KR20040020698A - Fan motor cooling device - Google Patents

Abstract

PURPOSE: A fan motor cooling apparatus is provided to maintain the fan motor at a constant temperature and prevent damages of the fan motor caused due to the over heat of the fan motor. CONSTITUTION: A fan motor cooling apparatus comprises a generating unit(20) arranged in the vicinity of an exhaust manifold, wherein the generating unit generates an electrical energy by using the heat generated from the exhaust manifold; a first switch(11), and a second switch(15) which switches the electrical energy generated from the generating unit; a cooling unit(30) for cooling a fan motor(12) by using the electrical energy supplied through the second switch; a temperature sensor(16) for sensing the temperature of the fan motor; and an ECU(14) for permitting the voltage generated from the generating unit to be supplied to the cooling unit by controlling the operation of the second switch in accordance with the information output from the temperature sensor.

Description

Fan motor cooling device

The present invention relates to a fan motor cooling apparatus, in particular, by intermittently controlling the output of the power generation means according to the temperature state of the fan motor to selectively drive the cooling means to maintain the fan motor at an appropriate temperature and to prevent overheating of the fan motor. The present invention relates to a fan motor cooling device that prevents damage due to heat of the fan motor and does not act as a load on the engine because it uses an independent power source generated by the power generation means, so that an additional effect of improving the engine output can be expected.

In general, a vehicle is provided with a radiator for cooling the coolant circulating the engine, one side of the radiator is provided with a cooling fan for promoting the cooling efficiency.

A flat fan motor is used as a means for driving the cooling fan. When the fan motor is overheated, internal circuits are damaged and it becomes difficult to implement normal operation.

Figure 4 shows a conventional fan motor cooling apparatus for cooling the above-described fan motor,

The fan shaft 3 of the fan motor 1 is provided with a plurality of blades for generating wind, while blocking the heat generated from the engine directly to the fan motor 1 on one side of the fan motor 1 The heat shield 2 is installed so that a part of the wind generated by the rotation of the blade 4 flows to the fan motor 1 side, and the reference numeral 5 is a shroud.

In the conventional fan motor cooling device configured as described above, a part of the wind generated by the blade 4 when the fan motor 1 is driven hits the heat shield 2 and is supplied to the fan motor 1 to cool the fan motor 1. It is to let.

However, in the related art, since the fan motor is hidden inside the cooling fan, even if a part of the wind generated by the blade flows to the fan motor side, the heat generated from the motor cannot be sufficiently dissipated and the fan motor is overheated. Frequently occurring, for this reason there was a problem that shorten the life of the fan motor.

Accordingly, the present invention for solving the above problems is a combination of an N-type semiconductor and a P-type semiconductor to generate a voltage by using the exhaust heat generated in the exhaust manifold and a drive motor driven by the voltage supplied from the power generating means By configuring the cooling means for cooling the fan motor by intermittently controlling the output of the power generation means according to the temperature state of the fan motor to selectively drive the cooling means to maintain the fan motor at the proper temperature and to prevent the fan motor from overheating the fan motor It is an object of the present invention to provide a fan motor cooling device that prevents damage due to heat, and does not act as a load on the engine because it uses an independent power source generated by the power generation means, so that an additional effect of improving engine power can be expected.

The present invention for achieving the above object,

An apparatus for cooling a fan motor for driving a cooling fan,

A power generation means provided in proximity to the exhaust manifold and generating and outputting electricity using exhaust heat generated from the exhaust manifold;

A second switch intermittent with electricity output from the power generation means;

Cooling means for driving the power supplied through the second switch to cool the fan motor;

A temperature sensor for sensing a temperature of the fan motor;

An ECU controlling the switching operation of the second switch according to the sensing information of the temperature sensor so that the voltage generated from the power generation means is supplied to the cooling means; It is characterized by consisting of.

The power generation means,

A first heat absorbing plate disposed to be close to the exhaust manifold, and having a plurality of heat absorbing fins protruding from one side thereof;

A first heat sink for maintaining a predetermined distance from the first heat sink;

Thermal conductors respectively formed to face each other on one side of the first heat sink and the first heat sink;

A first N-type semiconductor installed at a predetermined interval between the first heat sink and the first heat sink to generate a negative potential on the low temperature side according to the temperature difference between the first heat sink and the first heat sink;

A first P-type semiconductor disposed between the first N-type semiconductors and generating positive potential on the low temperature side according to the temperature difference between the first heat absorbing plate and the first heat sink;

A heat absorption junction plate provided on the first heat absorption plate side to electrically connect the pair of first N-type semiconductors and the P-type semiconductor;

A first plate disposed below the first N-type semiconductor and the first P-type semiconductor;

A wire connecting the first plate and the cooling means and supplying electricity, which is induced in the first N-type semiconductor and the first P-type semiconductor, to the cooling means; Characterized in that consisting of.

In addition, the cooling means,

A second heat sink having a plurality of heat sink fins;

A second heat absorbing plate contacting one side of the fan motor while maintaining a predetermined distance from the second heat sink;

The second heat sink is installed so as to intersect with each other between the heat sink and the second heat sink, and absorbs heat from the fan motor through the second heat sink while driving with the power supplied from the power generating means, the second heat dissipation through the second heat sink N-type semiconductor and P-type semiconductor;

A second conductive plate installed on both sides of the N-type and P-type semiconductors so that the second N-type and P-type semiconductors are connected in series; Characterized in that consisting of.

1 is a view showing a fan motor cooling apparatus of the present invention.

2 is a view for explaining the operation principle of the power generation means applied to the present invention.

3 is a view for explaining the principle of operation of the cooling means applied to the present invention.

Figure 4 is a cross-sectional view showing a conventional fan motor cooling device.

※ Explanation of code for main part of drawing

10: battery 11,15: switch

12: fan motor 13: water temperature sensor

14 ECU 16 Temperature sensor

20: power generation means 30: cooling means

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, FIGS. 1 to 3.

Reference numeral 12 denotes a fan motor for driving a cooling fan, which is driven by the output voltage of the battery 10 supplied by the switching operation of the first switch 11, the first switch described above. The switching operation of 11 is controlled by the control operation of the ECU 14 according to the coolant temperature detected by the water temperature sensor 13.

That is, when the temperature of the coolant detected by the water temperature sensor 13 is higher than the set value, the ECU 14 switches the first switch 11 to the on state in order to improve the cooling efficiency of the radiator. The output voltage is supplied to the fan motor 12 to operate the cooling fan.

On the other hand, in the present invention, the power generating means 20, the cooling means 30, the second switch 15, the temperature sensor 16 and the like as a means for cooling the fan motor 12 described above.

The power generation means 20 generates electricity by using heat generated in the exhaust manifold according to the Seebeck effect and supplies it to the cooling means 30.

A first heat absorbing plate 21 having a plurality of heat absorbing fins 21a protrudingly formed on one side thereof is installed close to the exhaust manifold, and the first heat sink 22 has a predetermined distance from the first heat absorbing plate 21. ), And the thermal conductor 26 is formed on one side of the first heat absorbing plate 21 and the first heat sink 22 to face each other.

A plurality of first N-type semiconductors 23 and first P-type semiconductors 24 are alternately installed between the first heat absorbing plate 21 and the first heat dissipation plate 22, but the first N-type and P-type An endothermic junction plate 25 is formed above the semiconductors 23 and 24 so that the pair of N-type semiconductors 23 and the P-type semiconductors 24 are electrically connected to each other, and under each of the semiconductors 23 and 24. The metal first plate 27 is formed.

With this configuration, the N-type semiconductor 23 and the P-type semiconductor 24 are thermally connected in parallel to the first heat absorbing plate 21 and the heat sink 22, and the semiconductors 23 and 24 of the one phase are electrically connected in series. Connected.

Here, the operation principle of the power generation means 20 will be described with reference to FIG.

As shown in FIG. 2, when two kinds of metals or semiconductors (N-type or P-type) are connected to be closed, and a temperature difference is applied between the two connected points, electromotive force is generated and current flows. This phenomenon is called a Seebeck effect. The generated electromotive force is called thermoelectric power.

As shown in the figure, when the energy band structure of the metal annular circuit using the N-type semiconductor is examined, many electrons are excited in the high temperature junction and are diffused to the low temperature junction as they move through the full band to the conduction band. As a result, an electric field is generated from the high temperature portion toward the low temperature portion, and the energy level inside the semiconductor is inclined. As a result, a temperature difference is generated between the Fermi levels of the metals on both sides, thereby generating a positive electric potential (+) at the high temperature junction. Then, the negative potential (-) thermoelectric power is generated in the low temperature junction.

When the P-type semiconductor is applied, the above action is reversed, so that the positive electric potential of the positive potential (+) is generated at the low temperature junction and the negative electric potential of the negative potential (-) is generated at the high temperature junction.

When the exhaust heat generated from the exhaust manifold is applied to the first heat absorbing plate 21 side of the power generating means 20 according to the above described operating principle, the first heat absorbing plate 21 side and the first heat sink 22 side The temperature difference is generated between them, and according to the temperature difference, the heat potential of the negative potential is generated on the heat dissipation side (low temperature junction) of the first N-type semiconductor 23, and the heat dissipation side of the first P-type semiconductor 24 ( The low-temperature junction portion) is a thermoelectric power of the positive potential is generated, the voltage generated in this way is supplied to the cooling means (30).

Meanwhile, the cooling means 30 includes a second heat sink 31 having a plurality of heat sink fins 31a, and contacts one side of the fan motor 12 while maintaining a predetermined gap with the second heat sink 31. The second heat sink 32 is formed to be formed, and the second N-type semiconductor 33 and the second P-type semiconductor 34 are disposed so as to cross each other between the second heat sink 31 and the second heat sink 32. The N-type semiconductor 33 and the P-type semiconductor 34 absorb heat from the fan motor 12 through the second heat absorbing plate 32 while being driven by the power supplied from the power generating means 20. The fan motor 12 is cooled by releasing heat absorbed through the second heat sink 31.

On one side of the second heat sink 31 and the second heat absorbing plate 32, a thermal conductor 35 is formed at a position opposite to each other, and on both sides of the N-type semiconductor 33 and the P-type semiconductor 34, respectively. A second plate 36 is formed to allow the N-type semiconductor 33 and the P-type semiconductor 34 to be connected in series with each other.

Here, the operation principle of the cooling means 30 will be described with reference to FIG.

When the current does not flow in a closed circuit connecting the metal and the N-type semiconductor as shown in Figure 3, the energy band structure is generally horizontal, but as shown in the drawing, by connecting batteries to both ends of the metal, the current flows through the N-type semiconductor. As the Fermi level in the semiconductor is inclined, a constant potential difference occurs between the metals.

At this time, the movement of the electrons is made in the opposite direction to the current flow. In order to move the electrons in the left metal on the drawing to the N-type semiconductor conduction band having a high energy level, the electrons have to exceed the potential difference (W [eV]). It requires energy.

For this reason, electrons move to the N-type semiconductor side while absorbing thermal energy from the surroundings, and electrons moving inside the N-type semiconductor move while releasing heat energy when they move to the metal having the low energy level on the opposite side.

The wires 28 connecting the power generating means 20 and the cooling means 30 described above are the first plate 27 and the cooling means 30 of the N-type semiconductor 23 of the power generating means 20. The second plate 36 of the second P-type semiconductor 34 of the () is connected as the first wire (28a), the plate 27 and the second switch (P) of the P-type semiconductor 24 of the power generating means (20) After connecting 15 as the second wire 28b, the second switch 15 is connected to the N-type semiconductor 33 of the cooling means 30 again, thereby generating power by the switching operation of the second switch 15. The voltage generated at 20 is supplied to the first N-type and P-type semiconductors 33 and 34 of the cooling means 30.

Referring to the operation of the present invention configured as described above is as follows.

When the engine is driven, the ECU 14 controls on / off of the first switch 11 according to the coolant temperature detected by the water temperature sensor 13 so that the battery 10 voltage is supplied to the fan motor 12. This drive is allowed to cool the cooling water passing through the radiator.

At this time, the temperature sensor 16 senses the temperature of the fan motor 12 and supplies it to the ECU 14, the ECU 14, the temperature of the fan motor 12 detected by the temperature sensor 16 is a predetermined value or more. In this case, the second switch 15 is turned on.

When the second switch 15 is turned on, the voltage generated by the first N-type semiconductor 23 and the first P-type semiconductor 24 of the power generation means 20 using the exhaust heat generated from the exhaust manifold. The second N-type semiconductor 33 and the second P-type semiconductor 34 of the cooling means 30 are supplied.

That is, a positive voltage generated from the first P-type semiconductor 24 is applied to the second N-type semiconductor 33, and the first N-type semiconductor 23 is generated from the second P-type semiconductor 34. As the negative (-) voltage is applied, heat is generated in the fan motor 12 in this process while electrons are moved into the second N-type semiconductor 33 and the second P-type semiconductor 34. Absorbed through the cooling plate 32 and then discharged through the second heat sink 31 to cool the fan motor 12.

As described above, the present invention combines an N-type semiconductor and a P-type semiconductor to generate a voltage using exhaust heat generated from an exhaust manifold, and to drive the voltage by the voltage supplied from the power generating means to cool the fan motor. By configuring the cooling means, the output of the power generating means is intermittently controlled according to the temperature of the fan motor to selectively drive the cooling means so that the fan motor is maintained at an appropriate temperature and the fan motor is prevented from overheating. Preventing damage and using an independent power source generated by the power generation means can be expected to provide a fan motor cooling device that does not act as a load on the engine and can expect the additional effect of improving the engine output.

Claims (3)

In the device for cooling the fan motor 12 for driving a cooling fan, A power generation means (20) installed in proximity to the exhaust manifold and generating and outputting electricity using exhaust heat generated from the exhaust manifold; A second switch 15 which regulates electricity output from the power generation means 20; Cooling means 30 for driving the power supplied through the second switch 15 to cool the fan motor 12; A temperature sensor 16 for sensing a temperature of the fan motor 12; An ECU 14 for controlling the switching operation of the second switch 15 according to the sensing information of the temperature sensor 16 so that the voltage generated from the power generation means 20 is supplied to the cooling means 30; Fan motor cooling apparatus, characterized in that consisting of. The method of claim 1, The power generation means 20, A first heat absorbing plate 21 provided to be close to the exhaust manifold and having a plurality of heat absorbing fins 21a protruding from one side thereof; A first heat sink 22 which maintains a predetermined distance from the first heat absorbing plate 21; Thermal conductors 26 formed on one side of the first heat absorbing plate 21 and the first heat sink 22 so as to face each other; It is installed at a predetermined interval between the first heat absorbing plate 21 and the first heat sink 22, and negative (-) potential on the low temperature side according to the temperature difference between the first heat absorbing plate 21 and the first heat sink 22 A first N-type semiconductor (23) for generating a; The first P-type is provided between the first N-type semiconductor 23, and generates a positive potential on the low temperature side according to the temperature difference between the first heat absorbing plate (21) and the first heat sink (22). A semiconductor 24; A heat absorbing junction plate 25 provided on the first heat absorbing plate 21 side to electrically connect the pair of first N-type semiconductors 23 and the P-type semiconductors 24; A first plate 27 provided below the first N-type semiconductor 23 and the first P-type semiconductor 24; A wire 28 connecting the first plate 27 and the cooling means 30 and supplying electricity, which is induced in the first N-type semiconductor 23 and the first P-type semiconductor 24, to the cooling means 3. ; Fan motor cooling apparatus, characterized in that consisting of. The method of claim 1, The cooling means 30, A second heat sink 31 having a plurality of heat sink fins 31a; A second heat absorbing plate 32 which is in contact with one side of the fan motor 12 while maintaining a predetermined distance from the second heat sink 31; Installed between the second heat sink 31 and the heat absorbing plate 32 to cross each other, the heat from the fan motor 12 through the second heat absorbing plate 32 while driving with power supplied from the power generation means 20 A second N-type semiconductor 33 and a P-type semiconductor 34 for absorbing the light and dissipating heat through the second heat sink 31; A second plate 36 installed on both sides of the N-type and P-type semiconductors 33 and 34 so that the second N-type and P-type semiconductors 33 and 34 are connected in series; Fan motor cooling apparatus, characterized in that consisting of.