KR20040089978A - fabrication of white Light Emitting Diodes - Google Patents
fabrication of white Light Emitting Diodes Download PDFInfo
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- KR20040089978A KR20040089978A KR1020030023845A KR20030023845A KR20040089978A KR 20040089978 A KR20040089978 A KR 20040089978A KR 1020030023845 A KR1020030023845 A KR 1020030023845A KR 20030023845 A KR20030023845 A KR 20030023845A KR 20040089978 A KR20040089978 A KR 20040089978A
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- fluorescent pigment
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000049 pigment Substances 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000007787 solid Substances 0.000 claims abstract description 11
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 18
- 238000000465 moulding Methods 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- 229910020068 MgAl Inorganic materials 0.000 claims description 3
- 108010043121 Green Fluorescent Proteins Proteins 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- IZJSTXINDUKPRP-UHFFFAOYSA-N aluminum lead Chemical compound [Al].[Pb] IZJSTXINDUKPRP-UHFFFAOYSA-N 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
- C09K11/592—Chalcogenides
- C09K11/595—Chalcogenides with zinc or cadmium
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/7729—Chalcogenides
- C09K11/7731—Chalcogenides with alkaline earth metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/7737—Phosphates
- C09K11/7738—Phosphates with alkaline earth metals
- C09K11/7739—Phosphates with alkaline earth metals with halogens
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
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Abstract
Description
본 발명은 백색 발광소자의 제조 방법에 관한 것으로 특히, 자외선 발광칩을 이용한 균일하고 안정된 고휘도의 백색 발광소자 제조 방법에 관한 것이다.The present invention relates to a method of manufacturing a white light emitting device, and more particularly, to a method of manufacturing a uniform and stable high brightness white light emitting device using an ultraviolet light emitting chip.
일반적으로, 백색광을 발광하는 다이오드를 제조하기 위하여 청색 발광 다이오드 상에 형광 안료가 혼합된 액상 수지를 봉입하여 백색광 LED를 제조하여 왔다. 백색광이란 일반적으로 그 파장이 400 nm에서 600 nm까지 균일하게 분포된 광을 말한다.In general, a white light LED has been manufactured by encapsulating a liquid resin mixed with a fluorescent pigment on a blue light emitting diode in order to manufacture a diode emitting white light. White light generally refers to light whose wavelength is uniformly distributed from 400 nm to 600 nm.
종래에 백색을 발광하는 LED는 회로가 구성되어 있는 인쇄회로기판 또는 알루미늄 재질의 리드 프레임 상에 청색 발광칩을 장착하고 칩 상부에 액상 수지를 도포한 후, 형광 안료를 상기 액상 수지내에 포팅하고 경화시켜 다시 몰딩부를 형성하도록 트랜스퍼 몰드한 후, 각각의 제품을 잘라내는 방식과, 일정한 형상을 갖는 플라스틱 재질의 사출물에 형광 안료를 디스펜서를 이용하여 포팅한 후 에폭시로 마감을 하는 방식과, 리드 프레임에 형광 안료를 포팅하여 램프의 형상을 한 몰드컵을 이용하여 LED 램프로 제조하는 방식 등 다양한 종류의 제조 방법이 있었다.Conventionally, an LED emitting white light has a blue light emitting chip mounted on a printed circuit board or aluminum lead frame in which a circuit is formed, and a liquid resin is coated on the chip, and then a fluorescent pigment is potted in the liquid resin and cured. After the mold is transferred to form the molding part again, each product is cut out, a fluorescent pigment is ported to a plastic injection molded product having a predetermined shape by using a dispenser, and then finished with epoxy and a lead frame. There have been various kinds of manufacturing methods such as a method of manufacturing a LED lamp using a mold cup in which a fluorescent pigment is potted and shaped into a lamp.
일반적으로 종래에는 가시광 영역 중 특히 파장 450 ～ 470 nm의 청색 발광칩을 외부와 전기적으로 도전상태가 되도록 실장한 후, 상기 발광칩을 덮도록 Yttrium Aluminum Garnet(Y3Al5O12; 이하 'YAG'라 칭함)계 형광 안료를 포함하는 형광물질층을 형성하는 방법을 이용하였다.Generally, after mounting a blue light emitting chip having a wavelength of 450 to 470 nm in an electrically conductive state in the visible region, the Yttrium Aluminum Garnet (Y 3 Al 5 O 12 ; A method of forming a fluorescent material layer containing a 'based) fluorescent pigment was used.
상술한 바와 같이 제조된 종래의 백색 발광소자는 청색 발광칩의 청색광이 상기 형광물질층 내에 첨가된 YAG계 형광 안료와 반응하여 나오는 적색 및 녹색 가시광과 형광 안료와 반응하지 못하고 투과한 원래 청색광 사이의 색조합에 의하여 백색광을 구현하였다.In the conventional white light emitting device manufactured as described above, the blue light of the blue light emitting chip is separated between the red and green visible light that is reacted with the YAG-based fluorescent pigment added in the fluorescent material layer and the original blue light that does not react with the fluorescent pigment. White light was realized by the hue sum.
그러나, 450 ～ 470 nm의 청색 발광칩은 여기 파워가 약해 조명용 백색광을 형성하기에는 어려운 문제가 있어 현재 광원 파워가 큰 300 ～ 420 nm의 자외선 발광칩을 이용하여 백색광을 형성하고자하는 노력들이 진행되고 있다.However, since blue light emitting chips of 450 to 470 nm have a weak excitation power, it is difficult to form white light for illumination, and efforts are being made to form white light using ultraviolet light emitting chips of 300 to 420 nm having large light source power. .
따라서, 본 발명의 목적은 광원 파워가 큰 자외선 발광칩 등을 이용하여 고휘도의 백색 발광소자 제조 방법을 제공함에 있다.Accordingly, an object of the present invention is to provide a method of manufacturing a high brightness white light emitting device using an ultraviolet light emitting chip having a large light source power.
상기 목적을 달성하기 위한 본 발명에 따른 백색 발광 소자는 외부와 전기적으로 연결되도록 자외선 영역의 발광칩을 실장하는 단계와, 상기 발광칩을 덮도록 고체 또는 액체수지에 (Sr,Ba)2SiO4:Eu 및 청색계열의 형광 안료를 첨가하여 형광물질층을 형성하는 단계를 포함하여 이루어진다. 상기 발광칩은 파장대가 300 ～ 420 nm의 자외선 영역인 것을 사용하며, 상기 청색 계열의 형광 안료는 (Sr, Ca, Ba, Mg)10(PO4)6Cl2:Eu, (Ba, Eu)MgAl10O17또는 ZnSiMg 중에 하나 이상을 사용하는 것을 특징으로 한다.The white light emitting device according to the present invention for achieving the above object is a step of mounting a light emitting chip in the ultraviolet region to be electrically connected to the outside, (Sr, Ba) 2 SiO 4 in a solid or liquid resin to cover the light emitting chip It comprises the step of forming a fluorescent material layer by adding a fluorescent pigment of Eu and blue series. The light emitting chip has a wavelength range of 300 to 420 nm ultraviolet range, and the blue-based fluorescent pigment is (Sr, Ca, Ba, Mg) 10 (PO 4 ) 6 Cl 2 : Eu, (Ba, Eu) It is characterized by using at least one of MgAl 10 O 17 or ZnSiMg.
도 1은 백색 발광소자의 일 예를 도시하는 단면도.1 is a cross-sectional view showing an example of a white light emitting element.
도 2는 백색 발광소자의 다른 예를 도시하는 단면도.2 is a cross-sectional view showing another example of a white light emitting element.
도 3은 백색 발광소자의 또 다른 일 예를 도시하는 단면도.3 is a cross-sectional view showing yet another example of a white light emitting device.
도 4는 백색 발광소자의 또 다른 일 예를 도시하는 단면도.4 is a sectional view showing another example of a white light emitting element;
도 5는 본 발명에서 사용된 형광 안료의 발광 특성을 나타내는 그래프.5 is a graph showing the light emission characteristics of the fluorescent pigment used in the present invention.
도 6은 본 발명의 일 실시 예에 따라 형성한 백색 발광소자의 스펙트로미터데이터 및 색좌표를 나타내는 그래프.6 is a graph showing spectrometer data and color coordinates of a white light emitting device formed according to an embodiment of the present invention.
도 7은 본 발명의 다른 실시 예로 제조한 백색 발광소자의 스펙트로미터 데이터 및 색좌표를 나타내는 그래프.7 is a graph showing spectrometer data and color coordinates of a white light emitting device manufactured according to another embodiment of the present invention.
도 8은 본 발명의 또 다른 실시 예로 형성한 백색 발광소자의 스펙트로미터 테이터 및 색좌표를 나타내는 그래프.8 is a graph showing spectrometer data and color coordinates of a white light emitting device formed as another embodiment of the present invention.
이하에서 첨부된 도 1 내지 도 8의 도면을 참고로 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings of FIGS. 1 to 8.
본 발명의 백색발광소자는 도 1 내지 도 4에서 도시된 단면도와 같이, 필요에 따라 각각의 재질로 여러 층 도금이 되어 일정한 패턴을 이루고 있는 인쇄회로기판(7)과 이와 비슷한 역할을 하는 리드프레임(6) 상에 자외선 영역의 발광칩(3)을 접착제(4)를 이용하여 접착 고정하고, 상기 접착제(4)가 경화되도록 일정 온도조건에 일정시간을 방치한다. 상기에서 자외선 영역의 발광칩(3)은 광원 파워가 큰 300 ～ 420 nm 파장 범위 내의 것을 사용한다.The white light emitting device of the present invention, as shown in the cross-sectional view shown in FIGS. The light emitting chip 3 in the ultraviolet region is adhesively fixed on the 6 by using the adhesive 4, and a predetermined time is left under constant temperature conditions so that the adhesive 4 is cured. In the above, the light emitting chip 3 in the ultraviolet region uses a light source having a large light source power within a wavelength range of 300 to 420 nm.
이렇게 실장된 발광칩(3)을 전기적으로 도전 상태로 만들기 위하여 도전성 재료로 와이어(5) 본딩한다. 이어서 (Sr, Ca, Ba, Mg)10(PO4)6Cl2:Eu, (Ba, Eu)MgAl10O17또는 ZnSiMg 등과 같은 청색 계열의 형광 안료 중 하나 이상을 (Sr,Ba)2SiO4:Eu 형광 안료와 같이 액체 또는 고체수지에 첨가하여 형광물질층(2)을 형성한다.In order to make the mounted light emitting chip 3 electrically conductive, the wire 5 is bonded with a conductive material. Subsequently, one or more of blue-based fluorescent pigments such as (Sr, Ca, Ba, Mg) 10 (PO 4 ) 6 Cl 2 : Eu, (Ba, Eu) MgAl 10 O 17, or ZnSiMg, is added to (Sr, Ba) 2 SiO 4 : The fluorescent material layer 2 is formed by adding to a liquid or a solid resin, such as an Eu fluorescent pigment.
상기 형광물질층(2)을 형성하는 방법은 액체수지를 이용하는 방법과, 고체수지를 이용하는 방법으로 크게 분류할 수 있다.The fluorescent material layer 2 may be broadly classified into a method using a liquid resin and a method using a solid resin.
도 1에 도시된 백색 발광소자의 경우는 고체수지를 이용한 것으로서, 상기 과정에 이미 제조된 인쇄회로기판(7)을 알맞은 금형이 설치된 트랜스퍼 몰딩 프레스 상에 배열하고 형광 안료가 첨가된 몰딩 컴파운드 태블릿을 넣고 소정의 압력, 온도 그리고, 시간을 두어 외부와 전기적으로 연결된 상기 발광칩(3)을 덮도록 성형하여 형광물질층(2)을 형성한다. 상기에서 몰딩 컴파운드 태블릿은 고체분말수지에 (Sr,Ba)2SiO4:Eu를 1 ～ 50 %, 청색 계열의 형광 안료를 1 ～ 50 % 범위 내에서 CIE(국제조명위원회)가 지정한 백색 색좌표 X=0.31, Y=0.31에 근접할 수 있도록 농도비를 조절하여 첨가한다.In the case of the white light emitting device shown in FIG. And a predetermined pressure, temperature, and time are formed to cover the light emitting chip 3 electrically connected to the outside to form the fluorescent material layer 2. In the above-mentioned molding compound tablet, the solid powder resin (Sr, Ba) 2 SiO 4 : Eu 1 ~ 50%, blue fluorescent pigment 1 ~ 50% within the range of white color coordinates designated by the CIE (International Lighting Commission) X Adjust the concentration ratio so that it is close to = 0.31 and Y = 0.31.
도 2 및 도 4의 백색 발광소자는 액체수지를 이용하여 형성한 예로서, 액체수지에 (Sr,Ba)2SiO4:Eu 형광 안료를 1 ～ 50 % 그리고, 청색 계열의 형광 안료를 1 ～ 50 % 범위에서 혼합하여 믹싱(Mixing) 한 후 디스펜서로 몰딩 또는 스크린 인쇄하여 형성한다.The white light emitting device of FIGS. 2 and 4 is an example formed using a liquid resin, wherein 1 to 50% of (Sr, Ba) 2 SiO 4 : Eu fluorescent pigment and 1 to blue fluorescent pigment are formed on the liquid resin. Mix by mixing in the range of 50% and mix and then form by molding or screen printing with a dispenser.
상기 형광물질층(2)의 성분비는 (Sr,Ba)2SiO4:Eu 형광 안료를 5 % 그리고, 청색 계열의 형광 안료를 15 ～ 20 %일 때 색좌표가 X = 0.31, Y = 0.31인 백색광에 근접하는 데이터를 얻을 수 있었다.The component ratio of the fluorescent material layer 2 is (Sr, Ba) 2 SiO 4 : Eu fluorescent pigment 5% and blue-based fluorescent pigment 15 to 20% when the color coordinates X = 0.31, Y = 0.31 I was able to get data close to.
추가로 상술한 형광 안료들을 첨가한 액체수지에 실리콘(Si)을 첨가하여 발광칩과 형광물질층 사이의 완충역활을 하도록하며, 고체분말수지를 추가 첨가하여 액체수지의 경화를 촉진하여 기존에 액체수지를 이용한 형광물질층의 장시간 경화도중 발생하는 형광 안료의 침전을 방지할 수도 있다. 또한, 상기 형광물질층 형성시 추가로 적색 계열의 형광 안료 또는 (Sr,Ba)2SiO4:Eu 동일계 녹색 형광 안료를 1 ～ 50 % 혼합하여 백색 색좌표에 더욱더 근접시킬 수 있다.In addition, silicon (Si) is added to the liquid resin to which the above-described fluorescent pigments are added to act as a buffer between the light emitting chip and the fluorescent material layer, and the solid powder resin is added to promote the curing of the liquid resin, thereby improving the existing liquid. It is also possible to prevent the precipitation of the fluorescent pigment generated during long time curing of the fluorescent material layer using a resin. In addition, when forming the phosphor layer, a red-based fluorescent pigment or a (Sr, Ba) 2 SiO 4 : Eu in-situ green fluorescent pigment may be mixed in an amount of 1 to 50% to further approach the white color coordinate.
첨부된 도면에서 도 1은 칩 발광다이오드(Chip LED), 도 2는 탑 발광다이오드(Top LED), 도 3은 램프 발광다이오드(Lamp LED) 그리고, 도 4는 COB(Chip On Board)를 개략적으로 도시한 단면도로서, 각각의 구조에 맞춘 인쇄회로기판 또는 리드프레임 상에 외부와 전기적으로 도전되도록 가시광 영역의 발광파장을 갖는 발광칩을 실장한 후 상기 발광칩을 덮도록 액체 또는 고체수지에 (Sr,Ba)2SiO4:Eu 및청색 계열의 형광 안료를 포함시킨 형광물질층을 형성하는 본 발명의 실시 예를 적용하여 각각의 목적과 쓰임새에 맞춘 다양한 종류의 백색 발광소자를 제조할 수 있다.In the accompanying drawings, FIG. 1 shows a chip LED, FIG. 2 shows a top LED, FIG. 3 shows a lamp LED, and FIG. 4 schematically shows a chip on board. In the cross-sectional view, a light emitting chip having a light emission wavelength in a visible light region is mounted on a printed circuit board or lead frame according to each structure, and then placed in a liquid or solid resin so as to cover the light emitting chip. , Ba) 2 SiO 4 : By applying an embodiment of the present invention to form a fluorescent material layer containing a fluorescent pigment of the Eu and blue series it can be produced a variety of white light emitting device according to the purpose and use.
도 5는 본 발명의 실시 예에 적용된 (Sr,Ba)2SiO4:Eu 형광 안료의 발광 특성 테이터로, 상기 형광 안료의 고체시료에 45°방향으로 광을 쏘아주어 여기되는 파장 변화를 도시하는 그래프이다.FIG. 5 is a light emission characteristic data of (Sr, Ba) 2 SiO 4 : Eu fluorescent pigment applied to an embodiment of the present invention, which illustrates a wavelength change excited by emitting light in a 45 ° direction to a solid sample of the fluorescent pigment. It is a graph.
도시된 바와 같이 상기 형광 안료는 250 ～ 500 nm 범위의 빛을 여기시킴을 알 수 있다. 즉 상기 (Sr,Ba)2SiO4:Eu를 형광 안료로 사용하여 일부 가시광 영역부터 자외선 영역에 이르는 파장 범위의 발광칩을 광원으로 사용하여 파장범위에 민감하게 적용하지 않는 백색 발광소자를 제조 할 수 있다.As shown, it can be seen that the fluorescent pigment excites light in the range of 250 to 500 nm. That is, by using the (Sr, Ba) 2 SiO 4 : Eu as a fluorescent pigment, a light emitting chip having a wavelength range from the visible region to the ultraviolet region as a light source to produce a white light emitting device that is not sensitive to the wavelength range. Can be.
도 6은 405 nm의 자외선 발광칩 상에 (Sr,Ba)2SiO4:Eu를 형광 안료를 혼합하여 형광물질층을 형성한 백색 발광소자의 스펙트로미터 데이터이다.FIG. 6 is spectrometer data of a white light emitting device in which a fluorescent material layer is formed by mixing (Sr, Ba) 2 SiO 4 : Eu with a fluorescent pigment on a 405 nm ultraviolet light emitting chip.
도시된 바와 같이 자외선 발광칩에서 나오는 자외선 빛과 여기된 형광 안료의 노란색이 혼합되어 색좌표가 X = 0.37, Y = 0.43인 백색 광을 얻었음을 알 수 있다.As shown, it can be seen that ultraviolet light emitted from the ultraviolet light emitting chip and yellow of the excited fluorescent pigment are mixed to obtain white light having X = 0.37 and Y = 0.43.
도 7은 405 nm의 자외선 발광칩 상에 (Sr,Ba)2SiO4:Eu와 청색계열의 형광 안료중 하나인 (Sr, Ca, Ba, Mg)10(PO4)6C를 혼합하여 형광물질층을 형성한 백색 발광소자의 스펙트로미터 데이터이다.FIG. 7 shows a mixture of (Sr, Ba) 2 SiO 4 : Eu and (Sr, Ca, Ba, Mg) 10 (PO 4 ) 6 C, which is one of blue-based fluorescent pigments, on a 405 nm ultraviolet light emitting chip. Spectrometer data of a white light emitting device in which a material layer is formed.
도시된 바와 같이 자외선 발광칩에서 나오는 자외선 빛과 여기된 형광 안료의 노란색 및 청색이 혼합되어 색좌표가 X = 0.33, Y = 0.37로 자외선 발광칩 상에(Sr,Ba)2SiO4:Eu만 첨가하여 형광물질층을 형성한 백색 발광소자보다 더 백색 색좌표에 근접한 데이터를 얻었음을 알 수 있다.As shown, the ultraviolet light emitted from the ultraviolet light emitting chip and the yellow and blue colors of the excited fluorescent pigment are mixed to add only (Sr, Ba) 2 SiO 4 : Eu on the ultraviolet light emitting chip with X = 0.33 and Y = 0.37. It can be seen that the data closer to the white color coordinates was obtained than the white light emitting device in which the fluorescent material layer was formed.
도 8은 395 nm의 자외선 발광칩 상에 (Sr,Ba)2SiO4:Eu와 청색계열의 형광 안료중 하나인 (Sr, Ca, Ba, Mg)10(PO4)6C를 혼합하여 형광물질층을 형성한 백색 발광소자의 스펙트로미터 데이터이다.FIG. 8 shows a mixture of (Sr, Ba) 2 SiO 4 : Eu and (Sr, Ca, Ba, Mg) 10 (PO 4 ) 6 C, which is one of blue-based fluorescent pigments, on a 395 nm ultraviolet light emitting chip. Spectrometer data of a white light emitting device in which a material layer is formed.
도시된 바와 같이 자외선 발광칩의 파장대를 변화시켜 색좌표가 X = 0.32, Y = 0.37인 백색 발광소자를 얻었음을 알 수 있다.As shown, it can be seen that a white light emitting device having a color coordinate of X = 0.32 and Y = 0.37 was obtained by changing the wavelength band of the ultraviolet light emitting chip.
상술한 바와 같이 본 발명은 광원파워가 큰 자외선 발광칩에 황색계열 및 청색계열의 형광 안료를 첨가한 형광물질층을 형성하므로서 균일하고 안정된 고휘도의 백색 발광소자를 얻을 수 있는 이점이 있다.As described above, the present invention has the advantage of providing a uniform and stable white light emitting device having a high luminance by forming a fluorescent material layer in which yellow and blue fluorescent pigments are added to an ultraviolet light emitting chip having a large light source power.
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| CN105206642A (en) * | 2015-10-13 | 2015-12-30 | 南京大学 | Super-high-density LED display device and manufacturing method thereof |
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| CN105206642A (en) * | 2015-10-13 | 2015-12-30 | 南京大学 | Super-high-density LED display device and manufacturing method thereof |
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