the alignment mark to be detected is guided to the measurement area of the alignment optical system based on the precision of the pre-alignment, a plurality of homogeneous marks enter the measurement area or only marks other than the detection object If you enter the measurement area. In this case, since the conventional alignment optical system does not determine whether all the marks in the fine alignment are the detection targets or the marks in the measurement area are the detection targets, the position of the alignment short region is determined based on an incorrect alignment mark that is not the detection target. It may measure and deteriorate alignment accuracy remarkably.

Moreover, the alignment process of the next layer may be aligned using the alignment mark used by the previous layer (or the previous layer). Also in this case, it becomes difficult to specify the alignment mark for aligning the pattern of the next layer from a plurality of alignment marks including alignment marks of all layers (or previous layers).

In addition, in the conventional sequence of performing search alignment, it is necessary to prevent a search mark detection error at the time of search alignment. For this reason, on the board | substrate, the prohibition zone for prohibiting formation of the same pattern (similar to a search mark) around the search mark is formed. This prohibition zone is for avoiding false detection of the search mark by preventing other patterns from entering the measurement area when the search mark is guided to the measurement area of the alignment optical system. However, since the pattern transfer region on the substrate is reduced by the area of the forbidden zone, thereby restricting the arrangement of the circuit and the like, the presence of the forbidden zone is not preferable from the viewpoint of efficient use of the substrate.

Further, since the search mark on the substrate is formed by transferring the search mark formed on the mask to the substrate, the search mark is formed in each of the shot regions on the substrate. However, since the number of search marks on the substrate used in the search alignment process is two or three, many useless search marks not used in the search alignment process exist on the substrate. The presence of these search marks also reduces the pattern transfer region on the substrate, which is not preferable in view of efficient use of the substrate.

In the search alignment process, two or more search marks spaced apart on the substrate are respectively detected by the alignment optical system. However, after the alignment optical system detects the first search mark, the second search mark is detected within the measurement area of the alignment optical system. When the substrate is deformed, for example, since the actual relative position of the first search mark and the second search mark is different from the relative design position, the process of disposing the second search mark in the measurement area of the alignment optical system is performed. It doesn't run smoothly.

Further, in the alignment process, the alignment mark image detected by the alignment optical system is image processed, but the processing speed is faster when the mark position is detected after compressing the obtained mark image without performing the compression process. However, when the compression process is executed, in the case of a small mark, the mark image may be distorted, so that it is impossible to perform mark position detection.

When manufacturing a micro device, a CMP (chemical mechanical polishing) process may be performed to planarize the surface of the device. However, depending on the unevenness of the device surface, the device surface is inclined with respect to the polishing surface of the CMP apparatus. It may come in contact, and a grinding | polishing state may become nonuniform.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides a position detecting mark and a mark identification method capable of reliably detecting the mark of the detection target even when a large number of marks of the same kind exist in close proximity to the mark to be detected. For the purpose of In addition, by reliably detecting a mark to be detected, an exposure method capable of improving throughput by maintaining alignment accuracy even in a sequence in which fine alignment is performed without pre-alignment from pre-alignment can be performed. It aims to provide.

Disclosure of the Invention

In order to solve the said subject, in this invention, the above structure corresponding to FIGS. 1-25 shown in embodiment is employ | adopted.

The position detecting mark 10 of the present invention is formed on the object P and used as a position detecting mark used when detecting the position information of the object P by the position detecting device 9 (CONT). Observed by the position detecting device 9 (CONT), the first pattern 1 for outputting position information to the position detecting device 9, CONT, and the first pattern 1 are arranged in a predetermined positional relationship, the pattern of the N type (N≥2) is constituted by two n (n≥1) in combination, it characterized in that it has a second pattern (2) N represents the ⁿ types of information.

According to the mark identification method of the present invention, in order to detect the positional information of the object P using the detection apparatus 9 (CONT), the mark identification method is provided from a plurality of first marks 1A to 1E formed on the object P. As a mark identification method for identifying the 1 mark 1A, N is arranged on the object P together with the first marks 1A to 1E in a predetermined positional relationship with the first marks 1A to 1E. type is constituted by a pattern of (N≥2) n stars (n≥1) in combination, N ⁿ types of the second pattern (2) is formed, and the detection device (9, CONT) to a second pattern by indicating the information (2) is detected, and the specific 1st mark 1A is determined based on the information shown by the 2nd pattern 2, It is characterized by the above-mentioned.

The position detection method of the present invention is characterized by detecting the position information of the object P by detecting the specific first mark 1A determined by the mark identification method using the detection apparatus 9 (CONT). .

According to the present invention, by forming a second pattern accompanying a predetermined positional relationship with respect to a first pattern for outputting positional information, the shape of this second pattern is detected so as to be close to a mark to be detected. Even if a mark is present, it is possible to specify a mark for use in position detection from the plurality of marks. In addition, since the second pattern has a configuration in which n pieces of N types are combined, many kinds of information such as the N ⁿ types can be displayed without setting a wide area for arranging marks on the substrate. As a result, even if there are many marks of the same kind, the marks can be identified without narrowing the pattern transfer region on the substrate.

The exposure method of the present invention is an exposure method for transferring a predetermined pattern onto the substrate P, wherein the first pattern 1 for detecting the position information on the substrate P by the position detection device 9 (CONT). And a second pattern (n ≧ 1) in combination with the N patterns (N ≧ 2) arranged in a predetermined positional relationship with the first pattern (1), and representing N ⁿ kinds of information ( 2), the second pattern 2 is detected by the detection device 9 (CONT), and the positional information is detected from the first pattern 1 based on the information indicated by the second pattern 2; The predetermined pattern is transferred onto the substrate P by relatively moving the substrate P and the predetermined pattern based on the detected positional information.

According to the present invention, since the second pattern accompanying the predetermined pattern is formed with respect to the first pattern for outputting the position information, by detecting the form of the second pattern, the second pattern is similar to the pattern to be detected. Even when there are a plurality of patterns of, a first pattern for use in position detection can be specified from the plurality of patterns based on the information indicated by the second pattern. Therefore, the alignment process can be performed with good precision using this 1st pattern, and an exposure precision can be improved. In addition, since the second pattern has a configuration in which n pieces of N types are combined, many types of information, such as N ⁿ types, do not have to be set to a wide area for arranging the first pattern for detecting positional information on the substrate. Can be displayed. Therefore, even if the same type of pattern exists, the first pattern for use in position detection can be specified, and the exposure process can be executed with good accuracy without narrowing the predetermined pattern transfer area on the substrate.

The exposure method of the present invention is an exposure method for transferring a predetermined pattern onto a substrate P. The exposure method is provided on the substrate P in a predetermined positional relationship with respect to the first pattern 1 and the first pattern 1. Relative position information of the first pattern 1 and the second pattern 2 of the specific marks 1 and 10 of the marks 1 and 10 formed on the substrate P and formed of the second pattern 2. Is detected, and based on the relative position information, the position information of a mark 1 ′ different from the specific mark 1 among the plurality of marks 1 formed on the substrate P is determined, and the position information is determined. It is characterized by transferring the predetermined pattern on the substrate P by moving the substrate P and the predetermined pattern relatively.

According to the present invention, by detecting the relative position information of the first pattern and the second pattern of the specific mark, for example, information on the amount of deformation and rotation of the substrate can be obtained. Even when the relative position is different from the relative position in the design, it is possible to determine the position information of the mark separate from the specific mark based on the obtained information. Therefore, when a separate mark is detected after detecting a specific mark in the measurement area of the position detection device, it is possible to smoothly move the substrate for placing the separate mark in the measurement area of the position detection device.

In the mark detection method of the present invention, the mark detection apparatus 9 (CONT) of the image processing method having a predetermined measurement area is used to establish a predetermined positional relationship with the first mark 1 and the first mark 1. In the mark detection method for detecting the second mark (2) on the object (P) having the second mark (2) smaller than the first mark (1), the image of the measurement area is picked up to obtain image data, Image data is compressed, and the positional information of the first mark 1 is detected from the compressed image data, and the positional information of the detected first mark 1, the first mark 1 and the second mark 2 The positional information of the second mark 2 is detected from the image data obtained by imaging the measurement area, based on the relative positional information of "

In the exposure method of the present invention, the mark detection device 9 (CONT) of the image processing method having a predetermined measurement area is used to have a predetermined positional relationship with the first mark 1 and the first mark 1. The second mark 2 is detected on the substrate P on which the second mark 2 smaller than the first mark 1 is formed, the mask M and the substrate P are aligned, and then the mask M In an exposure method for exposing a pattern to a substrate P, the image of the measurement area is picked up to obtain image data, and the image data is compressed to obtain position information of the first mark 1 from the compressed image data. The second mark 2 from the image data obtained by imaging the measurement area based on the detected position information of the first mark 1 and the relative position information of the first mark 1 and the second mark 2. It is characterized in that for detecting the position information.

According to the present invention, for example, in the case where the mark detection device is a detection device of an image processing method, the detection of a mark after compressing the image data may improve the processing speed. Problems such as distortion of an image may occur. However, by forming the first mark which is in a predetermined positional relationship with this second mark and larger than the second mark, the image data of this first mark is not distorted even if it is compressed. Therefore, the positional information of the first mark can be detected using the compressed image data of the first mark, and the positional information of the second mark can be efficiently obtained based on the detection result.

The mark detection method of the present invention is a mark detection method for detecting marks 1 and 2 on an object P by using mark detection devices 9 and CONT having a predetermined measurement area. The non-target mark 2 is formed around 1) at substantially equal intervals, and the target mark 2 is detected.

In the exposure method of the present invention, the marks 1 and 2 on the substrate P are detected using the mark detection apparatus 9 and CONT having a predetermined measurement area, and the mask M and the substrate P are positioned. In the exposure method of exposing the pattern of the mask M to the board | substrate P after matching, the non-target mark 2 is formed in substantially equal intervals around the target mark 1 to be detected, and the target mark 1 ) Is detected.

According to the present invention, by forming a non-target mark at substantially equal intervals around the target mark, for example, in the case of chemical mechanical polishing (CMP) of the device, the surface of the device is inclined against the polishing surface of the CMP apparatus. The problem can be avoided, and the polishing treatment can be performed with good accuracy.

The position information detection method of the present invention detects the target mark 2 formed on the object P by using the mark detection device 9 (CONT) which detects the mark by a predetermined detection method, and based on the detection result. A positional information detecting method for detecting positional information of an object P, comprising: a non-target mark having high detectability with respect to a predetermined detection method formed on the object P to have a predetermined positional relationship with the target mark 2 ( 1) is detected by the mark detection apparatus 9 (CONT), and the target mark 2 is detected by the mark detection apparatus 9 (CONT) based on the detection result of the non-target mark 1 and a predetermined positional relationship, The positional information of the object P is detected based on the detection result of the target mark 2.

According to the present invention, when detecting a target mark, after detecting the non-target mark at a high processing speed by detecting a non-target mark having high detectability and having a predetermined positional relationship with the target mark, the detection result of the non-target mark is detected. It is possible to efficiently detect the target mark based on and the predetermined positional relationship.

The mark of the present invention is a mark formed on the object P and used for detecting positional information of the object. The marks P1 and P2 are disposed at any position in the predetermined mark area A1 secured on the object P, and indicate information by the position in the mark area.

According to the present invention, since the information is expressed by the position information of the mark, more information can be expressed compared to expressing the information with or without the simple mark.

In addition, the mark of the present invention is a mark formed on the object P and used for detecting the positional information of the object, and has a predetermined positional relationship with the first mark region 1 and the first mark region. A first mark for detecting positional information of the object in the first mark area, the second mark area A1 being formed, and disposed in an arbitrary position within the second mark area in the second mark area; Two marks 2, P1 and P2 are formed to show information about the first mark based on the position of the second mark in the second mark region.

The exposure apparatus of the present invention comprises a detection means (9) for detecting positional information of a substrate by detecting a mark formed in a mark region composed of a first mark region and a second mark region on a substrate (P), and the detection means is electrically connected to the detection means. An exposure apparatus connected to the circuit board and including driving means (CONT, PST, PSTD) for relatively moving the predetermined pattern and the substrate based on the positional information of the substrate detected by the detecting means, the exposure apparatus transferring the predetermined pattern onto the substrate, The mark which is detected by the detecting means is detected by the detecting means, and the first mark 1 which generates a signal indicating the positional information of the substrate to the detecting means, and the mark disposed at an arbitrary position in the second mark area. Two marks 2, P1, and P2 are provided, and the detection means detects the information on the first mark based on the position of the second mark in the second mark area A1.

The exposure method of the present invention is an exposure method for transferring a predetermined pattern onto a substrate (P), wherein a mark (2) formed in a mark region composed of a first mark region (1) and a second mark region (A1) on a substrate. And detecting the positional information of the substrate by detecting the position information, and exposing the predetermined pattern by relatively moving the predetermined pattern and the substrate based on the positional information of the substrate detected by the detection means. And the first mark 1 which generates the position signal of the substrate by being detected in the detection step and an arbitrary position in the second mark region, and the information about the first mark is determined by the position in the second mark region. As a mark having the second marks 2, P1, and P2 shown, information on the first mark is detected based on the position of the second mark in the second mark area.

The manufacturing method of the present invention is a method of manufacturing an exposure apparatus for exposing a predetermined pattern onto a substrate P, the method comprising: a mark region composed of a first mark region 1 and a second mark region A1 on a substrate. Detection means 9 for detecting positional information of the substrate by detecting the formed mark, and driving means (CONT, PST, PSTD) for moving the substrate to a position where the substrate is to be exposed based on the positional information of the substrate detected by the detection means. ), The mark is detected by the detecting means, and the first mark 1 for generating a signal indicating the positional information of the substrate to the detecting means, and the second arranged at an arbitrary position in the second mark region. It is provided with the mark 2, and the detection means 9 detects the information regarding the 1st mark based on the position of the 2nd mark 2, P1, P2 in the 2nd area | region A1.

According to the present invention, since the information is expressed by the positional information of the mark, more information can be expressed compared to expressing the information with or without a simple mark.

The mark of the present invention is a mark formed on the object P and used for detecting the positional information of the object, and extending in the first direction within a predetermined mark area secured on the object (Fig. 23). -P1) and a horizontal pattern portion (Fig. 23-P2) extending in a second direction crossing the first direction in the mark area, the information being represented by the intersection position of the vertical pattern portion and the horizontal pattern portion.

According to the present invention, since the information is expressed by the positional information of the mark, more information can be expressed compared to expressing the information with or without a simple mark. Further, since the vertical pattern portion extends in the first direction long, if a portion of the vertical pattern portion can be detected, the position of the vertical pattern can be detected, and since the horizontal pattern portion extends in the second direction, the horizontal pattern portion If a part of the image can be detected, the position of the horizontal pattern can be detected, and the intersection position of the vertical pattern portion and the horizontal pattern portion can be obtained from the result, so that the position of the detection area of the detection device relative to the pattern portion is relatively determined. It becomes possible to allow the precision at the time of provision.

The mark of the present invention is a mark formed on the object P and used for detecting the positional information of the object. The mark is the first mark region 1 and the second mark having a predetermined positional relationship with the first mark region. A second mark including the area A1, wherein a first mark for detecting positional information of the object is formed in the first mark area, and disposed in an arbitrary position within the second mark area in the second mark area; (2) is formed, and the 2nd mark extends in the 2nd direction which cross | intersects the vertical pattern part (FIG. 23-P1) in a 1st direction in a 2nd area | region, and a 1st direction in a 2nd area | region. 23-P2 provided, and the information regarding a 1st pattern is shown by the intersection position of a vertical pattern part and a horizontal pattern part.

In the exposure apparatus of the present invention, detection means (9) for detecting positional information of a substrate by detecting a mark formed in a mark region composed of a first mark region (1) and a second mark region (A1) on a substrate (P). And drive means (CONT, PST, PSTD) electrically connected to the detection means and relatively moving the predetermined pattern and the substrate based on the positional information of the substrate detected by the detection means. An exposure apparatus for transferring, wherein a mark detected by a detection means extends in a first direction within a second mark and a first mark for generating a signal indicating position information of a substrate to the detection means by being detected by the detection means. A second mark 2 composed of a vertical pattern portion (Fig. 23-P1) and a horizontal pattern portion (Fig. 23-P2) extending in a second direction crossing the first direction in the second region, and detecting The means includes the vertical pattern portion and the horizontal pattern portion of the second mark. Information about the first mark is detected based on the intersection position.

The exposure method of the present invention is an exposure method for transferring a predetermined pattern onto a substrate P, wherein a mark formed in a mark region composed of the first mark region 1 and the second mark region A1 on the substrate is detected. Thereby detecting the positional information of the substrate, and exposing the predetermined pattern by relatively moving the predetermined pattern and the substrate based on the positional information of the substrate detected by the detection means, wherein the mark is detected in the detection process. Thereby generating a position mark of the substrate, a longitudinal pattern portion (FIG. 23-P1) extending in the first direction in the second region, and a second direction crossing the first direction in the second region. The 2nd mark 2 provided with the extending horizontal pattern part (FIG. 23-P2) is provided, and the information regarding a 1st mark is detected based on the intersection position of a vertical pattern part and a horizontal pattern part.

The manufacturing method of the present invention is a method of manufacturing an exposure apparatus for exposing a predetermined pattern onto a substrate (P), the method comprising: a mark region composed of a first mark region (1) and a second mark region (A1) on a substrate. Detection means 9 for detecting positional information of the substrate by detecting the formed mark, and driving means (CONT, PST, PSTD) for moving the substrate to a position where the substrate is to be exposed based on the positional information of the substrate detected by the detection means. ), The mark is detected by the detection means, and the first mark for generating a signal indicating position information of the substrate to the detection means, the vertical pattern portion P1 extending in the first direction in the second area; And a second mark 2 having a horizontal pattern portion P2 extending in a second direction crossing the first direction in the second region, wherein the detection means is transverse to the vertical pattern portion of the second mark. Based on the intersection of the pattern portion, information about the first pattern Shipping is also characterized in that.

According to the present invention, since the information is expressed by the positional information of the mark, more information can be expressed compared to expressing the information with or without a simple mark. Further, since the vertical pattern portion extends in the first direction long, if a portion of the vertical pattern portion can be detected, the position of the vertical pattern can be detected, and since the horizontal pattern portion extends in the second direction, the horizontal pattern portion When a part of the image can be detected, the position of the horizontal pattern can be detected, and the intersection position of the vertical pattern portion and the horizontal pattern portion can be obtained. Therefore, when the position of the detection area of the detection apparatus is relatively given to the pattern portion, It is possible to relax the precision of.

The mark of the present invention is a mark formed on an object and used for detecting positional information of an object, the mark having a pattern portion extending in a first direction in the mark region, The information is expressed based on the position with respect to the intersecting second direction.

According to the present invention, since the information is expressed by the positional information of the mark, more information can be expressed compared to expressing the information with or without a simple mark. In addition, since the pattern portion extends long in the first direction, if a portion of the pattern portion can be detected, the position of the pattern can be detected, and the position of the detection area of the detection apparatus relative to the pattern portion can be detected. It becomes possible to allow precision. In addition, since the position of the pattern portion needs only to be detected only in the second direction, that is, in one direction, the detection process can be simplified.

The mark of the present invention is a mark formed on the object P and used for detecting the positional information of the object. The mark is the first mark region 1 and the second mark having a predetermined positional relationship with the first mark region. An area A1, and having a first mark formed in the first mark area and used for detecting positional information of the object, and extending in a first direction in the second area (Fig. 24-P1); And a second mark indicating the information on the first mark by the position of the pattern portion in the second area in the second direction crossing the first direction.

In the exposure apparatus of the present invention, detection means (9) for detecting positional information of a substrate by detecting a mark formed in a mark region composed of a first mark region (1) and a second mark region (A1) on a substrate (P). And drive means (CONT, PST, PSTD) electrically connected to the detection means and relatively moving the predetermined pattern and the substrate based on the positional information of the substrate detected by the detection means. An exposure apparatus for transferring, wherein a mark detected by a detecting means is formed in a first mark region, and the first mark and second region (which generate a signal indicating position information of a substrate to the detecting means by detecting by a detecting means). It consists of the 2nd mark 2 provided with the pattern part (FIG. 24-P1) extended in a 1st direction in FIG. 24-A1, and a detection means is made from the pattern part in the 2nd area | region of a 2nd mark. Relative to the first mark based on the position in the two directions Detect information.

The exposure method of the present invention is an exposure method for transferring a predetermined pattern onto a substrate P, wherein a mark formed in a mark region composed of the first mark region 1 and the second mark region A1 on the substrate is detected. Thereby detecting the positional information of the substrate; and exposing the predetermined pattern by relatively moving the predetermined pattern and the substrate based on the detected positional information of the substrate. And a second mark (2) having a pattern portion (FIG. 25-P1) extending in the first direction in the second area (A1) for generating a? The information on the first mark is detected based on the position of the pattern portion in the second area in the second direction crossing the first direction.

The manufacturing method of the present invention is a method of manufacturing an exposure apparatus for exposing a predetermined pattern onto a substrate P, the method comprising: a mark region composed of a first mark region 1 and a second mark region A1 on a substrate. Detecting means 9 for detecting positional information of the substrate by detecting the formed mark, and driving means for moving the substrate to a position where the substrate is to be exposed based on the positional information of the substrate detected by the detecting means, And a first mark for generating a signal indicating the positional information of the substrate by the detection means, and a pattern portion (Fig. 24-P1) extending in the first direction in the second area. And a second mark (2) representing information on the first mark based on a position in the second direction that intersects with the first direction in the pattern portion in the second area, wherein the detection means includes the second area. Position of the pattern part in the inside To detect the information about the first base marks.

According to the present invention, since the information is expressed by the positional information of the mark, more information can be expressed compared to expressing the information with or without a simple mark. In addition, since the pattern portion extends long in the first direction, if a portion of the pattern portion can be detected, the position of the pattern can be detected, and the position of the detection area of the detection apparatus relative to the pattern portion can be detected. It becomes possible to allow precision. The position of the pattern portion needs only to be detected only in the second direction, that is, in one direction, so that the detection step can be simplified.

Brief description of the drawings

1 is a schematic configuration diagram showing an embodiment of an exposure apparatus according to the present invention.

2 is a diagram showing a first embodiment of the position detection mark of the present invention.

3A is a diagram illustrating an example of a position detection mark according to the first embodiment of the present invention.

3B is a diagram illustrating an example of a position detection mark according to the first embodiment of the present invention.

3C is a diagram illustrating an example of a position detection mark according to the first embodiment of the present invention.

3D is a diagram illustrating an example of a position detection mark according to the first embodiment of the present invention.

3E is a diagram illustrating an example of a position detection mark according to the first embodiment of the present invention.

3F is a diagram illustrating an example of a position detection mark according to the first embodiment of the present invention.

4A is a diagram illustrating a state in which a mark for position detection is detected using a position detection device.

4B is a diagram illustrating an example of an image pickup signal output by the X-axis image pickup device.

4C is a diagram illustrating an example of an imaging signal output by the Y-axis imaging device.

5 is a flowchart for explaining the outline of the alignment process.

6 is a diagram illustrating a plurality of position detection marks arranged in the measurement area of the position detection device.

Fig. 7 is a flowchart showing a first embodiment of the mark identification method of the present invention.

8 is a diagram for explaining a first embodiment of the mark identification method of the present invention.

9 is a diagram for explaining a first embodiment of the mark identification method of the present invention.

It is a figure which shows another embodiment of the position detection mark of this invention.

Fig. 11A is a diagram showing a second embodiment of the position detection mark and mark identification method of the present invention.

Fig. 11B is a diagram showing a second embodiment of the position detection mark and mark identification method of the present invention.

Fig. 11C is a diagram showing a second embodiment of the position detection mark and mark identification method of the present invention.

11D is a diagram showing a second embodiment of the position detection mark and mark identification method of the present invention.

Fig. 11E is a diagram showing a second embodiment of the position detection mark and mark identification method of the present invention.

Fig. 11F is a diagram showing a second embodiment of the position detection mark and mark identification method of the present invention.

Fig. 11G is a diagram showing a second embodiment of the position detection mark and mark identification method of the present invention.

Fig. 11H is a diagram showing a second embodiment of the position detection mark and mark identification method of the present invention.

Fig. 11I is a diagram showing a second embodiment of the position detection mark and mark identification method of the present invention.

Fig. 11J is a diagram showing a second embodiment of the position detection mark and mark identification method of the present invention.

Fig. 11K is a diagram showing a second embodiment of the position detection mark and mark identification method of the present invention.

Fig. 11L is a diagram showing a second embodiment of the position detection mark and mark identification method of the present invention.

Fig. 12 is a diagram showing a third embodiment of the position detection mark and mark identification method of the present invention.

It is a figure for demonstrating the operation | movement of the position detection mark of 3rd Embodiment of this invention.

It is a figure for demonstrating the operation | movement of the position detection mark of 3rd Embodiment of this invention.

It is a figure for demonstrating the operation | movement of the position detection mark of 3rd Embodiment of this invention.

It is a figure for demonstrating the operation | movement of the position detection mark of 3rd Embodiment of this invention.

It is a figure for demonstrating the operation | movement of the position detection mark of 3rd Embodiment of this invention.

Fig. 14A is a diagram showing a fourth embodiment of the position detection mark and mark identification method of the present invention.

14B is a diagram showing a fourth embodiment of the position detection mark and mark identification method of the present invention.

14C is a diagram showing a fourth embodiment of the position detection mark and mark identification method of the present invention.

Fig. 15A is a diagram showing another example of the fourth embodiment of the position detection mark and mark identification method of the present invention.

15B is a diagram showing another example of the fourth embodiment of the position detection mark and mark identification method of the present invention.

Fig. 16 is a diagram showing a fifth embodiment of the position detection mark and mark identification method of the present invention.

17 is a diagram for explaining a sixth embodiment of the mark identification method of the present invention.

18 is a flowchart for explaining the seventh embodiment of the mark identification method of the present invention.

19A is a diagram for explaining a seventh embodiment of the mark identification method of the present invention.

19B is a diagram for explaining a seventh embodiment of the mark identification method of the present invention.

20A is a diagram for explaining an eighth embodiment of the mark identification method of the present invention.

20B is a diagram for explaining an eighth embodiment of the mark identification method of the present invention.

20C is a diagram for explaining an eighth embodiment of the mark identification method of the present invention.

20D is a diagram for explaining an eighth embodiment of the mark identification method of the present invention.

It is a figure which shows 9th Embodiment of the position detection mark of this invention.

It is a figure for demonstrating the operation | movement of the position detection mark which concerns on 9th Embodiment of this invention.

It is a figure for demonstrating the operation | movement of the position detection mark which concerns on 9th Embodiment of this invention.

Fig. 23A is a diagram for explaining a tenth embodiment of the mark identification method of the present invention.

Fig. 23B is a diagram for explaining a tenth embodiment of the mark identification method of the present invention.

Fig. 23C is a diagram for explaining a tenth embodiment of the mark identification method of the present invention.

Fig. 23D is a diagram for explaining a tenth embodiment of the mark identification method of the present invention.

Fig. 23E is a diagram for explaining a tenth embodiment of the mark identification method of the present invention.

It is a figure for demonstrating the application example of 10th Embodiment of this invention.

25A is a diagram for explaining an eleventh embodiment of the mark identification method of the present invention.

25B is a diagram for explaining an eleventh embodiment of the mark identification method of the present invention.

25C is a diagram for explaining an eleventh embodiment of the mark identification method of the present invention.

25D is a diagram for explaining an eleventh embodiment of the mark identification method of the present invention.

26 is a flowchart illustrating an example of a process of manufacturing a semiconductor device.

Best Mode for Carrying Out the Invention

1st Embodiment

EMBODIMENT OF THE INVENTION Hereinafter, 1st Embodiment of the mark identification method and exposure method of this invention is described, referring drawings. In this embodiment, the mark identification method of the present invention is applied to an alignment step of an exposure apparatus (so-called scanning stepper) that exposes a pattern of a mask to a photosensitive substrate by a step-and-scan method. to be. Incidentally, the term "photosensitive substrate" as used herein includes a coating of a resist on a semiconductor wafer, and the term "mask" includes a reticle in which a device pattern to be projected on a photosensitive substrate is formed.

In FIG. 1, the exposure apparatus EX is supported by a mask stage MST that supports the mask M, a substrate stage PST that supports the photosensitive substrate P, and a mask stage MST. The illumination optical system IL for illuminating the mask M with the exposure light EL, and the photosensitive substrate P for holding the pattern of the mask M illuminated by the exposure light EL on the substrate stage PST. And a projection optical system PL for projecting exposure to the light. The exposure apparatus EX in this embodiment is a so-called scanning stepper. In the following description, the synchronous movement direction of the mask M and the photosensitive substrate P in a plane perpendicular to the Z axis direction and the Z axis direction in the direction coinciding with the optical axis AX of the projection optical system PL. The direction perpendicular to the X-axis direction, Z-axis direction, and X-axis direction is made into the Y-axis direction.

The illumination optical system IL illuminates the mask M supported by the mask stage MST by the exposure light EL, and is an optical integrator and an optical integrator that equalize the illuminance of the light beam emitted from the light source and the light source. And a condenser lens for condensing the exposure light EL from the grater, a relay lens system, and a variable field stop for setting the illumination region on the mask M by the exposure light EL to a slit shape. Examples of the exposure light EL emitted from the illumination optical system IL include atoms such as ultraviolet rays (g-ray, h-ray and i-ray) and KrF excimer laser light (wavelength 248 nm) in the ultraviolet region emitted from the mercury lamp. External light (DUV light), vacuum ultraviolet light (VUV) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) and the like are used.

The mask stage MST supports the mask M, and the two-dimensional movement and the minute rotation in the plane perpendicular to the optical axis AX of the projection optical system PL with respect to the base 3, that is, in the XY plane It is possible. The mask stage MST is driven by a drive device MSTD such as a linear motor, and the drive device MSTD is controlled by a control device CONT that collectively controls the operation of the entire exposure apparatus.

The projection optical system PL is composed of a plurality of optical elements (lenses), and these optical elements are supported by a barrel. In the present embodiment, the projection optical system PL is a reduction system whose projection magnification is for example 1/4 or 1/5. The projection optical system PL may be either an equal magnification system or an enlargement system. The projection optical system PL also has an imaging characteristic control device (not shown) for correcting optical characteristics. This imaging characteristic control apparatus is, for example, by adjusting the interval of a part of the lens group constituting the projection optical system PL, or by adjusting the gas pressure in the lens chamber of the part of the lens group, the projection magnification of the projection optical system PL, Correct optical characteristics such as distortion aberration. The imaging characteristic control device is controlled by the control device CONT.

The substrate stage PST supports the photosensitive substrate P. The substrate stage PST supports the photosensitive substrate P. The substrate stage PST supports the photosensitive substrate P in the plane perpendicular to the optical axis AX of the projection optical system PL, that is, in the XY plane. An XY stage for positioning in two dimensions, a Z stage for positioning the photosensitive substrate P in a direction parallel to the optical axis AX of the projection optical system PL, that is, a Z axis direction, and a photosensitive substrate P It is equipped with the (theta) stage which rotates a minute.

The movable mirror 6 is provided on the substrate stage PST. Moreover, the laser interferometer 7 is formed in the position which opposes the moving mirror 6. The movable mirror 6 is constituted by a plane mirror having a reflective surface perpendicular to the X axis and a plane mirror (not shown) having a reflective surface perpendicular to the Y axis. The laser interferometer 7 is constituted by an X-axis laser interferometer for irradiating a laser beam to the movable mirror 6 along the X axis and a Y-axis laser interferometer (not shown) for irradiating the laser beam to the movable mirror along the Y axis. The position (X coordinate, Y coordinate) of the board | substrate stage PST in the X direction and the Y direction is measured by the axis | shaft and Y-axis laser interferometer 7. Further, by arranging the two laser interferometers 7 in one of the X axis and the Y axis, the rotation angle of the substrate stage PST is measured from the difference between the two measured values. The measurement results of the positional information such as the X coordinate, the Y coordinate, and the rotation angle of the substrate stage PST by these laser interferometers 7 are output to the control device CONT, and the control device CONT monitors the position information. While controlling the positioning operation of the substrate stage PST through a drive device PSTD such as a linear motor. Although not shown in FIG. 1, the mask stage MST is also provided with a system having a plurality of laser interferometers, and positions of X coordinates, Y coordinates, rotation angles, and the like of the mask stage MST (mask M). Measure the information. These measurement results are output to the control apparatus CONT.

The exposure apparatus EX is provided with an off-axis alignment optical system (position detection apparatus, mark detection apparatus 9) provided separately from the projection optical system PL. The alignment optical system 9 has a rectangular measuring area, and is, for example, an alignment mark (mark for position detection) formed on the photosensitive substrate P for broadband light having a wavelength of about 550 to 750 nm emitted from a halogen lamp. ), The image of the indicator mark disposed on the surface conjugated with the surface of the photosensitive substrate P and the image of the alignment mark in the measurement area are detected by the imaging element CCD. The control apparatus CONT aligns the pattern image of the mask M and the shot region of the photosensitive substrate P using the alignment optical system 9, and then sets the mask stage MST to the optical axis of the projection optical system PL. Scan in the direction perpendicular to AX (+ X direction in this embodiment), and at the same speed as the projection magnification of the projection optical system PL in the reverse direction (-X direction), for example, in synchronism with this. By scanning at a ratio, the pattern image of the mask M is sequentially transferred (exposure) to each shot region on the photosensitive substrate P.

Next, the alignment mark formed on the photosensitive board | substrate P is demonstrated, referring FIG. FIG. 2 is a diagram showing a position detection mark 10 including an alignment mark 1 formed on the photosensitive substrate P. As shown in FIG.

As shown in FIG. 2, the position detection mark 10 is formed on the photosensitive board | substrate P, and the alignment detection system 9 detects the positional information in the XY plane of the photosensitive board | substrate P. As shown in FIG. As a mark used at this time, an alignment mark (first pattern, first mark: 1), an alignment mark 1, and a predetermined position for outputting position information to the alignment optical system 9 by being observed by the alignment optical system 9 The identification mark (2nd pattern, 2nd mark: 2) arrange | positioned in relationship is provided. The alignment mark 1 includes the Y detection mark 11 in which the pattern portion 11L and the space portion 11S are periodically arranged in the Y-axis direction, and the Y-detection portion, which extends a predetermined length in the X-axis direction in the drawing. The X detection mark 12 formed on both sides of the mark 11 in the X-axis direction and periodically arranged in the X-axis direction with a pattern portion 12L and a space portion 12S extending in a predetermined length in the Y-axis direction is provided. Have In the present embodiment, the plurality of pattern portions 11L are all the same length, and the plurality of space portions 11S are the same size (spacing) in the Y-axis direction, respectively. Similarly, the plurality of pattern portions 12L also have the same length, and the plurality of space portions 12S also have the same size (spacing) in the X-axis direction, respectively.

The identification mark 2 identifies the alignment mark 1 to be used for the alignment process among the plurality of alignment marks 1 formed on the photosensitive substrate P, and each of the plurality of alignment marks 1 is identified. It is formed incidentally. The identification mark 2 shown in FIG. 2 is comprised by arrange | positioning three types of character patterns A, B, and C in each of 4 area | regions R1-R4 arrange | positioned by the alignment mark 1 in predetermined positional relationship. do. The regions R1 to R4 are formed at predetermined positions (relative positions) preset with respect to the alignment mark 1, and the regions R1 and R2 are formed side by side in the X-axis direction, and the regions R3 and The regions R4 are formed side by side in the X-axis direction, the regions R1 and R3 are formed side by side in the Y-axis direction, and the regions R2 and R4 are formed side by side in the Y-axis direction. One of A, B, and C three types of character patterns is disposed in the area R1, and one of A, B, and C three types of character patterns is disposed in the area R2, and A is in the area R3. , Any one of B, C three kinds of character patterns are arranged, and in the region R4, any one of A, B, C three kinds of character patterns is arranged. Here, the character patterns A, B, and C arranged in each of the regions R1 to R4 are determined in accordance with the accompanying alignment mark 1. And the identification mark 2 can represent 34 types of information by arrange | positioning three types of character patterns in each of four area | regions.

Here, in the identification mark 2 shown in FIG. 2, although the number of areas is four of R1-R4 and the number of character patterns is three of A-C, the number n of areas and the number N of character patterns are 2 and is a natural number equal to or greater than the identification mark (2), N ⁿ may represent a type of information by arranging the character pattern of the N type to the n number of areas arranged in the alignment mark 1 and the predetermined positional relationship. In addition, the number n of areas may be set to 1, and any one of a plurality of character patterns may be selected and arranged for one area.

3A to 3F are diagrams showing an example of the configuration of the identification mark 2.

In the identification mark 2 shown to FIG. 3A, the character pattern A is formed in each of area | regions R1-R4. In the identification mark 2 shown in FIG. 3B, the character pattern A is formed in the region R1, the character pattern B is formed in the region R2, and the character pattern C is formed in the region R3. Is formed, and the character pattern A is formed in the area | region R4. In the identification mark 2 shown in FIG. 3C, the character pattern A is formed in the region R1, the character pattern B is formed in the region R2, and the character pattern C is formed in the region R3. Is formed, and there is no character pattern in the area R4. In this way, one of the four (n) regions R1 to R4 has no character pattern. Here, although the character pattern is formed in each of the areas R1 to R3 and there is no character pattern only in the area R4, the area without the character pattern may be any of the areas R1 to R4. That is, like the identification mark 2 shown in FIG. 3D, there is no character pattern in the area R3, and the character patterns A, B, and C are formed in each of the areas R1, R2, and R4. It may be. Here, the identification mark 2 of FIG. 3C and the identification mark 2 of FIG. 3D can be identified as other types. In the identification mark 2 shown in FIG. 3E, there are no character patterns in the regions R1 to R3, and the character pattern A is formed in the region R4. Thus, a character pattern can be formed only in one area | region of four (n) area | regions R1-R4. Here, the identification mark 2 of FIG. 3E and, for example, the identification mark 2 of FIG. 3A can be identified as other types. In the identification mark 2 shown in FIG. 3F, all regions of the regions R1 to R4 do not have a character pattern. In this way, it is also possible to have a configuration in which all regions of the four (n) regions R1 to R4 have no character pattern. Here, the identification mark 2 of FIG. 3F and, for example, the identification mark 2 of FIG. 3A can be identified as other marks.

FIG. 4A shows a state in which an image of the alignment mark 1 on the photosensitive substrate P is imaged on the indicator plate (not shown) having the indicator marks 20: 20A to 20D in the alignment optical system 9. Here, the alignment mark is illuminated by the alignment detection light, and the indicator mark 20 is illuminated by the illumination light independent of the alignment detection light. An image of the alignment mark 1 extends in an image of the Y detection mark 11 having the pattern portion 11L extending in a predetermined direction (X-axis direction) and in a direction orthogonal to the predetermined direction (Y-axis direction). It has an image of the X detection mark 12 having the pattern portion 12L to be formed, and each extending direction is conjugated with the X-axis direction and the Y-axis direction of the stage coordinate system. Then, two indicator marks 20A and 20B are formed in the indicator plate by sandwiching the image of the alignment mark 1 in the X axis direction, and two images of the alignment mark 1 are sandwiched in the Y axis direction. Two indicator marks 20C and 20D are formed, and these indicator marks 20A to 20D are arranged in conjugate with the surface of the photosensitive substrate P. As shown in FIG. Moreover, in the alignment optical system 9, the X-axis imaging element which scans in the direction corresponding to the X-axis direction, and the Y-axis imaging element which scans in the direction corresponding to the Y-axis direction are formed. The X-axis imaging device picks up an image in the detection area 21X in the X-axis direction by scanning in the direction crossing the indicator marks 20A, 20B and the pattern portion 12L. On the other hand, the Y-axis imaging device picks up an image in the detection area 21Y in the Y-axis direction by scanning in the direction crossing the indicator marks 20C, 20D and the pattern portion 11L. Then, the X-axis imaging device outputs an imaging signal (luminance data: SX) shown in FIG. 4B. In Fig. 4B, the signal portion 22X corresponds to the pattern portion 12L of the X detection mark 12, converts the captured image signal SX to analog / digital (A / D), and controls the controller CONT. By the image processing at, the X coordinate of the X detection mark 12 on the basis of the indicator marks 20A and 20B is detected. On the other hand, the Y-axis imaging device outputs an imaging signal (luminance data: SY) shown in Fig. 4C. In Fig. 4C, the signal portion 22Y corresponds to the pattern portion 11L of the Y detection mark 11, converts the captured image signal SY to analog / digital (A / D), and controls the controller CONT. By the image processing at, the Y coordinate of the Y detection mark 11 on the basis of the indicator marks 20C and 20D is detected.

And based on the measurement result of the board | substrate stage PST which the X- and Y-axis laser interferometers 7 output when the alignment mark 1 is imaged, the control apparatus CONT is the stage coordinate system of the alignment mark 1, Find the coordinates of the phase. The method of obtaining the coordinate value of the alignment mark 1 by imaging such an alignment mark image with an imaging element is called a FIA (Field Image Alignment) system, and in this embodiment, an alignment process is performed using the FIA system alignment optical system 9. In addition, the alignment mark which consists of the line and space used by this embodiment is a two-dimensional mark detected by the alignment detection system 9 of FIA system, and one mark has the position of X-axis direction and Y-axis direction as one mark. Can be detected. In addition, in the above description, it demonstrated on the assumption of the FIA system that the image of the alignment mark 1 image-forms on the indicator board, but the indicator board is arrange | positioned on the optical path separate from the optical path image of the alignment detection light, and the alignment mark 1 The same applies to the case in which the image of) and the image of the indicator mark are formed on the image pickup device.

Next, using the exposure apparatus EX provided with the alignment optical system (position detection apparatus 9) which has the above-mentioned structure, the alignment mark formed in the photosensitive board | substrate P is detected, and it exposes to the method of exposing process. This will be described with reference to FIGS. 5 to 7.

5 is a flowchart showing the outline of the operation of the exposure apparatus EX. With reference to FIG. 5, the outline | summary of the operation which focused on the alignment process during operation of the exposure apparatus EX is demonstrated.

First, each of the mask M and the photosensitive substrate P is conveyed with respect to each of the mask stage MST and the substrate stage PST. Here, when the photosensitive substrate P is transported and supported by the substrate stage PST, the physical shape of the photosensitive substrate P, for example, when the photosensitive substrate P is a wafer, an orientation flat plate or a notch is used. Thus, preliminary positioning of the photosensitive substrate P with respect to the substrate stage PST (preliminary alignment processing) is performed (step S1).

In addition, here, the alignment when the photosensitive board | substrate P is conveyed and supported by the board | substrate stage PST was called "preliminary process." The photosensitive board | substrate P was before being supported by the board | substrate stage PST. On the substrate conveyance path, when preliminary positioning is performed using the physical shape of the photosensitive substrate P, or before the photosensitive substrate P is supported by the substrate stage PST and the photosensitive substrate P Note that there is a case where preliminary positioning is performed by using the physical shape of the photosensitive substrate P in both immediately before being supported by the substrate stage PST, and these are collectively referred to as " prealignment processing ".

Subsequently, the exposure apparatus CONT determines whether the exposure treatment with respect to the photosensitive substrate P is the first exposure treatment, that is, whether it is the pattern transfer of the first layer to the photosensitive substrate P, or the pattern transfer after the second layer. (Step S2).

When it determines with the 1st exposure process, the control apparatus CONT synchronously moves the mask stage MST which supports the mask M, and the board | substrate stage PST which supports the photosensitive board | substrate P, and the illumination optical system The mask M is illuminated with the exposure light EL by IL, and the pattern of the mask M is exposed to each shot region of the photosensitive substrate P through the projection optical system PL (step S8).

The short array at this time is executed based on design data (short map data).

On the other hand, in step S2, when it is judged that the exposure process to the photosensitive board | substrate P is the exposure process after 2nd time, the control apparatus CONT detects the mark in a measurement area by the alignment optical system 9 ( Step S3).

Here, in the measurement area of the alignment optical system 9, the alignment mark used for alignment processing and the alignment mark not used for alignment processing may be inserted simultaneously, as demonstrated later using FIG. The control apparatus CONT identifies and specifies the alignment mark used by the alignment process among the some alignment mark inserted in the measurement area of the alignment optical system 9 (step S4).

When the control apparatus CONT specifies the alignment mark used for alignment processing from a plurality of alignment marks, the control apparatus CONT detects the position (coordinate value in a stage coordinate system) of this specified alignment mark (step S5).

Subsequently, the control apparatus CONT determines whether the position of the predetermined number of alignment marks has been detected (step S6).

If it is determined in step S6 that the predetermined number has not been reached, the control apparatus CONT returns to step S3. On the other hand, when it is determined that the predetermined number has been reached, the control apparatus CONT executes statistical calculation processing (EGA processing, etc.) using the detection positions of the plurality of alignment marks, and calculates the position of each shot area (step S7). ).

The control device CONT detects the position of the predetermined alignment mark on the photosensitive substrate P by the alignment optical system 9, and based on the base line amount managed in advance, the control device CONT of the mask M and the photosensitive substrate P is controlled. After aligning the shot regions, the photosensitive substrate P is sequentially moved in accordance with the calculation position of each shot region calculated in step S7, and the exposure light (with the pattern image of the mask M superimposed accurately for each shot region) EL) projects and exposes the pattern image of the mask M. FIG. At this time, the base line quantity used in step S8 is previously measured using the reference mark FM (refer FIG. 1) formed in the board | substrate stage PST.

Further, alignment processing is a series of processes from steps S3 to S7 which detect a plurality of alignment marks on the photosensitive substrate P and perform position detection (EGA processing) of each shot region.

Incidentally, a plurality of alignment marks are formed on the photosensitive substrate P corresponding to each of the plurality of short regions, and for example, alignment marks formed corresponding to each of the adjacent short regions may be disposed adjacent to each other. In this case, the alignment optical system 9 may insert a plurality of these adjacent alignment marks simultaneously in a measurement area. FIG. 6 shows a state in which a plurality of alignment marks 1A to 1E formed on the photosensitive substrate P are simultaneously arranged in the measurement region of the alignment optical system 9.

As shown in Fig. 6, on the photosensitive substrate P, a plurality of alignment marks 1A to 1E are formed corresponding to each of the adjacent shot regions SH1 and SH2, and the plurality of alignment marks 1A to 1E. Is detected simultaneously in the measurement area of the alignment optical system 9. Among these, the alignment marks 1A, 1B, and 1C are formed corresponding to the shot region SH1, and the alignment marks 1D and 1E are formed corresponding to the shot region SH2.

In addition, a plurality of layers are provided on the substrate to form a layer structure, and the alignment marks 1A and 1E are alignment marks formed on the uppermost layer (hereinafter referred to as "No. 3 layer"), The alignment marks 1B and 1D are alignment marks formed on all layers, that is, the lower layer of the No. 3 layer (hereinafter referred to as "No. 2 layer" as appropriate), and the alignment marks 1C are all layers, That is, it is an alignment mark formed in the lower layer of a No. 2 layer (henceforth "No. 1 layer"). The alignment marks are brought into proximity in this manner because the alignment marks formed in the previous layers may be observed. In FIG. 6, the alignment marks formed in the previous layer and the previous layer are aligned through the upper layer. Recognized state is shown in the figure.

In the identification mark 2 accompanying the alignment mark 1A, a character pattern A is formed in the region R1, a character pattern B is formed in the region R2, and in the region R3. The character pattern C is formed, and the character pattern A is formed in the area | region R4. In the identification mark 2 accompanying the alignment mark 1C, a character pattern A is formed in the region R1, a character pattern B is formed in the region R2, and in the region R3. The character pattern A is formed, and the character pattern C is formed in the area | region R4. In the identification mark 2 accompanying the alignment mark 1E, a character pattern A is formed in the region R1, a character pattern B is formed in the region R2, and in the region R3. The character pattern C is formed, and the character pattern C is formed in the area R4. On the other hand, in the identification mark 2 accompanying the alignment marks 1B and 1D, there is no character pattern in each of the areas R1 to R4. Thus, the alignment marks 1A to 1E and the identification marks 2 accompanying them are formed for each layer, and the identification marks 2 are formed so that the information displayed by the identification marks 2 is different for each layer. It is.

Hereinafter, in step S4 shown in FIG. 5, the circuit pattern of the next layer using the alignment mark (detection target mark; 1A) among the some alignment mark 1A-1E inserted in the measurement area of the alignment optical system 9 hereafter. A case of aligning the mask having the structure and the shot region SH1 on the photosensitive substrate P will be described.

Here, the control device CONT (or a storage device connected thereto) includes process data containing information on alignment marks (detection target marks) to be position detection objects, and positions of the respective shot regions on the photosensitive substrate P. FIG. The shot map data including the data and the position data of the marks in each shot area and the mark information are stored in advance.

The process data includes, for example, information that " alignment mark 1A is an alignment mark used for alignment processing when laminating a circuit pattern of a next layer on layer No. 3 ". Therefore, when the control apparatus CONT performs the exposure process using the mask M having the circuit pattern of the next layer, the control device CONT determines the alignment mark (detection target mark) for use, and then performs the alignment process with reference to this process data. .

The mark information is, for example, "the character pattern A in the area R1, the character pattern B in the area R2, the character pattern C in the area R3, and the character pattern A in the area R4. And the alignment marks are 1A, ”information regarding the shape and arrangement position of the three types of identification marks A to C attached to each of the plurality of alignment marks 1A to 1E. It includes. By referring to this mark information, the control apparatus CONT specifies the alignment mark 1A which is a detection target mark from the some alignment mark 1A-1E.

FIG. 7 is a flowchart showing the procedure for identifying the specific alignment mark (mark to be detected) 1A to be used for alignment processing from the plurality of alignment marks 1A to 1E (that is, a detailed view of step S4 in FIG. 5). .

First, the control apparatus CONT detects the mark in the measurement area of the alignment optical system 9 as mentioned above (step S3).

Here, the control apparatus CONT determines the detection target mark 1A with reference to the process data, reads the coordinate value of the detection target mark 1A from the short map data, and based on this coordinate value. The substrate stage PST is driven to control to continuously insert the detection target mark 1A into the measurement area of the alignment optical system 9. The control apparatus CONT inserts the luminance data in the measurement area of the alignment optical system 9 and performs image processing to detect a mark.

The control apparatus CONT first determines whether one or more alignment marks have been detected in the measurement area of the alignment optical system 9 (step S11).

That is, since the photosensitive board | substrate P is positioned by the prealignment of step S1, since a positional precision is low, a mark may not be detected at all in the measurement area of the alignment optical system 9. For this reason, the control apparatus CONT determines whether there is a mark in the measurement area.

When it is determined in step S11 that no mark is detected in the measurement area, the control device CONT determines whether the number of times of measurement area change has reached a predetermined number of times (step S12).

In step S12, when it is determined that the area change has reached a predetermined number of times, the control apparatus CONT displays an error. On the other hand, when it is determined that the area change has not reached the predetermined number of times, the control apparatus CONT changes the measurement area (step S13).

And the control apparatus CONT detects a mark using the alignment optical system 9 in the changed measurement area (step S3).

In addition, the change of the measurement area of step S13 is reduced by adjusting the alignment optical system 9 with respect to the measurement area centering on the target control value (coordinate value of the detection target mark 1A by short map data). A predetermined offset is added based on the coordinates of the detection target mark 1A from the short map data or the process of changing to the wide-area region of?), And the measurement area is moved based on the correction coordinate value. Processing to be performed.

On the other hand, when it is determined in step S11 that a plurality of alignment marks have been detected in the measurement area (that is, the state shown in Fig. 6), the control device CONT performs each alignment mark 1A based on the short map data. ˜1E is detected by the alignment optical system 9, the observed images of each of the alignment marks 1A to 1E detected by the alignment optical system 9 are image processed, and the respective identification of each of the alignment marks 1A to 1E is performed. The position is obtained (step S14).

That is, the alignment mark 1 has a pattern portion and a space portion as described with reference to Figs. 2 and 4, and includes an alignment optical system 9 and a control device CONT (position processing apparatus) of the image processing method (mark When the observed image observed by the detecting device) is subjected to image processing, the positional information is indicated by the luminance data. Therefore, as shown in the schematic diagram of FIG. 8, the control apparatus CONT performs image processing based on the detection result of the alignment optical system 9, for example, center position Oa-E of each alignment mark 1A-1E. Oe) can be obtained. The specific position of the alignment mark may be an edge position (see reference numeral Eg in FIG. 7) instead of the center position.

Next, the control apparatus CONT determines the position of the identification mark 2 accompanying each of the alignment marks 1A to 1E from the specific positions Oa to Oe of the alignment marks 1A to 1E obtained in step S14. Each is calculated | required (step S15).

That is, as shown in the schematic diagram of FIG. 9, each specific position (center position; OR1-OR4) of the area | regions R1-R4 of the identification mark 2 with respect to the specific position (center position; O) of the alignment mark 1 ) Is set in advance, and the relative position information is stored as the mark information (or short map data). The control device CONT refers to the mark information and, from the position (coordinate of the specific position; O) of the alignment mark 1 detected in step S14, the position of each area R1 to R4 of the identification mark 2 ( The coordinates of the specific position; OR1 to OR4) are obtained.

Moreover, in this embodiment, although it is the structure which calculate | requires the relative position of each area | region R1-R4 with respect to the center position O of the alignment mark 1, For example, the center position O of the alignment mark 1 is calculated | required. Obtain the position (relative position; OR1) of the region R1 with respect to the position (relative position; OR2 to OR4) of each of the regions R2 to R4 with respect to the position OR1 of the determined region R1. You can also do that.

Subsequently, the control apparatus CONT observes each of the areas R1 to R4 of the identification mark 2 obtained in step S15 using the alignment optical system 9, and controls each of the areas R1 to R4. The arranged character patterns A to C are detected (step S16).

The control apparatus CONT is the image of the character pattern A-C formed in each area | region R1-R4 of each identification mark 2 accompanying each alignment mark 1A-1E calculated | required in step S15. Is detected using the alignment optical system 9, and the observed image is subjected to image processing to obtain the shape (shape) of the character pattern arranged in each of the regions R1 to R4. Here, the control apparatus CONT compares the reference image previously stored as mark information with the observation image detected by the alignment optical system 9, and by the pattern matching method which examines the similarity of both images, each area | region ( The shape of the character pattern arranged in each of R1-R4) is calculated | required. The identification mark 2 is comprised by the character pattern which shows 34 types of information when the observation image observed by the position detection apparatus containing the alignment optical system 9 of the image processing system, and the control apparatus CONT was image-processed. As a result, the control apparatus CONT executes image processing based on the detection result of the alignment optical system 9, and can obtain the shape of the character pattern based on the pattern matching method.

Subsequently, the control device CONT refers to the mark information and aligns the alignment marks from the plurality of alignment marks 1A to 1E based on the information on the shape and arrangement of the character pattern of the identification mark 2 obtained in step S16. The detection target mark 1A to be used for the process is specified (step S17).

And the control apparatus CONT determines that the alignment mark used for the alignment process is 1A.

If it is determined that the alignment mark used for the alignment process is 1A, the control apparatus CONT aligns the short region SH1 of the mask M and the photosensitive substrate P using this alignment mark 1A ( Step S5).

Hereinafter, as described with reference to FIG. 5, after calculating the position of each shot region, the exposure process is executed.

As described above, the identification mark 2 is formed so as to accompany the alignment mark 1 for outputting the position information of the photosensitive substrate P in a predetermined positional relationship, thereby forming the identification mark 2. By detecting, even when alignment marks 1B to 1E of the same type are present in proximity to the alignment marks 1A to be detected, alignment marks for use in the alignment process from the plurality of alignment marks 1A to 1E. (1A) can be specified. And since the identification mark 2 is the structure which combined three pieces by arrange | positioning three types of character patterns in each of 4 area | regions R1-R4, it is for the alignment mark 1 to arrange | position on the photosensitive board | substrate P. Even if the alignment mark forming area is not set wide, 34 types of information can be displayed, and many alignment marks are formed for each layer, and even if there are alignment marks of the same kind in the measurement area, the photosensitive substrate P Marks can be identified without narrowing the circuit pattern forming area.

In the above embodiment, the positions Oa to Oe of the plurality of alignment marks 1A to 1E in the measurement area are obtained, and based on the obtained position information, the position of the identification mark 2 is referred to while referring to the mark information. The positions of the regions R1 to R4) are obtained, and the shapes of the character patterns A to C arranged in each of the regions R1 to R4 are obtained by the pattern matching method, but the alignment marks 1A to 1E are used. The position of each identification mark 2 can be obtained based on the shot map data, and the character pattern can be detected to identify the identification mark 2 without performing the position detection. And since the identification mark 2 and the alignment mark 1 are arrange | positioned in a predetermined positional relationship, based on the positional information of the identification mark 2 identified, the alignment mark 1A for use in alignment processing can be specified. Can be.

In the above embodiment, the character pattern is an alphabet letter of A to C, but is not limited to the alphabet letter, of course, and indicates N ⁿ kinds of information when the observed image observed by the position detection device of the image processing method is image processed. If it is a pattern, it does not matter, for example, the letter which contains numbers like "1", "2", "3", hiragana or katakana, " "," (Triangle | delta), and "(square)" may be sufficient.

In the said embodiment, although the identification mark 2 provided with four area | regions R1-R4 is the structure formed one with respect to one alignment mark 1, as shown in FIG. 10, one alignment mark is shown. It can also be set as the structure which provided two identification marks 2A and 2B with respect to (1). Thereby, 38 types of information can be displayed by arrange | positioning three types of character patterns A-C in each of the area | regions R1-R4 of two identification marks 2A, 2B. And the number of identification marks 2 is not limited to two, You may form three or more arbitrary numbers. Here, in FIG. 10, the identification mark 2A on the upper left side and the identification mark 2B on the lower right side with respect to the alignment mark 1 have the same relative position with respect to the alignment mark 1, for example, a photosensitive substrate When P is turned upside down (when rotated 180 ° around the Z axis), when detected in the measurement area of the alignment optical system 9, the control unit CONT does not distinguish the identification marks 2A and 2B. It is conceivable that a problem arises that, before performing mark detection with the alignment optical system 9, the photosensitive substrate with respect to the substrate stage PST is utilized by using the physical shape of the photosensitive substrate P (orientation flat or notch, etc.). Since the prealignment process (P) is executed, and the control apparatus CONT grasps the position of the photosensitive substrate P in the vertical direction in advance, the alignment process using the alignment optical system 9 is not disturbed.

2nd Embodiment

Next, a second embodiment of the position detection mark and mark identification method of the present invention will be described with reference to Figs. 11A to 11I. In the following description, the same or equivalent components as those of the first embodiment described above are denoted by the same reference numerals and the description thereof will be omitted or omitted.

In FIGS. 11A-11I, the identification mark 2 is comprised by the combination of the bit marks 30. In the present embodiment, the bit mark 30 is "□", but may be "○" or "Δ". Each of these bit marks 30 is formed in each of the regions R1 to R4 set in a predetermined positional relationship with respect to the alignment mark 1, similarly to the first embodiment. The number of areas of the identification mark 2 is not limited to four, but may be two or more natural numbers n.

In the example shown in FIG. 11A, the bit mark 30 is formed in each of the regions R1 to R4. In the example shown in FIG. 11B, the bit mark 30 is formed in each of the regions R1, R2, and R4, and there is no bit mark 30 in the region R3. In the examples shown in FIGS. 11C and 11F, one bit mark 30 is formed for the alignment mark 1, and in FIG. 11C, the bit mark 30 is formed in the region R1, and FIG. 11F. In the region R4, the bit mark 30 is formed. In the example shown in FIG. 11I, there is no bit mark 30 in each of the regions R1 to R4. Thus, the identification mark 2 is based on the number and arrangement | positioning of the area | region in which the bit mark 30 was formed among the four area | regions R1-R4, and the area | region in which the bit mark 30 was not formed, the bit mark 30 is carried out. In the case of using one type without, the 24 types of information obtained by combining two two types of marks, such as the presence or absence of the bit mark 30, can be represented.

When the control apparatus CONT specifies the alignment mark 1 for use in the alignment process from the plurality of alignment marks 1 accompanying these bit marks 30, it is similar to the procedure demonstrated using FIG. Each of the specified positions O of the plurality of alignment marks 1 is detected, and the positions of the regions R1 to R4 with respect to the alignment marks 1 are specified with reference to the bit map data. If the bitmap data contains information on the positions of the regions R1 to R4, the position of each of the regions R1 to R4 is not detected based on the information without detecting the specific position O of the alignment mark 1. Is determined. And the control apparatus CONT scans the X-axis imaging element and Y-axis imaging element of the alignment optical system 9 with respect to each of this specific area | region R1-R4 similarly to the procedure demonstrated using FIG. It detects which area | region is formed in (R1-R4), and in which area | region the pattern is not formed. The control apparatus CONT specifies the alignment mark 1 for use in the alignment process from the plurality of alignment marks 1 based on the detected arrangement information of the bit mark 30 and the mark information stored in advance. do.

Thus, since the identification mark 2 was identified by which pattern is formed in which area | region of four area | regions R1-R4, and which pattern is not formed, the example shown to FIG. 11C and FIG. 11F, for example As described above, even if the bit mark 30 is formed in the alignment mark 1, by detecting whether the bit mark 30 is formed in the region R1 or the region R4. 11C and 11F can be identified as being different identification marks 2.

In addition, in the above-described example, it has been explained to identify the identification mark 2 by which of the regions R1 to R4 is formed, and in which region the bit mark 30 is not formed. For example, after detecting the number of the bit marks 30, each of the detected bit marks 30 is detected, for example, an arrangement at a specific position such as an edge portion of the alignment mark 1, and the bit marks. The identification mark 2 may be identified based on the number and arrangement of the 30 (the number and arrangement of the areas where the bit mark 30 is formed). Instead of obtaining the relative position of each of the regions R1 to R4 with respect to the specific position of the alignment mark 1 (relative position of the bit mark 30 to the specific position of the alignment mark 1), the regions R1 to R4. ), And the identification mark 2 may be identified based on the relative position between the obtained areas R1 to R4 and the number of bit marks 30.

As described above, the identification mark 2 can also be constituted by arranging the bit marks 30 in each of the n areas R1 to Rn, whereby ^2N types of information can be represented. By forming the identification mark 2 by the bit mark 30, it is different from the character pattern of the first embodiment and does not require complicated image processing such as a pattern matching method, and mark identification is performed by a relatively simple image processing procedure. You can run

Third embodiment

Next, a third embodiment of the present invention will be described with reference to FIGS. 12 and 13A to 13E.

In FIG. 12, each of the four regions R1 to R4 of the identification mark 2 is disposed so as not to substantially overlap each other in the X-axis direction and the Y-direction. Then, by placing the bit mark 30 described in the second embodiment in each of these regions R1 to R4, the detection accuracy of the bit mark 30 by the alignment optical system 9, and furthermore, the identification mark 2 The identification precision of can be improved.

That is, the bit mark 30 is detected by scanning the X-axis imaging element and the Y-axis imaging element as described above. For example, as shown in Fig. 13A, the region R1 and the region R2 are in the X-axis direction. In the case where the bit mark 30 is formed in each of the region R1 and the region R2, the peaks of the imaging signal SX detected by the imaging device are two. On the other hand, when the bit mark 30 is formed in the area R1 and there is no bit mark 30 in the area R2, as shown in FIG. 13B, the peak of the imaging signal SX is one. By the way, although the bit mark 30 is formed in area | region R1 and there is no bit mark 30 in area | region R2, as shown to FIG. 13C, it corresponds to area | region R2 by noise, for example. A signal peak may occur in the part. In this case, even though there is no bit mark 30 in the region R2, there is a fear that the bit mark 30 is present in the region R2, which may be misdetected. In addition, even when the bit mark 30 is formed in each of the region R1 and the region R2 as shown in FIG. 13D, if there are three peaks due to noise, for example, any peak among the three peaks is the region. It may be difficult to grasp whether it corresponds to the bit mark 30 formed in R1 (or region R2). However, as illustrated in FIG. 13E, the imaging of the bit mark 30 disposed in the region R1 (or region R2) is performed by arranging the region R1 and the region R2 so as not to overlap each other in the X-axis direction. Since the signal has only one peak, even if noise or the like enters the imaging signal SX, signal peaks other than those corresponding to the region R1 can be judged to be based on noise, so that the noise component can be easily identified. Can be. The detection accuracy of the bit mark 30 can be improved by arranging each of the regions R1 to R4 so as not to overlap each other in the X-axis direction (or Y-axis direction).

In the present embodiment, each of the regions R1 to R4 is set at a position not overlapping with respect to each of the X-axis direction and the Y-axis direction, but with respect to any one of the X-axis direction and the Y-axis direction. It may be set at a position not overlapping.

Fourth embodiment

Next, a fourth embodiment of the present invention will be described with reference to FIG.

As shown to FIG. 14A-FIG. 14C, the identification mark 2 is arrange | positioned on the extension of the extension direction of the pattern part of the alignment mark 1. In the example shown to FIG. 14A, the identification mark 2 is formed in the alignment mark 1 in the position continuous to the + Y side of the pattern part 12L extended in the Y-axis direction, Y mark 11 for detection Of the three pattern portions 12L formed on the right side of the + Y side of the center pattern portion 12L and the Y detection mark 11 among the drawings of the three pattern portions 12L formed on the left side in the drawing of FIG. It is formed in the + Y side of the center pattern part 12L. In the example shown to FIG. 14B, the identification mark 2 is Y + of the pattern part 12L of the center among the three pattern parts 12L formed in the left side of the figure of the Y detection mark 11, and Y; In the drawing of the detection mark 11, it is formed in the -Y side of the center pattern part 12L among the three pattern parts 12L formed in the right side. Thus, 212 types of information can be represented by forming the identification mark 2 so that it may continue on each of the + Y side and -Y side of the six pattern part 12L of the X detection mark 12 in total.

The identification mark 2 can also be continued to the pattern portion 11L of the Y detection mark 11 in addition to the pattern portion 12L of the X detection mark 12. For example, in the example shown to FIG. 14C, the identification mark 2 is -X of the 3rd pattern part 11L from the top among the 6 pattern parts 11L of the Y detection mark 11 in the figure. It is formed on the side. In addition, in the example shown in FIG. 14C, the identification mark 2 is arrange | positioned in the detection area 21X (refer FIG. 4) of the X-axis imaging element of the alignment optical system 9, and there exists a possibility that it may affect alignment processing. Therefore, in this embodiment, from the viewpoint that it is preferable not to arrange the identification mark 2 in the detection areas 21X and 21Y of the imaging device, the pattern of the X detection mark 12 as shown in Figs. 14A and 14B. The structure which arrange | positions the identification mark 2 on extension of the extension direction of the part 12L is preferable. That is, in this embodiment, the identification mark 2 is arrange | positioned on the extension part of the extension part of the pattern part 12L in the outer part of the detection area 21X, 21Y of the imaging element of the alignment optical system 9. .

In addition to forming an identification mark by extending the length of the detection pattern in the extending direction as in the present embodiment, it is also conceivable to increase the number of detection patterns. For example, in the present embodiment, the pattern portions 12L are formed at three line portions on each side of the Y detection mark 11, but four of these are provided on one side and three on the other, or four on each side. By this, it is also possible to distinguish from the mark in which three line parts are formed in both sides.

In addition, in the case of the X-axis direction (Y-axis direction) exclusive detection mark 23 as shown in FIG. 15A, as shown in FIG. 15B, identification marks 23a, 23b, and 23c are connected in the form which connects a part of adjacent line parts. May be formed.

5th embodiment

Next, 5th Embodiment of this invention is described, referring FIG.

In FIG. 16, the mark for recognition larger than the identification mark 2 is attached to each of the alignment marks 1. In this embodiment, the letters "03" are located on the alignment marks 1A and 1E formed on the No. 3 layer as the mark for recognition, and "01" on the alignment marks 1 C formed on the No.1 layer. Are formed to accompany each letter. Thus, by forming a large recognition mark in the area | region on the photosensitive board P which is not used for alignment process or identification process, an operator can recognize a predetermined alignment mark easily from a plurality of alignment mark, and can specify it. . By setting the mark for recognition according to each layer, the operator can grasp, for example, on which layer the layer is to be processed, and thus the occurrence of an operator error can be reduced.

Further, by detecting the shape of the mark for recognition by the pattern matching method, the alignment mark 1 can be identified based on the detection result. That is, the mark for recognition can also be used as the identification mark 2.

6th embodiment

Next, a sixth embodiment of the present invention will be described with reference to FIG. 17.

In this embodiment, the identification mark 2 is not formed in each alignment mark 1, and the alignment optical system 9 is based on the information regarding the arrangement | positioning of the some alignment mark 1 detected in a measurement area. By using the alignment marks 1A to 1E detected in the measurement area, the detection target mark to be used for the alignment process is specified. In the following description, the case where the alignment mark 1A is specified from the some alignment mark 1A-1E is demonstrated.

As shown in FIG. 17, each of the plurality of alignment marks 1A to 1E is inserted into the measurement area of the alignment optical system 9. The control apparatus CONT obtains the specific position (center position; Oa-Oe) of each of the alignment marks 1A-1E arrange | positioned in a measurement area | region first.

The control apparatus CONT, with reference to the mark information, specifies the alignment mark 1A, which is a detection target mark, from the obtained arrangement of the center positions Oa to Oe. That is, the control apparatus CONT finds the relative position of each center position Oa-Oe, and finds the combination of the arrangement H which rotated "L" by 90 degree as shown by the solid line in FIG. Since the alignment mark 1A present in the corner portion of the arrangement H is the detection target mark, the control device CONT determines that the alignment mark 1A present in the corner portion is the detection target mark. It is specified. Here, in the measurement area, when there is no arrangement H indicated by the solid line, the optical element of the alignment optical system is adjusted to widen the measurement area, and the process is repeated until a combination of alignment marks having the arrangement H is found. do. On the other hand, when a similar arrangement H exists in the measurement area, the measurement area is moved or narrowed so that the alignment optical system is adjusted so that only one desired array H exists in the measurement area.

Moreover, although it is clear from FIG. 17, the arrangement H is the alignment mark 1A formed corresponding to the shot area SH1, and the alignment mark 1D formed corresponding to the shot area SH2 adjacent to the shot area SH1. Even if it is an arrangement composed of), it is not necessarily an arrangement composed of alignment marks having different layers, such as alignment mark 1A and alignment mark 1B.

In the present embodiment, the relative positions of the plurality of alignment marks 1A to 1E are obtained, and the detection target mark is specified from the relative position information. For example, the specific position of the circuit pattern formed in the shot area (Fig. 17. The relative positions of the alignment marks 1A to 1E with respect to the reference mark 17 are obtained, and the detection target marks (from the plurality of alignment marks 1A to 1E are based on the relative position information with respect to the specific position of the circuit pattern). 1A) may be specified.

7th embodiment

Next, a seventh embodiment of the present invention will be described with reference to FIG. 18. 18 is a flowchart of the alignment processing according to the present embodiment.

The circuit pattern, the alignment mark, and the identification mark formed in the mask M are exposed to the resist and transferred to the resist of all the layers of the photosensitive substrate P. FIG. Images of the circuit pattern, the alignment mark and the identification mark are formed in all the layers of the photosensitive substrate P (step SA1).

The development process is performed on the photosensitive substrate P on which the images of the alignment mark and the identification mark have been transferred. By the development process, the alignment mark 1 and the identification mark 2 are formed in the photosensitive substrate P in a predetermined positional relationship (step SA2).

The photosensitive board | substrate P by which the resist was apply | coated on all the layers is prealigned, and is conveyed to the board | substrate stage PST of the exposure apparatus EX. The control apparatus CONT detects the alignment mark 1 and the identification mark 2 formed in the photosensitive board | substrate P using the alignment optical system 9 (step SA3).

Here, the controller (CONT), the specific position of the alignment mark (1) as shown in Figure 19a (the center position; O _1), and identify a particular position of the mark (2) (the central position; O _2), the coordinates of The relative position information of the alignment mark 1 and the identification mark 2 is detected based on the detected coordinates (step SA4).

In addition, the control apparatus CONT performs alignment from the detected relative position information to when the alignment mark 1 and the identification mark 2 are formed on the photosensitive substrate P until the relative position information is detected. The amount of change in the distance between the mark 1 and the identification mark 2 or the amount of rotation of the photosensitive substrate P (short region) in the predetermined direction is determined (step SA5).

Control device as that is illustrated in Fig. 19a (CONT), the specific position (O ₁₎ and on the basis of the coordinates of a specific position (O _2), the amount of change in the distance of these specific position (O ₁ and O _2), or The amount of rotation θ of the photosensitive substrate P with respect to the X axis direction, which is a reference axis, is obtained. Scaling of the photosensitive substrate P (short region) is obtained from the change amount of the distance, and rotation of the photosensitive substrate P (short region) is obtained from the rotation amount θ. In this case, the information on the deformation of the photosensitive substrate P can also be detected based on the relative position information of the specific position O ₁ and the specific position O ₂ .

The control apparatus CONT corrects the design position of another alignment mark based on the obtained scaling and rotation (step SA6).

The control apparatus CONT determines the position of the alignment mark different from the detected alignment mark 1 based on the correction amount (step SA7).

That is, the alignment mark 1 can be used as a search alignment mark, and in this case, as shown in the schematic diagram of FIG. 19B, the control apparatus CONT is a plurality of spaced apart on the photosensitive substrate P by the alignment optical system 9. The mark is detected. Information on scaling, rotation, or deformation of the photosensitive substrate P is obtained from the alignment mark 1 and the identification mark 2 shown in FIG. 19A, and a correction amount is derived based on the obtained result. On the basis of the derived correction amount, it is possible to determine the position of the other alignment mark 1 'to be detected next. When the substrate stage PST supporting the photosensitive substrate P is moved to detect the separate alignment mark 1 ′ with the alignment optical system 9, the controller CONT moves the measurement area of the alignment optical system 9. The separate alignment mark 1 'on the photosensitive substrate P can be quickly and smoothly arranged in the inside. Here, based on the positional information of the plurality of alignment marks 1, the shift component of the photosensitive substrate P (short region) can also be obtained. After detecting position information of two conventional search alignment marks and detecting scaling information, rotation information, and substrate deformation information (collectively referred to as "search information"), the search mark is executed to execute fine alignment of the EGA method. In comparison with a method of detecting eight fine alignment marks, for example, the conventional method requires moving the photosensitive substrate to obtain search information. In this embodiment, the photosensitive substrate is moved to obtain search information. It is preferable to improve the throughput at two points that do not need to be moved, and that the photosensitive substrate does not need to be moved largely in order to move the first fine alignment mark to the viewing field among the eight fine alignment marks. .

When the alignment process is complete | finished, the exposure apparatus EX exposes the circuit pattern of the mask M to the layer of the next layer on the photosensitive board | substrate P (step SA8).

In addition, in this embodiment, although the detection of the relative position information of the alignment mark 1 and the identification mark 2 was demonstrated to be performed at the time of the search alignment process, it can also be performed at the time of a pre-alignment process, for example. have.

In this embodiment, the specific position O ₁ of the alignment mark 1 and the specific position O ₂ of the identification mark ₂ are detected to obtain scaling information and the like. It is preferable from the standpoint of precision that the distance between two points to be separated is apart. Accordingly, a second identification mark is formed at a point symmetrical with the identification mark 2 with the center of the alignment mark 1 as a symmetry point, and the specific position of the second identification mark and the specific position of the original identification mark 2 are formed. It is also preferable to obtain scaling information, rotation information, and the like from (O ₂ ). Alternatively, the same effect can be obtained by reducing the distance between the alignment mark 1 and the identification mark 2.

Eighth embodiment

Next, an eighth embodiment of the present invention will be described with reference to FIGS. 20A to 20D.

In the case where the alignment mark 1 and the identification mark 2 shown in FIG. 20A are detected by the mark detection device of the image processing method including the alignment optical system 9 and the control device CONT, imaging is performed as shown in FIG. 20B. Performing mark detection after compressing one image data can improve the processing speed than without the compression process. However, since the identification mark 2 is a mark smaller than the alignment mark 1, the mark image is distorted by the compression process, so that the position detection of the identification mark 2 cannot be performed, or the identification mark 2 is small by the compression process. In some cases, it may take a very long time to find the entire captured image.

In this case, as shown in Fig. 20A, the mark detection apparatus acquires image data by capturing an image in the measurement area, and then compresses the image data as shown in Fig. 20B, and then detects it as shown in Fig. 20C. The position of the alignment mark (first mark) 1 as a non-target mark which is in a predetermined positional relation to the target identification mark (second mark) 2 and is larger than the identification mark 2 is detected, and the detected alignment mark is detected. Based on the positional information of (1) and the relative positional information of the alignment mark 1 and the identification mark 2 previously calculated | required, the position of the identification mark 2 can be calculated | required from the image data which imaged the measurement area. . And after returning a compressed image to the original state as shown in FIG. 20D, the mark detection apparatus detects the shape of the character pattern of the identification mark 2. As shown in FIG. According to this method, the range in which the identification mark 2 exists can be narrowed, so that the time can be shorter than finding the smaller identification mark 2 from the entire compressed image.

As described above, when detecting the identification mark 2 smaller than the alignment mark 1, it is easily detectable by the mark detection device, that is, it has a larger area than the identification mark 2, so that the detection mark is high and the identification mark ( By detecting the alignment mark 1 in a predetermined positional relationship with 2), the alignment mark 1 is detected at a high processing speed, and then the identification mark 2 is detected based on the detection result of the alignment mark 1 and the predetermined positional relationship. ) Can be efficiently detected.

Moreover, in this embodiment, although it is a detection system which detects the position of the alignment mark 1 larger than the identification mark 2 which is a detection target mark, and performs the position detection of the identification mark 2 based on this detection result, it is a detection object. For example, the position information of the non-target mark is detected based on the detection result, and the luminance data of the image captured by the alignment optical system 9 in a predetermined positional relationship with respect to the mark is detected. A detection method may be used. Here, a mark in which the luminance data of an image is constant is a mark having a small dispersion value of image data (luminance data), and the control unit CONT has a position where the dispersion value has a minimum value in the measurement area of the alignment optical system (imaging element). That is, the position of the non-target mark can be detected in a short time. In this case, when there is a non-target mark having a predetermined positional relationship with respect to the detection target mark and having a form capable of high speed detection (highly detectable) according to the image processing method (detection method) of the mark detection apparatus, By performing the position detection of this non-target mark, the position of a target mark can be detected in a short time based on this detection result.

9th Embodiment

Next, a ninth embodiment of the present invention will be described with reference to FIG. 21.

As shown in FIG. 21, around the alignment mark (target mark) 1, an identification mark (non-target mark) 2 is formed at substantially equal intervals. In the present embodiment, the alignment mark 1 is a cross mark, and the identification mark 2 is formed at four points at equal intervals around the alignment mark 1. Moreover, each of the identification marks 2 arrange | positions the bit mark 30 in each of four area | regions R1-R4.

In addition, the " equal interval " referred to herein means, for example, the distance from the longitudinal pattern portion of the cross mark to the identification mark 2 in the upper right (lower right) and the longitudinal pattern portion of the cross mark in FIG. The distance to the identification mark 2 of (lower left) is the same, the distance from the horizontal pattern part of a cross mark to the identification mark 2 of upper right (upper left), and the horizontal pattern part of a cross mark to the right The distance to the identification mark 2 of the lower (lower left) is the same, and the distance from the intersection of the longitudinal pattern part of a cross mark and the horizontal pattern part to the identification mark 2 of the upper right (upper left) The distance from the intersection to the identification mark 2 at the lower left (lower right) means at least one of the same.

With such a configuration, for example, a CMP (chemical mechanical polishing) process may be performed to flatten the photosensitive substrate P surface (device surface). As shown in the schematic diagram of FIG. 22A, the target mark 1 If the non-target mark 2 is not formed at equal intervals around the surface of the device, the surface of the device is inclined to abut against the polishing surface of the CMP apparatus, resulting in uneven polishing. However, by forming the non-target mark 2 around the target mark 1 at equal intervals, as shown in the schematic diagram of Fig. 22B, the surface of the device is not inclined to touch the polishing surface of the CMP apparatus and polished in a uniform contact state. Therefore, it is possible to avoid the problem that the polishing state becomes uneven or that only a part of the target mark 1 is polished.

Further, instead of forming the non-target mark 2 at equal intervals around the target mark 1, a partition portion is formed around the target mark 1 with the same material as that of the target mark 1 and the target mark 1 ) Can be protected. In addition, when the line width of the target mark 1 is narrow, as described in the eighth embodiment described above, when the image data is compressed or observed using a low magnification optical system that can observe a wide range on the substrate, the target mark 1 ) May not be confirmed quickly. Therefore, if the line width of the partition formed to protect the target mark 1 is formed wider than the line width of the target mark 1, it is also suitable for compressing image data or observing the mark using a low magnification optical system.

10th embodiment

Next, a tenth embodiment of the present invention will be described with reference to FIGS. 23A to 23E. In the following, for convenience of explanation, the vertical direction in these drawings is defined as "vertical direction" and the horizontal direction is defined as "lateral direction", respectively.

As shown in FIG. 23A, four second mark regions A1 are formed around the alignment mark region 1 in a predetermined positional relationship with the alignment mark region 1, and within this second mark region A1. The 2nd mark 2 comprised from the vertical pattern P1 and the horizontal pattern P2 is formed. The vertical pattern P1 extends in the longitudinal direction in the second mark region A1 and is disposed at any position in the second region in the transverse direction. The horizontal pattern P2 extends in the horizontal direction in the second mark area A1 and is disposed at an arbitrary position in the second mark area A1 in the longitudinal direction. And the same information as the above-mentioned 1st-5th embodiment is displayed by the intersection position of the vertical pattern P1 and the horizontal pattern P2. In addition, in the example shown to FIG. 23A, it forms by the partition pattern P3 for protecting the above-mentioned 1st mark.

Hereinafter, the display method of the information in this embodiment is demonstrated, referring FIG. 23B-FIG. 23E about the 2nd mark 2 located in upper right in FIG.

In the second mark 2 shown in FIG. 23B, the vertical pattern P1 is disposed at the position of the length L1 from the left end of the second mark region A1 in the drawing, and the horizontal pattern P2 is the second mark region. It is arrange | positioned at the position of length L2 from the lower end part in the figure of FIG. 23 of (A1). In the second mark 2 shown in FIG. 23C, the vertical pattern P1 is disposed at the position of the length L1 from the left end in the drawing of the second mark region A1 in the same manner as in FIG. 23B. The length from the lower end part of the 2nd mark area | region A1 of this figure is L2a longer than FIG. 23B. In the second mark 2 shown in FIG. 23D, the horizontal pattern P2 is disposed at the position of the length L2 from the lower end in the drawing of the second mark region A1 in the same manner as in FIG. 23B. The length from the left end of the second mark region A1 in the drawing is L1a shorter than that in FIG. 23B. In the second mark 2 shown in FIG. 23E, the length from the left end portion of the second mark region A1 of the vertical pattern P1 is L1a shorter than that of FIG. 23B, and the horizontal pattern P2 The length from the lower end of the second mark region A1 in the drawing is L2a longer than that in FIG. 23B.

As described above, one or both of the horizontal position of the vertical pattern P1 and the vertical position of the horizontal pattern P2 are different, so that the intersection positions of the vertical pattern P1 and the horizontal pattern P2 are in FIGS. 23A to 23E. Each one is different. Therefore, by making different information correspond to each of these intersections, a lot of information can be represented by the intersection of the vertical pattern P1 and the horizontal pattern P2. According to the above method, the resolution of the detection device for detecting the lateral position of the vertical pattern P1 and the resolution of the detection device for detecting the vertical position of the lateral pattern P2 are different. Different information can be represented by the number of combinations of variations and transverse positions of the transverse pattern. Therefore, compared with the identification mark using the bit mark as described in the above-mentioned second and third embodiments, the number of information that can be displayed is dramatically increased.

Moreover, as a detection apparatus which detects the longitudinal position of the vertical pattern P1 of the 2nd mark demonstrated above, and the horizontal position of the lateral pattern P2, the alignment optical system for detecting the alignment mark formed in the alignment mark area | region 1 For example, the alignment optical system 9 provided with the imaging element as shown in FIG. 1 may also be used, and the detection apparatus for detecting the 2nd mark 2 may be provided separately. Moreover, it is not limited to the alignment apparatus provided with an image pick-up element, It scans the spot light and alignment mark irradiated from the alignment illumination system, detects the scattered light which generate | occur | produces at the timing which illuminates the spot light and the alignment mark, and so-called position information An LSA method or a so-called LIA method for detecting positional information by interfering diffracted light generated by illuminating a mark with an alignment beam with reference light and obtaining a phase difference between the reference light and the diffracted light from the mark may be used.

Further, although the variation of the transverse position of the longitudinal pattern P1 and the longitudinal position of the transverse pattern P2 is related to the resolution of the detection device, the alignment optical system including the image pickup device is influenced by a process such as a mark low step. When the desired resolution cannot be obtained, the desired resolution may be obtained by utilizing the gain adjusting function of the image pickup device, that is, the function of changing the amplitude of the signal generated from the image pickup device. In addition, in the case of using an alignment apparatus having a function of changing the wavelength of alignment light for illuminating the alignment mark according to the characteristics of the resist applied on the wafer, this wavelength switching function is detected when the second mark 2 is detected. You may use it. By changing the detection conditions at the time of detecting the second mark 2 in accordance with the characteristics of the resist and the process as described above, a high resolution can be obtained by the detection apparatus, and furthermore, the vertical pattern of the present embodiment. Variation of the horizontal position of P1 and the vertical position of the horizontal pattern P2 can be increased, and more information can be expressed.

23A to 23E illustrate an example in which four second mark regions are formed around the alignment mark region 1, but this is preferable as a response to the CMP process described in the ninth embodiment described above. However, when the device manufacturing process does not include the CMP process, it is not necessary to secure four second mark regions around the alignment mark region 1, and the second mark region 2 is the alignment mark region 1. 1 to 3 may be around.

23A to 23E, one vertical pattern P1 and one horizontal pattern P2 each represent marks of the second mark in the second mark region, but two or more vertical patterns (or horizontal patterns) are shown. You may use the provided mark.

Application to Search Mark of Tenth Embodiment

By the way, the mark as shown in FIG. 24 is used as a search mark mentioned above in the prior art. In this search mark 50, the idea of the tenth embodiment can be applied.

The search mark 50 includes three vertical patterns P1L, PIC, and PIR extending in parallel to each other in the longitudinal direction, and three horizontal patterns P2A, P2C, and P2U extending in the transverse direction. The vertical pattern and the three horizontal patterns overlap each other to form nine intersections. The center pattern P1C in the longitudinal patterns extending in parallel to each other in the longitudinal direction is disposed at an arbitrary position between the left and right longitudinal patterns P1L and P1R, and the center pattern (in the horizontal patterns extending in parallel in the transverse direction) PC2) is arrange | positioned in the arbitrary position between the upper and lower horizontal patterns P2A and P2U. By associating different information for each intersection position, much information can be expressed similarly to 10th Embodiment mentioned above.

In the past, a prohibition zone for prohibiting the formation of a homogeneous pattern was formed around the search mark in order to prevent a detection error of the search mark. However, as described above, the idea of the tenth embodiment is applied to the search mark to provide a vertical pattern. The search marks to be detected can be identified by varying the intersection positions of P1 and the horizontal pattern P2 for each layer.

11th Embodiment

Next, an eleventh embodiment of the present invention will be described with reference to FIGS. 25A to 25D.

As shown to FIG. 25A, the 2nd part which has a predetermined positional relationship with the alignment mark area | region 1 around the alignment mark area | region 1, and consists of 1st division area A1 and 2nd division area A2. The mark region is formed, and the first pattern portion P1 extends in the longitudinal direction in the first divided area A1, and the second pattern portion P2 extends in the longitudinal direction in the second divided area A2. The 2nd mark 2 comprised by () is formed. In addition, similarly to the tenth embodiment, the partition pattern P3 is also formed to protect the first mark.

Hereinafter, the method of displaying information will be described with reference to FIGS. 25B to 25D with respect to the second mark 2 located on the upper right side in the sheet of FIG. 25A.

In the 2nd mark 2 shown to FIG. 25B, the 1st pattern part P1 is arrange | positioned at the position of length L1 from the left end part in the figure of 1st division area A1, and 2nd division area A2 is carried out. 2nd pattern part P2 is arrange | positioned at the position of length L2 from the left end part in the figure in the figure. In the second mark 2 shown in FIG. 25C, the second pattern portion P2 is disposed at the position of the length L2 from the left end in the figure in the second divided area A2 in the same manner as in FIG. 25B. The 1st pattern part P1 is arrange | positioned at the position of L1a longer than FIG. 25B from the left end part in the figure in the 1st division area A1. In the 2nd mark 2 shown to FIG. 25D, the 1st pattern part P1 is the 1st pattern part in the position of length L1 from the left end part in the figure in 1st division area A1 similarly to FIG. 25B. Although P1 is arrange | positioned, the 2nd pattern part P2 is arrange | positioned at the position of L2a shorter than FIG. 25B from the left end part in the figure in the 2nd division area A2.

As described above, one or both of the transverse positions of the first pattern portions P1 in the first divided region A1 and the transverse positions of the second pattern portions P2 in the second divided regions A2 are different from each other. Information as much as the number of combinations of the lateral position of the first pattern P1 and the lateral position of the second pattern P2 can be displayed. Therefore, similarly to the tenth embodiment described above, the number of information that can be displayed is dramatically increased compared with the identification mark using the bit mark.

Moreover, in the 2nd mark of 10th Embodiment mentioned above, it was necessary to detect the horizontal position in a 2nd mark area | region with respect to a vertical pattern part, and to detect the vertical position within a 2nd area with respect to a horizontal pattern part. . However, some detection apparatuses using imaging elements can detect positional information in only one direction. If the second mark of the tenth embodiment shown in Figs. 23A to 23E is detected using such a detection device, after detecting the lateral position of the vertical pattern portion, the substrate on which the mark is formed and the detection device are relatively rotated. Then, the process of relatively rotating a board | substrate and a detection apparatus which detects the horizontal position of a horizontal pattern part is needed.

On the other hand, the second mark 2 of the eleventh embodiment shown in Figs. 25 to 25D has a step of relatively rotating the substrate and the detection apparatus because only the first pattern portion and the second pattern portion need to detect the lateral position. It becomes unnecessary and contributes to improvement of throughput.

Moreover, in the embodiment described above, the configuration is mainly described after specifying the detection target mark and then performing the subsequent positioning and the like using the location information of the specified mark, but the present invention is not limited thereto. For example, after detecting a specific mark, position information of a mark separate from the specific mark in a predetermined relative positional relationship from the specific mark is detected, and subsequent processing is performed using the position information of this distinct mark. You may comprise.

And it is also possible to use combining embodiment described above. For example, the identification mark 2 comprised of the bit mark 30 is formed in the vicinity of the alignment mark 1 of 2nd Embodiment, and the pattern part extension direction of the alignment mark 1 of 4th Embodiment is extended. You may arrange | position the identification mark 2 on a surface. Further, by combining the pattern information of the circuit pattern portion formed in the shot region, it is possible to further express various kinds of information.

In addition, as the exposure apparatus EX of the present embodiment, the mask M and the photosensitive substrate (in addition to the scanning type exposure apparatus for synchronously moving the mask M and the photosensitive substrate P to expose the pattern of the mask M) The present invention can also be applied to a step-and-repeat type exposure apparatus in which the pattern of the mask M is exposed while P) is stopped and the photosensitive substrate P is sequentially moved. Also, the exposure apparatus and the proximity exposure apparatus which expose the pattern of the mask M by bringing the mask M and the photosensitive substrate P into close contact without using the projection optical system PL as the exposure apparatus and the position detection mark of the present embodiment. Can apply.

The application of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor, and is widely applied to, for example, a liquid crystal exposure apparatus for exposing a liquid crystal display element pattern on a rectangular glass plate, or an exposure apparatus for manufacturing a thin film magnetic head. can do.

As the projection optical system PL, when using far ultraviolet rays such as excimer laser, a material that transmits far ultraviolet rays such as quartz or fluorite is used as a base material, and when using an F2 laser or X-ray, a refraction system Alternatively, an optical system of a refractometer may be used (a mask is also a reflective type), and when an electron beam is used, an electron optical system composed of an electron lens and a deflector may be used as the optical system. It goes without saying that the optical path through which the electron beam passes is in a vacuum state.

When a linear motor is used for the substrate stage PST or the mask stage MST, either an air levitation type using air bearing and a magnetic levitation type using Lorentz force or reactance force may be used. The stage may be of a type that moves along a guide or may be a guideless type that does not form a guide.

When using a planar motor as a driving device for the stage, one of the magnet unit (permanent magnet) and the armature unit may be connected to the stage, and the other of the magnet unit and the armature unit may be formed on the moving surface side (base) of the stage. .

The reaction force generated by the movement of the substrate stage PST may be caused to mechanically go out to the floor (ground) using a frame member as described in JP-A-8-166475. The present invention is also applicable to an exposure apparatus having such a structure.

The reaction force generated by the movement of the mask stage MST may be caused to mechanically go out to the floor (ground) using a frame member as described in JP-A-8-330224. The present invention is also applicable to an exposure apparatus having such a structure.

As described above, the exposure apparatus of the present embodiment is manufactured by assembling various subsystems including each component included in the claims of the present application so as to maintain predetermined mechanical precision, electrical precision, and optical precision. In order to secure these various accuracy, before and after this assembly, adjustment for achieving optical precision for various optical systems, adjustment for achieving mechanical precision for various mechanical systems, and adjustment for achieving electrical precision for various electric systems This is carried out. The process of assembling the exposure apparatus in various subsystems includes mechanical connection of various subsystems, wiring connection of electric circuits, piping connection of pneumatic circuits, and the like. It goes without saying that there is an individual assembly step of each subsystem before the step of assembling with the exposure apparatus in these various subsystems. When the process of assembling with the exposure apparatus of the various subsystems is finished, comprehensive adjustment is performed to ensure various precisions as the whole exposure apparatus. In addition, it is preferable to manufacture an exposure apparatus in the clean room where temperature, a clean degree, etc. were managed.

As shown in Fig. 26, the semiconductor device includes step 201 for designing the function and performance of the device, step 202 for producing a mask based on this design step, step 203 for manufacturing a substrate as a substrate, and the exposure apparatus of the above-described embodiment. By a substrate processing step 204 for exposing the pattern of the mask to the photosensitive substrate, a device assembly step (including a dicing step, a bonding step, a package step) 205, an inspection step 206, and the like.

Industrial availability

As described above, according to the present invention, by detecting the form of the second pattern by forming a second pattern combining n types of N patterns in a predetermined positional relationship with respect to the first pattern for outputting position information, Even when a mark of the same kind exists in proximity to the target mark, a mark for use in position detection can be specified from the plurality of marks. The second pattern can display many kinds of information, such as N ⁿ type, even if the area for arranging the mark on the substrate is not set wide, and the pattern transfer area on the substrate can be displayed even if a large number of the same first patterns exist. The mark can be identified without narrowing. And using this 1st pattern, the alignment process with favorable precision can be performed.

Further, according to the present invention, information on the amount of deformation and rotation of the substrate can be obtained by detecting the relative position information of the first pattern and the second pattern of the specific mark. Therefore, the throughput can be improved because the positions of the marks separate from the specific marks can be determined based on the obtained information and the plurality of marks can be detected smoothly.

Further, according to the present invention, when the mark is detected after compressing the image data of the mark, the image data of the large non-target mark is not distorted even if it is compressed. Therefore, the non-target is performed using the compressed image data of the non-target mark. The positional information of the mark can be detected, and the positional information of the target mark can be obtained quickly based on the detection result. Therefore, the mark position detection process can be performed efficiently in a short time.

Further, according to the present invention, by forming non-target marks at equal intervals around the target marks, the problem that the device surface tilts against the polishing surface of the CMP apparatus can be avoided, and the polishing treatment can be performed with good accuracy. . Thus, a device having a desired performance can be manufactured.

Claims (99)

A mark for position detection, formed on an object and used when detecting position information of the object by a position detection device, A first pattern observed by the position detecting device to output the position information to the position detecting device, For position detection having a second pattern arranged in a predetermined positional relationship with the first pattern and having ⁿ types (n≥1) in combination of n (n≥1) patterns and representing N ⁿ types of information Mark. A mark for position detection, formed on an object and used when detecting position information of the object by a position detection device, A first pattern observed by the position detecting device to output the position information to the position detecting device, For position detection arranged in a predetermined positional relationship with the first pattern and having a combination of ⁿ types (n≥2) of n pieces (n≥2) and having a second pattern representing Nn types of information Mark. According to claim 1 or 2, wherein the second pattern, wherein the position detection indicating N ⁿ types of information by arranging the N kinds of patterns in each of the n number of areas arranged in a predetermined positional relationship with respect to the first pattern Dragon mark. The mark for position detection according to claim 3, wherein the N type of the second pattern is one of which there is no pattern in one of the n areas. The method of claim 4, wherein the second pattern is, the n number of the region and the pattern the pattern is formed of the region based on the number and arrangement of the non-forming area, N = a second type of pattern n combinations a second ⁿ type Position detection mark indicating the information. The method of claim 4, wherein the second pattern is, the n number of areas of the patterns formed in any areas, by do a pattern is formed in any region, N = a second type of pattern n combinations a second ⁿ type Position detection mark indicating the information. The position detection device according to claim 1 or 2, wherein the position detection device is an image processing method of an image processing method that detects the position information by image processing an observation image of the object. And the first pattern is a pattern for indicating position information when the observed image observed by the position detecting apparatus of the image processing method is image processed. 8. The position detection mark according to claim 7, wherein the second pattern is a pattern representing N ⁿ kinds of information when the observed image observed by the position detection apparatus of the image processing method is image processed. The position according to claim 1 or 2, wherein the first pattern is formed by periodically arranging a pattern portion and a space portion extending in a first length in a first direction in a second direction substantially perpendicular to the first direction. Mark for detection. The position detection mark according to claim 9, wherein the second pattern is disposed on an extension in an extension direction of the first pattern. 10. The method according to claim 9, wherein the second pattern is a pattern representing N ⁿ types of information by arranging N types of patterns in each of the n areas arranged in a predetermined positional relationship with the first pattern. And said n area are arranged so that they do not substantially overlap with each other in said first direction. A mark identification method for identifying a specific first mark from a plurality of first marks formed on the object to detect the position information of the object with a detection device, On the object, the second is the first corresponding to the mark 1 formed by the pattern of the, type N (N≥2) arranged in a predetermined positional relationship of n (n≥1) in combination with the first mark, N ⁿ Forming a second pattern representing the kind of information, And detecting the second pattern with the detection device to determine the specific first mark based on the information indicated by the second pattern. A mark identification method for identifying a specific first mark from a plurality of first marks formed on the object to detect the position information of the object with a detection device, On the object, the first are arranged in the first mark and the predetermined positional relationship with the first mark is constituted by the pattern of the N type (N≥2) n stars (n≥2) combining N ⁿ kinds of information To form a second pattern representing And detecting the second pattern with the detection device to determine the specific first mark based on the information indicated by the second pattern. Claim 12 according to any one of claims 13, wherein the first mark and the N ⁿ types of information by arranging the N kinds of patterns in each of the n number of areas arranged in a predetermined positional relationship into a second pattern formed on the object The mark identification method which forms the pattern which shows. 15. The mark identification method according to claim 14, wherein the N type of the second pattern is one of which there is no pattern in one of the n areas. The method of claim 15, wherein the second pattern as the n number of the region and the pattern the pattern is formed of the region based on the number and arrangement of the non-forming area, N = 2 kinds of patterns for n combinations a 2 ⁿ kinds of A mark identification method for forming a pattern representing information. The method of claim 15, wherein the second pattern as the n number of areas of the patterns formed in any areas, by do a pattern is formed in any region, N = 2 kinds of patterns for n combinations a 2 ⁿ kinds of A mark identification method for forming a pattern representing information. A position detection method for detecting positional information of the object by detecting a specific first mark determined by the mark identification method according to any one of claims 12 to 17 with the detection apparatus. An exposure method for transferring a predetermined pattern onto a substrate, A first pattern on the substrate for detecting position information in a position detecting device; Arranged in a predetermined positional relationship with the first pattern, and configured by combining n (n ≧ 1) patterns of N kinds (N ≧ 2) to form a second pattern representing N ⁿ kinds of information, Detecting a second pattern with the detection device, detecting position information from the first pattern based on the information indicated by the second pattern, An exposure method for transferring the predetermined pattern onto the substrate by relatively moving the substrate and the predetermined pattern based on the detected position information. An exposure method for transferring a predetermined pattern onto a substrate, A first pattern on the substrate for detecting position information in a position detecting device; Arranged in a predetermined positional relationship with the first pattern, and configured by combining n pieces (n ≧ 2) of N types (N ≧ 2) to form a second pattern representing N ⁿ types of information, Detecting a second pattern with the detection device, detecting position information from the first pattern based on the information indicated by the second pattern, An exposure method for transferring the predetermined pattern onto the substrate by relatively moving the substrate and the predetermined pattern based on the detected position information. Claim 19 or claim 20, wherein the second pattern as to form a pattern representative of the first pattern and N ⁿ types of information by arranging the N kinds of patterns in each of the n number of areas arranged in a predetermined positional relationship Exposure method. The exposure method according to claim 21, wherein the N type of the second pattern is one of which there is no pattern in one of the n areas. Of claim 22 wherein the method, the second pattern as the n number of the region and the pattern the pattern is formed of the region based on the number and arrangement of the non-forming area, N = 2 kinds of patterns for n combinations a 2 ⁿ kinds of An exposure method for forming a pattern representing information. Of claim 22 wherein the method, the second pattern as the n number of areas of the patterns formed in any areas, by do a pattern is formed in any region, N = 2 kinds of patterns for n combinations a 2 ⁿ kinds of An exposure method for forming a pattern representing information. The method of claim 19 or 20, Forming a layer structure on the substrate; And forming the first pattern and the second pattern for each layer and simultaneously forming the second pattern such that the information represented by the second pattern is different for each layer. The exposure method according to any one of claims 19 to 25, wherein the detection apparatus detects position information by image processing the observed image of the first pattern. An exposure method for transferring a predetermined pattern onto a substrate, Of the marks which are formed on the said board | substrate with the 1st pattern and the 2nd pattern which has a predetermined positional relationship with respect to the said 1st pattern, and formed in multiple on the said board | substrate. Detecting the relative position information of the first pattern and the second pattern of the specific mark, Determining position information of a mark different from the specific mark among a plurality of marks formed on the substrate based on the relative position information, And transferring the predetermined pattern onto the substrate by relatively moving the substrate and the predetermined pattern based on the determined position information. 28. The method of claim 27, wherein by detecting the relative position information of the first pattern and the second pattern of the specific mark, from the time when the first pattern and the second pattern are formed on the substrate until the relative position information is detected. Detecting information about deformation of the substrate, and determining position information of the separate mark based on the deformation information. The method of claim 27, By detecting the relative position information of the first pattern and the second pattern of the specific mark, the first pattern and the first pattern from the time when the first pattern and the second pattern is formed on the substrate until the relative position information is detected; And at least one of the amount of change in the distance between the second patterns and the amount of rotation of the substrate in a predetermined direction. 30. The method according to any one of claims 27 to 29, wherein the first pattern is a pattern for detecting position information in the position detecting device. The second pattern is an exposure method comprising a combination of n patterns (N≥2) and n pieces (n≥1) and representing N ⁿ types of information. 30. The method according to any one of claims 27 to 29, wherein the first pattern is a pattern for detecting position information in the position detecting device. The second pattern is, the pattern of the N type (N≥2) n stars (n≥2) consists of a combination pattern of an exposure method that represents the N ⁿ types of information. The second mark is formed on an object on which a first mark and a second mark having a predetermined positional relationship with the first mark and smaller than the first mark are formed using an image processing method mark detection apparatus having a predetermined measurement area. In the mark detection method for detecting a, Image data of the measurement area to obtain image data, Compressing the image data, The position information of the first mark is detected from the compressed image data, And the position information of the second mark is detected from image data obtained by imaging the measurement area based on the detected position information of the first mark and relative position information of the first mark and the second mark. The second mark is formed on a substrate on which a first mark and a second mark having a predetermined positional relationship with the first mark and smaller than the first mark are formed using an image processing method mark detection apparatus having a predetermined measurement area. In the exposure method, detecting a pattern, positioning the mask and the substrate, and then exposing the mask pattern to the substrate. Image data of the measurement area to obtain image data, Compress image data, The position information of the first mark is detected from the compressed image data, And the positional information of the second mark is detected from the image data of the measurement area, based on the detected positional information of the first mark and the relative positional information of the first mark and the second mark. In the mark detection method for detecting a mark on an object using a mark detection device having a predetermined measurement area, A mark detection method for detecting the target mark by forming a non-target mark at substantially equal intervals around the target mark to be detected. In the exposure method which detects the mark on a board | substrate using the mark detection apparatus which has a predetermined | prescribed measurement area, positions a mask and the said board | substrate, and then exposes the pattern of the said mask to the said board | substrate A non-target mark is formed at substantially equal intervals around a target mark to be detected, and the target mark is detected. A position information detection method for detecting a target mark formed on an object using a mark detection device that detects a mark in a predetermined detection method, and detecting position information of the object based on the detection result. The mark detection device detects a non-target mark having high detectability with respect to the predetermined detection method formed on the object in a predetermined positional relationship with the target mark, Detecting the target mark with the mark detection device based on a detection result of the non-target mark and the predetermined positional relationship, And position information detection method based on the detection result of the target mark. The position information detection method according to claim 36, wherein the non-target mark having high detectability has an area larger than that of the target mark. The mark detection apparatus according to claim 36, wherein the mark detection apparatus is a mark detection apparatus that detects a mark by an image processing method. And a non-target mark having high detectability has a small dispersion value of image data when it is picked up by the mark detection device. A mark formed on an object and used to detect positional information of the object. A mark is formed which is disposed at an arbitrary position within a predetermined mark area secured on the object, A mark representing information by a position of the mark in the mark area. The method of claim 39, A vertical pattern portion extending in the first direction in the mark region; A transverse pattern portion extending in a second direction crossing the first direction in the mark region, The mark in which the said information is displayed by the intersection position of the said longitudinal pattern part and the said horizontal pattern part. The method of claim 39, A pattern portion extending in the first direction in the mark region, The mark in which the said information is displayed based on the position regarding the 2nd direction which cross | intersects the said 1st direction in the said mark part. The method of claim 39, A first pattern portion extending in the first direction in a first divided region which is one region obtained by dividing the inside of the second region at a predetermined position in a first direction; And a second pattern portion extending in the first direction in a second divided region which is the other region divided into the second region at a predetermined position in the first direction, A position with respect to a second direction crossing the first direction of the first pattern portion in the first divided region; And a mark in which the positional information is displayed based on both positions in a second direction crossing the first direction of the second pattern portion in the second divided area. A mark formed on an object and used to detect positional information of the object. A first mark region and a second mark region in a predetermined positional relationship with the first mark region, A first mark is formed in the first mark area for detecting position information of the object, A second mark disposed in the second mark region at an arbitrary position in the second mark region, A mark representing information relating to the first mark based on a position in the second mark area of the second mark. 44. The apparatus of claim 43, further comprising: a plurality formed on the object; The information about the first mark displayed based on the position of the second mark in the second mark area is And a mark for determining whether the first mark in the predetermined positional relationship with the second mark area is a mark to be detected or a mark other than the mark to be detected. The method of claim 43, wherein a plurality of layers are formed on the object, The mark is formed in each layer of the plurality of layers, The mark concerning the said 1st mark displayed based on the positional information of the said 2nd mark in the said 2nd mark area | region is the information regarding the layer in which the said 1st mark is formed. The method of claim 43, The second mark, A vertical pattern portion extending in the first direction in the second region; A transverse pattern portion extending in a second direction crossing the first direction in the second region, The mark in which the information about the said 1st mark is displayed by the intersection position of the said vertical pattern part and the said horizontal pattern part. The method of claim 43, The second mark, A pattern portion extending in a first direction in the second region, The mark in which the said information regarding the said 1st mark is displayed by the position regarding the 2nd direction which cross | intersects the said 1st direction in the said 2nd area | region. The method of claim 43, The second mark, A first pattern portion extending in the first direction in a first divided region which is one region obtained by dividing the inside of the second region at a predetermined position in a first direction; And a second pattern portion extending in the first direction in a second divided region which is the other region obtained by dividing the inside of the second region at a predetermined position in the first direction, A position in a second direction crossing the first direction of the first pattern portion in the first divided region; And a mark on which the information relating to the first mark is displayed based on both of positions in a second direction crossing the first direction of the second pattern portion in the second divided area. Detecting means for detecting positional information of the substrate by detecting a mark formed in a mark region composed of a first mark region and a second mark region on the substrate, and electrically connected to the detecting means and detected by the detecting means. An exposure apparatus including a driving means for relatively moving a predetermined pattern and the substrate based on the positional information of the substrate, the exposure apparatus for transferring the predetermined pattern on the substrate, The mark detected by the detecting means is A first mark which is detected by said detecting means to generate a signal representing position information of said substrate to said detecting means; And a second mark disposed at an arbitrary position within the second mark area, And the detection means detects information on the first mark based on the position of the second mark in the second mark area. The method of claim 49, The mark is formed in plural on the object, The detecting means determines whether the first mark in the predetermined positional relationship with the second mark area is a detection mark or a mark other than the detection object based on the positional information of the second mark in the second mark area. The exposure apparatus to judge. The method of claim 49, Multiple layers are formed on the object, The mark is formed in each layer of the plurality of layers, And the detecting means detects information on the layer on which the first mark is formed based on the positional information of the second mark in the second mark area. The method of claim 49, The second mark, A vertical pattern portion extending in the first direction in the second region; A transverse pattern portion extending in a second direction crossing the first direction in the second region, And the detecting means detects information on the first mark based on the intersection positions of the vertical pattern portion and the horizontal pattern portion. The method of claim 49, The second mark, A pattern portion extending in a first direction in the second region, And the detecting means detects information relating to the first mark based on a position in a second direction crossing the first direction in the pattern portion in the second area. The method of claim 49, The second mark, A first pattern portion extending in the first direction in a first divided region which is one region obtained by dividing the inside of the second region at a predetermined position in a first direction; And a second pattern portion extending in the first direction in a second divided region which is the other region obtained by dividing the inside of the second region at a predetermined position in the first direction, The said detection means is a position regarding the 2nd direction which cross | intersects the said 1st direction in the said 1st pattern part in the said 1st division part, The said 2nd pattern part in the said 2nd division part, The said 1st An exposure apparatus for detecting information relating to the first mark based on both of positions in a second direction crossing the one direction. The method of claim 49, And the detecting means changes the detection condition when detecting the mark in accordance with the condition at the time of forming the mark. The method of claim 55, The detection means includes an illumination system for irradiating the detection beam to the mark, Exposure apparatus which changes the wavelength of the said detection beam according to the conditions at the time of the said mark formation. The method of claim 55, The detecting means includes adjusting means for changing an amplitude of a signal generated by detecting the mark, An exposure apparatus which changes the amplitude of the signal in accordance with a condition at the time of forming the mark. The method of claim 56, wherein The detecting means includes an imaging device, And an exposure apparatus for detecting the mark by capturing an image of the mark with the imaging device. As an exposure method for transferring a predetermined pattern onto a substrate, Detecting position information of the substrate by detecting a mark formed in a mark region composed of a first mark region and a second mark region on the substrate; Exposing the predetermined pattern by relatively moving the predetermined pattern and the substrate based on the positional information of the substrate detected by the detecting means; The mark, A first mark generated by the detection step to generate a position signal of the substrate; A mark formed at an arbitrary position in the second mark region and having a second mark representing information about the first mark at a position in the second mark region, And an exposure method for detecting information about the first mark based on the position of the second mark within the second mark area. The method of claim 59, The mark is formed in plural on the object, In the step of detecting the positional information of the substrate, the first mark in the predetermined positional relationship with the second mark region based on the positional information of the second mark in the second pattern region. Exposure method which determines whether it is a mark other than a recognition object. The method of claim 59, A plurality of layers are formed on the object, The mark is formed in each layer of the plurality of layers, In the step of detecting the positional information of the substrate, the exposure method for detecting the information on the layer on which the first mark is formed based on the positional information of the second mark in the second mark area. The method of claim 59, The second mark, A vertical pattern portion extending in the first direction in the second region; A transverse pattern portion extending in a second direction crossing the first direction in the second region, In the step of detecting the positional information of the substrate, the exposure method wherein the information on the first mark is detected by the intersection position of the vertical pattern portion and the horizontal pattern portion. The method of claim 59, The second mark, A pattern portion extending in a first direction in the second region, The process of detecting the position of the said board | substrate WHEREIN: Exposure which the information regarding the said 1st mark is detected based on the position regarding the 2nd direction which cross | intersects the said 1st direction of the said pattern part in the said 2nd area | region. Way. The method of claim 59, The second mark, A first pattern portion extending in the first direction in a first divided region which is one region obtained by dividing the inside of the second region at a predetermined position in a first direction; And a second pattern portion extending in the first direction in a second divided region which is the other region divided into the second region at a predetermined position in the first direction, In the step of detecting the position of the substrate, a position in a second direction intersecting the first direction of the first pattern portion in the first divided region, and the second in the second divided region. 2. The exposure method, wherein information about the first mark is detected based on both of positions in the second direction crossing the first direction in the pattern portion. The method of claim 59, In the step of detecting the position of the substrate, an exposure method of changing the detection condition when detecting the mark in accordance with the condition at the time of forming the mark. The method of claim 59, The step of detecting the position of the substrate includes irradiating the detection beam to the mark, An exposure method for changing the wavelength of the detection beam in accordance with the conditions at the time of forming the mark. The method of claim 59, The step of detecting the position of the substrate includes changing the amplitude of the signal generated by detecting the mark, An exposure method of changing the amplitude of the signal in accordance with the conditions at the time of forming the mark. The method of claim 59, In the step of detecting the position of the substrate, an exposure method for detecting the mark by imaging an image of the mark using an imaging device. A device manufacturing method comprising the step of transferring a device pattern onto a substrate using the exposure method according to any one of claims 59 to 68. A device manufactured by the device manufacturing method of claim 69. A method of manufacturing an exposure apparatus for exposing a predetermined pattern on a substrate, comprising: detecting means for detecting position information of the substrate by detecting a mark formed in a mark region consisting of a first mark region and a second mark region on the substrate; Form the Forming driving means for moving the substrate to a position where the substrate is to be exposed based on the positional information of the substrate detected by the detecting means, The mark, A first mark which is detected by said detecting means to generate a signal for indicating position information of said substrate to said detecting means; A mark provided with a 2nd mark arrange | positioned at the arbitrary position in a 2nd mark area | region, And the detection means detects information on the first mark based on the position of the second mark in the second area. The method of claim 71 wherein The mark is formed in plural on the object, The detecting means determines whether the first mark in the predetermined positional relationship with the second mark area is a detection mark or a mark other than the detection object based on the position information of the second mark in the second mark area. The manufacturing method of the exposure apparatus to determine. The method of claim 71 wherein A plurality of layers are formed on the object, The mark is formed in each layer of the plurality of layers, And the detection means detects information on the layer on which the first mark is formed based on the positional information of the second mark in the second mark area. The method of claim 71 wherein The second mark, A vertical pattern portion extending in the first direction in the second region; A transverse pattern portion extending in a second direction crossing the first direction in the second region, And the detection means detects information on the first mark based on the intersection positions of the vertical pattern portion and the horizontal pattern portion. The method of claim 71 wherein The second mark, A pattern portion extending in a first direction in the second region, And the detecting means detects the information relating to the first mark based on the position of the pattern portion in the second area in the second direction crossing the first direction. The method of claim 71 wherein The second mark, A first pattern portion extending in the first direction in a first divided region which is one region obtained by dividing the inside of the second region at a predetermined position in a first direction; And a second pattern portion extending in the first direction in a second divided region which is the other region divided into the second region at a predetermined position in the first direction, The detection means is located in a second direction crossing the first direction of the first pattern portion in the first division, and the first direction of the second pattern portion in the second division; 10. A method for manufacturing an exposure apparatus that detects information about the first mark based on both positions in a second direction intersecting with. The method of claim 71 wherein And the detection means changes the detection condition when detecting the mark in accordance with the condition at the time of forming the mark. The method of claim 71 wherein The detection means includes an illumination system for irradiating the detection beam to the mark, The manufacturing method of the exposure apparatus which changes the wavelength of the said detection beam according to the conditions at the time of the said mark formation. The method of claim 71 wherein The detecting means includes adjusting means for changing an amplitude of a signal generated by detecting the mark, A manufacturing method of the exposure apparatus for changing the amplitude of the signal in accordance with the conditions at the time of forming the mark. The method of claim 71 wherein The detecting means includes an imaging device, A method for manufacturing an exposure apparatus for detecting the mark by imaging an image of the mark with the imaging device. A mark formed on an object and used to detect positional information of the object. A vertical pattern portion extending in the first direction within a predetermined mark area secured on the object; A transverse pattern portion extending in a second direction crossing the first direction in the mark area, A mark indicating information by the intersection position of the vertical pattern portion and the horizontal pattern portion. A mark formed on an object and used to detect positional information of the object. A first mark region and a second mark region in a predetermined positional relationship with the first mark region, A first mark is formed in the first mark area for detecting position information of the object, In the second mark region, a second mark arranged at an arbitrary position in the second mark region is formed, The second mark, A vertical pattern portion extending in the first direction in the second region; A transverse pattern portion extending in a second direction crossing the first direction in the second region, The mark which shows the information regarding the said 1st pattern by the intersection position of the said longitudinal pattern part and the said horizontal pattern part. Detecting means for detecting position information of the substrate by detecting a mark formed in a mark region composed of a first mark region and a second mark region on the substrate; An exposure apparatus electrically connected to the detecting means, the driving device comprising a driving means for relatively moving the predetermined pattern and the substrate based on the positional information of the substrate detected by the detecting means, and transferring the predetermined pattern onto the substrate. as, The mark detected by the detecting means is A first mark which is detected by said detecting means to generate a signal for indicating position information of said substrate to said detecting means; And a second mark including a vertical pattern portion extending in a first direction in the second region and a horizontal pattern portion extending in a second direction crossing the first direction in the second region, And the detecting means detects information on the first mark based on the intersection positions of the vertical pattern portion and the horizontal pattern portion of the second mark. As an exposure method for transferring a predetermined pattern onto a substrate, Detecting position information of the substrate by detecting a mark formed in a mark region composed of a first mark region and a second mark region on the substrate; Exposing the predetermined pattern by relatively moving the predetermined pattern and the substrate based on the positional information of the substrate detected by the detecting means; The mark, A first mark generated by the detection step to generate a position signal of the substrate; A second mark having a vertical pattern portion extending in a first direction in the second region and a horizontal pattern portion extending in a second direction crossing the first direction in the second region, And an information relating to the first mark based on the intersection positions of the vertical pattern portion and the horizontal pattern portion. A device manufacturing method comprising the step of transferring a device pattern onto a substrate using the exposure method of claim 84. A device manufactured by the device manufacturing method of claim 85. A method of manufacturing an exposure apparatus for exposing a predetermined pattern on a substrate, Detecting means for detecting position information of the substrate by detecting a mark formed in a mark region composed of a first mark region and a second mark region on the substrate, Forming driving means for moving the substrate to a position where the substrate is to be exposed based on the positional information of the substrate detected by the detecting means, The mark, A first mark which is detected by said detecting means to generate a signal for indicating position information of said substrate to said detecting means; A mark composed of a second mark having a vertical pattern portion extending in a first direction in the second region and a horizontal pattern portion extending in a second direction crossing the first direction in the second region. And the detection means detects information on the first pattern based on an intersection of the vertical pattern portion and the horizontal pattern portion of the second mark. A mark formed on an object and used to detect positional information of the object. A pattern portion extending in a first direction in the mark region, And a mark in which the information is displayed based on a position in a second direction crossing the first direction of the pattern portion in the mark area. 89. The method of claim 88 wherein The second mark, A first pattern portion extending in the first direction in a first divided region which is one region obtained by dividing the inside of the second region at a predetermined position in a first direction; And a second pattern portion extending in the first direction in a second divided region which is the other region divided into the second region at a predetermined position in the first direction, A position in a second direction intersecting the first direction of the first pattern portion in the first division, And a mark in which said positional information is displayed based on both of positions in a second direction crossing said first direction of said second pattern portion in said second division. A mark formed on an object and used to detect positional information of the object. A first mark region and a second mark region in a predetermined positional relationship with the first mark region, A first mark formed in the first mark area and used for detecting position information of the object; A pattern portion extending in a first direction in the second region, and displaying information about the first mark by a position in a second direction crossing the first direction of the pattern portion in the second region; A mark composed of a second mark. 92. The method of claim 90, A first pattern portion extending in the first direction in a first divided region which is one region divided into the second region at a predetermined position in a first direction; And a second pattern portion extending in the first direction in a second divided area, which is the other area obtained by dividing the inside of the second area at a predetermined position in the first direction, A position in a second direction intersecting the first direction of the first pattern portion in the first division, And a mark in which said positional information is displayed based on both of positions in a second direction crossing said first direction of said second pattern portion in said second division. Detecting means for detecting position information of the substrate by detecting a mark formed in a mark region composed of a first mark region and a second mark region on the substrate; An exposure apparatus electrically connected to the detecting means, the driving device comprising a driving means for relatively moving the predetermined pattern and the substrate based on the positional information of the substrate detected by the detecting means, and transferring the predetermined pattern onto the substrate. as, The mark detected by the detecting means is A first mark formed in said first mark region and detected by said detecting means for generating a signal for displaying position information of said substrate on said detecting means; A second mark having a pattern portion extending in a first direction in the second region, And the detection means detects the information relating to the first mark based on the position in the second direction of the pattern portion in the second region of the second mark. 92. The method of claim 92, The second mark, A first pattern portion extending in the first direction in a first divided region which is one region obtained by dividing the inside of the second region at a predetermined position in a first direction; And a second pattern portion extending in the first direction in a second divided region which is the other region divided into the second region at a predetermined position in the first direction, The said detection means is a position regarding the 2nd direction which cross | intersects the said 1st direction in the said 1st pattern part in the said 1st division part, and the said 1st pattern part in the said 2nd division part. And an exposure apparatus for detecting information on the first mark based on both of positions in the second direction crossing the direction. As an exposure method for transferring a predetermined pattern onto a substrate, Detecting position information of the substrate by detecting a mark formed in a mark region composed of a first mark region and a second mark region on the substrate; Exposing the predetermined pattern by relatively moving the predetermined pattern and the substrate based on the positional information of the substrate detected by the detecting means; The mark, A first mark generated by the detection step to generate a position signal of the substrate; A second mark having a pattern portion extending in a first direction in the second region, In the step of detecting the position information, An exposure method for detecting information about the first mark based on a position in a second direction intersecting the first direction in the pattern portion in the second area. 95. The method of claim 94, The second mark, A first pattern portion extending in the first direction in a first divided region which is one region obtained by dividing the inside of the second region at a predetermined position in a first direction; And a second pattern portion extending in the first direction in a second divided region which is the other region divided into the second region at a predetermined position in the first direction, In the step of detecting the positional information of the substrate, a position in a second direction crossing the first direction of the first pattern portion in the first division, and the second in the second division; And the information relating to the first mark is detected based on both of positions in the second direction crossing the first direction of the pattern portion. A device manufacturing method comprising the step of transferring a device pattern onto a substrate using the exposure method according to claim 94 or 95. A device manufactured by the device manufacturing method of claim 96. A method of manufacturing an exposure apparatus for exposing a predetermined pattern on a substrate, Detecting means for detecting position information of the substrate by detecting a mark formed in a mark region composed of a first mark region and a second mark region on the substrate, Forming driving means for moving the substrate to a position where the substrate is to be exposed based on the positional information of the substrate detected by the detecting means, The mark, A first mark which is detected by said detecting means to generate a signal representing position information of said substrate to said detecting means; A pattern portion extending in a first direction in the second region, wherein the detection means is based on a position in a second direction crossing the first direction of the pattern portion in the second region; A second mark for displaying information about the mark, And the detection means detects the information on the first mark based on the position of the pattern portion in the second area. 99. The method of claim 98, The second mark, A first pattern portion extending in the first direction in a first divided region which is one region obtained by dividing the inside of the second region at a predetermined position in a first direction; A second pattern portion extending in the first direction in a second divided region which is the other region obtained by dividing the inside of the second region at a predetermined position in the first direction; The detection means is located in a second direction crossing the first direction of the first pattern portion in the first division, and the first direction of the second pattern portion in the second division; A manufacturing method of an exposure apparatus for detecting information relating to the first mark based on both of positions in a second direction intersecting with.