KR200320072Y1 - Ballast stabilizer having a integrated socket - Google Patents

Abstract

The present invention relates to an electronic ballast having a PCB substrate on which a plurality of device components are mounted, and a ballast cover of a container shape accommodating the PCB substrate, wherein one terminal of the discharge lamp is elastically provided at one side of the PCB substrate. A plurality of socket terminals which are inserted and coupled and are in close contact with at least a portion of each terminal of the discharge lamp; A plurality of terminal holes through which the discharge lamp terminal passes is formed at a position corresponding to the socket terminal at least at one end along a plate surface direction of the PCB board of the ballast cover, and at least one end of the discharge lamp is formed in a region where the terminal hole is formed. It characterized in that it comprises a ballast cover formed with a receiving portion for receiving a portion.

As a result, by installing the socket terminal directly on the PCB substrate and integrating the socket into the ballast cover, not only the cost is reduced, but also the assembly work is simplified. In addition, by increasing the binding force between the socket terminal and the lamp terminal, overheating can be prevented and the ceiling embedded lamp can also be installed using the electronic ballast, which eliminates the need to develop an electronic ballast for the embedded lamp. Savings. In addition, by mounting the PCB substrate and the main frame at a predetermined distance apart, it is possible to prevent overheating of the PCB substrate, thereby preventing damage to the PCB substrate itself and damage to device components, and to shorten the life of the discharge lamp. . On the other hand, according to the installation of a separate wire clip, the wiring work becomes easy.

Description

BALLAST STABILIZER HAVING A INTEGRATED SOCKET}

The present invention relates to an electronic ballast incorporating a socket, and more particularly, to increase electrical contact area between a ballast terminal and a fluorescent lamp terminal to achieve electrical stability, and to simplify the structure by integrally forming a socket on the ballast cover. The present invention relates to an electronic ballast incorporating a socket to reduce cost and simplify assembly.

In general, ballasts used in discharge lamps such as fluorescent lamps and three-wavelength lamps to provide a stable power supply when the lamp is turned on to help discharge, and to maintain a stable lighting state by preventing excessive current flow after the lamp is turned on.

Such ballasts are classified into electronic and magnetic types, and the dual electronic ballasts are discharged with a high frequency power source of 20KHz-30KHz using a semiconductor device to light a discharge lamp.

The discharge lamp device including the electronic ballast 120, as shown in Figure 6, is attached to the ceiling and the like main plate 110 for fixing the discharge lamp and coupled to one side of the main frame 110 It includes a ballast 120 for supplying a stable power to the discharge lamp.

The main frame 110 may have various structures according to the number and arrangement of the discharge lamps, but in the present embodiment, the main frame 110 is formed in a long plate shape to one side so that the pair of discharge lamps can be arranged long. The ballast 120 is coupled to the central region of the main frame 110, and a pair of lamp holders 115 for holding each discharge lamp coupled to the ballast 120 are provided at both ends of the main frame 110. Are combined. In the region where the ballast 120 of the main frame 110 is coupled, the heater wire 123 withdrawing hole 111 for drawing out the heater wire 123 to be described later is formed.

The ballast 120 includes a PCB board 121 on which various component parts are mounted, a socket 130 mounted on one side of the PCB board 121, to which a discharge lamp terminal is coupled, and a ballast accommodating the PCB board 121. Cover 140.

The heater board 123 is connected to the PCB substrate 121 for connection with a power line for supplying power from the outside. In addition, one side of the PCB substrate 121 is provided with a plurality of substrate terminals 125, which are erected on the PCB substrate 121 by soldering and are formed in a pin shape in order to be electrically connected to the socket 130. The substrate terminal 125 is electrically connected to the device component by a circuit formed on the PCB substrate 121.

On the other hand, the socket 130 is formed of an elliptical shape, one end is formed with a plurality of discharge lamp terminal holes 133, the terminal of the discharge lamp is inserted, one end of the discharge lamp terminal hole 133 is formed discharge lamp An accommodating portion 131 is formed to be recessed inwardly by a predetermined width so that the end of the accommodating portion is accommodated. In addition, a plurality of substrate terminal holes (not shown) for the passage of the substrate terminal 125 are formed on a surface of the socket 130 that contacts the PCB substrate 121.

The inside of the socket 130 has a discharge lamp terminal (not shown) inserted into the socket 130 through the discharge lamp terminal hole 133, and a substrate terminal inserted into the socket 130 through the substrate terminal hole ( A socket terminal 150 for electrically connecting 125 to each other is disposed.

As shown in FIG. 7, the socket terminal 150 has a narrower width toward one end and a clip-shaped terminal portion 151 for holding a discharge lamp terminal, and a terminal portion 151 extending downward from the terminal portion 151. It has a contact portion 153 is bent in parallel to the parallel to the bent again parallel to the bent surface is formed in two layers and the substrate terminal 125 is in contact. According to such a configuration, the socket 130 is connected to the PCB substrate 120 so that the substrate terminal 125 contacts the contact portion 153 by passing the substrate terminal 125 of the PCB substrate 121 through the substrate terminal hole of the socket 130. By pressing toward 121, the socket 130 can be mounted on the PCB substrate 121.

The ballast cover 140 in which the PCB substrate 121 on which the socket 130 is mounted is accommodated is formed long along the longitudinal direction of the PCB substrate 121, and is formed in a container shape having an upper opening. Passing holes 143 are formed at both ends of the ballast cover 140 in the longitudinal direction, and a plurality of ventilation holes 141 are formed in the ballast cover 140 in a slit shape penetrating the plate surface. To prevent overheating of the PCB substrate 121.

Looking at the process of assembling the discharge lamp device according to this configuration as follows. First, the auxiliary plate (not shown) for fixing the main frame 110 is fixed to the ceiling by using a screw or the like, and the PCB board 121 is moved to the main frame 110 so that the component parts of the PCB board 121 face downward. After placing it in the center of the PCB substrate 121 is fixed to the main frame. At this time, the PCB substrate 121 and the main frame 110 may be screwed using a screw or the like, and a pole is formed in the main frame 110, and a pole through hole is formed in the PCB substrate 121. The main frame 110 and the PCB substrate 121 may be fixed by pressing the end portion with heat while passing the through-hole.

After fixing the PCB substrate 121 to the main frame 110, the main frame 110 is disposed to be adjacent to the auxiliary plate, and then the heater wire 123 connected to the PCB substrate 121 is connected to the main frame 110. The lead is drawn out through the drawing hole 111 formed in the connection to an external power line. Then, the main frame 110 is completely coupled to the auxiliary plate, and the ballast cover 140 is screwed to the main frame 110.

By the way, this conventional electronic ballast 120 has the following problems.

First, when the discharge lamp is coupled to the socket 130, as shown in Figure 7, the discharge lamp terminal is connected to the terminal portion 151 of the socket terminal 150 through the discharge lamp terminal hole 133, At this time, the discharge lamp terminal and the terminal portion 151 are in point contact. As the discharge lamp terminal and the terminal portion 151 are point-contacted as described above, there is a high possibility that overload occurs in the point-contacted area and overheating, and thus electrical stability is lowered.

In addition, as the discharge lamp terminal and the socket terminal 150 are in point contact, the discharge lamp terminal and the socket terminal 150 do not have a sufficient binding force, so a separate lamp holder 115 is required, thereby increasing the accessories. The resulting cost rises. In addition, in the case of a ceiling embedded lamp, since a tight binding force between the lamp and the ballast 120 is required, the socket terminal 150 used for the general lamp cannot be used for the embedded lamp. Accordingly, since the ballast 120 having a terminal having a different binding strength is used for the ceiling embedded lamp, there is a disadvantage in that there is no device compatibility between the general lamp and the embedded lamp. Due to these drawbacks, cost, time, human waste caused by separately manufacturing the ballast 120 for the general lamp and the ballast 120 for the embedded lamp.

Meanwhile, in the related art, the PCB substrate 121 is installed to be directly fixed to the main frame 110 so that heat from the PCB substrate 121 is directly transmitted to the main frame 110, and the main frame 110 which is an injection molded product. This can overheat and deform. In addition, even though the vent hole 141 is formed in the ballast cover 140, as the distance between the PCB substrate 121 and the main frame 110 is too narrow, the PCB substrate 121 is not sufficiently cooled. As a result, damage to the PCB substrate 121 itself or the device components mounted on the PCB substrate 121 may occur, or the current of the discharge lamp may not be properly controlled, thereby reducing the life of the discharge lamp. .

In order to supply power to the PCB substrate 121, the heater wire 123 and the power line from the outside should be connected. For this purpose, the heater wire 123 from the PCB substrate is drawn out of the main frame 110. After drawing to the outside through, the heater wire 123 and the power line must be connected by hand. At this time, it is also important to form the power wire and the heater wire 123 to a suitable length so that the power wire and the heater wire 123 is not exposed to the outside of the main frame 110. Slightly spaced 110 from the ceiling, the connection between the heater wire 123 and the power line to put the hand between the spaced space is cumbersome wiring work.

In addition, in the conventional electronic ballast 120, the socket 130 is formed separately and mounted on the PCB substrate 121, so that the cost increases, as well as the socket 130 of the socket 130 separately manufactured. Since a separate work process for mounting is required, there is a problem that the assembly work is cumbersome.

Accordingly, an object of the present invention is to increase the contact area between the discharge lamp terminal and the socket terminal and increase the binding force, thereby preventing overload and overheating to improve the electrical stability and at the same time integrated socket that can be applied to the ceiling embedded lamp It is to provide an electronic ballast having a.

Another object of the present invention is to ensure that the PCB substrate and the mainframe are spaced apart by a predetermined distance to facilitate the cooling of the PCB substrate, thereby preventing damage to device components and extending the life of the discharge lamp. It is to provide an electronic ballast having a.

It is still another object of the present invention to provide an electronic ballast having an integrated socket that enables the socket to be integrated into the ballast cover, thereby simplifying the assembly work and reducing the cost.

Another object of the present invention is to provide an electronic ballast having an integrated socket for simplifying the connection work between the heater wire and the power supply wire.

1 is an exploded perspective view of an electronic ballast according to the present invention,

2 is a partial cross-sectional view of the assembly of FIG.

Figure 3a is an enlarged cross-sectional view of the "A" region of FIG.

3B is an enlarged sectional view taken along the line B-B in FIG.

4 is a plan view of a PCB substrate according to another embodiment of FIG.

5 is a side view of a PCB substrate according to another embodiment of FIG. 1;

6 is an exploded perspective view of a conventional electronic ballast,

7 is a partial detailed view of the socket terminal coupled to the discharge lamp terminal of FIG.

* Explanation of symbols for the main parts of the drawings

10: mainframe 20: electronic ballast

21: PCB board 25: socket terminal

26: terminal portion 27: coupling portion

30: wire clip 31: power line clip

40: ballast cover 40a: cover

41: ventilation hole 44: terminal hole

45: accommodating part 46: support flange

47: frame passing hole

The above object is, according to the present invention, in the electronic ballast having a PCB substrate on which a plurality of device components are mounted and a ballast cover of the container shape for accommodating the PCB substrate, one side of the PCB substrate each terminal of the discharge lamp Is elastically inserted and integrally mounted with a plurality of socket terminals in close contact with at least a portion of each terminal of the discharge lamp; A plurality of terminal holes through which the discharge lamp terminal passes is formed at a position corresponding to the socket terminal at least at one end along a plate surface direction of the PCB board of the ballast cover, and at least one end of the discharge lamp is formed in a region where the terminal hole is formed. It is achieved by an electronic ballast having an integrated socket characterized in that it comprises a ballast cover formed with a receiving portion for receiving a portion.

Here, guide rails protruding from the plate surface and formed along the plate surface direction of the PCB board are formed on both inner wall surfaces of the ballast cover, so that the positions of the terminal holes and the socket terminals of the ballast cover correspond exactly.

The PCB board is slidably mounted along the guide rail, and the device parts are disposed to be seated on the PCB board in the ballast cover, thereby smoothing the cooling of the PCB board.

One end of the substrate clip portion coupled to the PCB substrate, and the other end further comprises a wire clip formed with a power line clip portion is inserted into the power line from the outside, so that the substrate clip portion and the power line clip portion is electrically connected By doing so, the wiring work can be simplified.

Hereinafter, with reference to the accompanying drawings will be described in detail for the subject innovation.

The electronic ballast directly mounts the socket terminal for coupling with the lamp terminal to the PCB board, and makes the socket terminal contact the whole area along the circumferential direction of the lamp terminal, thereby preventing overload and improving electrical stability. do. In addition, by integrally forming a socket on the ballast cover, it is possible to simplify the structure of the ballast to reduce the cost.

Hereinafter, the structure of the electronic ballast will be described with reference to the drawings. In the present embodiment, a case where a pair of discharge lamps are arranged in a straight line will be described as an example. However, the scope of the present invention is not limited to the present embodiment. Of course, the configuration can be changed according to the number or type of mounting of course.

1 and 2, the discharge lamp device includes a main plate 10 which is long on one side and an electronic ballast 20 coupled to the central region of the main frame 10. As shown in FIG.

The electronic ballast 20 includes a PCB board and a ballast cover 40, and a plurality of socket terminals 25 are mounted on the PCB board 21 to be coupled with the lamp terminal 61 as well as a conventional device component. The ballast cover 40 is formed integrally with the socket.

A plurality of socket terminals 25 mounted on the PCB substrate 21 are mounted on both ends of the PCB substrate 21 in the longitudinal direction, and the plurality of socket terminals 25 are along the ends of the PCB substrate 21. It is arranged at regular intervals.

The socket terminal 25 is preferably mounted to the PCB substrate 21 by soldering, and as shown in FIGS. 3A and 3B, a terminal portion in which a lamp terminal 61 is inserted is formed in a cylindrical shape ( 26 and a coupling portion 27 extending from the terminal portion 26 and coupled to the PCB substrate 21. The terminal portion 26 is formed with a cutting slot 28 in which one side is cut in the longitudinal direction along the circumferential direction, and the width of the terminal portion 26 when the lamp terminal 61 is inserted by the cutting slot 28. Because of this elastic adjustment, the lamp terminal 61 is inserted in close contact with the terminal portion 26. On the other hand, the coupling portion 27 extends from the terminal portion 26 and is formed in a shape that is unfolded by a predetermined width around the cutting slot 28, and the coupling portion 27 is electrically connected to other device components of the PCB substrate 21. It is coupled to the PCB substrate 21 by soldering so as to be connected.

Unlike the conventional terminal portion 26 of the socket terminal 25 is in surface contact along the circumferential direction of the lamp terminal 61, it is possible to prevent the occurrence of overload due to the point contact. In addition, as the binding force between the socket terminal 25 and the lamp terminal 61 is strengthened, the lamp holder, which is conventionally provided in the main frame 10 for fixing the discharge lamp 60, is not necessary.

On the other hand, the PCB substrate 21 is electrically connected to the power line to receive power from the outside, for this purpose, a power terminal (not shown) is protruded on one side of the PCB substrate 21, the wire clip 35 in the power terminal ) Is installed. The wire clip 35 includes a substrate clip portion (not shown) into which a power terminal protruding from the PCB board 21 is inserted, and a power line clip portion 31 into which a power line from the outside is inserted. The part and the power line clip part 31 are electrically connected with each other. In addition, a clip button 32 for pressing a terminal in the board clip portion and the power line clip portion 31 so that the wire can be easily inserted into one side surface connecting the board clip portion and the power line clip portion 31 is a wire clip. It is formed through 35. In the case of using such a wire clip 35, the power supply line drawn out through the main frame 10 only need to be inserted into the power line clip portion 31 of the wire clip 35, the connection work becomes easy.

On the other hand, the ballast cover 40 for accommodating the PCB substrate 21, the socket terminal 25 is formed on both sides of the PCB substrate 21, a pair to facilitate the mounting work of the ballast cover 40 Is divided into a cover portion 40a. Each cover portion 40a has an open surface facing each other, and a plurality of terminal holes 44 through which the lamp terminal 61 passes through the other side of each cover portion 40a is positioned at each socket terminal 25. It is formed along the horizontal direction of the PCB substrate 21 so as to correspond to. In the region where the terminal hole 44 is formed, an elliptical accommodating part 45 recessed inwardly from the plate surface is formed in the region where the terminal hole 44 is formed, and the discharging lamp is disposed below the accommodating part 45. A support flange 46 for supporting the lower portion of the 60 to prevent the discharge lamp 60 from falling down is formed to protrude from the plate surface of the cover portion 40a by a predetermined width.

Inside the cover portion 40a, guide rails 48 for guiding the PCB substrate 21 are formed at both sides along the longitudinal direction of the PCB substrate 21, and the guide rail 48 is formed by a cover portion ( It is formed by the pair of rail parts 49 arrange | positioned at predetermined intervals in the up-down direction on the inner wall of 40a). Accordingly, when the PCB substrate 21 is accommodated in the ballast cover 40, the PCB substrate 21 is inserted between the rails 49 of the guide rails 48 and then slides along the guide rails 48. By doing so, not only the terminal portion 26 of the socket terminal 25 and the terminal hole 44 of the cover portion 40a can be accurately fixed but also prevented from flowing from the fixed position.

On the other hand, in the ballast cover 40, the PCB substrate 21 is accommodated in a state in which the device component is mounted on the upper portion of the PCB substrate 21, so if the PCB substrate 21 is mounted in the ballast cover 40 As the PCB substrate 21 is spaced apart from the ceiling, not only heat generated from the PCB substrate 21 is transferred to the main frame 10 but also sufficient space for cooling is formed. In addition, a plurality of ventilation holes 41 penetrating the plate surface are formed in each cover portion 40a, and heat generated from the PCB substrate 21 through the ventilation holes 41 is external to the ballast cover 40. Is released. On the other hand, one side of the ballast cover 40 is formed with a power line through hole for the passage of the power line from the outside, the power line through hole 43 is in contact with each other when the cover portion (40a) is coupled A portion of the area is provided by the groove formed by cutting away.

The ballast cover 40 is fixed to the ceiling by the main frame 10, for this purpose, each cover portion 40a of the ballast cover 40, the main frame 10 in the upper portion of the terminal hole 44 The frame passing hole 47 is formed to pass, and the frame passing hole 47 is formed long along the arrangement direction of the terminal hole 44.

On the other hand, the electronic ballast 20 of the present invention, the binding force between the socket terminal 25 and the lamp terminal 61 is improved, the support flange 46 for supporting the discharge lamp 60 in the ballast cover 40 is provided Since it is formed, without using a separate mainframe 10, it is possible to provide a coupling means such as screw fastening to the ballast cover 40 can be installed directly on the ceiling.

If described briefly the process of assembling the electronic ballast 20 by such a configuration. First, each socket terminal 25 is soldered to both ends of the PCB substrate 21 and mounted in a row, and then coupled to the power supply terminal of the PCB substrate 21 in the substrate clip portion of the wire clip 35. Then, both ends of the PCB substrate 21 are inserted between the rail portions 49 of the respective cover portions 40a, and then the two cover portions 40a are pressed toward the center region. At this time, the wire clip 35 is exposed to the outside to ensure the separation distance between the cover portion (40a) so that the power line can be easily inserted later. In this state, the main frame 10 is passed through the frame through hole 47, and at this time, the drawing hole of the main frame 10 and the power line through hole 43 of the ballast cover 40 communicate with each other. To place. Then, the power line is drawn out through the power line passing hole 43 and the drawing hole, and then, the main frame 10 is fixed to the ceiling, and the power line is connected to the power line clip portion 31 of the wire clip 35. Insert it. Finally, both cover parts 40a are slid to be in contact with each other.

In this way, the electronic ballast 20 is provided with a socket terminal 25 directly on the PCB substrate 21, so that a separate socket for fixing the socket terminal 25 is not required. Accordingly, by integrating the socket into the ballast cover 40, not only the cost is reduced by the conventional socket removal, but also the assembly operation is simplified.

In addition, by making the socket terminal 25 in surface contact with the lamp terminal 61 rather than point contact, and increasing the binding force, it is possible not only to prevent overheating due to the point contact, but also to the socket terminal 25 and the lamp terminal ( According to the improvement in the binding force between the 61, the separate means for preventing the fall of the discharge lamp 60, that is, the lamp holder is not necessary, and the main frame (10) by removing the area of the main frame (10) required for installation of the lamp holder main frame ( 10) can be made short or eliminated at all.

On the other hand, when mounting the PCB substrate 21 in the ballast cover 40, by placing the PCB substrate 21 so that the component parts are mounted on top of the PCB substrate 21, the PCB substrate 21 is the main frame 10 A sufficient heat dissipation space is formed by being spaced apart from each other, thereby preventing overheating of the PCB substrate 21. Accordingly, by preventing the damage to the PCB substrate 21 itself and the damage to the device components, it is possible to prevent the life of the discharge lamp (60).

Since the PCB board 21 is equipped with a separate wire clip 35 for the wiring work, the wiring work is simply performed by inserting the power wire into the wire clip 35 without the need for connecting the wires by hand as in the prior art. Since it can be completed, the wiring work is simplified.

Meanwhile, in the above-described embodiment, the socket terminals 25 are respectively mounted at both ends of the PCB board 21, and the discharge lamps 60 are installed at both sides of the electronic ballast 20, respectively. Each cover part 40a of the ballast cover 40 may be installed at both ends of the main frame 10, and each discharge lamp 60 may be installed to face the center of the cover part 40a. to be. In addition, as shown in Figure 4, by mounting a plurality of socket terminals 25, respectively, on the four sides of the PCB substrate 21, four discharge lamps 60 are provided on all sides of the PCB substrate 21, Four discharge lamps 60 may be installed at one time by using one electronic ballast 20.

In addition, as shown in FIG. 5, the socket terminal 25 may be installed on a surface where the component parts of the PCB substrate 21 are not mounted, that is, a lower surface of the PCB substrate 21. At this time, due to the improvement in the binding force between the socket terminal 25 and the lamp terminal 61, even when the socket terminal 25 is installed upright, there is no fear that the lamp terminal 61 is separated from the socket terminal 25. Therefore, the terminal of the ceiling embedded lamp can be inserted and fixed. As described above, the electronic ballast 20 of the present invention has mechanical compatibility between the general lamp device and the embedded lamp device, and it is not necessary to develop the electronic ballast 20 of the ceiling embedded lamp separately, thereby reducing the cost.

As described above, according to the present invention, by installing the socket terminal directly on the PCB board, and by integrating the socket to the ballast cover, not only the cost is reduced, but also the assembly work is simplified.

In addition, by increasing the binding force between the socket terminal and the lamp terminal, overheating can be prevented and the ceiling embedded lamp can also be installed using the electronic ballast, which eliminates the need to develop an electronic ballast for the embedded lamp. Savings.

In addition, by mounting the PCB substrate and the main frame at a predetermined distance apart, it is possible to prevent overheating of the PCB substrate, thereby preventing damage to the PCB substrate itself and damage to device components, and to shorten the life of the discharge lamp. .

On the other hand, according to the installation of a separate wire clip, the wiring work becomes easy.

Claims (4)

In the electronic ballast having a PCB substrate equipped with a plurality of device components, and a ballast cover of the container shape for accommodating the PCB substrate, One side of the PCB substrate is elastically inserted and coupled to each terminal of the discharge lamp, a plurality of socket terminals in close contact with at least a portion of each terminal of the discharge lamp is integrally mounted; A plurality of terminal holes through which the discharge lamp terminal passes is formed at a position corresponding to the socket terminal at least at one end along a plate surface direction of the PCB board of the ballast cover, and at least one end of the discharge lamp is formed in a region where the terminal hole is formed. Electronic ballast having an integrated socket, characterized in that it comprises a ballast cover formed with a receiving portion for receiving a portion. The method of claim 1, Electronic ballasts having integrated sockets on both inner wall surfaces of the ballast cover protruding from the plate surface and extending along the plate surface direction of the PCB substrate. The method of claim 2, The PCB substrate is slidingly mounted along the guide rail, the electronic ballast having an integrated socket, characterized in that arranged in the ballast cover the device component is seated on top of the PCB substrate. The method of claim 1, One end of the substrate clip portion coupled to the PCB substrate, and the other end further comprises a wire clip formed with a power line clip portion is inserted into the power line from the outside, the substrate clip portion and the power line clip portion is electrically connected Electronic ballast having an integrated socket, characterized in that.