KR20040072580A - The apparatus for recycling used chip-board - Google Patents

Abstract

PURPOSE: An apparatus for recycling a waste chip board is provided to increase the recycling efficiency of the waste chip board. CONSTITUTION: The apparatus for recycling a waste chip board includes; a feed device compressing and feeding a waste board; a device(50) for removing foreign materials, on which the feed device and a roller for removing foreign materials having many removing blades on its circumference are arranged; a heating device(60) having a hot-air generator and a conveyor(2); and a surface peeling device(70) having the feed device and a high-speed peeling roller; wherein the above-mentioned devices are installed in an adjacent manner to each other.

Description

The apparatus for recycling used chip-board}

The present invention relates to a recycling apparatus for waste chip boards, and more particularly, waste chips for removing foreign substances such as coating films formed on both sides of the waste chip boards and nails used for installation in order to crush the waste chip boards and regenerate the new chip boards. As a board recycling device, a debris removal device equipped with a debris removal roller that rotates at a high speed, a heating device for separating the coating film, and a surface peeling device for peeling the coating film are sequentially installed in the recycling device of the waste chip board. It is about.

Chipboards are made of plywood by grinding wood and grinding them together with a glue to a powder, then compacting them. There are kinds of chipboard such as medium density fiber board (MDF) and particle board (PB). Such a chip board has excellent stability and machinability that can be freely made, and its value is also lower than that of solid wood, so it is used in place of general wood for various purposes.

And since the chipboard is a material that is made of powdered wood, the powder can be recycled by grinding the chipboard discarded after use again. At this time, since the scrapped chip boards already have fastening elements such as nails and screws or coating films, such unnecessary elements should be removed for recycling. In the past, the surface treatment of the waste chip boards collected for recycling is mainly a fastening element. They are removed by chisels or hammers, and the surface coating is made by hand using sandpaper, which makes the process very inconvenient and inefficient.

An object of the present invention is to improve the recycling efficiency of the waste chipboard by solving the above problems, as an embodiment to achieve this, a foreign material removal device for removing foreign matters such as nails stuck on the surface of the waste chipboard, and by heating the coating film Disclosed is a waste chipboard recycling apparatus, which is a series of devices including a heating device for separating and a surface peeling device for peeling a separated coating film.

1 is an overall front view of the present invention

2 is an overall plan view of the present invention.

Figure 3 is a detailed view of the foreign matter removal apparatus of the present invention

4 is a partial detail view of FIG.

FIG. 5 is a sectional view taken along the line “A-A” of FIG. 4.

Figure 6 is a detailed perspective view of the foreign material removal roller of the foreign material removal apparatus of the present invention

Figure 7 is a detailed view of the surface peeling apparatus of the present invention

8 is a partial detailed top view of FIG. 7

9 is a partial detailed perspective view of FIG.

10 is a partial detailed front view of FIG.

FIG. 11 is a cross-sectional view taken along the line “B-B” of FIG. 10.

<Description of the symbols for the main parts of the drawings>

1: waste chipboard 2: conveyor

3: toothed wheel 4: feed roller

5: transfer motor 6: power transmission device

7: foreign material removal roller 8: removal blade

9: Motor for removing foreign substances 10: High speed thin skin roller

11: peeling motor 12: brush

13: foreign matter 14: hot air fan

15: coating film 16: spring

50: debris removal device 60: heating device

70: surface peeling device 80: transfer device

Detailed configuration and operation of the present invention for achieving the above object will be described in detail with reference to the accompanying drawings.

In the present invention, the foreign matter removing device 50, the heating device 60 and the surface peeling device 70 are continuously installed, and the waste chipboard 1 is placed on the foreign material removing device 50 and the surface peeling device 70 up and down. The conveying apparatus 80 which is squeezed and conveyed in the is installed, and the heating apparatus 60 is provided with a conveyor 2 and a hot air blower 14 for conveying the waste chipboard 1. In addition, a conveyor 2 for transferring the waste chipboard 1 is installed in front of the debris removing device 50.

The transfer device 80 has a structure in which two feed rollers 4 having a cogwheel 3 arranged on a circumferential surface are arranged side by side at a predetermined distance up and down. The feed rollers 4 are driven by the feed motor 5 and have a structure interlocked with each other by a power transmission device 6 such as a chain or a belt and a chain sprocket or a belt pulley. The gear wheels 3 installed at equal intervals are in staggered positions.

The foreign matter removal device 50, which is a main component of the present invention, is provided with a foreign matter removal roller 7 which is rotated at a high speed in addition to the transfer device 80, and the circumferential surface of the foreign matter removal roller 7 is long and long along the axis. The dog removal blade 8 protrudes. The removal blade 8 may be installed to be inclined so that foreign matters can be easily removed, or the cross-sectional shape thereof may be formed as “a”, and may be coupled to a head of a nail or the like to easily remove the foreign material. The foreign matter removal roller 7 has a structure driven by a dedicated foreign matter removal motor 9.

In addition, the surface peeling device 70 which is a main component of the invention has two high-speed peeling rollers 10 installed side by side at a predetermined distance up and down, and a plurality of pairs are formed at regular intervals, and a transfer device between the pairs ( 80) is installed. The high speed peeling roller 10 is connected to each of the dedicated peeling motor 11 is driven, the brush 12 is provided on each circumferential surface.

In addition, the transfer roller 4, the foreign material removal roller 7 and the high-speed thin peeling roller 10 is provided with a spring 16, to press the waste chipboard (1) or to remove the foreign material (13) or coating film (15) It is easy to remove.

In the drawings, reference numeral 13 denotes a big hin foreign matter on the waste chip board 1, and 15 is a coating film formed on the waste chip board 1.

The present invention having the configuration as described above is to remove the foreign matter 13 and the coating film 15 on the upper and lower surfaces while sequentially transporting the waste chip board (1).

The waste chipboard 1 enters the foreign matter removing apparatus 50 by the conveyor 2 installed on the right side of FIG. 1. The foreign material removing apparatus 50 is shown in detail in FIGS. 3 to 6. As shown in FIG. 3, the waste chip board 1 is transported by the transfer device 80 so that the foreign matter removing roller 7 removes foreign matter 13 such as nails or screws.

First, the conveying apparatus 80 of the present invention is installed and used in the foreign material removing apparatus 50 and the surface peeling apparatus 70, and has a structure that is interlocked by one conveying motor 5. The interlocking structure consists of a chain or belt, and in each case a chain sprocket or belt pulley, the construction and operation of which are common. The interlocking structure is shown in FIGS. 7 and 8.

Removal of the foreign matter 13 in the foreign matter removal device 50 is achieved by a foreign material removal roller 7 which is rotated at a high speed, the plurality of removal blades 8 installed in the foreign material removal roller 7 is responsible for this. . 4 and 6, the removal blade 8 has a shape that can be easily removed by removing the foreign matter 13, such as nails, the basic embodiment of the "b" shape, "-" shape It may be installed on the circumferentially inclined to achieve the same effect as "".

And the debris removal roller 7 may be provided with a spring 16, in which case the removal blade 8 of the debris removal roller 7 by the elastic force of the spring 16 is more than the waste chipboard (1). Applicable to the closed chipboard 1 of various thicknesses or close, it is possible to reliably remove the foreign matter (13).

In addition, the foreign matter removal roller 7 is driven by a dedicated foreign matter removal motor 9, which is to rotate at a high speed to easily remove the foreign matter (13). Therefore, the removal blade 8, which is rotated at high speed, is pulled out by walking the head of the foreign matter 13 such as a nail as shown in FIG.

In addition, the transfer device 80 is pressed by the gear wheel 3 in the upper and lower sides of the waste chip board (1) to be transferred. In particular, the gear wheels 3 provided in pairs of the transfer rollers 4 as shown in FIG. 5 are different from each other in the installation position thereof, which is to prevent the waste chipboard 1 from being cut. The transfer device 80 of this structure is the same in other parts, and the many transfer rollers 4 constituting the transfer device 80 do not need to have a high rotational speed, and thus are interlocked by one transfer motor 5. It is possible to have a sufficient rotational force just to have a structure that becomes.

In addition, at least one of the feed rollers 4 constituting the transfer device 80 is provided with a spring 16, which is required to transfer the waste chipboard 1 having various thicknesses. That is, the two conveying rollers 4 are adjacent by the spring 16 at intervals smaller than the thickness of the waste chip board 1, but when the waste chip board 1 is transferred therebetween, the spring 16 is compressed and the waste chip board is compressed. It is changed at intervals as much as the thickness of (1). Therefore, it is possible to transfer the waste chipboard 1 of various thickness by the spring (16). The feed roller 4 of the surface peeling device 70 also has the same structure and function as described above.

The waste chipboard 1 from which the foreign matter 13 is removed from the foreign matter removal device 50 is transferred to the heating device 60 by the transfer device 80. The heating device 60 is provided with a hot air fan 14, and in order to maintain the coating film 15 that is peeled off or ductile by heat, a conveyor 2 is installed in place of the conveying device 80, whereby a waste chip board 1 is provided. Will be transferred.

The hot air blower 14 serves to apply heat to melt or peel the coating film 15 formed on the waste chipboard 1, and the heated coating film 15 can be easily removed from a subsequent surface peeling device 70. It has softness to be able.

The length of such a heating device 60 is related to the conveying speed of the conveyor 2, and the length of the heating device 60 is enough to ensure the time that the coating film 15 is heated to the extent that the coating film 15 is appropriately ductile or peeled.

In the waste chip board 1 which has passed through the heating device 60, the coating film 15 may have ductility or peeling, as shown in FIG. The closed chipboard 1 in this state is transferred to the surface peeling device 70.

In the surface peeling device 70, the waste chip board 1 is transferred by the transfer device 80, and the coating film 15 heated by the high speed peeling roller 10 is removed. The action in the surface peeling device 70 is shown in FIGS. 7-11.

First, as shown in FIG. 7, the waste chip board 1 is transferred by the transfer device 80, and the coating film 15 is removed by the high speed thin film roller 10 installed between the transfer devices 80. The driving of the feed roller 4 has a structure in which all of them are linked by one transfer motor 5 and a power transmission device 6 connected thereto, and the high-speed peeling roller 10 has one peeling motor each. 11). This is to give a high-speed rotational force easy to remove the coating film (15).

And since the high-speed thin peeling roller 10 is installed side by side at a predetermined interval side by side to form a pair, it is configured to remove the coating film 15 on the upper and lower surfaces of the waste chip board 1 to be transported therebetween.

At least one of the above-described high speed thinner rollers 10 is elastically supported by a spring 16 to be close to the surface of the waste chipboard 1, and can be used in the waste chipboard 1 of various thicknesses. It is possible to reliably remove the coating film 15.

9 to 11 illustrate a state in which the coating film 15 is removed by the high speed peeling roller 10, and the brush 12 is installed on the circumferential surface of the high speed peeling roller 10 as in the perspective view of FIG. 9. It is. The brush 12 should have sufficient rigidity and durability to serve as peeling or grinding the coating film 15, and is composed of a steel brush or a steel needle.

Accordingly, the brush 12 is rotated at a high speed by the peeling motor 11 connected to each other to remove the coating film 15 as shown in FIGS. 10 and 11.

As the waste chip board 1 is unfolded as described above, the foreign matter 13 attached to the surface and the coating film 15 are removed while the foreign matter removing device 50, the heating device 60, and the surface peeling device 70 are removed. The preprocessing for reproduction is completed.

Therefore, the present invention can easily remove the foreign matter 13 and the coating film 15 of the waste chipboard 1 so that the waste chipboard 1 can be crushed and reproduced as a new chipboard.

As described above, the present invention can easily remove the foreign matter 13 and the coating film 15 on the surface of the waste chipboard 1 by a series of devices, thereby increasing the degree of recycling of the waste chipboard 1, The workability is increased because relying on manual operation is possible by an automated device.

Claims (7)

A transfer device 80 for pushing and transferring the waste chip board 1; A foreign material removing device 50 provided with the transfer device 80 and a foreign material removing roller 7 having a plurality of removal blades 8 formed on a circumferential surface thereof; A heating device (60) provided with a hot air fan (14) and a conveyor (2); The transfer device (80) and the surface peeling device (70), the high speed peeling roller 10 is installed; waste chipboard recycling apparatus characterized in that the configuration is installed adjacent to each other. According to claim 1, the conveying apparatus 80 is composed of two feed rollers 4 installed side by side at a predetermined distance up and down, the gear wheels (3) in the circumferential surface of the feed rollers 4 at regular intervals Waste chipboard recycling apparatus. 3. The waste chipboard recycling apparatus according to claim 2, wherein the transfer roller (4) is interlocked by one transfer motor (5) and a power transmission device (6) connecting them. According to claim 1, wherein the surface peeling device 70 is a plurality of pairs formed by two high-speed peeling rollers 10 are arranged side by side at a predetermined distance up and down are installed at a predetermined interval, the transfer device 80 between the pair ) Waste chipboard recycling device installed. The waste chipboard recycling apparatus of claim 4, wherein the high-speed peeling rollers (10) are respectively connected to and driven by a dedicated peeling motor (11). The waste chipboard recycling apparatus of claim 4, wherein the high speed thin film roller (10) is provided with a brush (12) on a circumferential surface. The waste chipboard recycling apparatus according to claim 1 or 2, wherein the conveying roller (4) or the debris removing roller (7) or the high speed thinning roller (10) is elastically supported by a spring (16).