KR20040101973A - Insert type connector mold apparatus - Google Patents

Abstract

PURPOSE: An insert type connector molding apparatus is provided to prevent a circuit board and terminals from being cracked by compensating variation in height regardless of the thickness of the circuit board and terminals. CONSTITUTION: An insert type connector molding apparatus is composed of a positioning jig(100) installed at a lower molding plate(10b), a board jig(200) installed at the lower molding plate, a terminal jig(300), and a compensation jig(400). The positioning jig is coupled to a positioning hole formed at a circuit board, and precisely disposes the circuit board on molding spaces(20a,20b). The board jig supports the circuit board with a predetermined pressure so that the surface of an upper connecting terminal adheres closely to the surface of an upper molding plate(10a). The terminal jig is installed at the lower molding plate, and presses the surface of a lower connecting terminal bent downward from the circuit board with a predetermined pressure. The compensation jig is installed at the upper molding jig, and presses the rear of the lower connecting terminal with a pressure corresponding to the pressure of the terminal jig.

Description

Insert type connector resin molding device {INSERT TYPE CONNECTOR MOLD APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for resin molding a circuit board of an electronic product. More specifically, the present invention relates to an apparatus for resin molding a circuit board of an electronic product. Molding, but compensating for the height variation of the upper and lower connection terminals or the side connection terminals as well as the circuit board to prevent the molding resin penetrates into the surface of each terminal or to cause cracks in the circuit board or each terminal. The present invention relates to an insert type connector resin molding apparatus.

Generally, various types of connectors are used in electronic products. Among them, electronic products such as handheld phones (Cyon Phones), personal digital assistants (PDAs), notebook computers, or digital cameras require such batteries and the like. A connector for connecting the main body is formed, wherein the connector is coupled to the lower end of the battery, and each connection terminal exposed on the upper and lower sides of the connector closely contacts the terminal of the main body to supply power, and It is well known that it is formed to be in close contact and charge power.

Looking at the configuration of such a connector in more detail as shown in Figure 1, the positioning hole 60 is formed through one side of the predetermined circuit board 50, a plurality of upper surfaces on the upper surface of the circuit board 50 While the connection terminal 70 is in close contact with the bottom of the circuit board 50, a plurality of lower connection terminals 80 are bent and protruded, and the outer surface of the circuit board 50 is usually covered with resin M of a synthetic resin material. The state is fixed to the bottom of the battery coupled.

On the other hand, the configuration of the molding apparatus for molding the outer surface of the circuit board 50 with the upper and lower connection terminals 70 and 80 as the resin M as described above, the upper and lower forming plate (10a, 10b) In the state separated by), predetermined molding spaces 20a and 20b are formed on the opposite inner surface so that the circuit board 50 and the connection terminals 70 and 80 attached thereto are seated, and resin is formed on one side thereof. An injection port (not shown) for injecting (M) is formed. Therefore, the surface of the upper and lower connection terminals 70 and 80 is injected by injecting resin (M) while the surfaces of the connection terminals 70 and 80 are in close contact with the surfaces of the upper and lower forming plates 10a and 10b. Except for the outside of the circuit board 50 is molded resin (M).

However, the following problems are pointed out when molding the resin M of the circuit board 50.

First, predetermined molding spaces 20a and 20b are formed in the upper and lower molded plates 10a and 10b so that the circuit board 50 is seated therein in close contact with each other. The surface of the upper and lower connection terminals 70 and 80 attached to the upper and lower surfaces of the 50 is in close contact with the surfaces of the upper and lower forming plates 10a and 10b. This is most preferred.

However, when the circuit board 50 is produced, there is a limit that the thickness cannot be exactly matched. That is, the conventional general circuit board 50 has a standard deviation of at least ± 0.1 mm in thickness at the time of production, and even if it is produced as precisely as possible, a standard deviation of at least ± 0.08 mm is generated. In addition, even when the upper and lower connection terminals 70 and 80 are attached to the upper and lower surfaces of the circuit board 50, more standard deviations occur.

Therefore, the molding spaces 20a and 20b formed between the upper and lower forming plates 10a and 10b due to the standard deviation between the circuit board 50 and the upper and lower connecting terminals 70 and 80 attached to the surface thereof. And some difference occurs.

In this case, when the height of the circuit board 50 and the upper and lower connection terminals 70 and 80 is smaller than the molding spaces 20a and 20b inside the upper and lower forming plates 10a and 10b, the injection characteristics may be 0.02 mm or more. Even if a small gap occurs, a phenomenon in which the resin M penetrates therebetween occurs, causing a problem that the surfaces of the upper and lower connection terminals 70 and 80 are heated by the molding resin M.

In addition, when the height of the circuit board 50 and the upper and lower connection terminals 70 and 80 is larger than the molding spaces 20a and 20b inside the upper and lower forming plates 10a and 10b, the upper and lower connections Since the terminals 70 and 80 are compressed, cracks may be generated or deformed in the upper and lower connection terminals 70 and 80 as well as the circuit board 50.

The present invention has been made to solve the above problems and shortcomings, the main object of the present invention is to form a resin on the outer surface of the mold while the circuit board is attached to the upper and lower connection terminals in the mold, the circuit Insert type connector resin molding device which prevents penetration of molding resin into the surface of each terminal or crack generation on the circuit board or each terminal while compensating for the height deviation regardless of the thickness of the board and the upper and lower connection terminals. Is to provide.

Another object of the present invention is to provide an insert type connector resin molding apparatus which prevents the molding resin from penetrating the surface of not only the upper and lower connection terminals of the circuit board, but also the side connection terminals connected in the left and right directions. .

It is another object of the present invention to provide an insert type connector resin molding apparatus which prevents distortion of a circuit board during resin molding.

1 is a side cross-sectional view showing a conventional insert type connector resin molding apparatus.

Figure 2 is a side cross-sectional view showing an insert type connector resin molding device to which the present invention is applied.

Figure 3 is an operating state side cross-sectional view showing the operating state of the insert-type connector resin molding device of FIG.

Figure 4 is a side cross-sectional view showing another embodiment of the insert-type connector resin molding device to which the present invention is applied.

Fig. 5 is an operational state side cross-sectional view showing an operating state of the insert type connector resin molding device of Fig. 4;

Figure 6 is a perspective view showing a state of use of the connector to which the present invention is applied.

** Description of symbols for the main parts of the drawing **

10a, 10b: upper and lower molding plates 20a, 20b: molding space

30a, 30b, 30c, 30d, 30e: guide ball

40a, 40b, 40c, 40d, 40e: working groove 50: circuit board

60: positioning hole 70: upper connection terminal

80: lower connection terminal 90: side connection terminal

M: Resin 100: Positioning Jig

120: stopper projection 200: substrate jig

220: stopper protrusion 240: elastic member

300: terminal jig 320: stopper projection

340: elastic member 400: compensation jig

420: stopper protrusion 440: elastic member

500: side jig 520: stopper protrusion

540: elastic member 600: auxiliary jig

620: stopper protrusion 640: elastic member

The present invention for achieving the above object is a molding apparatus for resin-molding the outside of the circuit board seated in the molding space is a predetermined molding space is formed on the inner surface facing the upper and lower molding plate,

A positioning jig installed in the lower molding plate and coupled with the positioning hole of the circuit board so that the circuit board is accurately seated in a predetermined molding space; A substrate jig installed on the lower molding plate to support the circuit board at a constant pressure so that the surface of the upper connection terminal in close contact with the upper side of the circuit board is in close contact with the surface of the upper molding plate; A terminal jig installed on the lower molding plate to closely contact the surface of the lower connection terminal bent and protruded to the lower side of the circuit board at a constant pressure; And a compensation jig installed on the upper forming plate to closely contact the rear surface of the lower connection terminal bent and projected downward to face the terminal jig with a corresponding pressure. It consists of.

At this time, the side jig is installed on both sides of the lower forming plate to be in close contact with the side connection terminal formed on both sides of the circuit board; And an auxiliary jig installed horizontally on left and right sides of the lower molding plate to closely contact the side jig to a side connection terminal. Is further configured.

In addition, the rear end of each jig is coupled to the elastic member is formed so that the front end of each jig in close contact with the corresponding circuit board and the upper, lower, side connection terminals as a constant elastic force.

At this time, the elastic member is made of a spring or made of high elastic urethane rubber.

In addition, a stopper protrusion protruding from the rear end of each jig to limit its forward distance in a state of being coupled to the upper and lower forming plates, and the stopper protrusion is inserted into an end portion of the upper and lower forming plates corresponding thereto. The groove is formed to have a predetermined depth deeper so as to move forward and backward a predetermined distance.

In addition, the through hole of the lower forming plate to which the side jig is coupled is formed larger than the diameter of the side jig so that the side jig is moved left and right by a predetermined interval to be in close contact with the side connection terminal.

Hereinafter, a preferred embodiment of the present invention will be described in more detail with reference to the accompanying drawings.

Figure 2 is a side cross-sectional view showing an insert type connector resin molding device to which the present invention is applied, Figure 3 is a side view showing an operating state of the insert type connector resin molding device of Figure 2, Figure 4 is FIG. 5 is a side sectional view showing another embodiment of the insert type connector resin molding device applied, and FIG. 5 is a side view showing the operating state of the insert type connector resin molding device of FIG.

The insert-type connector resin molding apparatus of the present invention has a top and bottom molding plates 10a and 10b and a positioning jig 100 and a substrate installed on the top and bottom molding plates as shown in FIGS. 2 to 5. The jig 200, the terminal jig 300, the compensation jig 400, the side jig 500, the auxiliary jig 600 and the elastic member 240, 340, which is coupled to the lower end of each jig to act a constant elastic pressure 440, 540, 640).

The upper and lower molding plates 10a and 10b are formed with molding spaces 20a and 20b for molding the resin M in a state in which the circuit board 50 is seated on opposite surfaces in close contact with each other. The lower forming plates 10a and 10b are normally spaced apart or in close contact with each other by operation of a cylinder (not shown). In particular, the upper and lower forming plate (10a, 10b) of the present invention is a predetermined guide hole (30a, 30b, 30c, 30d, 30e) in place so that a plurality of jigs are installed in the forming space (20a, 20b) The through grooves are formed at the rear ends of the guide holes 30a, 30b, 30c, 30d, and 30e so that the stopper protrusions 220, 320, 420, 520, and 620 of the respective jigs are operated at a predetermined distance. 40b, 40c, 40d, 40e) are recessed. At this time, the formation position of the guide hole (30a, 30b, 30c, 30d, 30e) is a substrate jig 200, terminal jig 300, compensation jig 400, side jig 500 and auxiliary jig 600 which will be described later It is formed at a position corresponding to). Meanwhile, although not shown in the drawings of the present invention, injection holes for injecting molding resin are formed in the upper and lower forming plates 10a and 10b.

Thus, as shown in Figure 6 as a preferred embodiment of the present invention when looking at the configuration of the connector coupled to the bottom of the battery of the mobile phone to connect the battery and the mobile phone body, a plurality of upper portion on the upper surface of the circuit board 50 of a predetermined size The connection terminal 70 is attached and fixed, and a pair of lower connection terminals protrude in a bent state and fixed to the lower surface of the circuit board 50. In addition, a positioning hole 60 is formed through one side of the circuit board 50.

Therefore, the positioning jig 100 is installed at one side of the lower forming plate 10b to protrude to a certain height so as to be coupled to the positioning hole 60 formed in the circuit board 50. That is, the positioning jig 100 is exposed to the inside of the molding space (20a, 20b) in a state coupled to the lower molding plate (10b), the circuit board at the front end of the positioning jig 100 The positioning holes 60 of 50 may be inserted into the molding spaces 20a and 20b. In addition, a stopper protrusion 120 is formed at the rear end of the positioning jig 100 to maintain a fixed state on the lower forming plate 10b.

In addition, the substrate jig 200 is installed on both sides of the lower molding plate 10b so that the surface of the upper connection terminal 70 closely attached to the upper surface of the circuit board 50 is in close contact with the surface of the upper molding plate 10a. If possible, the lower surface is formed to push up to a constant pressure. That is, the front end is formed to be in close contact with the bottom surface of the circuit board 50 in the state that the substrate jig 200 is inserted into the guide hole (30a) of the lower molding plate (10b), the lower end of the lower molding plate ( A stopper protrusion 220 is formed to be operated at a predetermined distance in a state coupled to the inside of the operating groove 40a formed at the end of 10b), and the substrate jig 200 is pushed to a lower end of the stopper protrusion 220 at a predetermined pressure. The elastic member 240 for raising is coupled.

In addition, the terminal jig 300 is installed at the center of the lower molding plate 10b and adhered to the surface of the lower connection terminal 80 attached to the bottom surface of the circuit board 50 in a state of being bent and protruded to form a molding resin ( M) is formed to prevent the penetration of the lower connection terminal 80 to the surface. That is, in the state where the terminal jig 300 is inserted into the guide hole 30b of the lower forming plate 10b, the front end thereof is formed to be in close contact with the surface of the lower connecting terminal 80, and the lower forming plate is formed at the rear end thereof. A stopper protrusion 320 is formed to be operated at a predetermined distance while being coupled to the inside of the operating groove 40b formed at the end of the stop 10b, and the terminal jig 300 is formed at a constant pressure at the rear end of the stopper protrusion 320. An elastic member 340 for pushing up is coupled.

In addition, the compensation jig 400 is installed in the center of the upper forming plate (10a) in close contact with the rear surface of the lower connecting terminal 80 in the state penetrating the circuit board 50, the force of the terminal jig 300 It is formed to cushion the pressure. That is, in the state where the compensation jig 400 is inserted into the guide hole 30c of the upper forming plate 10a, the front end thereof is formed to be in close contact with the rear surface of the lower connecting terminal 80, and the upper forming plate is formed at the rear end thereof. A stopper protrusion 420 is formed to be operated at a predetermined distance in a state coupled to the inside of the operation groove 40c formed at the end of the stop 10a, and the compensation jig 400 is formed at a constant pressure at the rear end of the stopper protrusion 420. An elastic member 440 for pushing up is coupled.

Therefore, according to the configuration of the positioning jig 100, the substrate jig 200, the terminal jig 300, and the compensation jig 400, the molding spaces 20a and 20b of the upper and lower forming plates 10a and 10b are formed. The upper connection terminal 70 of the circuit board 50 seated therein is completely in close contact with the upper forming plate 10a and the surface of the lower connection terminal 80 is completely in contact with the terminal jig 300. As it is buffered by the compensation jig 400, the upper and lower connection terminals 70 and 80 are exposed when the resin M is injected, without deformation or cracks caused by the elastic force of the elastic members 240, 340 and 440. Molding takes place.

On the other hand, as another embodiment of the present invention as shown in Figures 4 and 5 as a molding apparatus for molding the resin (M) connector formed with side connection terminals 90 on both sides of the circuit board 50, Side jig 500 and auxiliary jig 600 corresponding to the side connection terminal 90 are installed at both sides of the lower forming plate 10b.

Accordingly, the side jig 500 is installed on both sides of the lower molding plate 10b to be in close contact with side surfaces of the side connection terminals 90 bent to both sides of the circuit board 50. That is, in the state in which the side jig 500 is inserted into the guide hole 30d of the lower forming plate 10b, the inner surface of the front end is formed to be in close contact with the surface of the side connection terminal 90, and the rear end A stopper protrusion 520 is formed to be operated at a predetermined distance in a state coupled to an operating groove 40d formed at an end of the lower forming plate 10b, and the side jig at a constant pressure is formed at a rear end of the stopper protrusion 520. An elastic member 540 for pushing up 500 is coupled. In particular, the guide hole (30d) of the lower molding plate (10b) in which the side jig 500 is installed is formed to a diameter larger than the diameter of the side jig 500, so that the side connection terminal (90) It is formed to be in close contact with the.

In addition, the auxiliary jig 600 is installed in the horizontal direction on both sides of the lower forming plate (10b) is formed to be in close contact with the side connecting terminal 90 by pushing the side jig 500 at a constant pressure. That is, since the side jig 500 is advanced along the guide hole 30e of the lower forming plate 10b, the side jig 500 may be slightly spaced apart in close contact with the side connection terminal 90 of the circuit board 50. The front end of the auxiliary jig 600 is formed to be in close contact with the side connection terminal 90 by pushing the front end of the side jig 500, the rear end of the operation is formed on the side end of the lower forming plate (10b) A stopper protrusion 620 is formed to operate at a predetermined distance in a state coupled to the groove 40e, and an elastic member 640 for pushing the side jig 500 at a constant pressure at a rear end of the stopper protrusion 620. Is combined.

On the other hand, the elastic members 240, 340, 440, 540, 640 coupled to each jig described above is formed of a spring or urethane rubber to which a cushion of a certain pressure is applied. In this case, the urethane rubber is formed as a high-elasticity molded product so that one end thereof is elastic at a constant pressure in a state in which it is coupled to each jig.

Hereinafter, the operation of the insert-type connector resin molding device to which the present invention is applied will be described in more detail.

First, the upper connection terminal 70, the lower connection terminal 80, and the side connection terminal 90 are attached to the upper, lower, or side surfaces of the circuit board 50 prior to molding the connector through the molding apparatus. .

At this time, the upper and lower forming plates (10a, 10b) are spaced apart by a predetermined distance by the operation of the cylinder (not shown) of the rear end, each jig is exposed to the corresponding forming space (20a, 20b). .

Subsequently, after positioning the circuit board 50 with the connection terminals in the forming spaces 20a and 20b of the upper and lower forming plates 10a and 10b by the positioning jig 100, the cylinder is operated. The upper and lower molding plates 10a and 10b are in close contact with each other.

At this time, both sides and the center of the circuit board 10 is in close contact with the upper surface of the upper mold plate 10a with a uniform force by the substrate jig 200 and the elastic member 240 of the rear end of the upper connection is in close contact with the upper surface The surface of the terminal 70 is in close contact with the surface of the upper forming plate 10a.

At the same time, the surface of the lower connection terminal 80 which is bent and protruded on both sides of the center of the circuit board 50 is in close contact with a certain pressure by the terminal jig 300 and the elastic member 340 at the rear end thereof. The back surface of the connection terminal 80 is brought into close contact with the same pressure by the compensation jig 400 provided on the upper forming plate 10a and the elastic member 440 at the rear end thereof. Therefore, a predetermined through hole is formed in the circuit board 50 to which the lower connection terminal 80 is attached so that the compensation jig 400 passes therethrough.

As a result of the interaction between the substrate jig 200, the terminal jig 300, and the compensation jig 400, resin M is injected and molded while the upper and lower connection terminals 70 and 80 are completely covered. After that, the upper and lower forming plates 10a and 10b are separated from each other to separate the connector.

On the other hand, when the side connection terminal 90 is formed on both sides of the circuit board 50, the side connection terminal 90 is the side jig 500 when the circuit board 50 is seated in the molding spaces 20a and 20b. After fitting so as to be in close contact with the upper and lower molding plates (10a, 10b) in a state in which the resin (M) is injected and molded, and then the upper and lower molding plates (10a, 10b) to separate the connector.

Therefore, according to such an operation, each connection terminal is provided on the resin molded connector in a completely exposed state.

As described above, the present invention has been described with reference to the embodiments illustrated in the drawings, but this is merely exemplary and will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. will be. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

As described above, the insert-type connector resin molding apparatus of the present invention compensates for the height deviation regardless of the thickness of the circuit board and the upper and lower connection terminals by each jig provided on the upper and lower forming plates, and the surface of each terminal. By preventing the molding resin from penetrating into or cracking the circuit board or each terminal, a very useful effect of completely eliminating the defective rate of the product is generated, thereby reducing the economic waste for disposal of the defective product A very useful effect of improving productivity is exerted.

In addition, it is possible to prevent the twisting of the circuit board by the balanced action of each jig, including a finger plate jig for supporting the circuit board is exhibited a very useful effect to further improve the reliability of the product.

Claims (7)

In the molding apparatus for resin-molding the outside of the circuit board seated in the molding space in a predetermined molding space is formed on the inner surface facing the upper and lower molding plate, A positioning jig installed in the lower molding plate and coupled with the positioning hole of the circuit board so that the circuit board is accurately seated in a predetermined molding space; A substrate jig installed on the lower molding plate to support the circuit board at a constant pressure so that the surface of the upper connection terminal in close contact with the upper side of the circuit board is in close contact with the surface of the upper molding plate; A terminal jig installed on the lower molding plate to closely contact the surface of the lower connection terminal bent and protruded to the lower side of the circuit board at a constant pressure; And Insert type connector resin molding device, characterized in that configured to be provided on the upper forming plate, but a compensation jig for close contact with the corresponding pressure on the back of the lower connection terminal bent protruding downward facing the terminal jig. According to claim 1, Side jig provided on both sides of the lower forming plate to be in close contact with the side connection terminal formed on both sides of the circuit board; And An auxiliary jig installed horizontally on the left and right sides of the lower molding plate to closely contact the side jig to a side connection terminal; Insert type connector resin molding device, characterized in that consisting of. The insert according to claim 1 or 2, wherein an elastic member is coupled to the rear end of each jig so that the front end of each jig is in close contact with the corresponding circuit board and the upper, lower and side connection terminals as a constant elastic force. Type connector resin molding device. 4. The insert type connector resin molding apparatus according to claim 3, wherein the elastic member is made of a spring. 4. The insert type connector resin molding apparatus according to claim 3, wherein the elastic member is made of high elastic urethane rubber. The rear end of each jig protrudes a stopper protrusion for limiting its advance distance in a state of being coupled to the upper and lower forming plates, and an end portion of the upper and lower forming plates corresponding thereto. The insert-type connector resin molding device is characterized in that the groove is formed in the groove formed in the deeper predetermined depth so that the stopper projection is inserted forward and backward a predetermined distance. 8. The insert type connector resin molding apparatus according to claim 6, wherein the through hole of the lower forming plate to which the side jig is coupled is formed larger than the diameter of the side jig so that the side jig is moved left and right at a predetermined interval to be in close contact with the side connecting terminal.