KR20040069800A - Wax for analysis sample adhesion and its using method - Google Patents
Wax for analysis sample adhesion and its using method Download PDFInfo
- Publication number
- KR20040069800A KR20040069800A KR1020030006342A KR20030006342A KR20040069800A KR 20040069800 A KR20040069800 A KR 20040069800A KR 1020030006342 A KR1020030006342 A KR 1020030006342A KR 20030006342 A KR20030006342 A KR 20030006342A KR 20040069800 A KR20040069800 A KR 20040069800A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive
- specimen
- attaching
- analytical
- thermosensitive
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
- B29C45/1468—Plants therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Abstract
Description
본 발명은 분석 시편 부착용 접착제 및 그 부착 방법에 관한 것으로, 보다 자세하게는 반도체 웨이퍼의 불량 분석용 분석 시편을 제작하는 데 사용하는 열가소성 접착제를 온도에 민감한 반응을 보이는 색소와 혼합하여 사용함으로써 시편의부착시기를 쉽게 식별할 수 있도록 하는 방법에 관한 것이다.The present invention relates to an adhesive for attaching an analytical specimen and a method of attaching the same, and more particularly, by using a thermoplastic adhesive used to prepare an analytical specimen for defect analysis of a semiconductor wafer, by mixing it with a dye having a temperature sensitive reaction. It's about how to make it easier to identify when.
반도체 웨이퍼는 여러 가지 공정을 거쳐 제조되며, 이 각각의 공정들에서 발생하는 결함을 검출하는 과정을 거치게 되는데, 이 때 결함 분석을 위하여 웨이퍼 시편을 홀더에 부착시킨 후 연마하는 공정을 행하게 된다.The semiconductor wafer is manufactured through various processes, and the defects occurring in the respective processes are detected. At this time, the wafer specimen is attached to the holder and polished for defect analysis.
도 1은 종래 기술에 의한 분석 시편의 부착 방법을 나타낸 것으로서, 소정의 공정이 완료된 웨이퍼의 일부(3)를 절단하여 시편홀더(1)에 부착시키는 방법을 나타낸 것이다. 접착제(2)를 시편(3)이 부착될 위치의 시편홀더(1)에 도포한 뒤, 이 접착제(2)가 도포된 시편홀더(1)를 핫플레이트(4) 위에 올리고 온도조절부(5)를 조절하여 가열한 다음 적절한 온도가 되었을 때 시편(3)을 시편홀더(1)에 부착시키게 된다.1 illustrates a method for attaching analytical specimens according to the prior art, and illustrates a method of cutting a portion 3 of a wafer having a predetermined process and attaching the specimen to the specimen holder 1. The adhesive 2 is applied to the specimen holder 1 at the position where the specimen 3 is to be attached, and then the specimen holder 1 to which the adhesive 2 is applied is placed on the hot plate 4 and the temperature control part 5 After heating by adjusting), the specimen (3) is attached to the specimen holder (1) when the temperature is appropriate.
반도체 웨이퍼를 시편홀더에 부착시키는 방법은 상기와 같이 열가소성 접착제를 이용하는 방법 이외에 물리적인 방법도 있지만, 공정의 용이성과 시편의 보호를 위하여 주로 왁스를 포함하는 열가소성 수지의 접착제를 이용하여 시편을 제작한다. 열가소성 접착제를 이용한 시편 제작 시 좀더 향상된 공정을 위하여 한국등록특허 특1995-0011557호에서는 왁스를 이용하여 반도체 웨이퍼 시편을 홀더에 부착시킬 때 편평도(flatness)를 향상시키는 방법에 대하여 개시하고 있고, 국제출원 PCT/US1996/10336호 에서는 웨이퍼 가공에 유용한 접착제 조성물에 대하여 개시하고 있다.The method of attaching the semiconductor wafer to the specimen holder may be a physical method in addition to the method of using the thermoplastic adhesive as described above, but for ease of processing and the protection of the specimen, the specimen is manufactured using an adhesive of a thermoplastic resin mainly containing wax. . In order to further improve the process of fabricating a specimen using a thermoplastic adhesive, Korean Patent Publication No. 195-0011557 discloses a method of improving flatness when attaching a semiconductor wafer specimen to a holder using wax, and an international application PCT / US1996 / 10336 discloses adhesive compositions useful for wafer processing.
그러나, 상기와 같은 종래의 열가소성 접착제를 이용한 시편 준비 방법에서는 무색 투명한 왁스를 포함하는 열가소성 접착제의 가열시 적절한 온도에 도달한시점을 쉽게 알 수 없기 때문에 핫플레이트(4)가 과도하게 가열되는 경우가 많아서 불필요한 전력과 시간을 낭비하게 되며 작업상 위험한 요소가 발생하는 문제점이 있다.However, in the specimen preparation method using the conventional thermoplastic adhesive as described above, when the appropriate temperature is reached when the thermoplastic adhesive including the colorless transparent wax is heated, the hot plate 4 may be excessively heated. Many waste unnecessary power and time, there is a problem that a dangerous operation occurs.
따라서, 본 발명은 상기와 같은 종래 기술의 문제점을 해결하기 위한 것으로, 무색 투명한 열가소성 접착제에 감온 색소를 첨가하여 핫플레이트(4)에 시편홀더(1)를 가열할 때 온도의 변화를 색소에 의해 시각적으로 감지하도록 하여 시편(3)을 부착시킬 시간을 쉽게 결정할 수 있는 분석 시편 부착용 접착제 및 그 부착 방법을 제공함에 본 발명의 목적이 있다.Accordingly, the present invention is to solve the problems of the prior art as described above, by adding a thermosensitive pigment to a colorless transparent thermoplastic adhesive to heat the specimen holder 1 on the hot plate 4 by a pigment SUMMARY OF THE INVENTION An object of the present invention is to provide an adhesive for attaching analytical specimens and a method for attaching the specimen which can be visually sensed to easily determine the time to attach the specimen 3.
도 1은 종래기술에 의한 분석 시편의 부착 방법.1 is a method for attaching analytical specimens according to the prior art.
도 2는 본 발명에 의한 분석 시편의 부착 방법.2 is a method for attaching analytical specimens according to the present invention.
((도면의 주요부분에 대한 부호의 설명))((Explanation of symbols for main parts of drawing))
1 : 시편 홀더 2 : 접착제1: specimen holder 2: adhesive
3 : 시편 4 : 핫플레이트3: Psalm 4: Hot Plate
5 : 온도조절부 6: 감온 색소가 첨가된 접착제5: temperature control part 6: adhesive with temperature-sensitive pigment
본 발명의 상기 목적은 열가소성 수지와 일정한 온도에서 변색하는 감온 색소가 첨가된 접착제(6)를 시편(3)이 부착될 위치의 시편홀더(1)에 도포하는 단계; 상기 시편홀더(1)를 핫플레이트(Hot plate)(4)에서 일정한 온도로 가열하는 단계; 상기 시편홀더(1)가 가열되면서 도포된 접착제(6)가 감온 색소에 의해 변색되면 시편(3)을 부착하는 단계를 포함하여 이루어진 분석 시편 부착용 접착제 및 그 부착 방법에 의해 달성된다.The object of the present invention is the step of applying to the specimen holder (1) at the position where the specimen (3) to which the adhesive (6) to which the thermoplastic resin and thermochromic dye discolored at a constant temperature are added; Heating the specimen holder (1) to a constant temperature in a hot plate (4); When the adhesive 6 applied while the specimen holder 1 is heated is discolored by a thermochromic dye, it is achieved by an adhesive for attaching the analytical specimen and a method for attaching the specimen 3.
이하 도면을 참조하여 본 발명에 대하여 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명에 의한 분석 시편의 부착 방법을 나타낸 것이다.2 shows a method for attaching analytical specimens according to the present invention.
왁스(wax)를 포함하는 열가소성(thermoplastic) 수지와 일정한 온도에서 변색하는 감온 색소가 혼합된 접착제(6)를 사용하여 시편(3)을 부착하는 방법으로서, 이 때 사용되는 감온 색소는 50℃ 이상에서 변색하는 조성을 사용한다.A method of attaching the specimen 3 using an adhesive 6 in which a thermoplastic resin including a wax and a thermosensitive pigment discoloring at a constant temperature are attached. The thermosensitive pigment used at this time is 50 ° C or higher. Use a composition that discolors.
시편홀더(1)에 온도에 민감한 색소가 첨가된 접착제(6)가 도포된 후 핫플레이트(4)에 의해 가열된 후 접착제(6)가 변색하면 시편(3)을 부착시키게 되는 방법을 도식적으로 나타낸 것이다. 즉, 감온 색소를 접착제에 첨가하는 제 1단계; 상기 제 1단계의 접착제(6)를 시편(3)이 부착될 위치의 시편홀더(1)에 도포하는 제 2단계; 상기 제 2단계의 시편홀더(1)를 핫플레이트(4)에서 일정한 온도로 가열하는 제 3단계; 및 상기 시편홀더(1)가 가열되면서 도포된 접착제(6)가 감온 색소에 의해 변색되면 시편(3)을 부착하는 제 4단계를 포함하여 이루어 지게 된다.The method of attaching the specimen 3 when the adhesive 6 discolors after the adhesive 6 is applied to the specimen holder 1 with a temperature sensitive pigment added thereto and then heated by a hot plate 4. It is shown. That is, the first step of adding a thermosensitive pigment to the adhesive; A second step of applying the adhesive (6) of the first step to the specimen holder (1) at the position where the specimen (3) will be attached; A third step of heating the specimen holder (1) of the second step to a constant temperature in the hot plate (4); And a fourth step of attaching the specimen 3 when the adhesive 6 applied while the specimen holder 1 is heated is discolored by the thermosensitive dye.
열가소성 수지를 이용한 접착제는 열에 의해 용해된 후 냉각과정을 통해 짧은 시간에 접착시키는 접착제이다. 일반적으로 베이스 폴리머와 왁스, 점착부여수지, 가소제, 충진제 및 가열시 산화를 방지하는 산화방지제가 첨가되는데, 주요 재료로서 왁스가 대표적이다.Adhesive using a thermoplastic resin is an adhesive that is dissolved by heat and then bonded in a short time through a cooling process. Generally, base polymers and waxes, tackifiers, plasticizers, fillers and antioxidants that prevent oxidation upon heating are added, with wax being the main material.
또 본 발명에서 첨가되는 감온 색소(Thermochromic Colors)는 온도 변화에 따라 가역적으로 물질의 화학구조가 달라지고 색상이 변화하는 현상을 나타내게 되는데, 스피로피란(Spiropyrane)계와 같은 단분자 감온 색소와 복합물질을 사용하는 감온 색소가 있다. 최근 개발된 시온색소는 색깔을 결정하는 전자공여성 유기화합물과 농도를 결정해 주는 전자수용성 화합물 및 변색온도를 결정해 주는 알코올류로 구성되어 있다. 본 발명에서는 열가소성 접착제로 사용되는 왁스의 특성을 고려하여 첨가되는 감온 색소는 시온색소를 포함하며 50℃ 이상에서 변색하는 조성을 사용한다.In addition, the thermochromic colors added in the present invention exhibit a phenomenon in which the chemical structure of the material is reversibly changed and the color changes according to temperature change, and a single molecule thermochromic dye such as spiropyrane-based composite material There is a thermosensitive pigment using. Recently developed Zion pigments consist of electron donating organic compounds that determine color, electron-soluble compounds that determine concentration, and alcohols that determine discoloration temperature. In the present invention, the thermosensitive dye added in consideration of the characteristics of the wax used as the thermoplastic adhesive includes a Zion pigment and uses a composition that discolors at 50 ° C or higher.
따라서, 본 발명의 분석 시편 부착용 접착제 및 그 부착 방법은 무색 투명한 열가소성 접착제에 감온 색소를 첨가하여 핫플레이트(4)에 시편홀더(1)를 가열할 때 온도의 변화를 색소에 의해 시각적으로 감지하도록 하여 시편(3)을 부착시킬 시간을 쉽게 결정할 수 있도록 함으로써 불필요한 비용과 시간을 절약하고, 핫플레이트(4)의 가열에 의한 작업상의 위험 요소를 미연에 예방할 수 있는 효과가 있다.Therefore, the adhesive for analytical specimen attachment and the method for attaching the analytical specimen of the present invention visually detect a change in temperature by a pigment when the specimen holder 1 is heated on the hot plate 4 by adding a thermosensitive pigment to a colorless transparent thermoplastic adhesive. Therefore, it is possible to easily determine the time to attach the specimen (3) to save unnecessary costs and time, there is an effect that can prevent in advance the operational risk factors due to the heating of the hot plate (4).
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0006342A KR100531953B1 (en) | 2003-01-30 | 2003-01-30 | Wax for analysis sample adhesion and its using method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0006342A KR100531953B1 (en) | 2003-01-30 | 2003-01-30 | Wax for analysis sample adhesion and its using method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20040069800A true KR20040069800A (en) | 2004-08-06 |
| KR100531953B1 KR100531953B1 (en) | 2005-11-30 |
Family
ID=37358482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2003-0006342A KR100531953B1 (en) | 2003-01-30 | 2003-01-30 | Wax for analysis sample adhesion and its using method |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100531953B1 (en) |
-
2003
- 2003-01-30 KR KR10-2003-0006342A patent/KR100531953B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100531953B1 (en) | 2005-11-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU2008352457B2 (en) | Plasma sterilization indicator | |
| US3744295A (en) | Photochromic-thermochromic coating composition | |
| KR20030046315A (en) | Test strips having a plurality of reaction zones and methods for using and manufacturing the same | |
| JPS6075299A (en) | Ethanol chromatographic analysis and test product | |
| KR20120029416A (en) | Indicator system for monitoring a sterilization process | |
| JP2004239906A5 (en) | ||
| KR100531953B1 (en) | Wax for analysis sample adhesion and its using method | |
| TWI627403B (en) | Biochemical test chip | |
| WO2006091465A1 (en) | Time/temperature indicators, their preparation and use | |
| JPH0319536B2 (en) | ||
| TW201243323A (en) | Humidity indicator and coating for humidity indicator | |
| JP5908840B2 (en) | Nucleic acid detection method, device and kit | |
| JP2017057245A (en) | Elapsed time indicator | |
| JP4966627B2 (en) | Humidity indicator and its manufacturing method | |
| AU627839B2 (en) | Device and process for the visualization of substance stains on layer chromatograms | |
| JP3848347B2 (en) | Method for discriminating changes in probe fixing substrate, probe fixing substrate and detection apparatus | |
| KR101033043B1 (en) | Dicing film and dicing die bonding film for semiconductor device | |
| JP7305172B2 (en) | Reversible temperature-sensitive material containing composite of clay mineral and cationic organic dye, and method for producing the same | |
| JP4991246B2 (en) | Humidity indicator and its manufacturing method | |
| Blackburn et al. | The determination of lanthionine in amino-acid mixtures: the separation of its diastereoisomers on columns of ion-exchange resin | |
| US20230060072A1 (en) | Responsive photonic coating | |
| JP4971056B2 (en) | Hot water temperature detection indicator and hot water disinfection confirmation method | |
| CN116133700A (en) | Composition for wet indicator | |
| CN116209481A (en) | Composition for wet indicator and wet indicator | |
| CN110437642A (en) | A kind of novel N- ethyl Cy5 cyanine dyes and its synthetic method and application |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20080930 Year of fee payment: 4 |
|
| LAPS | Lapse due to unpaid annual fee |