KR20040079634A - Inkjet printhead and method of manufacturing thereof - Google Patents

Abstract

PURPOSE: An ink jet print head and a method for fabricating the same are provided to improve an adhesive characteristic between a heater and an insulation layer by forming the heater with a plurality of layers. CONSTITUTION: An ink jet print head includes a base plate(100), a fluid path plate(200) and a nozzle plate(300), which are sequentially stacked. The fluid path plate(200) defines an ink chamber(202) filled up with ink and an ink path for feeding ink into the ink chamber(202) from an ink reservoir. The fluid path plate(200) forms a sidewall surrounding the ink chamber(202) and the ink path. The nozzle plate(300) is provided with a nozzle plate(300) corresponding to the ink chamber(202). The base plate(100) includes a substrate(110) and a plurality of material layers deposited on the substrate(110).

Description

Inkjet printhead and method of manufacturing the same

The present invention relates to an inkjet printhead, and more particularly, to an inkjet printhead of a thermal drive type and a method of manufacturing the same.

In general, an inkjet printhead is an apparatus for ejecting a small droplet of printing ink to a desired position on a recording sheet to print an image of a predetermined color. Such inkjet printheads can be largely classified in two ways depending on the ejection mechanism of the ink droplets. One is a heat-driven inkjet printhead which generates bubbles in the ink by using a heat source and ejects ink droplets by the expansion force of the bubbles, and the other is ink due to deformation of the piezoelectric body using a piezoelectric body. A piezoelectric drive inkjet printhead which discharges ink droplets by a pressure applied thereto.

The ink droplet ejection mechanism of the thermally driven inkjet printhead will be described in detail as follows. When a pulse current flows through a heater made of a resistive heating element, heat is generated in the heater and the ink adjacent to the heater is instantaneously heated to approximately 300 ° C. Accordingly, as the ink boils, bubbles are generated, and the generated bubbles expand and apply pressure to the ink filled in the ink chamber. As a result, the ink near the nozzle is discharged out of the ink chamber in the form of droplets through the nozzle.

FIG. 1 is a schematic partial cutaway perspective view showing a configuration of a conventional thermal inkjet printhead, and FIG. 2 is a cross-sectional view illustrating a vertical structure of the conventional inkjet printhead shown in FIG.

Referring to FIG. 1, an inkjet printhead includes a base plate 10 formed by stacking a plurality of layers of materials on a substrate, and an ink chamber 22 and an ink flow path 24 stacked on the base plate 10. It consists of a flow path plate 20 and a nozzle plate 30 stacked on the flow path plate 20. Ink is filled in the ink chamber 22, and a heater (13 in FIG. 2) is provided below the ink chamber 22 for heating the ink to generate bubbles. The ink passage 24 is connected to an ink reservoir (not shown) as a passage for supplying ink into the ink chamber 22. The nozzle plate 30 is provided with a plurality of nozzles 32 through which ink is discharged at positions corresponding to the respective ink chambers 22.

Referring to FIG. 2, a vertical structure of a conventional inkjet printhead having the above configuration is described. On the substrate 11 made of silicon, an insulating layer 12 for insulating and insulating between the heater 13 and the substrate 11 is provided. ) Is formed. The insulating layer 12 is mainly formed by depositing a silicon oxide film on the substrate 11. On the insulating layer 12, a heater 13 for generating bubbles by heating the ink in the ink chamber 22 is formed. The heater 13 is formed by, for example, depositing tantalum nitride (TaN) or tantalum-aluminum alloy (TaAl) on the insulating layer 12 in the form of a thin film. On the heater 13 there is provided a conductor 14 for applying a current thereto. This lead wire 14 is made of aluminum or an aluminum alloy, for example. Specifically, the conductive wire 14 is formed by stacking aluminum or the like on the heater 13 to a predetermined thickness and then patterning the same to a predetermined shape.

A passivation layer 15 is formed on the heater 13 and the conductive wire 14 to protect them. The protective layer 15 is for preventing the heater 13 and the conductive wire 14 from being oxidized or coming into direct contact with ink. The protective layer 15 is mainly formed by depositing a silicon nitride film. In addition, an anticavitation layer 16 is formed on a portion where the ink chamber 22 is formed on the protective layer 15. The cavitation prevention layer 16 is for preventing the heater 13 from being damaged by the high air pressure generated when the upper surface forms the bottom surface of the ink chamber 22 and the bubbles in the ink chamber 22 disappear. Mainly tantalum thin films are used.

The flow path plate 20 for forming the ink chamber 22 and the ink flow path 24 is stacked on the base plate 10 formed by stacking several material layers on the substrate 11. The flow path plate 20 is formed by applying a photosensitive polymer by a lamination method of heating, pressing and compressing the photosensitive polymer onto the base plate 10 and then patterning the photosensitive polymer. At this time, the coating thickness of the photosensitive polymer is determined by the height of the ink chamber 22 required according to the volume of the ink droplets to be ejected.

The nozzle plate 30 in which the nozzle 32 is formed is laminated on the flow path plate 20. The nozzle plate 30 is made of polyimide or nickel, and is heated and pressed onto the flow path plate 20 by using the adhesiveness of the photosensitive polymer forming the flow path plate 20.

In the structure of the conventional inkjet printhead, since the conductive wire 14 is formed on the heater 13, when etching the aluminum or the like for the patterning of the conductive wire 14, for example, by the dry etching, the conductive wire 14 is under the conductive wire 14. The heater 13 may also be etched together. Therefore, conventionally, the patterning of the conductive wire 14 is dependent on the wet etching. However, according to the wet etching, the surface of the etched portion is rough, and fine and precise patterning is difficult, and thus, uniformity of the electric wire 14 corresponding to each of the plurality of nozzles 32 is lowered, resulting in unevenness of the electric field. And there is a problem that the variation in the resistance heating characteristics in each heater 13 is increased.

In the related art, a heater 13 made of tantalum nitride (TaN) or tantalum-aluminum alloy (TaAl) is directly deposited on an insulating layer 12 made of an oxide film. However, tantalum nitride (TaN) and tantalum-aluminum alloy (TaAl) have a problem in that the adhesion to the oxide film is poor, thereby deteriorating the reliability of the printhead.

SUMMARY OF THE INVENTION The present invention has been made to solve the problems of the prior art as described above. In particular, the object of the present invention is to provide an inkjet printhead of a thermal drive type in which a heater is formed of a plurality of layers to improve adhesion between the heater and the insulating layer. have.

Another object of the present invention is to provide a method of manufacturing an inkjet printhead capable of precisely patterning a wire and a heater by dry etching by forming a heater after formation of the wire.

1 is a schematic partial cutaway perspective view showing the configuration of a conventional thermal drive inkjet printhead.

FIG. 2 is a cross-sectional view illustrating a vertical structure of the conventional inkjet printhead shown in FIG. 1.

3 is a cross-sectional view showing a vertical structure of the inkjet printhead according to the present invention.

4A to 4K are cross-sectional views for explaining step by step a method of manufacturing an inkjet printhead according to the present invention.

<Explanation of symbols for the main parts of the drawings>

100 ... base plate 110 ... substrate

120 Insulation layer 130

140 Heater 141 Lower titanium layer

142 ... heat generation layer 143 ... top titanium layer

150 ... protective layer 160 ... cavitation prevention layer

200 ... Euro Plate 102 ... Ink Chamber

300 ... Nozzle Plate 302 ... Nozzle

In order to achieve the above technical problem, the inkjet printhead according to the present invention,

A base plate formed of a plurality of material layers, a flow path plate laminated on the base plate to define an ink chamber and an ink flow path, and a nozzle stacked on the flow path plate and configured to discharge ink at a position corresponding to the ink chamber; A nozzle plate,

The base plate, the substrate; An insulating layer formed on the substrate; A heater having a plurality of layers including a lower titanium (Ti) layer formed on the insulating layer and a heating material layer formed on the lower titanium (Ti) layer; A conductive line formed on the insulating layer and connected to both ends of the heater; And a protective layer formed on the entire surface of the substrate to cover the heater and the conductive wire.

Here, the heater may further include an upper titanium (Ti) layer formed on the heating material layer, the heating material layer is titanium nitride (TiN), tantalum nitride (TaN), tantalum-aluminum alloy (TaAl) or It may be made of tungsten silicide.

The conductive wire may be formed of a plurality of metal layers, and may include at least one material selected from the group consisting of aluminum (Al), tungsten (W), titanium (Ti), titanium nitride (TiN), and tantalum nitride (TaN). Can lose.

In addition, the end of the conductive wire is preferably formed to be inclined.

In addition, the base plate is preferably further provided with a cavitation prevention layer formed on the protective layer.

In addition, the present invention provides a method of manufacturing an inkjet printhead having the above structure. The manufacturing method of the inkjet printhead according to the present invention,

(A) forming an insulating layer on the surface of the substrate;

(B) depositing a conductive metal material on the insulating layer to form a metal layer, and then patterning the metal layer by dry etching to form conductive lines;

(C) sequentially depositing a plurality of layers including a lower titanium layer and a heating material layer on the insulating layer and the conductive wire, and then patterning the plurality of layers by dry etching to form a heater connected to the conductive wire. step;

(D) forming a protective layer on the entire surface of the substrate to cover the heater and the conductive wires;

(E) forming a flow path plate defining an ink chamber and an ink flow path on the substrate; And

(F) forming a nozzle plate having a nozzle corresponding to the ink chamber on the flow path plate.

In the step (b), the metal layer may be formed of a plurality of layers, and the end portion of the conductive wire is preferably etched obliquely.

In the step (c), the plurality of layers may include an upper titanium layer deposited on the heating material layer, and the deposition of the titanium layer and the heating material layer may be performed by PVD.

In addition, after the step (d), it is preferable to further include the step of forming a cavitation prevention layer on a position corresponding to the heater on the protective layer.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the examples exemplified below are not intended to limit the scope of the present invention, but are provided to fully explain the present invention to those skilled in the art. In the drawings, like reference numerals refer to like elements, and the size of each element may be exaggerated for clarity and convenience of description. In addition, when one layer is described as being on top of a substrate or another layer, the layer may be present over and in direct contact with the substrate or another layer, with a third layer in between.

3 is a cross-sectional view showing a vertical structure of the inkjet printhead according to the present invention. Although only the unit structure of the inkjet printhead is shown in the drawing, in the inkjet printhead manufactured in a chip state, a plurality of ink chambers and a plurality of nozzles are arranged in one row or two rows, and may be arranged in three or more rows for further resolution. have.

Referring to FIG. 3, the inkjet printhead of the thermal driving method according to the present invention has a structure in which the base plate 100, the flow path plate 200, and the nozzle plate 300 are sequentially stacked. The flow path plate 200 defines an ink chamber 202 in which ink is filled therein and an ink flow path (not shown) for supplying ink into the ink chamber 202 from an ink reservoir (not shown). That is, the flow path plate 200 forms a side wall surrounding the ink chamber 202 and the ink flow path. The nozzle plate 300 is formed with a nozzle 302 through which ink is discharged at a position corresponding to the ink chamber 202.

The base plate 100 is formed by stacking a plurality of material layers on the substrate 110. As the substrate 110, a silicon wafer widely used in the manufacture of integrated circuits may be used. The insulating layer 120 is formed on the upper surface of the substrate 110. The insulating layer 120 serves as a heat insulating layer for suppressing the insulation between the substrate 110 and the heater 140 as well as the heat energy generated from the heater 140 to escape to the substrate 110. The insulating layer 120 may be formed of a silicon oxide film formed by oxidizing the surface of the substrate 110 at a high temperature.

On the insulating layer 120, a heater 140 for heating bubbles in the ink chamber 202 to generate bubbles and a conductive wire 130 for applying a current to the heater 140 are provided. In the present invention, the heater 140 is composed of a plurality of layers including the heating material layer 142. Here, the heating material layer 142 may be made of titanium nitride (TiN), tantalum nitride (TaN), tantalum-aluminum alloy (TaAl) or tungsten silicide. However, as described above, materials such as titanium nitride (TiN) have poor adhesion to the insulating layer 120 formed of an oxide film thereunder. Therefore, in the present invention, the lower titanium layer 141 is formed between the heating material layer 142 and the insulating layer 120. Titanium (Ti) has good adhesion to the oxide film thereunder, and also excellent adhesion to titanium nitride (TiN) formed thereon. Accordingly, the heater 140 having the laminated structure of the lower titanium layer 141 and the heat generating material layer 142 may be adhered well on the insulator 120, thereby increasing the reliability of the printhead. Preferably, the heater 140 may have a three-layer structure including an upper titanium layer 143 formed on the heating material layer 142 as shown. This is to improve the adhesiveness with the protective layer 150 formed thereon.

In addition, since titanium nitride (TiN) has a relatively high resistance while titanium (Ti) has a relatively low resistance, adjusting the thicknesses of the lower and upper titanium layers 141 and 143 facilitates the resistance of the entire heater 140. I can regulate it. Therefore, resistance uniformity between the plurality of heaters 140 provided in the printhead can be improved.

Under the both sides of the heater 140, that is, the conductive wire 130 is provided between both ends of the heater 140 and the insulating layer 120. As illustrated, the conductive wire 130 may be formed of one metal layer, but may be formed by stacking two or more metal layers. The conductive wire 130 may be made of a metal having good conductivity, such as aluminum (Al), tungsten (W), titanium (Ti), titanium nitride (TiN), or tantalum nitride (TaN). And, the end of the conductive wire 130 is preferably formed to be inclined.

As described above, since the conductive wires 130 are provided under both end portions of the heater 140 in the present invention, the conductive wires 130 are first formed in the manufacturing process described later, and then the heaters 140 are formed. Such a laminated structure enables the conductive wire 130 and the heater 140 to be formed by dry etching, thereby enabling uniform and fine patterning of the conductive wire 130 and the heater 140. When the end of the conductive wire 130 is formed to be inclined, the material constituting the heater 140 when the heater 140 is formed by PVD is compared with the case where the end of the conductive wire 130 is vertically formed. It may be easily deposited to a more uniform thickness at the end of (130).

A passivation layer 150 is formed on the heater 140 and the conductive wire 130 to protect them. The protective layer 150 is to prevent the heater 140 and the conductive wire 130 from being oxidized or in direct contact with the ink, and may be formed of a silicon nitride film (SiN) or a polysilicon film.

In addition, an anticavitation layer 160 may be formed on the passivation layer 150 at a portion where the ink chamber 202 is formed. The cavitation prevention layer 160 is to prevent the heater 140 from being damaged by the high pressure generated when the upper surface forms the bottom surface of the ink chamber 202 and the bubbles in the ink chamber 202 disappear. . The cavitation prevention layer 160 may be formed of a tantalum (Ta) thin film or a tungsten (W) thin film.

Hereinafter, a preferred manufacturing method of the inkjet printhead according to the present invention having the structure as described above will be described.

4A to 4K are cross-sectional views for explaining step-by-step a preferred method for manufacturing an inkjet printhead according to the present invention.

First, referring to FIG. 4A, in the present embodiment, a silicon wafer is processed to a thickness of about 300 to 500 μm as the substrate 110. Silicon wafers are widely used in the manufacture of semiconductor devices and are effective for mass production.

On the other hand, as shown in Figure 4a shows a very small portion of the silicon wafer, the inkjet printhead according to the present invention can be manufactured in a state of tens to hundreds of chips on one wafer.

The insulating layer 120 is formed on the prepared upper surface of the silicon substrate 110. The insulating layer 120 may be formed of a silicon oxide film having a thickness of about 1 to 3 μm formed on the surface of the substrate 110 when the surface of the substrate 110 is oxidized at a high temperature.

Subsequently, as shown in FIG. 4B, the metal layer 130 ′ for forming the conductive wire (130 of FIG. 4C) is formed on the insulating layer 120 formed on the upper surface of the substrate 110. The metal layer 130 ′ is formed by sputtering a metal material having good conductivity such as aluminum (Al), tungsten (W), titanium (Ti), titanium nitride (TiN), or tantalum nitride (TaN). It can be formed by depositing to a thickness of about ~ 2㎛. In addition, after the photoresist is applied to the surface of the metal layer 130 ′ thus formed, the photoresist is patterned by photolithography to form a first etching mask M ₁ . Subsequently, a portion of the metal layer 130 ′ exposed by the first etching mask M ₁ is removed by dry etching, and the first etching mask M ₁ is removed by ashing and strip, which is a conventional photoresist removing process. After removing the conductive wires 130, the conductive wires 130 are formed as shown in FIG. 4C.

At this time, as shown in Figure 4c it is preferable that the end of the conductive wire 130 is patterned inclined. This allows the material constituting the heater 140 to be easily deposited to a more uniform thickness at the end of the conductive wire 130 when the heater 140 is formed by the physical vapor deposition (PVD) in the step of FIG. 4D.

Meanwhile, the conductive wire 130 may be formed of two or more metal layers as described above. When the conductive wire 130 is formed of two metal layers, two metal layers made of different metal materials are deposited, and then the two conductive metal layers are etched together using an etching mask to form the conductive wire 130.

4D to 4F are views illustrating a step of forming the heater 140 on the conductive wire 130 and the insulating layer 120. Specifically, as illustrated in FIG. 4D, after depositing titanium 141 ′ with a predetermined thickness on the conductive wire 130 and the insulating layer 120, a resistance heating material 142 ′ is deposited on the titanium 141 ′. Deposit to a predetermined thickness. The resistance heating material 142 ′ may be, for example, titanium nitride (TiN), tantalum nitride (TaN), tantalum-aluminum alloy (TaAl), or tungsten silicide. The deposition thicknesses of the titanium 141 ′ and the resistance heating material 142 ′ are about 01.˜0.3 μm, respectively, so as to have an appropriate resistance value in consideration of the type of material and the width and length of the heater 140. It may be in another range. Meanwhile, as described above, the titanium 143 'may be again deposited on the resistance heating material 142'. In addition, the deposition of the titanium 141 ′ and 143 ′ and the resistive heating material 142 ′ may be performed by PVD such as sputtering.

And, as shown in Figure 4e, after the photoresist is applied to the entire surface of the resultant of Figure 4d, it is patterned by photolithography (photolithography) to form a second etching mask (M ₂ ). Subsequently, the portions exposed by the second etching mask M ₂ among the titanium 141 ′ and 143 ′ and the resistance heating material 142 ′ deposited on the insulating layer 120 and the conductive wire 130 are formed by dry etching. The second etching mask M ₂ is removed by ashing and stripping, which is a normal photoresist removing process. Then, as illustrated in FIG. 4F, a heater 140 having a structure in which the lower titanium layer 141, the heating material layer 142, and the upper titanium layer 143 are sequentially stacked is formed.

As described above, according to the present invention, the conductive wire 130 and the heater 140 are formed by dry etching. Accordingly, the conductive wire 130 and the heater 140 may be uniformly and finely patterned. When a plurality of nozzles are formed on one substrate, the conductive wire 130 and the heater 140 corresponding to each of the plurality of nozzles may be formed. It has an overall uniform pattern and electrical and thermal properties.

Next, as shown in FIG. 4G, the protective layer 150 is formed on the entire surface of the resultant product of FIG. 4F. The protective layer 150 protects the heater 140 and the conductive wire 130. The silicon nitride layer (SiN) is formed to have a thickness of about 1 to 3 μm by physical vapor deposition (PVD) or chemical vapor deposition (CVD). Or by depositing polysilicon.

4H and 4I illustrate a step of forming the cavitation prevention layer 160 on the protective layer 150. Specifically, as shown in FIG. 4H, the tantalum thin film 160 ′ is deposited on the protective layer 150 by sputtering to a thickness of about 0.1 μm to about 1.0 μm. In this case, the tantalum thin film 160 ′ may be replaced with a tungsten thin film.

Then, after the photoresist is applied to the surface of the tantalum thin film 160 ′ formed as above, the third etching mask M ₃ is formed by patterning the photoresist by photolithography. Subsequently, a portion of the tantalum thin film 160 ′ exposed by the third etching mask M ₃ is removed by dry etching, and the third etching mask M ₃ is removed by ashing and strip, which is a general photoresist removing process. ). Then, as illustrated in FIG. 4I, the cavitation prevention layer 160 is formed, and the base plate 100 formed of a plurality of material layers is completed.

Next, as shown in FIG. 4J, the flow path plate 200 defining the ink chamber 202 and the ink flow path (not shown) is stacked on the base plate 100. The flow path plate 200 may be formed by applying a photosensitive polymer such as polyimide to the base plate 100 to a predetermined thickness and then patterning it by photolithography. The coating thickness of the photosensitive polymer is approximately 25 to 35 μm, which is appropriately determined by the height of the ink chamber 202 required according to the volume of ink droplets to be ejected, and has a height in a range different from the illustrated height. It may be. Specifically, the photosensitive polymer may be dried or filmed or liquid. When the photosensitive polymer is a dry film, it is applied by a lamination method of heating, pressing and compressing it on the base plate 100. When the photosensitive polymer is a liquid, the base plate ( 100) by a spin coating method. When the photosensitive polymer coated on the base plate 100 is selectively exposed using the photomask protecting the ink chamber 202 and the portion where the ink flow path is to be formed, the exposed portion is cured to have chemical resistance and high mechanical properties. Strength. Subsequently, when the uncured portion of the photosensitive polymer is dissolved and removed using a solvent, the ink chamber 202 and the ink passage are formed, and the portion cured by exposure forms the flow path plate 200 surrounding them. .

Finally, as shown in FIG. 4K, the nozzle plate 300 having the nozzle 302 is formed on the flow path plate 200. The nozzle plate 300 is made of polyimide or nickel, and is heated and pressed onto the flow path plate 200 by using the adhesiveness of the photosensitive polymer forming the flow path plate 200.

After the above steps, an inkjet printhead according to the present invention having a structure as shown in Fig. 4K is completed.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and equivalent other embodiments are possible. For example, the materials used to construct each element of the printhead in the present invention may use materials not illustrated. In addition, the specific numerical values exemplified in each step may be adjusted beyond the exemplified ranges within the range in which the manufactured printhead can operate normally. In addition, as a method of laminating and forming each material is merely illustrated, various deposition methods may be applied. In particular, since the present invention has a main feature in the laminated structure and method of the base plate, the flow path plate and the nozzle plate laminated thereon can be formed by various other methods known from the above method. For example, the nozzle plate may be integrally formed using the same material as the flow path plate. Therefore, the true technical protection scope of the present invention will be defined by the appended claims.

As described above, according to the present invention, the heater is composed of a plurality of layers including a titanium layer and a heat generating material layer. Therefore, the adhesion between the heater and the insulating layer is improved, so that the reliability of the printhead is increased, and the resistance of the heater can be easily adjusted by controlling the thickness of the titanium layer, thereby improving the uniformity of resistance between the plurality of heaters.

In addition, since the heater is formed after the formation of the conductive wire, both the conductive wire and the heater can be formed by dry etching. Accordingly, the conductive wire and the heater can be patterned uniformly and finely, and the conductive wire and the heater have a uniform pattern and electrical and thermal characteristics as a whole.

Claims (16)

A base plate formed of a plurality of material layers, a flow path plate laminated on the base plate to define an ink chamber and an ink flow path, and a nozzle stacked on the flow path plate and configured to discharge ink at a position corresponding to the ink chamber; An inkjet printhead comprising a nozzle plate, The base plate, Board; An insulating layer formed on the substrate; A heater having a plurality of layers including a lower titanium (Ti) layer formed on the insulating layer and a heating material layer formed on the lower titanium (Ti) layer; A conductive line formed on the insulating layer and connected to both ends of the heater; And And a protective layer formed on the entire surface of the substrate to cover the heater and the conductive wire. The method of claim 1, And the heater further comprises an upper titanium (Ti) layer formed on the heat generating material layer. The method according to claim 1 or 2, The heat generating material layer is an inkjet printhead, comprising any one selected from the group consisting of titanium nitride (TiN), tantalum nitride (TaN), tantalum-aluminum alloy (TaAl), and tungsten silicide. The method of claim 1, The conductive line is an inkjet printhead, characterized in that consisting of a plurality of metal layers. The method according to claim 1 or 4, The conductive line is made of at least one material selected from the group consisting of aluminum (Al), tungsten (W), titanium (Ti), titanium nitride (TiN) and tantalum nitride (TaN). The method according to claim 1 or 4, Inkjet printhead, characterized in that the end of the lead is formed obliquely. The method of claim 1, The base plate further comprises a cavitation prevention layer formed on the protective layer. (A) forming an insulating layer on the surface of the substrate; (B) depositing a conductive metal material on the insulating layer to form a metal layer, and then patterning the metal layer by dry etching to form conductive lines; (C) sequentially depositing a plurality of layers including a lower titanium layer and a heating material layer on the insulating layer and the conductive wire, and then patterning the plurality of layers by dry etching to form a heater connected to the conductive wire. step; (D) forming a protective layer on the entire surface of the substrate to cover the heater and the conductive wires; (E) forming a flow path plate defining an ink chamber and an ink flow path on the substrate; And (F) forming a nozzle plate having a nozzle corresponding to the ink chamber on the flow path plate. The method of claim 8, In the step (b), the metal layer is a method of manufacturing an inkjet printhead, characterized in that composed of a plurality of layers. The method according to claim 8 or 9, In the step (b), the metal layer is made of at least one material selected from the group consisting of aluminum (Al), tungsten (W), titanium (Ti), titanium nitride (TiN) and tantalum nitride (TaN). A method of manufacturing an inkjet printhead. The method according to claim 8 or 9, In the step (b), the end of the conductive line is etched obliquely, characterized in that the inkjet printhead manufacturing method. The method of claim 8, In the step (c), wherein the plurality of layers comprises an upper titanium (Ti) layer deposited on the heat generating material layer. The method of claim 8 or 12, In the step (c), the heat generating material layer is an ink jet comprising any one selected from the group consisting of titanium nitride (TiN), tantalum nitride (TaN), tantalum-aluminum alloy (TaAl), and tungsten silicide. Method of manufacturing a printhead. The method of claim 8 or 12, In the step (c), the deposition of the titanium layer and the heating material layer is a method of manufacturing an inkjet printhead, characterized in that performed by PVD. The method of claim 8, After the step (d), further comprising forming a cavitation prevention layer on a position corresponding to the heater on the protective layer. The method of claim 15, In the forming of the cavitation prevention layer, the tantalum thin film or the tungsten thin film is deposited on the protective layer and then patterned by dry etching to form the cavitation prevention layer.