KR20040082883A - Vacuum device of semiconductor manufacturing equipment having improved bellows - Google Patents
Vacuum device of semiconductor manufacturing equipment having improved bellows Download PDFInfo
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- KR20040082883A KR20040082883A KR1020030017584A KR20030017584A KR20040082883A KR 20040082883 A KR20040082883 A KR 20040082883A KR 1020030017584 A KR1020030017584 A KR 1020030017584A KR 20030017584 A KR20030017584 A KR 20030017584A KR 20040082883 A KR20040082883 A KR 20040082883A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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Abstract
Description
본 발명은 개선된 벨로우즈를 갖는 반도체 제조설비의 진공장치에 관한 것으로서, 보다 상세하게는 반도체 제조설비에 사용되는 진공라인 연결용 벨로우즈에 방진부재와 열선부를 설치하여 반도체 제조설비에 전달되는 진동을 최소화 하고 벨로우즈 내부에 이물질이 침적되는 것을 방지하는 개선된 벨로우즈를 갖는 반도체 제조설비의 진공장치에 관한 것이다.The present invention relates to a vacuum apparatus of a semiconductor manufacturing equipment having an improved bellows, and more particularly, to minimize vibrations transmitted to the semiconductor manufacturing equipment by installing a dustproof member and a hot wire in a bellows for connecting a vacuum line used in a semiconductor manufacturing equipment. And a vacuum device of a semiconductor manufacturing facility having an improved bellows which prevents foreign matter from being deposited inside the bellows.
일반적으로, 타 산업의 기술 개발에 큰 영향을 미치는 반도체 제품은 다양하면서 매우 정밀한 반도체 제조공정을 필요로 함은 물론 정밀한 반도체 제조공정이 가능토록 하는 반도체 제조설비를 필요로 한다.In general, semiconductor products that have a great influence on the technology development of other industries require various and very precise semiconductor manufacturing processes, and also require semiconductor manufacturing facilities that enable precise semiconductor manufacturing processes.
이들 반도체 제조설비에 의하여 소정 반도체 공정을 진행할 때에는 자연계에 존재하지 않는 환경 즉, 반도체 제조에 적합한 고유 반도체 공정환경을 필요로 하는 바, 반도체 제품을 제조하기 위한 공정 환경에는 일반적으로 고압환경, 고진공 환경, 고온 환경 등이 포함된다.When a semiconductor process is performed by these semiconductor manufacturing facilities, an environment that does not exist in nature, that is, a unique semiconductor process environment suitable for semiconductor manufacturing is required. In the process environment for manufacturing a semiconductor product, a high pressure environment and a high vacuum environment are generally used. , High temperature environment and the like.
이는 반도체 제품의 핵심 부분인 반도체 칩을 제작하는 과정에서 반도체 칩에 형성되는 반도체 박막에 박막형성 물질 이외에 필요하지 않는 이물질이 포함됨으로써 이물질이 박막형성 물질과 반응하여 원하지 않는 특성을 갖는 박막이 형성되지 않도록 하기 위함이다.This is because in the process of manufacturing a semiconductor chip, which is a core part of a semiconductor product, the semiconductor thin film formed on the semiconductor chip contains foreign matter which is not needed in addition to the thin film forming material, so that the foreign material reacts with the thin film forming material so that a thin film having unwanted properties is not formed. This is to avoid.
이와 같이 진공환경이 필요한 대부분의 반도체 제조설비에는 진공환경을 만들어 주기 위한 진공장치가 설치되는데, 진공장치는 크게 진공펌프, 진공라인, 배기라인으로 구성된다.As such, most semiconductor manufacturing facilities requiring a vacuum environment are provided with a vacuum device for creating a vacuum environment. The vacuum device is largely composed of a vacuum pump, a vacuum line, and an exhaust line.
상기 진공라인의 일측은 진공환경이 필요한 반도체 제조설비에 연결되고, 타측은 진공펌프에 연결되며, 진공펌프의 일측에는 배기라인이 연결된다.One side of the vacuum line is connected to a semiconductor manufacturing equipment that requires a vacuum environment, the other side is connected to a vacuum pump, one side of the vacuum pump is connected to the exhaust line.
이에 따라, 진공펌프의 작동으로 반도체 설비의 내부를 진공으로 유지하고, 반도체 제조설비 내부에서 공정이 진행된 후의 부산물은 진공라인을 통해 진공펌프로 흡입되어 배기라인을 통해 배출된다.Accordingly, the operation of the vacuum pump maintains the inside of the semiconductor facility as a vacuum, and the by-products after the process is performed inside the semiconductor manufacturing facility are sucked into the vacuum pump through the vacuum line and discharged through the exhaust line.
여기서, 진공장치의 진공라인은 진공환경이 필요한 반도체 제조설비와 진공펌프를 연결하는 것으로서, 반도체 제조설비의 배관이 복잡하거나, 반도체 제조설비와 진공장치의 설치 위치에 따라 진공장치의 진공라인이 수평 혹은 수직으로만 연결될 수 없어 유연성이 요구되는 일부분에는 파이프 대신 신축성을 갖는 벨로우즈를 사용한다.Here, the vacuum line of the vacuum apparatus connects a semiconductor manufacturing equipment and a vacuum pump that requires a vacuum environment, and the piping of the semiconductor manufacturing equipment is complicated, or the vacuum line of the vacuum apparatus is horizontal depending on the installation position of the semiconductor manufacturing equipment and the vacuum apparatus. Alternatively, flexible bellows are used instead of pipes for parts that require flexibility because they cannot be connected vertically only.
상기 벨로우즈는 나사선 모양의 골이 진 주름부를 갖는 메탈관으로 형성되어 주름부가 접혀지거나 펼쳐지는 것으로 신축성을 갖도록 구성된다.The bellows is formed of a metal tube having a threaded corrugated corrugated portion and is configured to have elasticity by folding or unfolding the corrugated portion.
그런데, 상기 벨로우즈는 진공펌프가 반도체 설비 내부의 기체를 흡입할 때의 미세한 압력차에 의해 벨로우즈의 주름부가 움직이게 되므로 반도체 설비로 진동이 전달되는 문제점이 있다.However, the bellows has a problem that vibration is transmitted to the semiconductor device because the bellows of the bellows is moved by the minute pressure difference when the vacuum pump sucks gas in the semiconductor device.
또한, 반도체 제조설비의 내부에서는 고온의 상태에서 공정이 진행되는데 진공라인의 온도는 반도체 제조설비에 비하여 낮고, 특히 벨로우즈는 주름부가 형성되어 배기가스에 포함된 공정 부산물들이 벨로우즈의 주름부 즉, 골과 골 사이에 침적되어 더욱 쉽게 진공라인의 배기능력을 저하시키는 문제점이 있다.In addition, inside the semiconductor manufacturing equipment, the process is performed at a high temperature. The temperature of the vacuum line is lower than that of the semiconductor manufacturing equipment, and in particular, the bellows have wrinkles, so that the process by-products contained in the exhaust gas are wrinkled, that is, the valleys. There is a problem in that it is deposited between the bone and the valley to reduce the exhaust capacity of the vacuum line more easily.
따라서, 본 발명의 목적은, 벨로우즈의 주름부를 형성하는 골과 골 사이에 방진부재를 설치하여 진공펌프에서 반도체 제조설비로 전달되는 진동을 최소화 시키는 개선된 벨로우즈를 갖는 반도체 제조설비의 진공장치를 제공하는 것이다.Accordingly, an object of the present invention is to provide a vacuum apparatus of a semiconductor manufacturing apparatus having an improved bellows to minimize vibrations transmitted from the vacuum pump to the semiconductor manufacturing apparatus by installing a dustproof member between the bone and the valley forming the bellows of the bellows. It is.
본 발명의 또 다른 목적은, 벨로우즈 주름부의 골과 골 사이에 설치된 방진부재의 내부에 벨로우즈를 둘러쌀 뿐만 아니라, 주름부의 골과 골 사이까지 열선부를 설치하여 벨로우즈 내부의 온도를 반도체 제조설비 내부의 온도로 유지하여 배기되는 공정 부산물들이 벨로우즈 내부에 침적되는 것을 방지하는 개선된 벨로우즈를 갖는 반도체 제조설비의 진공장치를 제공하는 것이다.Still another object of the present invention is not only to surround the bellows inside the dustproof member provided between the valleys and valleys of the bellows wrinkles, but also to install a hot wire between the valleys and valleys of the wrinkles so that the temperature inside the bellows is increased within the semiconductor manufacturing equipment. It is to provide a vacuum apparatus of a semiconductor manufacturing facility having an improved bellows which prevents process byproducts which are maintained at a temperature and are exhausted from being deposited inside the bellows.
도 1은 본 발명에 따른 벨로우즈가 적용된 진공장치의 구성을 도시한 개략도,1 is a schematic view showing the configuration of a vacuum apparatus to which the bellows is applied according to the present invention;
도 2는 본 발명에 따른 벨로우즈를 일부 확대 도시한 단면도이다.2 is a partially enlarged cross-sectional view of the bellows according to the present invention.
* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
100 : 반도체 제조설비 200 : 진공장치100: semiconductor manufacturing equipment 200: vacuum apparatus
210 : 진공라인 211 : 벨로우즈210: vacuum line 211: bellows
212 : 방진부재 214 : 열선부212 dustproof member 214: hot wire part
215 : 전원 220 : 진공펌프215: power supply 220: vacuum pump
230 : 배기라인230: exhaust line
상기 목적을 달성하기 위한 본 발명에 따른 개선된 벨로우즈를 갖는 반도체 제조설비의 진공장치는 반도체 제조설비를 진공으로 유지하기 위한 진공펌프; 상기 진공펌프의 일측에 설치된 배기라인; 상기 반도체 제조설비와 진공펌프를 연결하는 진공라인상에 설치되되 나사선 모양의 골이 형성된 주름부를 갖는 관형태의 벨로우즈; 상기 벨로우즈의 외부를 감싸며 주름부를 형성하는 골과 골 사이에 설치되는 방진부재를 구비하는 것을 특징으로 한다.Vacuum apparatus of a semiconductor manufacturing equipment having an improved bellows according to the present invention for achieving the above object is a vacuum pump for maintaining a semiconductor manufacturing equipment in a vacuum; An exhaust line installed at one side of the vacuum pump; A bellows in the form of a tube installed on the vacuum line connecting the semiconductor manufacturing equipment and the vacuum pump, the bellows having a corrugated portion having a threaded valley; It characterized in that it comprises a dust-proof member is installed between the bone and the bone surrounding the outside of the bellows to form a wrinkle portion.
나아가, 상기 방진부재는 러버 재질로 형성된 것을 특징으로 한다.Furthermore, the dustproof member is formed of a rubber material.
더 나아가, 상기 방진부재는 우레탄 재질로 형성된 것을 특징으로 한다.Furthermore, the dustproof member is formed of a urethane material.
또 다른 목적을 달성하기 위한 본 발명에 따른 개선된 벨로우즈를 갖는 반도체 제조설비의 진공장치는 반도체 제조설비를 진공으로 유지하기 위한 진공펌프; 상기 진공펌프의 일측에 설치된 배기라인; 상기 반도체 제조설비와 진공펌프를 연결하는 진공라인상에 설치되되 나사선 모양의 골이 형성된 주름부를 갖는 관형태의 벨로우즈; 상기 벨로우즈의 외부를 감싸며 주름부를 형성하는 골과 골 사이에 설치되는 방진부재; 및 상기 방진부재의 내부에 벨로우즈를 감싸며, 주름주의 골을 따라 내설되어 인가되는 전류에 의해 온도가 상승되는 열선부를 구비하는 것을 특징으로 한다.Vacuum apparatus of a semiconductor manufacturing equipment having an improved bellows according to the present invention for achieving another object comprises a vacuum pump for maintaining the semiconductor manufacturing equipment in a vacuum; An exhaust line installed at one side of the vacuum pump; A bellows in the form of a tube installed on the vacuum line connecting the semiconductor manufacturing equipment and the vacuum pump, the bellows having a corrugated portion having a threaded valley; Anti-vibration member is installed between the bone and the bone surrounding the bellows to form a wrinkle portion; And it wraps the bellows inside the dustproof member, characterized in that it comprises a hot wire portion which is raised in temperature by the current applied by being installed along the bone of the corrugated column.
이하에서는 첨부도면을 참조하여 본 발명에 대해 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 발명에 따른 벨로우즈가 적용된 진공장치의 구성을 도시한 개략도이고, 도 2는 본 발명에 따른 벨로우즈를 일부 확대 도시한 단면도로써, 이들 도면에 도시된 바와 같이, 본 발명의 진공장치(200)는 전체적으로 진공라인(210)과 진공펌프(220) 그리고, 배기라인(230)으로 구성된다.1 is a schematic view showing the configuration of a vacuum apparatus to which the bellows is applied according to the present invention, and FIG. 2 is a partially enlarged cross-sectional view of the bellows according to the present invention. As shown in these drawings, the vacuum apparatus of the present invention ( 200 generally includes a vacuum line 210, a vacuum pump 220, and an exhaust line 230.
상기 진공라인(210)은 일측에 반도체 제조설비(100)가 연결되고, 타측에 상기 진공펌프(220)가 연결되어 반도체 제조설비(100)의 내부에 진공을 형성하도록 반도체 제조설비(100) 내부의 공기를 강제 흡입하는 진공펌프(200)와 반도체 제조설비(100)를 연결한다.The vacuum line 210 is connected to the semiconductor manufacturing equipment 100 on one side, the vacuum pump 220 is connected to the other side to form a vacuum in the semiconductor manufacturing equipment 100 inside the semiconductor manufacturing equipment 100 Connect the vacuum pump 200 and the semiconductor manufacturing equipment 100 to forcibly suck the air.
여기서, 상기 진공라인(210)이 수직 또는 수평으로 진공펌프(220)와 반도체 제조설비(100)를 연결시킬 수 없을 경우, 신축성을 갖는 벨로우즈(211)를 일부구간에 사용할 수 있다.Here, when the vacuum line 210 cannot connect the vacuum pump 220 and the semiconductor manufacturing equipment 100 vertically or horizontally, the bellows 211 having elasticity may be used in some sections.
상기 벨로우즈(211)는 나사선 모양의 골이 진 주름부를 갖는 메탈관 형태로 형성되어 상기 주름부가 접혀지거나 펼쳐짐에 따라 신축성을 갖도록 구성된다.The bellows 211 is formed in the shape of a metal tube having a corrugated corrugated portion of a threaded shape is configured to have elasticity as the corrugated portion is folded or unfolded.
이때, 상기 벨로우즈(211)의 외부에는 도 2에 도시된 바와 같이, 벨로우즈(211)의 외면을 감싸면서 나사선 모양의 골과 골 사이까지 삽입되는 방진부재(212)를 설치하고, 상기 방진부재(212)의 내부에는 벨로우즈(211)의 외면을 감싸면서 나사선 모양 주름부의 골을 따라 열선부(214)를 설치한다.At this time, as shown in Figure 2, the outside of the bellows 211, while installing the dust-proof member 212 is inserted between the bone and the valley of the spiral shape while wrapping the outer surface of the bellows 211, the dust-proof member ( Inside the 212, the heating wire portion 214 is installed along the valley of the threaded corrugation while surrounding the outer surface of the bellows 211.
상기 방진부재(212)는 러버나 우레탄 재질로 형성되는 것이 바람직하고, 상기 열선부(214)는 외부에 구비된 전원(215)에 의해 전력이 인가된다.The vibration isolator 212 is preferably formed of a rubber or urethane material, the electric wire portion 214 is applied power by the power source 215 provided on the outside.
한편, 상기 진공라인(210)과 연결된 진공펌프(220)의 일측에는 배기라인(230)이 설치된다.On the other hand, the exhaust line 230 is installed on one side of the vacuum pump 220 connected to the vacuum line 210.
이하에서는 이러한 구성에 의하여 본 발명에 따른 개선된 벨로우즈를 갖는 반도체 제조설비의 진공장치의 작용 및 효과를 구체적으로 설명한다.Hereinafter, the operation and effect of the vacuum apparatus of the semiconductor manufacturing equipment having the improved bellows according to the present invention by this configuration will be described in detail.
먼저, 진공장치(200)의 진공펌프(220)는 반도체 제조설비(100)의 내부를 진공으로 유지하기 위해 반도체 제조설비(100) 내부의 기체를 흡입한다.First, the vacuum pump 220 of the vacuum apparatus 200 sucks gas inside the semiconductor manufacturing apparatus 100 to maintain the interior of the semiconductor manufacturing apparatus 100 in a vacuum.
여기서, 반도체 제조설비(100) 내부에서 진행되는 공정의 폴리머 등의 부산물들은 진공라인(210)을 따라 진공펌프(220)로 유입된다.Here, by-products such as polymer of the process proceeding in the semiconductor manufacturing equipment 100 are introduced into the vacuum pump 220 along the vacuum line 210.
이때, 진공라인(210) 중 벨로우즈(211)가 설치된 부분에는 벨로우즈(211)를 감싸면서 주름부를 구성하는 골과 골 사이에 설치된 방진부재(212)에 의해 진공펌프(220)의 펌핑으로 유발되는 압력차에 의한 미세한 진동이 반도체 제조설비(100)로 전달되는 것을 방지한다.At this time, the bellows 211 of the vacuum line 210 is installed in the portion of the bellows 211 is wrapped around the bellows 211 is caused by the pumping of the vacuum pump 220 by the dust-proof member 212 installed between the bone and the bone constituting the wrinkles The minute vibrations due to the pressure difference are prevented from being transmitted to the semiconductor manufacturing equipment 100.
한편, 파이프로 구성되는 진공라인(210)을 통과한 폴리머를 비롯한 공정 부산물들이 벨로우즈(211)로 구성되는 진공라인(210)을 통과할 경우, 상기 방진부재(212)에 내설된 열선부(214)는 전원(215)에 의해 전류가 인가하면, 벨로우즈(211) 내부의 온도를 반도체 제조설비(100) 내부의 온도만큼 상승시켜 반도체 제조설비(100)에서 흡입된 폴리머를 비롯한 공정 부산물들이 반도체 제조설비(100) 내부에서와 같은 환경에서 진공펌프(220)로 흡입되도록 하여 벨로우즈(211)의 주름부를 형성하는 골에 침적되는 것을 방지한다.On the other hand, when the process by-products including the polymer passed through the vacuum line 210 made of pipes passes through the vacuum line 210 made of the bellows 211, the hot wire portion 214 built into the dustproof member 212 When the current is applied by the power source 215, the temperature inside the bellows 211 is increased by the temperature inside the semiconductor manufacturing facility 100, so that process by-products including the polymer sucked from the semiconductor manufacturing facility 100 are manufactured. It is sucked into the vacuum pump 220 in the environment, such as in the installation (100) to prevent deposition on the bone forming the wrinkles of the bellows (211).
다음, 진공라인(210)을 따라 진공펌프(220)에 흡입된 폴리머를 비롯한 공정 부산물들은 배기라인(230)을 따라 외부로 배출된다.Next, process by-products including the polymer sucked into the vacuum pump 220 along the vacuum line 210 are discharged to the outside along the exhaust line 230.
이상 설명한 바와 같이, 본 발명에 따르면 벨로우즈의 주름부에 설치된 방진부재에 의해 진공장치의 작동시 발생하는 진동이 반도체 제조설비로 전달되는 것을 방지하는 효과가 있다.As described above, according to the present invention, there is an effect of preventing the vibration generated during the operation of the vacuum apparatus by the anti-vibration member provided in the pleated portion of the bellows to be transmitted to the semiconductor manufacturing equipment.
또한, 상기 방진부재에 열선부를 내설함으로써, 반도체 제조설비 내부의 공정온도와 벨로우즈 내부의 온도차가 발생하는 것을 해소시켜 벨로우즈의 주름부에 공정부산물들이 침적되는 것을 방지함으로써, 이를 소재하는 번거로움을 줄이는 효과가 있다.In addition, by incorporating the hot wire portion in the dustproof member, the process temperature in the semiconductor manufacturing equipment and the temperature difference in the bellows is eliminated to prevent the process by-products deposited on the wrinkles of the bellows, reducing the hassle of the material It works.
이와 같이 본 발명의 상세한 설명에서는 구체적인 실시예에 관해 설명하였으나, 본 발명의 범주에서 벗어나지 않는 한도 내에서 여러 가지 변형이 가능함은 물론이다. 그러므로, 본 발명의 범위는 설명된 실시예에 국한되어 정해져서는 안되며 후술하는 특허청구범위 뿐만 아니라 이 특허청구범위와 균등한 것들에 의해 정해져야 한다.As described above, in the detailed description of the present invention, specific embodiments have been described, but various modifications are possible without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims below and equivalents thereof.
Claims (4)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0017584A KR100506935B1 (en) | 2003-03-20 | 2003-03-20 | Vacuum device of semiconductor manufacturing equipment having improved bellows |
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| Application Number | Priority Date | Filing Date | Title |
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| KR10-2003-0017584A KR100506935B1 (en) | 2003-03-20 | 2003-03-20 | Vacuum device of semiconductor manufacturing equipment having improved bellows |
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| KR20040082883A true KR20040082883A (en) | 2004-09-30 |
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