KR200358654Y1 - A memory chip package isolation structure of an ink cartridge - Google Patents

Abstract

The present invention relates to a memory chip package of an ink cartridge.

The present invention is configured such that the memory chip package storing capacity information for detecting the amount of ink used can be freely separated from and combined with the ink cartridge, so that the ink cartridge can be recycled more actively. The present invention provides a memory chip package separation structure of an ink cartridge, which facilitates replacement and repair of an ink cartridge when a memory chip package and a contact pad are not used due to a defective contact or other memory chip breakage.

Description

A memory chip package isolation structure of an ink cartridge

The present invention relates to a memory chip package of an ink cartridge, and in particular, it is possible to freely separate and combine a memory chip package storing capacity information for detecting ink usage from an ink cartridge, so that the ink cartridge can be recycled more actively. The present invention relates to a memory chip package separating structure of an ink cartridge.

As is well known, as shown in Figure 1, the inkjet printing system for industrial use is applied to the replaceable consumable ink cartridge 10, the ink cartridge 10 is a pressure vessel (1) and the ink storage pack (2) and the combination of the front end cap (3) and the rear end cap (4) formed with the through hole (3a), the upper portion of the ink storage pack (2) for the ink capacity to display the remaining amount of ink A memory chip package 5 having information, an ink level sensing circuit 6 for sensing a storage capacity of ink stored in the memory chip package 5, and the memory chip package 5 and an ink level sensing circuit 6 ) Is composed of a structure that is coupled to the chassis member 8 is formed with a contact pad (7) electrically connecting.

However, the conventional memory chip package 5 has a structure in which the tip cap 3 is covered thereon while being integrated with the chassis member 8 so as to be in contact with the contact pad 7. The replacement was quite difficult.

That is, the memory chip package 5 has a structure in which the memory chip package 5 is completely in close contact with the chassis member 8, and the chassis member 8 has a through hole 3a in a state located at the upper end of the pressure vessel 1. Covered by the cap 3,

When the memory chip package 5 is to be replaced, the tip cap 3 is conventionally removed from the pressure vessel 1, or a tool (eg, an awl or a screwdriver, etc.) may be used as the through hole 3a of the tip cap 3. Had to be inserted.

However, since the distal end cap 3 is designed to have a very difficult disassembly after the product is released in order to increase the bonding force with the pressure vessel 1, the separation of the memory chip package 5 was not easy. In order to remove the tip cap 3 from the pressure vessel 1 to separate the package 5, the tool had to be used. In this case, the tip cap 3 or the pressure vessel 1 was attached to the tool. This caused a problem of breakage, followed by the closure of the entire ink cartridge.

In addition, even when the tool is inserted into the through hole 3a of the tip cap 3 to separate the memory chip package 5, the tip cap 3 may be damaged by the tool.

Accordingly, the present invention has been made to solve the above-mentioned conventional problems, the present invention, by configuring the memory chip package containing the capacity information for detecting the amount of ink used to be freely separated and combined from the ink cartridge In addition, the ink cartridge can be recycled more actively, and the replacement and repair can be easily performed when the ink cartridge cannot be used due to a defective contact of the memory chip package and the contact pad or other damage of the memory chip. It is an object of the present invention to provide a memory chip package separation structure of an ink cartridge.

1 is an exploded view showing the structure of a conventional ink cartridge.

2 is a structural diagram of a removable memory chip package according to an embodiment of the present invention.

Figure 3 is a perspective view showing the structure of an ink cartridge equipped with a memory chip package in one embodiment of the present invention.

Figure 4 is a plan view showing the structure of an ink cartridge equipped with a memory chip package in one embodiment of the present invention.

Figure 5 is a side cross-sectional view showing a structure of an ink cartridge equipped with a memory chip package in one embodiment of the present invention.

* Explanation of symbols on the main parts of the drawings *

5; Memory chip package 8; Chassis member

10; Ink cartridge 11; Chip engaging protrusion

12; A memory unit 13; Contact projection

21,22; First and second printed circuit board

23; Connection 24; Coupling hole

Hereinafter, a preferred embodiment of the present invention based on the accompanying drawings.

For reference, the drawings referred to below will be described with the same reference numerals for the same parts as in the prior art for convenience of description.

2 is a structural diagram of a removable memory chip package according to an embodiment of the present invention, and FIG. 3 is a perspective view showing a structure of an ink cartridge in which a memory chip package is mounted as an embodiment of the present invention, and FIG. 4 is one of the present inventions. As an embodiment, a plan view showing a structure of an ink cartridge in which a memory chip package is mounted, and FIG. 5 is a side cross-sectional view illustrating a structure of an ink cartridge in which a memory chip package is mounted according to an embodiment of the present invention.

As shown in Figures 2 to 5, it consists of a combination of the pressure vessel 1, the ink storage pack (2) and the front end cap (3) and the rear end cap (4) formed with a through hole (3a), the ink An ink cartridge 10 for an inkjet printing system in which a memory chip package 5, an ink level sensing circuit 6, and a chassis member 8 having a contact pad 7 are coupled to an upper portion of the storage pack 2. To

On the chassis member 8 is formed a chip coupling protrusion 11 for guiding the detachment of the memory chip package 5 freely,

The memory chip package 5 includes first and second printed circuit boards (PCBs) 21 and 22 in which the memory unit 12 and the contact unit 13 are separately formed.

The first and second printed circuit boards 21 and 22 are connected to each other by a foldable connecting portion 23,

The second printed circuit board 22 is characterized in that the coupling hole 24 is inserted into which the chip coupling protrusion 11 of the chassis member 8 is inserted.

Referring to Figures 2 to 5 attached to the operation of an embodiment of the present invention configured as described above are as follows.

First, the memory chip package 5 in the ink cartridge 10 formed of a combination of the pressure vessel 1, the ink storage pack 2, and the front end cap 3 having the through hole 3a, as well as the rear end cap 4; In this case, the coupling is easily performed by one chip coupling protrusion 11 formed on the chassis member 8 of the ink cartridge 10.

That is, the chip coupling protrusion 11 can be easily identified from the outside through the through hole 3a of the tip cap 3,

The coupling hole 24 of the second printed circuit board 22 having the contact portion 13 is inserted into the chip coupling protrusion 11.

Then, the contact portion 13 maintains the contact state with the contact pad 7 formed in the chassis member (8).

At this time, the second printed circuit board 22 is connected to the first printed circuit board 21 by the connecting portion 23 so as to be foldable,

The second printed circuit board 22 is brought into close contact with the chassis member 8 through the coupling hole 24 of the second printed circuit board 22, and then the first printed circuit board 21 is folded. Eg, 90 °)

Then, the memory chip package 5 can be easily coupled without removing the tip cap 3.

On the other hand, the memory chip package 5 coupled as described above is easily separated by the second printed circuit board 22 having the coupling hole 24 from the coupling protrusion 11 of the chassis member 8. As can be achieved, the present invention not only does not remove the tip cap 3, but also has the feature that the memory chip package 5 can be easily separated from the ink cartridge 10 without using a tool.

As described above, the memory chip package separation structure of the ink cartridge of the present invention is configured to freely separate and combine the memory chip package storing the capacity information for detecting the amount of ink used from the ink cartridge. In addition, the ink cartridge can be replaced and repaired easily when the ink cartridge cannot be used due to a failure in contact between the memory chip package and the contact pad or other memory chips.

The present invention is not limited to the above-described specific preferred embodiment, and any person having ordinary skill in the art to which the present invention pertains may make various modifications without departing from the gist of the present invention claimed in the claims. Of course, such changes will fall within the scope of the claims.

Claims (1)

Combination of the pressure vessel, the ink storage pack and the front end cap and the rear end cap formed with the through-hole, and the upper portion of the ink storage pack, the memory chip package (5), the ink level sensing circuit and the chassis member formed with the contact pad In the ink cartridge for the combined inkjet printing system, The chassis member is formed with a chip coupling protrusion for guiding the detachment of the memory chip package freely, The memory chip package includes first and second printed circuit boards in which a memory part and a contact part are separately formed. The first and second printed circuit boards are connected to each other by a foldable connection part. And a coupling hole into which the chip coupling protrusion of the chassis member is inserted into the second printed circuit board.