KR20040086485A - Interconnection pin/socket components for electrically connecting two circuit boards and method for mounting said components in a circuit board - Google Patents

Abstract

The method of the present invention which provides the mechanical / electrical interconnection and thus the required interconnect components between two circuit boards comprises pins and sockets with tails, shoulders and heads, respectively. The tail is sized to fit within the plated through hole of the first substrate, and the head portion is sized to allow the automation equipment to capture the head and to seat on top when inserted into the plated through hole. Set, the shoulder seated inside the plated through hole and plated through hole to allow a predetermined amount of solder to flow below the head and below the plated through hole but not to flow below the tail Size is set for to help center the pin in the through hole. Upon heating to the solder reflow temperature, a solder loop flows around the head of the pin and the shoulder circumference of the socket, causing the solder loop to flow under the shoulder of the socket and the head of the pin, thereby between the pin and first substrate and between the socket and the second substrate Form soldered electrical connections. A detachable and reliable mechanical electrical interconnect is formed between the first substrate and the second substrate by aligning the pin with the socket and inserting the tail of the pin into the cavity of the socket.

Description

INTERCONNECTION PIN / SOCKET COMPONENTS FOR ELECTRICALLY CONNECTING TWO CIRCUIT BOARDS AND METHOD FOR MOUNTING SAID COMPONENTS IN A CIRCUIT BOARD}

Pin and socket interconnect technologies exist in the industry today. A commonly practiced method in which pins and sockets are connected to a surface mount technology circuit board to create an attachment in a high capacity manufacturing environment is to press-fit the pins and sockets into individual circuit boards and to surround the interconnect components on the substrate. This is to reflow the solder paste which has been deposited in advance. However, this requires the purchase and installation of special and expensive through hole insertion capital equipment inside the surface mount reflow manufacturing line. The equipment may cost around $ 200,000 per surface mounted reflow line. It may also be necessary to operate a plurality of reflow manufacturing lines that generally handle various manufacturing lines.

In addition to incurring significant expense for employing interference pin and socket methods inside the factory, the technology is also very limited in its use. The type of circuit board dielectric material and its thickness play an important role in determining whether an interference fit technique can be used. Amplifier designs often use microwave substrate materials made from PTFE materials. This material is Teflon-based and soft in essence. This softness makes it difficult to clamp the interconnect parts. In addition, plated through holes in such materials are less precise than in hard materials, often resulting in unreliable connections between the interconnect components and the substrate. Finally, the substrate dielectric material often needs to be thinned to provide the optimum width transmission line. These two constraints make it impossible to use the pressure fit method in many applications, for example in applications requiring a high reliability RF connection between a mother board of a power amplifier and an amplifier module used in a wireless base station.

Accordingly, the present invention is directed to the problem of developing a method of mounting interconnect pin and socket components on a printed circuit board, which provides the ability to use standard surface mount reflow manufacturing lines to provide a significant amount of flexibility. Can be.

It is another object of the present invention to provide a pin and socket interconnect component that can be easily designed with any circuit board and can be evenly integrated into a standard surface mount reflow manufacturing line. These through hole interconnect components must be designed and packaged so that they can be assembled to the circuit board using standard surface mount pick and place equipment, including the use of standard vacuum nozzles inside the pick and place equipment. Finally, the parts should allow for normal manufacturing and assembly changes to be used in all aspects of the process.

The present invention relates generally to methods of mounting and electrically connecting modules to surface mount technology circuit boards and the required pin and socket interconnect components.

This application has priority to US Provisional Application No. 60 / 365,824, filed March 20, 2002, entitled "Pin / Socket Parts Designed for Mounting to Surface Mount Circuit Boards and Methods of Mounting the Parts". Claim the interests of

1 is a side view of a pin according to a preferred embodiment of the present invention.

2 and 3 are top and bottom views, respectively, of the pin of FIG. 1 being inserted into a plated through hole of a printed circuit board.

4 is a side view of a socket according to a preferred embodiment of the present invention.

5 and 6 are top and bottom views, respectively, of the socket of FIG. 4 being inserted into a plated through hole of a printed circuit board.

7 and 8 are top / side and side / bottom views of the pin of FIG. 1 and the socket of FIG. 4, supported on a corresponding printed circuit board and with pins mounted inside the socket.

The present invention solves these and other problems by providing interconnect components comprising pins and sockets each having a wide head diameter sufficient for a standard vacuum nozzle to capture. The pin tail has two diameters: a small diameter for the tail and a slightly larger diameter for the shoulder just below the head. The top or "shoulder" of the tail adjacent the head portion is sized to help center the pin within the plated through hole in the surface of the circuit board. Likewise, the socket has two diameters below the head, i.e. the smallest "tail" diameter and the large diameter referred to herein as the "shoulder".

Solder paste previously deposited on the circuit board is placed around the perimeter of the socket shoulder and the perimeter of the pin head upon insertion of the pin and socket into each individual circuit board. When the circuit board reaches the solder reflow temperature, it flows under the head of the pin and the shoulder of the socket and under the plated through hole to provide a mechanical and electrical connection. This reflow process also serves to center the pin / socket inside the plated through-holes, helping to reduce tolerances in pin and socket alignment effort. The diameter of the plated through hole, the diameter of the pin head portion and the pin shoulder and the exact amount of solder paste ensure that all the solder is in the plated through hole and around the head portion of the pin.

In one exemplary embodiment of the present invention, a pin / surface mount printed circuit board assembly for providing electrical connection between a surface mount printed circuit board and a surface mount mother substrate is a surface mount having one or more through holes having a diameter. And a pin having a circuit board, a tail, a shoulder and a head, the tail and the shoulder having a diameter smaller than the diameter of the at least one through hole and the head portion having a diameter larger than the diameter of the through hole. The diameter of the shoulder, in relation to the diameter of the through hole, allows the solder to settle inside the through hole and allow the solder to flow down the head and below the through hole, but not below the tail. And to form a solder joint between the through hole and the pin and to help center the pin within the through hole. Electrical connection between the surface mount printed circuit board and the surface mount mother board is provided by inserting the tail of the pin into the corresponding socket of the surface mount mother board.

In yet another embodiment, the solder is provided in a solder mask dam supported on a surface mounted printed circuit board. And in yet another embodiment, the preform solder paste is supported on a surface mounted printed circuit board.

In another exemplary embodiment of the present invention, inside the plated through hole of the printed circuit board, the head part, the shoulder part and the tail part have a diameter smaller than the diameter of the through hole where the shoulder part and the tail part are plated and the head part is plated. A method of mounting an interconnect component having a diameter larger than the through hole is provided. The head portion of the interconnect component is captured and the tail portion of the interconnect component is positioned over the plated through hole so that it is inserted into the through hole and solder around the through hole periphery is below the head portion of the interconnect component and through the hole. The circuit board is heated to a predetermined solder reflow temperature so as to flow downward to form a solder joint between the pin and the plated through hole. The diameter and length of the shoulder, the diameter of the head, the diameter of the through hole, and the predetermined amount of the solder paste are configured to prevent the solder from flowing to the tail.

In another embodiment of the present invention, a detachable mechanical and electrical interconnect is provided between the first substrate and the second substrate. The interconnect is a tail sized to fit within the plated through hole of the first substrate, and a head sized to seat on top of the plated through hole when inserted therein with a diameter greater than the diameter of the plated through hole. And is sized for the plated through hole seated inside the plated through hole and allowing the solder to flow under the head portion and below the plated through hole but not to flow below the tail. And a pin having a shoulder adapted to help center the pin in the through hole. The interconnect also has a cavity sized to fit within the plated through hole of the second substrate, and to allow solder to flow under the shoulder and below the plated through hole seated on top of the plated through hole. And a socket sized with respect to the plated through hole and having a shoulder adapted to help center the socket in the through hole. Upon heating, a ring of solder around the periphery of the shoulder of the socket and the head of the pin flows down the shoulder of the socket and the head of the pin, thereby soldering between the pin and the first substrate and between the socket and the second substrate, respectively. Form an electrical connection. The pin and the socket are joined by aligning the pin and the socket and inserting the tail of the pin into the cavity of the socket, thereby forming a separable electrical and mechanical interconnect between the first substrate and the second substrate. .

The proposed interconnect components and methods withstand the usual changes found in standard manufacturing processes, while providing strong integrity, allowing module design inside the amplifier, ease of assembly and repair, and each individual matching pair Mounting processes that provide the necessary float within the circuits offer the possibility to quickly and reliably interconnect thin RF circuit boards.

It should be noted that any reference herein to "one embodiment" or "an embodiment" means that a particular configuration, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. It is worth it. The use of the phrase “in one embodiment” in various places in the specification is not necessarily all referring to the same embodiment.

1 shows a preferred embodiment of a surface mount pin constructed in accordance with the present invention to be interconnected with a surface mount socket (described in detail below). The pins can of course be manually inserted into the plated through-holes, but those skilled in the art can use user-friendly tape and reel packaging, which further improves the efficiency of the automated assembly process. It will be appreciated that standard automated pick and place equipment can be used to automatically mount the substrate inside.

As shown in Figure 1, the tip of the surface mount pin 10 is a nail shape that enhances the insertion capability of the tip into the plated through hole of the circuit board, but the tail of the pin according to the teachings herein is hemispherical if desired. It may be any other shape that facilitates insertion, such as a tip. The head portion of the pin 10 is shown to have an exemplary head portion diameter of 0.052 inches (of course the diameter of the head portion, tail portion or shoulder of the pin and any other specific dimensions provided herein are provided for illustrative purposes only. It is by no means meant to limit the scope of the invention. The width of the head portion is wide enough that a standard vacuum nozzle of an automated assembly process can capture it. The nozzle grasps the pin with the tail directed down towards the circuit board on which the pin is to be installed. The diameter of the tail end of the pin is 0.018 inches and has a lead-in chamfer.

As shown in Figures 2 and 3, the nozzle passes through a 0.025 inch diameter plated through hole in the circuit board 30 (again, the actual dimensions are only exemplary) and the underside of the head is the surface of the circuit board. The pin 10 is positioned so as to lean on the solder "preform" or solder paste as shown in advance. The diameter of the plated through hole is between the through hole of the circuit board and the tail of the pin 10 to allow the tolerance required for a standard surface mount machine for inserting the through hole pin 10 into the circuit board 30. Allow sufficient tolerance. The top or “shoulder” 15 of the tail proximate the head portion is projected to 0.021 inches, which helps to determine the center of the pin 10 inside a plated through hole of 0.025 inches in diameter.

When using a standard stencil printing process, a ring of solder paste is placed around the periphery of the pin head and inserted into the electrical contacts upon insertion into the circuit board to solder the solder pin 10 to the circuit board 30. (The person skilled in the art may know that the solder may be a solder “preform” or the solder paste may not be deposited in a “complete ring” or multiple sectors in a large ring). It will be appreciated that it may be deposited in any formation that includes it as sectors). Of course, the entire circuit board or only the individual fins themselves may be heated to a predetermined solder reflow temperature sufficient to melt the solder paste. Once the circuit board 30 is heated to the solder reflow heating temperature, the solder flows down the head portion of the pin 10 and down the plated through holes to fill the plated through holes and substantially to seal the solder joint 35. Will provide mechanical and electrical connections.

Those skilled in the art will appreciate that the industry standard process for pin-in-paste reflow is to deposit solder paste on top of a through hole prior to insertion of the through hole component. However, solder paste located on top of the holes can naturally lead to solder residue on the pins, which is unacceptable for electrical interconnect surfaces.

Applicant's extensive assembly process development has achieved a successful process of depositing solder paste adjacent to (but not on top of) the through hole and in close proximity so that the head portion of the pin is in contact with the solder paste. This same solder paste deposit is also applied to the top of the ring with the exact dimensions of the solder mask (not shown) surrounding the through hole location. Paste deposits flow towards the pins and holes during oven reflow to contact the periphery of the pin head so that the capillary forces are equalized during reflow, whereby the soldered pins are straight and are suitable for proper insertion into the mating socket. Make sure you are ready. Specifically, the capillary action of the solder paste during reflow pulls the pin down to an appropriate position over the solder pad of the through hole of the circuit board. Reflow completes the required solder joints, making efficient use of all solder paste volumes for the pin head and holes, while at the same time preventing foreign matter from contaminating the interconnects (fines) of the pins. Since no paste is applied to the top of the hole, the use of a nitrogen atmosphere during the oven reflow process at 100 ppm (or less oxygen) recommended to ensure consistent flow of solder to the full range of pin holes is desirable. .

In acting to center the pin 10 in the plated through hole, the reflow process helps to reduce the margin in pin and socket alignment action. The correct amount of solder paste is predetermined so that all solder is present in the plated through hole and around the head / shoulder of the fin 10 and does not flow below the tail of the fin. Specifically, the amount of solder required to form a reliable solder joint while ensuring that the solder does not extend beyond the plated through hole is determined by the diameter of the plated through hole and the diameter of the pin head portion, pin shoulder and pin tail portion. , The function of the diameter of the socket head, socket shoulder and socket tail. It will be apparent to those skilled in the art that solder on the border of the pin tails makes the electrical interconnect unreliable.

Although a detailed description of the socket 50 is shown in FIG. 4, many of the foregoing descriptions relating to the pin 10 also apply to a preferred embodiment of a surface mount socket according to the present invention. Like the pin 10, the socket 50 is configured to allow the through-hole socket to pick up its 0.085 inch diameter head portion by a standard surface mount pick and place vacuum nozzle (again, head portion, tail portion of the socket). Or shoulder diameters and other specific dimensions provided herein for illustrative purposes, which in no way limits the scope of the invention). The socket internal cavity has no outlet so that the nozzle maintains suction force.

Again, similar to FIGS. 2 and 3 with reference to the pins, the tail of the socket 50 is pointed downward toward the circuit board 70 as shown in FIGS. 5 and 6, and plated through 0.040 inches in diameter. Placed into the hole. The socket 50 is then placed on a shoulder 55 of 0.060 inches in diameter and is reflowed with solder, all similarly having the same characteristics and benefits as the pin 10.

After each is mounted on a separate circuit board, the pins and sockets are interconnected as shown in FIGS. 7 and 8 by aligning the pins in the sockets and inserting the tails of the pins 10 into the cavities of the sockets 50. Can be combined to form.

Returning to FIG. 1, the pin 10 is such that when mounted to the circuit board 30, the solder paste flows down into the through-holes below the head of the pin and toward the shoulder of the pin, but not to the tail of the pin 10. Being dimensioned is essential. This helps the solder center with the shoulders again to center the pin 10 in the through hole, while avoiding problems that may arise by allowing the solder to flow to the tail.

The specific shape / dimensions of the pins and sockets to be incorporated into the circuit board design are critical to the manufacturability of the overall interconnect system, the mechanical integrity of the solder joints and the RF performance of the interconnects. Exemplary pin and socket dimensions mentioned in the detailed description herein are intended to allow radial misalignment of 0.008 inches. This is accomplished by maximizing the inner diameter of the socket and providing a compliant spring member inside the socket, while minimizing the diameter of the pin and maintaining a reliable interconnect to enhance compliance.

Specifically, the interconnect pin and socket components and the method of mounting these components into the circuit board according to the preferred embodiment described herein allow for the use of automated equipment to mount the components within the individual circuit board, By heating the appropriate amount of solder to the solder reflow temperature, a reliable electrical / mechanical solder joint can be formed, and a tip of the pin can be mounted in the cavity of the socket to provide a reliable electrical connection between the two surface mount circuit boards. .

Although various embodiments have been shown and described in detail herein, it will be apparent that modifications and variations of the present invention are covered by the above teachings and are within the scope of the appended claims without departing from the spirit and scope of the invention. will be. Moreover, these examples merely illustrate possible variations and should not be construed to limit the modifications and variations of the present invention covered by the claims.

Claims (17)

A pin / surface mounted printed circuit board assembly for providing an electrical connection between a surface mounted printed circuit board and a surface mounted mother substrate, A surface mount circuit board having one or more through holes having a diameter; A pin having a tail, a shoulder and a head, wherein the tail and the shoulder have a diameter less than the diameter of the at least one through hole and the head portion has a diameter greater than the diameter of the through hole, The diameter of the shoulder, in relation to the diameter of the through hole, is to be seated inside the through hole and to allow the solder to flow down the head and below the through hole, but not to flow down to the tail. Configured to help form a solder joint between the through hole and the pin and to center the pin within the through hole, A pin / surface mounted printed circuit board assembly wherein electrical connection between the surface mounted printed circuit board and the surface mounted mother substrate is provided by inserting the tail of the pin into a corresponding socket of the surface mounted mother substrate. The pin / surface mounted printed circuit board assembly of claim 1, wherein the solder is provided in a solder mask dam supported on a surface mounted printed circuit board. 3. The pin / surface mounted printed circuit board assembly of claim 2, wherein the solder comprises preform solder supported on a surface mounted printed circuit board. 3. The pin / surface mounted printed circuit board assembly of claim 2, wherein the solder comprises solder paste deposited in a ring form on a solder mask dam. 3. The pin / surface mounted printed circuit board assembly of claim 2, wherein the diameter of the head portion is adapted to allow an automated device to capture the head portion. Inside the plated through hole having the diameter of the printed circuit board, the head, shoulders and tails are provided, each of the shoulders and tails having a diameter smaller than the diameter of the plated through hole and the head portion having a diameter larger than the plated through hole. How to mount the interconnect components, Capturing a head portion of the interconnect component; Positioning the tail of the interconnect component over the plated through hole; Inserting the tail of the interconnect component into the through hole; Heating the circuit board to a predetermined solder reflow temperature, The heating step causes solder around the periphery of the through hole to flow under the head of the interconnect component and under the through hole to form a solder joint between the pin and the plated through hole, The length and diameter of the shoulder, the diameter of the head, the diameter of the through hole, and the predetermined amount of the solder paste are adapted to prevent the solder from flowing to the tail. 7. The method of claim 6 wherein the capture step, the positioning step and the insertion step are each performed manually. 7. The method of claim 6, wherein the capturing step, the positioning step and the inserting step are each performed by an automated device. 7. The method of claim 6, wherein said heating step comprises locally heating the solder. The method of claim 6, wherein the heating step comprises heating the entire printed circuit board. 7. The method of claim 6, further comprising depositing a solder paste having a predetermined solder reflow temperature adjacent to the plated through hole and on top of the solder mask ring surrounding the plated through hole. The method of claim 11, wherein said depositing step occurs before said capture step. 7. The method of claim 6, further comprising depositing a solder preform surrounding the plated through hole on the printed circuit board. The method of claim 13, wherein the solder preform has a ring shape. The method of claim 8, wherein the automation device interacts with a tape and a reel in which interconnect components are disposed. A detachable mechanical and electrical interconnection between the first substrate and the second substrate, A pin having a tail, a shoulder and a head, A socket having a tail, a shoulder, a head, and a cavity defined therein, The pin has a tail sized to fit within the plated through hole of the first substrate, and a head sized to seat on top of the plated through hole when inserted therein with a diameter greater than the diameter of the plated through hole. It is sized to allow the solder to flow under the head and under the plated through hole in relation to the part and the plated through hole seated inside the plated through hole, but not down to the tail. Has a shoulder set to help center the pin in the through hole, The socket is soldered under the shoulder and under the plated through hole in relation to the tail portion sized to fit within the plated through hole of the second substrate and plated through hole seated on top of the plated through hole. With shoulders sized to allow flow, to help center the socket in the through hole, Upon heating, a ring of solder around the shoulder of the socket and the periphery of the head of the pin flows under the shoulder of the socket and the head of the pin, thereby soldering between the pin and the first substrate and between the socket and the second substrate, respectively. Form electrical connections, The pin and the socket are joined by aligning the pin with the socket and inserting the tail of the pin into the cavity of the socket, thereby forming a separable electrical and mechanical interconnect between the first substrate and the second substrate. Connections. The interconnect of claim 16, wherein the first substrate comprises a module and the second substrate comprises a mother substrate.