KR20040011995A - Wafer carrier for both 300 mm wafer and 200 mm wafer - Google Patents

Abstract

PURPOSE: A wafer carrier for both 200 millimeter and 300 millimeter wafers is provided to simultaneously fabricate the 200 millimeter and 300 millimeter wafers by selectively storing and containing both 200 millimeter and 300 millimeter wafers. CONSTITUTION: A holder can be attached/detached to/from the inside of a 300 millimeter wafer carrier. The 200 millimeter wafer can be received in the holder(100). Slots having the same pitch as a 200 millimeter wafer cassette are formed in the holder to receive a plurality of 200 millimeter wafers. A protrusion is formed in the end of the slots of the holder so that the wafer does not move when attached to the inside of the carrier.

Description

Wafer carrier for both 300 mm wafer and 200 mm wafer

The present invention relates to a processing tool used to process a wafer, and more particularly to a wafer carrier used to load and transport a wafer.

In the semiconductor device manufacturing process, various unit processes, such as photographing, etching, diffusion, deposition, and metal processes, are performed on a wafer. In performing the unit process, a wafer is stored, moved or directly put into a production process using a wafer carrier having a plurality of wafers loaded thereon.

As the wafer is gradually enlarged in size to increase the yield of semiconductor devices, the wafer carrier is also changing. For example, 200 mm (8 inch) wafers were used and wafer cassettes were used as wafer carriers, while gradually using 300 mm (12 inch) wafers, FOUP (Front Open Unified Pod) and FOSB (Front) as wafer carriers. It is a trend to manufacture and use Opening Shipping Box.

The FOUP is configured as shown in FIG. 1 and is mainly used for direct input into the production process. The FOUP cell 10 is a portion for holding a wafer. The whole of the FOUP cell 10 and the FOUP door 20 is called FOUP 30. A plurality of wafers are horizontally loaded in the FOUP 30. The wafer enters and exits through the FOUP door 20. When using a cassette, the loaded wafer is exposed and a separate cassette carrier box is required, while the FOUP 30 has excellent sealing properties for the loaded wafer and does not require a separate auxiliary device such as a carrier box. A clamping mechanism 24 (stopper) is provided on the side of the FOUP door 20 in order to secure the FOUP door 20 to the FOUP cell 10 in order to have the sealing material 22 in the FOUP door 20 to maintain hermeticity. Has Reference numeral 26 denotes a latch key hole, and 28 denotes a wafer pressing member. On the other hand, FOSB is mainly used for the purpose of shipping (Shipping) for storing or moving the wafer, the structure is almost similar to the FOUP (30) of Figure 1, but the operator takes a configuration that can easily open the door.

The 300 mm standard FOUP and FOSB have dimensions of 343 mm x 430 mm x 334 mm, all designed to hold only 300 mm wafers. As a result, only 300 mm wafers are used. Therefore, since it cannot be used interchangeably with the 200 mm wafer conventionally used, there is a problem that causes significant inefficiency in the measurement equipment and other parts requiring inspection.

The technical problem to be achieved by the present invention is to provide a wafer carrier that satisfies the simultaneous production of 300 mm wafer and 200 mm wafer.

1 is a view for explaining a front open unified pod (FOUP) for a 300 mm wafer.

2 is a view for explaining a holder according to an embodiment of the present invention.

3 is a view illustrating a locking jaw formed at an end of a slot in the holder of FIG. 2.

Figure 4 shows the holder of Figure 2 mounted to the FOUP.

<Explanation of symbols for the main parts of the drawings>

30: FOUP100: holder 110: body

120: slot 122: locking jaw 150: stand

160: handle

In order to achieve the above technical problem, the present invention proposes a technique of applying a detachable wafer holder to a 300 mm wafer carrier (FOUP or FOSB). The holder proposed in the present invention is detachable in a 300 mm wafer carrier and configured to receive a 200 mm wafer therein, the holder having a pitch equal to that of a 200 mm wafer cassette to receive a plurality of 200 mm wafers. Slots are formed.

Preferably, the holder is made of PBT or PEEK, and the holder is preferably provided with a locking jaw at the end of the slot so that the holder does not shake when attached to the carrier.

The present invention also proposes a 200 mm and 300 mm wafer combined wafer carrier equipped with the holder described above.

According to the present invention, the holder for the 200 mm wafer can be selectively mounted while using the existing 300 mm wafer carrier as it is, so that various wafer sizes can be selectively processed, or can be easily reconfigured to handle different wafer sizes.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Like numbers refer to like elements all the time. Furthermore, various elements and regions in the drawings are schematically drawn. Accordingly, the present invention is not limited by the relative size or spacing drawn in the accompanying drawings.

2 is a view for explaining a holder according to an embodiment of the present invention. Referring to FIG. 2, a holder 100 according to an embodiment of the present invention is removable to a 300 mm wafer carrier (FOUP or FOSB) and configured to receive a 200 mm wafer therein. The body 110 is formed with slots 120 of the same pitch (i.e., 6.4 mm) of the 200 mm wafer cassette to receive 25 200 mm wafers, like a large number, conventional cassettes, FOUPs or FOSBs. . The shape of the body 110 may be applied from an existing cassette, and for example, a pedestal 150 may be formed on the rear surface of the body 110. In addition, the handle 160 may be further formed on / under the body 110. Thus, the holder 100 can be attached and detached in a 300 mm wafer carrier by simultaneously loading 25 wafers as a cassette.

Since the holder 100 material, especially the portion in which the slot 120 is formed, is in contact with the wafer edge, it should be selected to minimize the generation of particles due to friction to prevent contamination transfer to the wafer. For example, it is preferable that it is PBT (polybutylene terephthalate resin) or PEEK (polyether ether ketone resin).

FIG. 3 illustrates a locking step 122 formed at an end of the slot 120 in the holder 100 of FIG. 2. The catching jaw 122 is formed so as not to shake the wafer when attached to the 300 mm wafer carrier, and may form an angle of about 20 ° with the horizontal plane.

4 is a view illustrating a holder 100 of FIG. 2 mounted to a FOUP. The same reference numerals are given to the same members as in FIG. As shown in FIG. 4, a 200 mm wafer may be stored in a form of inserting a holder 100 for a 200 mm wafer into a standard 300 mm wafer carrier. Therefore, the pitch interval (10 mm) of the 300 mm wafer carrier (FOUP or FOSB) and the pitch (6.4 mm) interval of the 200 mm wafer carrier (cassette) are maintained as they are. As such, the optional mounting of the holder 100 according to the present embodiment into a 300 mm wafer carrier is suitable for selectively processing both 200 mm and 300 mm wafers.

In the above, the present invention has been described in detail with reference to preferred embodiments, but the present invention is not limited to the above embodiments, and various modifications can be made by those skilled in the art within the technical idea of the present invention. Is obvious.

According to the present invention described above, it is suitable for selectively processing both 200 mm wafers and 300 mm wafers. The 200 mm and 300 mm wafers can be selectively stored and contained, so that 200 mm and 300 mm wafers can be produced simultaneously, which contributes to mass production of wafers. In the existing 200 mm wafer production system, it is of great value in manufacturing lines that apply 300 mm wafers to improve productivity, reduce costs and improve yield.

In particular, it has advantages in terms of shortening wafer manufacturing time through simultaneous production of 200 mm and 300 mm wafers and efficient operation of facilities according to wafer sizes (eg, securing facility space in a manufacturing line). The FOSB is compatible with 200 mm in various test facilities of the EDS (Electrical Die Sorting) team. Therefore, the equipment efficiency of the EDS can be increased, and the wafer test speed can be doubled.

In addition, the simultaneous use of 200 mm and 300 mm test wafers by engineers can contribute to process conditions and process improvement activities.

Claims (8)

A holder detachable in a 300 mm wafer carrier and configured to receive a 200 mm wafer therein. The method of claim 1, And the holder is formed with a slot having a pitch equal to that of a 200 mm wafer cassette to receive a plurality of 200 mm wafers. The method of claim 1, The holder material, characterized in that the PBT or PEEK. The method of claim 1, The holder is characterized in that the locking jaw is formed at the end of the slot so that the wafer does not shake when attached to the carrier. 300 mm wafer carrier; And And a holder detachable in the carrier and configured to receive a 200 mm wafer therein. The method of claim 5, And the holder is formed with a slot having a pitch equal to that of a 200 mm wafer cassette to receive a plurality of 200 mm wafers. The method of claim 5, And the holder material is PBT or PEEK. The method of claim 5, The holder is a wafer carrier, characterized in that the locking jaw is formed at the end of the slot so that the wafer does not shake when attached to the carrier.