KR200395268Y1 - Probe and thereof manufacturing method - Google Patents

Abstract

The present invention is directed to a probe and a method for manufacturing the same, for this purpose the present invention is formed in the upper surface of the main body 11 to be recessed downward to a predetermined size and depth to form a coupling groove 12, the coupling groove 12 A portion extending from the bottom surface to the bottom of the main body is a connecting portion 10 which is a conductive layer 13 made of a conductor; In the configuration consisting of the probe portion 20 is provided to protrude downward from the conductive layer 13 of the bottom of the connecting portion 10, it can be manufactured in large quantities, such as a variety of electrical signal transmission configuration 300, that is, the needle of the probe card Easily replaceable and easy to replace and configure, allowing maintenance at a relatively low cost, and also ensuring accurate contact with stable pattern terminals with ultra-fine pitches, and ensuring these connections for a long time By maintaining the durability of the contact area while maintaining it significantly extends the service life, it is possible to perform a stable electrical signal transmission function with economics.

Description

Probe and manufacturing method thereof

The present invention relates to a probe and a method for manufacturing the same, and more particularly, to a probe and a method for manufacturing the same to enhance the contact strength, which is excellent in durability, easy to replace, and inexpensive maintenance is possible.

In general, a probe is a component provided as a means for electrically connecting to a terminal.

In other words, a probe, or a probe, is configured to be in contact with a terminal formed on a board when an electrical signal is sent to or received from a board on which a circuit pattern is formed.

Such probes vary widely in shape depending on the application.

Probes are most commonly used for probe cards used for semiconductor inspection on wafers or inspection of LCD panels.

Probes applied to semiconductor and LCD inspection are mainly used as wire type or blade type needles in probe cards.

In particular, as the circuit patterns of semiconductors and LCDs become very fine in recent years, high integration and high density have been encountered, and thus the shape of the needle has also changed from a wire type to a blade type in the face of processability limitations.

The workability limit here is that the needle of the conventional wire type is manufactured by mechanical processing, so the diameter of the needle which can be reduced as much as possible by mechanical processing is limited.

Therefore, wire type needles cannot cope with circuit patterns of semiconductors and LCDs that are becoming more integrated and denser.

On the other hand, the blade type needle uses an etching process, which is a thin film pattern process applied to semiconductor manufacturing, and thus, a large number of needles can be manufactured at the same time as a very fine size, which is mainly used in recent needle manufacturing.

However, the blade-type needle may not be usable due to its deformed or damaged contact end as it is in continuous contact with the terminal after prolonged use, resulting in a short service life and inability to replace the needle individually. there is a problem.

Therefore, the present invention is designed to solve the above-described problems of the prior art, and an object of the present invention is to facilitate the combination and separation with other components to minimize the maintenance cost with the convenience of replacement and its It is to provide a manufacturing method.

In addition, the present invention has another object to provide a probe and a method of manufacturing the same to increase the contact strength with the terminal to maintain a more stable contact.

In order to achieve the above object, the present invention forms a coupling groove in the upper surface of the main body to be recessed downward in a predetermined size and depth, and a portion of the coupling groove from the bottom of the coupling groove to the bottom of the main body is made of a conductive layer. Phosphorus connection; It is configured to be made as a probe portion provided to protrude downward from the conductive layer on the bottom of the connecting portion.

The probe having the above configuration may include forming a photo mask on the surface of the first substrate using a photolithography process, and etching the first substrate using the photo mask to form a trench; Removing the photo mask remaining on the surface of the first substrate, and depositing a first adhesion film by sputtering as a fine thickness on the surface of the first substrate on which the trench is formed; Plating a first soldering film with a predetermined thickness on top of the first advice film; Plating a first conductive film of metal on top of the first soldering film; Planarizing such that the first substrate is simultaneously exposed to the outside of the trench region together with the first conductive film of the trench region by chemical mechanical polishing; Depositing a second adhering film by sputtering to a planarized surface with a fine thickness so that the first coupling member is provided; Forming a photo mask on the surface of the second substrate using a photolithography process, and etching the second substrate using the photo mask to form etching grooves having a predetermined size and depth; Removing the photo mask remaining on the surface of the second substrate, and forming an oxide film with a fine thickness on a surface including an etching groove; Depositing a second conductive film made of a high strength material by plating on the oxide film; Depositing a third conductive film by plating on top of the second conductive film; Planarizing the second substrate along with the third conductive film on the outside thereof by chemical mechanical polishing; Depositing a third adventure film on the planarized surface by surfacing at a predetermined thickness; Forming a photo mask on top of the third advice film using a photolithography process, and depositing a third soldering film on the top of the photo mask by a predetermined thickness by plating; Removing the third soldering film deposited on the photomask while removing the photomask by using a cleaning solution so that a third soldering film is deposited only on the third conductive film so that the second coupling member is provided. Wow; Contacting one side of each of the first soldering member and the second soldering member on which the second soldering film and the third soldering film are formed so as to be firmly joined by thermocompression bonding; Etching stop of the first advice layer of the first coupling member by using a photolithography process and an etching process from the first coupling member and the second coupling member to the surface corresponding to the coupling surface of the first coupling member Forming a coupling groove by dry etching the first substrate as a layer; Dry etching a predetermined thickness by using the second advance film as an etch stop layer on an outer side thereof concentrically with the coupling groove formed in the first substrate; The first substrate remaining on the outside of the first substrate is removed while the second adhering layer and the third adhering layer are exposed by dipping the combined first and second coupling members in an etchant. Steps; The second substrate is removed by immersing the coupling structure of the first coupling member and the second coupling member through the above step in another etching solution so that the oxide film surrounding the second conductive layer is removed.

Hereinafter, a preferred embodiment of the present invention will be described in more detail with reference to the accompanying drawings.

1 shows a probe of the present invention, the probe of the present invention is largely configured in which the connection portion 10 and the probe portion 20 are integrally coupled.

The connecting portion 10 is recessed downward from the upper surface of the main body 11 to a predetermined size and depth to form the engaging groove 12, and from the bottom surface of the engaging groove 12 to the bottom surface of the main body 11. It is the structure which forms the conductive layer 13 so that the site | part which leads up may be formed as a conductor. At this time, since the main body 11 should form a defect groove 12 having a fine size, it is preferable to use a material which is easy to process such a micro bar. Most preferably, it consists of the silicon substrate used.

The conductive layer 13 of the connecting portion 10 constitutes the bottom surface of the defect groove 12, and is such that the thickness from the bottom surface of the defect groove 12 to the bottom surface of the main body 11 is formed as a conductor. . In this case, the conductive layer 13 is made of a particularly good conductive material, and the main materials constituting the conductive layer 13 include nickel (Ni), copper (Cu), gold (Au), silver (Ag), A metal with good conductivity such as platinum (Pt) is used.

The probe unit 20, which constitutes the present invention together with the connection unit 10, is configured to protrude downward from the bottom of the conductive layer 13 of the connection unit 10 to a predetermined height. In particular, since the connecting portion 10 is configured to have good electrical current with the conductive layer 13 of the connecting portion 10 and is in continuous contact with the terminal, it is most preferable that the connecting portion 10 be formed of a stronger material in terms of conductivity and strength. . Ni-w is typical as a material forming the probe unit 20, and may be used as various other alloys.

On the other hand, the probe portion 20 may be formed at the center of the bottom surface of the conductive layer 13, or may be formed to be eccentrically positioned to one side, in particular, the lower end portion and the terminal portion is gradually narrowed from the top to the bottom It is most desirable to be in line contact.

Probe of such a configuration is manufactured through the following process.

In order to manufacture the probe of the present invention, first, a first coupling member for forming the connection portion 10 and a second coupling member for forming the probe portion 20 should be manufactured.

In order to manufacture each coupling member, a separate first substrate 100 and a second substrate 200 are required.

At this time, it is most preferable to use a silicon substrate for the first substrate 100 and the second substrate 200.

The first coupling member of the first coupling member and the second coupling member is manufactured by FIGS. 2A to 2H.

That is, after the photoresist is applied to the upper surface of the first substrate 100 having a constant size, a photomask 110 is formed as shown in FIG. 2A by using a photolithography process by development and exposure. The first substrate 100 is etched using the 110 by a predetermined depth and size.

Most preferably, the etching of the first substrate 100 is performed by dry etching. A trench 120 having a predetermined size and depth is formed on the upper surface of the first substrate 100 by the etching. .

After forming the trench 120, the photo mask 110 remaining on the first substrate 100 is removed by cleaning, and the upper surface of the first substrate 100 on which the trench 120 is formed is shown in FIG. 2B. As described above, the first adhesion membrane 130 is deposited by sputtering at a fine thickness along the surface.

The first soldering film 140 and the first electrically conducting film 150 are sequentially formed on the upper part of the advice film 130 deposited on the upper surface, as shown in FIGS. 2C and 2D. Laminate by plating.

Since the metal used for direct soldering to the first substrate 100 is hardly adhered to the first advice layer 130 first applied to the surface of the first substrate 100, the first solder layer 140 may be stable. It will be deposited for deposition.

Gold (Au) is mainly used as a film material for use as the first adventure film 130, and the first soldering film 140 mainly uses Au-Sn, Pb-Sn, or the like.

Meanwhile, various materials such as nickel (Ni), copper (Cu), gold (Au), silver (Ag), and platinum (Pt) may be used as the first conductive layer 150. Can also be used.

When the first adduct film 130, the first soldering film 140, and the first conductive film 150 are sequentially deposited on the upper surface including the trench 120 formed on the first substrate 100, they are chemically deposited. Mechanical polishing equipment (CMP) is used to planarize the surface as shown in FIG. 2E.

In this case, the degree of planarization is such that planarization is performed such that the first substrate 100 outside the trench 120 is simultaneously exposed together with the first conductive layer 150 filled in the trench 120.

The second planarized film 160 is deposited on the planarized surface again by sublimation to a fine thickness, as shown in FIG. 2F, thereby completing the first coupling member to form the connection part 10 of the present invention.

The first coupling member may be formed in such a manner that only the second adhering film 160 is deposited on top, but as shown in FIG. 2G, a photoresist is applied to the upper part of the second adhering film 160 to develop and expose the first coupling member. When the photomask 170 is formed by patterning a portion of the upper surface of the second adhesion layer 160 by exposure, and depositing the second soldering layer 180 on the photomask 170, the drawing As described above, the second soldering layer 180 may be formed on the photomask 170 while the plating layer is filled only on a portion of the upper surface of the second advice layer 160 exposed without plating.

When the second soldering film 180 is deposited, the photomask 170 is removed by using a cleaning solution, and the second soldering film is formed on the upper portion of the second advice film 160 to a minimum size as shown in FIG. 2H. It is also preferable that the first coupling member is provided in such a configuration that the 180 is provided.

The process of FIGS. 3A to 3H is performed by using a second substrate 200 having the same size as the first substrate 100 used to fabricate the first coupling member, which is also manufactured separately from the first coupling member. Make it through.

The photomask 210 is applied to the upper surface of the second substrate 200 having the same size as the first substrate 100 by using a photolithography process by developing and exposing a photoresist as shown in FIG. 3A. A portion of the second substrate 200 is etched at a predetermined depth by using the photo mask 210.

In this case, the etching is performed by wet etching, unlike dry etching for forming the trench 120 in the first substrate 100 so that the etching groove is formed to have a shape in which the inner diameter gradually decreases downward.

The second substrate 200 on which the etching groove is formed is removed from the photo mask 210 remaining on the second substrate 200 using a cleaning solution, and the surface of the second substrate 200 from which the photo mask 210 is removed. Together, the oxide film 220 is formed to have a constant thickness as shown in FIG. 3B along the inner circumferential surface of the etching groove.

The second conductive film 230 and the third conductive film 240 are sequentially deposited on the oxide film 220 by plating again as shown in FIGS. 3C and 3D.

In this case, the second conductive film 230 is particularly preferably formed of a material having good conductivity and strong strength against contact impact, and most preferably Ni-w, Cu-w, or the like. The third conductive film 240 is the same as the second conductive film 230, but if the conductivity is good, there is no limitation in strength, and thus, like the first conductive film 150 in the first connecting member, nickel (Ni) and copper are used. (Cu), gold (Au), silver (Ag), platinum (Pt) and the like.

As such, when the second conductive layer 230 and the third conductive layer 240 are deposited, the surface is planarized by a chemical mechanical polishing facility (CMP) as shown in FIG. 3E.

In this case, the planarization may be performed such that the oxide film 220, the second conductive film 230, the third conductive film 240, and the second substrate 200 on the outside thereof are simultaneously exposed.

3F is deposited on the upper surface of the planarized second substrate 200 to have a fine thickness by surfering, and the upper portion of the third advice layer 250 is illustrated in FIG. 3G. After the photoresist is applied, the patterned photomask 260 is deposited through a photolithography process of developing and exposing the photoresist.

At this time, the photomask 260 is patterned to have a shape in which the upper portion of the second conductive film 230 is opened, and when the third soldering film 270 is plated on the photomask 260, the photomask ( Since the plating layer is not formed on the upper surface of the 260, the third soldering layer 270 is filled only in a portion of the second conductive layer 230 that is open.

After the third soldering film 270 is deposited along with the open portion of the photo mask 260, and then the photo mask 260 is removed using a cleaning solution, the upper portion of the third advice film 250 may be removed. As in 3h, only the third soldering film 270 remains in the size of the second conductive film 230.

This completes the second coupling member to form the probe 20 of the present invention.

Meanwhile, the third advice film 250 and the third soldering film 270 provided in the second coupling member may be formed of the first advice film 130 and the second advice film 160 of the first substrate 100. And the same or similar materials as those of the first soldering film 140 and the second soldering film 180.

As shown in FIG. 4, the first soldering member 270 and the second soldering member 270 of the second coupling member side closely adhere to each other as shown in FIG. 4. Heat-compress in a state where it is possible to bond firmly to each other.

In the state in which the first connection member and the second connection member are coupled to the upper surface of the first substrate 100 corresponding to the coupling surface coupled to the second connection member of the first connection member provided on the upper side as shown in FIG. The first substrate 10 is etched using the first adhesion film 130 deposited on the trench 120 of the first coupling member by a photolithography process and an etching process as an etch stop layer.

By etching the first substrate 100, the first substrate 100 is formed with a groove open upward to a predetermined size, which is to form a coupling groove 12 of the present invention.

The second advice layer of the first substrate 100 formed outwardly from the outer end portion of the first advice layer 130 on the outer side of the coupling groove 12 formed in the first substrate 100. Using the 160 as an etch stop layer, the first substrate 100 is etched again to a predetermined thickness as shown in FIG. 6.

Meanwhile, the formation of the coupling groove 12 in the first substrate 100 and the etching performed to the outside of the coupling groove 12 may be performed by using the first advice film 130 and the second advice film 160 as an etch stop layer. Most preferably, it is achieved by dry etching used.

The first structure of the first coupling member and the second coupling member which etched the first substrate 100 of the first coupling member may be immersed in the etchant to selectively etch only the Adherence film, thereby adsorbing the second adduct in direct contact with the etchant. The contact portion of the first layer 160 and the third advice layer 250 may be removed.

The etching of the second and third adhering films 160 and 250 by the etching solution leaves portions between the portions covered by the third soldering film 270 and adheres to the first and first adhering films which are removed. A portion of the substrate 100 is also removed, leaving only the configuration as shown in FIG. 7.

When the coupling structure of the first coupling member and the second coupling member of FIG. 7 is again immersed in the etching solution for removing the oxide film, the oxide film 220 that surrounds the second conductive film 230 is removed as shown in FIG. The second substrate 200 attached by the 220 is removed.

In this manner, when the oxide film 220 and the second substrate 200 are removed from the second coupling member, the second coupling member 230 and the third conductive layer 240 are finely attached to the second coupling member. As the electrode film 250 and the third soldering film 270 remain, the probe part 20 of the present invention is formed.

As such, the present invention forms the connection portion 10 by the first coupling member, and the probe portion 20 is formed by the second coupling member, so that the coupling groove side coupling groove 12 as shown in FIG. ) Can be used as an assembly structure to allow the needle tip of the probe substrate or the end of a similar electrical signal transfer configuration 300 to be coupled.

Therefore, the present invention can be easily assembled to replace the tip portion of the configuration for transmitting electrical signals, in particular, when the coupling groove 12 is formed in a size that is custom-fitted to the tip of the signal transmission configuration can be easily replaced and assembled It will provide convenience for work.

In addition, the probe portion 20 continuously contacting the terminal and the like may be made stronger through the second conductive layer 230 to minimize wear and deformation due to prolonged use, thereby providing a stable connection.

While many details are specifically described in the above description, they should be construed as illustrative of preferred embodiments, rather than to limit the scope of the invention.

Therefore, the scope of the present invention should not be defined by the described embodiments, but should be determined by the technical spirit described in the claims.

As described above, the present invention can be manufactured in large quantities, and can be easily combined and separated with various electrical signal transmission configurations 300, that is, configurations such as needles of a probe card, so that replacement can be easily maintained by relatively low cost. There is an advantage to making repairs possible.

In addition, the probe of the present invention maintains accurate contact with the pattern terminals of ultra-precision fine pitch, and maintains the connection for a long time, thereby increasing the durability of the contact portion, thereby greatly extending the service life, thereby providing more stable electrical Allows you to perform signal transfer functions.

In particular, since it is used in combination with each of the electrical signal transmission configuration 300, such as the needle of the probe card, it is very economical to simply replace only the probe of the present invention without having to replace relatively expensive electrical signal transmission configuration 300 Provide effect.

1 is a cross-sectional structural view of a probe according to the present invention,

2a to 2h is a process diagram showing a process for manufacturing a first coupling member of the present invention,

3a to 3h is a process diagram showing a process of manufacturing a second coupling member of the present invention,

4 is a cross-sectional view showing a coupling structure of the first coupling member and the second coupling member according to the present invention;

5 is a cross-sectional view showing a structure in which the first coupling member and the second coupling member of the present invention are compressed;

6 and 7 are cross-sectional views showing a configuration in which the first coupling member of the present invention is patterned by etching;

8 is a cross-sectional view illustrating a state in which a second substrate of the second coupling member is removed from FIG. 7;

9 is a use state illustrating a state in which the probe of the present invention is coupled to the needle of the probe card.

Explanation of symbols on the main parts of the drawings

10: connection part

20 probe

100: first substrate

130, 160, 250: Adhesion membrane

140, 180, 270: soldering membrane

150, 220, 230: electric conduction membrane

200: second substrate

Claims (12)

The upper surface of the main body 11 is recessed downward in a predetermined size and depth to form a coupling groove 12, and a portion from the bottom surface of the coupling groove 12 to the bottom of the main body is formed of a conductive layer ( 13 and a connecting portion 10; A probe unit 20 protruding downward from the conductive layer 13 at the bottom of the connection unit 10; Probe consisting of. The probe according to claim 1, wherein the main body (11) is made of silicon. The probe of claim 1, wherein the conductive layer (13) is made of one of nickel (Ni), gold (Au), copper (Cu), silver (Ag), and platinum (Pt). The probe of claim 1, wherein the probe part (20) is eccentrically positioned on one side of the bottom surface of the conductive layer (13). (delete) delete (delete) (delete) (delete) (delete) (delete) (delete)