KR200319767Y1 - Anti-Heat Label Tag - Google Patents

Abstract

The present invention relates to a heat resistant tag that can be used in a semiconductor manufacturing process that must withstand high temperature heat and be free of fine dust, and that can display barcodes. The heat resistant tag has a thickness of 50 to 100 μm. Ester mat film; An aluminum film having one surface bonded to a first adhesive material on the first polyester mat film; A bar code display unit which is adhered with a predetermined adhesive material on the other surface of the aluminum film, includes a second polyester mat film having a thickness of 50 to 100 μm, and a bar code is printed on which a target product to be marked is printed; Characterized in that the item name or name of the target product to be printed and characterized in that it comprises a content display unit including the quantity, serial number, manufacturing date.

Description

Heat-resistant tag {Anti-Heat Label Tag}

The present invention relates to a heat resistant tag, and more particularly, to a heat resistant tag that can be used in a semiconductor manufacturing process that must withstand high temperature heat and be free of fine dust, and can display orders of customers.

Generally, a tag is a mark that attaches the necessary information such as the name and address of the sender, the destination and the name and address of the addressee when sending the goods by car, railroad, ship, aircraft and mail. This label refers to a label attached to a paper note or other appropriate label pre-printed at the handling office before being sent out, but is referred to as an identification mark in the manufacturing process.

In the semiconductor manufacturing process, a tag for displaying an orderer or the like is attached to the manufactured product. However, in the semiconductor manufacturing process, a material that is resistant to high temperature heat and the semiconductor manufacturing process environment is free of dust to maintain a clean state is used. Should be used.

However, since synthetic resins are vulnerable to heat and paper generates dust, there are no tags that can be used in a semiconductor manufacturing process.

The present invention aims to solve the above problems and to provide a heat resistant tag that is resistant to heat and does not generate dust so that it can be used in a semiconductor manufacturing process.

1 is a flow chart for explaining the manufacturing process of the heat-resistant tag according to the present invention.

2 is a cross-sectional view showing a cross-sectional structure of the heat resistant tag according to the present invention.

Figure 3 is a block diagram for explaining a specific use of the heat-resistant tag according to the present invention.

<Description of the symbols for the main parts of the drawings>

200: heat resistant tag 210: first polyester mat film

220: aluminum film 230: second polyester mat film

Features of the present invention for achieving the above object is a first polyester mat film having a thickness of 50 ~ 100㎛; An aluminum film having one surface bonded to a first adhesive material on the first polyester mat film; A bar code display unit which is adhered with a predetermined adhesive material on the other surface of the aluminum film, includes a second polyester mat film having a thickness of 50 to 100 μm, and a bar code is printed on which a target product is printed; It includes a product name display unit printed product name or name of the product, and a content display unit including the quantity, serial number, date of manufacture, and the like.

Hereinafter, with reference to the accompanying drawings to describe the present invention in detail.

1 is a flow chart illustrating a manufacturing process of a heat resistant tag according to the present invention, the first and second polyester mat film constituting the heat resistant tag, and the first step (S100) of loading the aluminum film (Loading) and then A second step (S110) of applying an industrial adhesive is performed.

Subsequently, a third step (S120) of aging the fixed semi-finished product coated with the adhesive for a predetermined time (S120) is carried out, followed by cutting and dividing to a size desired by the manufacturer to form a roll shape (S130). Perform

Finally, the fifth step (S140) of completing the heat-resistant tag by printing predetermined display contents to be suitable for the company which is divided and rolled into a roll shape is completed, and ends the present loop.

The cross-sectional structure of the heat resistant tag manufactured according to the above-described manufacturing process is as follows.

Figure 2 is a cross-sectional view showing a cross-sectional structure of the heat-resistant tag according to the present invention, the heat-resistant tag 200 is the aluminum film 220 is bonded on the first polyester mat film 210, the second bonded on it Polyester mat film 230 is located.

Herein, the thickness of the first and second polyester mat films 210 and 230 may be 50 to 100 μm, but about 75 μm is most suitable, and the aluminum film 220 is 5 to 5 μm. Although it should just be 10 micrometers, about 7 micrometers is the most preferable, and this can be changed according to a manufacturer's design rule.

The use mode of the heat resistant tag manufactured according to the above-described process and structure is as follows.

Figure 3 is a block diagram for explaining the use of the heat-resistant tag according to the present invention, by cutting the heat-resistant tag 300 to a suitable size, a bar code display unit 305 printed a bar code to display the target product to be displayed, and It is preferable to include a product name display unit 310 printed with the product name or name of the target product to be displayed, and a content display unit 315 including a quantity, serial number, manufacturing date, and the like.

As described above, the heat-resistant tag does not generate deformation even at high temperature heat, for example, at 130 ° C., such as in a semiconductor manufacturing process, and the order name of the semiconductor product, the semiconductor product name, etc. are described according to the convenience of the manufacturer.

According to the preferred embodiment of the present embodiment described above has the following advantages.

First, it does not generate dust while resisting the heat generated in the semiconductor manufacturing process has the advantage of providing improved quality than conventional.

Second, there is an advantage of increasing the ease of manufacture and management convenience by providing a label that is easy to identify a large number of order items.

Claims (1)

Labels used to mark articles of manufacture in semiconductor manufacturing processes, A first polyester mat film 200 having a thickness of 50 to 100 μm, An aluminum film 210 having one surface bonded to a predetermined adhesive material on the first polyester mat film 200; It is bonded to the other surface of the aluminum film 210 with a predetermined adhesive material, and comprises a second polyester mat film 220 having a thickness of 50 ~ 100㎛, Barcode display unit 305 is a bar code printed to display the target product to be displayed, the product name display unit 310 is printed product name or name of the target product to be attached, the contents including the quantity, serial number, manufacturing date, etc. Heat-resistant tag comprising a display unit 315.