KR20040069846A - Device for cleaning particle of conditioning disk in CMP - Google Patents

Abstract

PURPOSE: An apparatus for removing particles from a surface of a disc in CMP equipment is provided to reduce an error rate and scratches and lengthen the lifetime by preventing the damage of the disc. CONSTITUTION: A plurality of injection nozzles(40,41) are installed in a predetermined interval at one side of a clean cup(14) in order to inject deionized water to a lateral part of a disc. A conditioning disc(16) is restored to the clean cup. An injection nozzle(42) is installed at bottom of the clean cup in order to inject the deionized water to a bottom of the disc. A disc detection sensor(50) is installed at one side of the clean cup in order to detect a restoring state of the disc.

Description

Device for cleaning particle of conditioning disk in CMP equipment

The present invention relates to a chemical mechanical polishing (hereinafter referred to as CMP) equipment, which is a planarization equipment for manufacturing a semiconductor wafer, and more particularly, to a disk surface debris removal device for removing foreign matter from a conditioning disk of a chemical mechanical polishing equipment. It is about.

In general, CMP equipment, which is a semiconductor manufacturing equipment, is used for polishing a wafer surface to obtain as much polishing rate and planarization as desired.

The CMP apparatus chemically polishes the surface of the wafer by mechanical polishing by a polishing pad and chemical polishing by a slurry solution.

That is, as shown in FIG. 1, the CMP apparatus is largely composed of a polishing unit for polishing a wafer, a loading unit for transferring and loading the wafer to the polishing unit, and a cleaning unit for cleaning the polished wafer.

Therefore, when the loading unit loads the wafer into the polishing unit, the robot picks up the wafer and moves it to the load cup 26 to be seated. The polishing head 24 then loads the wafer and crosses to the platen to which the pad 20 is attached. The head 24 located on the pad 20 applies pneumatic force to polish the wafer, while at the same time the disk 16 to which the diamond particles of the pad conditioner 18 are attached maintains the uniformity of the pad 20. In order to evenly adjust the height of the pad 20. When the time of the set recipe of the head 24 and the conditioner 18 ends, the pad conditioner 18 returns to the original position of the conditioner clean cup 14, and the polished head 24 is finished. The wafer is dechucked in vacuo to move to the next platen.

Here, the above polishing process causes a lot of scratches due to the characteristics of the equipment, which is generally caused by hard particles in the slurry, dry slurry, particles suspended in the equipment, or between particles or platens falling on the platen. This may be due to inflow from the outside of the phase or hard particles accumulated on the disk and particles falling off the disk.

As described above, the cause of the scratch may be an important factor due to foreign matter caused by the disk. In the related art, as shown in FIG. 2, only the pure jet nozzle 30 is pure in one direction for cleaning the disk 16. There is a problem that the disk cleaning is not made properly because the structure is sprayed.

That is, in the process of conditioning the polishing pad, a large amount of foreign matter gets on the surface of the disk, and when the polishing operation is completed, deionized water is sprayed on the wafer at high pressure to remove the wafer from the pad and clean the pad contaminated by the slurry. When the deionized water is sprayed at a high pressure, the contaminants and deionized water remaining on the pad flow into the disk of the pad conditioner and act as a contaminant on the disk.

However, in the related art, the problem of shortening the life of the disk as well as scratching is not properly removed.

Accordingly, the present invention has been made to solve the above problems, the disk of the CMP equipment to increase the efficiency of the removal of foreign matter adhering to the disk for conditioning the polishing pad to reduce the occurrence of scratches and to extend the life of the disk The object is to provide a surface foreign matter removal device.

1 is a schematic diagram showing a general CMP equipment,

Figure 2 is a schematic diagram showing a disk surface cleaning apparatus of the CMP apparatus according to the prior art,

3 is a schematic diagram showing a disk surface foreign matter removal apparatus of the CMP apparatus according to the present invention.

In order to achieve the object as described above, the present invention, in the CMP equipment, the injection nozzle for injecting pure water for removing foreign matters of the conditioning disk is located on the left and right sides and the lower portion of the disk to inject the pure water against the disk. It features.

To this end, the present invention in the CMP equipment is provided with at least two injection nozzles for spraying pure water toward the side of the disk on one side of the clean cup to return the conditioning disk at a predetermined interval and the disk on the bottom of the clean cup At least one spray nozzle for spraying pure water toward the bottom of the structure is provided.

Here, the present invention is characterized in that the disk detection sensor is installed on one side of the clean cup to check whether the disk is returned.

In addition, the pure water is preferably using a high temperature steam.

Accordingly, pure water is sprayed from various places including the bottom of the disk in contact with the pad to completely remove foreign substances on the surface of the disk.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic view showing a general CMP equipment, Figure 3 is a schematic diagram showing a disk surface debris removal device of the CMP equipment according to the present invention.

According to the above drawings, the CMP apparatus includes a polishing unit for polishing a wafer, a loading unit for transferring and loading the wafer to the polishing unit, and a cleaning unit for cleaning the polished wafer. When loaded into the polishing unit, the robot picks up the wafer and moves it to the rod cup 26 for seating. The polishing head 24 then loads the wafer and crosses to the platen to which the pad 20 is attached. The head 24 located on the pad 20 applies pneumatic force to polish the wafer, while at the same time the disk 16 to which the diamond particles of the pad conditioner 18 are attached maintains the uniformity of the pad 20. In order to evenly adjust the height of the pad 20. When the time of the set recipe of the head 24 and the conditioner 18 ends, the pad conditioner 18 returns to the original position of the conditioner clean cup 14, and the polished head 24 is finished. The wafer is dechucked in vacuum to move to the next platen.

In the present invention, in the CMP device having the above-described structure, a disk detecting sensor 50 for detecting the return of the disk is installed at one side of the clean cup 14 on which the disk 16 waits to move, and the foreign matter adhered to the disk. Pure jet nozzles (40, 41, 42) are installed to remove the, and the pure jet nozzles (40, 41, 42) is a structure arranged toward the bottom surface in contact with both edges and the pad of the disk (16) It is.

That is, according to the present embodiment, three injection nozzles 40, 41, and 42 for pure water injection are provided in the clean cup 14, and one of the injection nozzles 42 is the clean cup 14 Water is sprayed toward the bottom surface of the disk 16, which is installed on the bottom surface of the disk 16 and moved over the clean cup, and the other two spray nozzles 40 and 41 are spaced 180 degrees with respect to the center of the disk 16. Disc 16 is disposed toward the edge portion to spray pure water toward the side of the disc.

Here, the pure water injected through the injection nozzle is preferably using a high temperature steam pure water.

Therefore, it is possible to more completely remove the foreign matter on the disk by the pure water sprayed toward the side and bottom of the disk 16.

Here, the number of pure jet nozzles is not particularly limited to three, and three or more of them may be installed within a range that does not interfere with the movement path of the disk, and all such deformable examples also belong to the true spirit of the present invention.

Referring to the operation of the present invention, when the conditioning disk 16 is returned and moved over the clean cup 14, the sensor 50 installed on one side of the clean cup 14 detects the disk 16, In response to the signal of this sensor, a valve (not shown) is opened and pure water is supplied to each nozzle 40, 41, 42.

Therefore, hot water of high temperature steam is sprayed from the nozzles 40, 41 and 42 installed on the bottom of the clean cup 14 toward the edges and the bottom of the disc 16 to remove foreign substances on the disc. Will be.

According to the disk surface debris removal device of the CMP apparatus according to the present invention as described above, it is possible to prevent damage to the wafer and increase the error rate.

In addition, scratches are reduced and the life of the disc can be extended.

In addition, the removal of foreign matter enables stable process management.

Claims (3)

In the CMP apparatus comprising a disk for pad conditioning, At least two spray nozzles for spraying pure water toward the side of the disk are installed at one side of the clean cup to which the conditioning disk is returned, with a predetermined interval, and the bottom surface of the clean cup sprays pure water toward the bottom of the disk. Disc surface foreign matter removal device of the CMP equipment, characterized in that at least one injection nozzle is installed. The apparatus of claim 1, wherein the disk detecting sensor for detecting the return of the disk is further installed on one side of the clean cup. [3] The apparatus for removing foreign matter on the disk surface of the CMP apparatus according to claim 1 or 2, wherein the pure water is steam of high temperature.