KR20030093402A - The Method and Apparatus of Valve Lapping - Google Patents

The Method and Apparatus of Valve Lapping Download PDF

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Publication number
KR20030093402A
KR20030093402A KR1020020030949A KR20020030949A KR20030093402A KR 20030093402 A KR20030093402 A KR 20030093402A KR 1020020030949 A KR1020020030949 A KR 1020020030949A KR 20020030949 A KR20020030949 A KR 20020030949A KR 20030093402 A KR20030093402 A KR 20030093402A
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KR
South Korea
Prior art keywords
lapping
wrapping
disk
valve
adjusting
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KR1020020030949A
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Korean (ko)
Inventor
백수곤
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백수곤
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Priority to KR1020020030949A priority Critical patent/KR20030093402A/en
Publication of KR20030093402A publication Critical patent/KR20030093402A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/70Structural association with built-in electrical component with built-in switch
    • H01R13/703Structural association with built-in electrical component with built-in switch operated by engagement or disengagement of coupling parts, e.g. dual-continuity coupling part
    • H01R13/7031Shorting, shunting or bussing of different terminals interrupted or effected on engagement of coupling part, e.g. for ESD protection, line continuity
    • H01R13/7032Shorting, shunting or bussing of different terminals interrupted or effected on engagement of coupling part, e.g. for ESD protection, line continuity making use of a separate bridging element directly cooperating with the terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/42Securing in a demountable manner
    • H01R13/422Securing in resilient one-piece base or case, e.g. by friction; One-piece base or case formed with resilient locking means
    • H01R13/4223Securing in resilient one-piece base or case, e.g. by friction; One-piece base or case formed with resilient locking means comprising integral flexible contact retaining fingers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/64Means for preventing incorrect coupling

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE: A method and a device for lapping a valve for the surface pressure control are provided to perform the even wear of the lapping surface for the complete contact of a valve seat and a disc. CONSTITUTION: A lapping device sits on a valve. A positioning device controls the contact of a lapping surface and a disc(80). The lapping compounds are injected on the lapping surface. The surface pressure of the discs roughly is controlled. The lapping surface is finely controlled again. The lapping disc rotates to wear the lapping surface and disc with the lapping compounds so as to flatten the uneven surface.

Description

면압 조절 밸브 래핑 방법 및 장치 {The Method and Apparatus of Valve Lapping}Method and Apparatus for Wrapping Pressure Control Valves {The Method and Apparatus of Valve Lapping}

본 발명은 밸브의 래핑에 관한 기술이다.The present invention relates to the wrapping of valves.

본 발명은 밸브를 래핑하면서 면압을 조절하고 디스크 각을 조절하면서 래핑을 하는 방법을 개발하고자 하였다.The present invention seeks to develop a method of lapping while adjusting a surface pressure and lapping a valve while wrapping a valve.

도 1 은 본 발명에 의한 면압 조절 밸브 래핑방법의 일 실시예1 is an embodiment of a method for wrapping a pressure regulating valve according to the present invention

도 2 는 본 발명에 의한 세로안내의 일 실시예Figure 2 is an embodiment of the vertical guide according to the present invention

도 3 은 본 발명에 의한 가로안내의 일 실시예3 is an embodiment of a horizontal guide according to the present invention

도 4 는 본 발명에 의한 주축지지판의 일 실시예Figure 4 is an embodiment of a spindle support plate according to the present invention

도 5 은 본 발명에 의한 주축지지판 누름자의 일 실시예Figure 5 is an embodiment of the spindle support plate presser according to the present invention

도 6 은 본 발명에 의한 밸브 래핑장치의 일 실시예Figure 6 is an embodiment of the valve wrapping apparatus according to the present invention

도 7 은 본 발명에 의한 밸브 래핑장치의 일 실시예Figure 7 is an embodiment of the valve wrapping apparatus according to the present invention

도 8 은 본 발명에 의한 디스크의 일 실시예8 is an embodiment of a disk according to the present invention.

도 9 은 본 발명에 의한 회전축 각조절장치의 일 실시예9 is an embodiment of a rotation shaft angle adjusting device according to the present invention

도 10 은 본 발명에 의한 면압조절장치의 일 실시예10 is an embodiment of a surface pressure control device according to the present invention

도 11 은 본 발명에 의한 주축의 일 실시예11 is an embodiment of a main shaft according to the present invention

도 12 은 본 발명에 의한 주축힌지의 일 실시예12 is an embodiment of a spindle hinge according to the present invention

도 13 은 본 발명에 의한 디스크 각조절장치의 일 실시예Figure 13 is an embodiment of the disk angle adjustment apparatus according to the present invention

도 14 은 본 발명에 의한 디스크 각조절장치의 일 실시예Figure 14 is an embodiment of the disk angle adjustment apparatus according to the present invention

도 15 은 본 발명에 의한 가변 글로브 밸브 래핑디스크의 일 실시예15 is an embodiment of a variable globe valve wrapping disk according to the present invention.

10 : 지지대 20 : 주축 30 : 회전축 높이조절 장치10: support 20: spindle 30: rotating shaft height adjusting device

40 : 회전축 50 : 면압조절 장치 60 : 구동자40: rotation shaft 50: surface pressure control device 60: driver

70 : 디스크 집게 80 : 디스크 90 : 디스크 각 조절장치70: disc clamp 80: disc 90: disc angle adjustment device

100 : 지지대 고정자 110 : 제어장치 120 : 회전축 각 조절장치100: support stator 110: controller 120: rotating shaft angle adjustment device

본 발명은 현장에 설치되어 있는 상태의 밸브 씨트(Seat)와 디스크(Disc)를 래핑(Lapping)할 때 종래의 기술로서는 이루지 못하였던 회전축과 디스크 각을 미세하게 조절하여 래핑면과 래핑 디스크가 정 수평이 될 수 있도록 하는 래핑면 미세 조정 단계와 디스크의 면압(面壓)을 일정하게 조절하는 단계가 추가되어, 래핑면이 골고루 마모되도록 함으로서 밸브 씨트와 디스크의 완전한 접촉이 가능하도록하는 방법과 장치에 관한 것이다.The present invention, when lapping the valve seat (Seat) and the disc (Disc) in the state of being installed in the field, the lapping surface and the lapping disc is finely adjusted by finely adjusting the rotation axis and the disc angle, which was not achieved by the prior art. Steps and devices to fine-tune the wrapping surface to be horizontal and to adjust the surface pressure of the disk uniformly to allow the wrapping surface to wear evenly so that the valve seat and the disk are in perfect contact. It is about.

현장에서 수행하는 래핑은 래핑장치를 밸브위에 안착시키는 단계와 래핑면과 디스크가 개략적으로 접촉이 되도록 조절하는 개략적 위치 조절단계와 상기한 래핑면 미세 조정단계와 래핑면위에 래핑 콤파운드를 주입하는 단계와 디스크 면압을 조절하는 단계와 래핑 디스크를 회전시켜 래핑면과 디스크가 래핑 콤파운드에 의하여 상호 마모됨으로서 요철이 있던 표면이 평탄화되게 하는 래핑작업 단계와 소요의 평면이 가공되어 래핑장치를 철거하는 래핑완료 단계로 이루어진다.Lapping in the field includes the steps of seating the lapping device on the valve, roughly adjusting the position so that the lapping surface and the disk are in rough contact with each other, and finely adjusting the lapping surface and injecting the wrapping compound on the lapping surface Adjusting the disk surface pressure and lapping work by rotating the lapping disk to make the lapping surface and the disk wear out by the lapping compound, so that the uneven surface is flattened and the lapping completed step to remove the lapping device by processing the required plane. Is made of.

지금부터 본 발명에 의한 실시예를 상세히 설명하고자 한다.Now, embodiments of the present invention will be described in detail.

현장에 설치되어 있는 밸브가 분해된 상태에서 래핑장치를 밸브 위에 안착시키는 단계는 밸브 플랜지면위에 발판(11)을 올려놓는다.In the disassembling state of the valve installed in the field, the step of placing the lapping apparatus on the valve places the footrest 11 on the valve flange surface.

본 발명에 의하여 래핑면과 디스크가 접촉이 되도록 조절하는 단계는 개략적 위치 조절 단계와 래핑면 미세 조정단계로 구분된다. 개략적 위치조절 단계는 종래의 기술에서 수행하던 방법과 같은 것으로 디스크와 밸브 씨트가 개략적으로 수평이 되게 발판(11) 위치와 회전축 높이 조절장치(30), 회전축 각 조절장치(120)를 조절한 후, 지지대 고정자(100)를 이용하여 밸브 몸체와 래핑장치의 지지대(10)를 흔들리지 않도록 단단히 체결한다. 래핑면 미세 조정단계에서는 주축(20)의 하부에 네 방향으로 설치되어 있는 직각안내자(FL)를 필요한 길이만큼 밀어 주축의 위치를 동일 평면에서 임의의 위치로 제어할 수 있는 가로세로 이송핸들(H)과, 주축의 높이를 조절하는 높이 조절 핸들(27)을 회전시키고, 회전축 각 조절장치(120)의 각 조절핸들(126)을 회전시키고, 디스크 각 조절장치(90)의 판각제어봉(95)를 회전시켜디스크(80)의 접촉판(84)과 래핑면이 완전히 일치하게 한다.According to the present invention, the step of adjusting the contact between the lapping surface and the disk is divided into a rough position adjustment step and a lapping surface fine adjustment step. The coarse position adjustment step is the same as the conventional method, and after adjusting the position of the footrest 11 and the height adjustment device 30 and the rotation axis angle adjusting device 120 so that the disk and the valve seat are approximately horizontal. Using the support stator 100, firmly tighten the valve body and the support 10 of the wrapping device so as not to shake. In the lapping surface fine adjustment step, the horizontal and horizontal transfer handle (H) which can control the position of the main axis to any position in the same plane by pushing the right angle guide (FL) installed in the four directions in the lower part of the main axis 20 by the required length And the height adjusting handle 27 for adjusting the height of the main shaft, rotating the angle adjusting handle 126 of the rotating shaft angle adjusting device 120, and the plate control rod 95 of the disk angle adjusting device 90. Rotate so that the contact plate 84 and the wrapping surface of the disc 80 are completely coincident.

래핑면에 래핑 콤파운드를 주입하는 단계는 기존의 기술을 이용한다.Injecting the wrapping compound into the wrapping surface uses existing techniques.

디스크 면압을 조절하는 단계는 지지대(10)에 고정된 주축(20)과 회전축(40)을 핀으로 연결하는 회전축 핀(128)을 통하여 회전축의 각도를 조정할 수 있고, 이 회전축(40)이 일정한 각도에서 유지될 수 있도록 하는 회전축 각 조절장치(120)에 부가된 면압조절장치(50)에서 수행한다. 면압조절장치(50)는 각 멈춤너트(123)에 일체화되어 있는 멈춤너트 지지판(51)을 주축(20)에 일체화되어 있는 면압 조절베이스(59A)를 반력판으로 하여 스프링(57)으로 밀어붙임으로서 구현된다. 면압조절 베이스(59A)에 있는 각 멈춤 구멍(52)의 끝과 회전축(40)의 각 위치를 제어하는 각 멈춤자(125)가 접촉하게 되면 면압을 가할 수 없으므로 디스크(80)와 래핑면을 접촉시킬 때 각 멈춤자(125)가 접촉하지 않고, 래핑면의 마모정도 이상으로 간격을 띠워놓고 래핑작업을 시작하여야 한다. 래핑면압 조절은 면압조절베이스(59A)에 일체화 되어 있는 면압 조절 나사(55)를 따라 나사 축방향으로 이동하는 면압 조절 너트(56)가 면압조절 베이스(59A)의 바닥을 따라 미끄러 질수 있는 구조로 된 스프링 지지판(59)을 회전축(40) 방향으로 밀거나 당김으로서 스프링의 길이를 조절하여 면압을 변화시킴으로서 소요의 면압을 디스크에 일정하게 인가하게 된다.The step of adjusting the disk surface pressure can adjust the angle of the rotating shaft through the rotating shaft pin 128 connecting the main shaft 20 and the rotating shaft 40 fixed to the support 10 with a pin, the rotating shaft 40 is constant It is carried out in the surface pressure adjusting device 50 added to the rotating shaft angle adjusting device 120 to be maintained at an angle. The surface pressure adjusting device 50 pushes the spring pressure control base 59A, which is integrated with the respective stop nuts 123, to the spring 57, using the surface pressure control base 59A, which is integrated with the main shaft 20, as a reaction plate. Is implemented as: When the end of each stop hole 52 in the surface pressure control base 59A and the respective stoppers 125 for controlling the respective positions of the rotary shaft 40 come into contact with each other, the surface pressure cannot be applied. Each stopper 125 does not contact when contacting, and the lapping operation should be started with a gap more than the degree of wear of the wrapping surface. Wrapping pressure control is a structure in which the surface pressure adjustment nut 56, which moves in the screw axial direction along the surface pressure adjustment screw 55 integrated with the surface pressure adjustment base 59A, can slide along the bottom of the surface pressure adjustment base 59A. By pushing or pulling the spring support plate 59 in the direction of the rotation shaft 40, the surface pressure is changed by adjusting the length of the spring to constantly apply the required surface pressure to the disk.

래핑 작업단계는 구동자(60)의 회전이 회전축(40)에 전달되고, 이는 다시 디스크축(81)을 회전시켜 디스크(80)가 회전함으로서 래핑면과 디스크가 래핑 콤파운드에 의하여 상호 마모되는 과정을 통하여 요철이 있던 표면이 평탄화된다.In the lapping operation step, the rotation of the driver 60 is transmitted to the rotation shaft 40, which in turn rotates the disk shaft 81 to rotate the disk 80 so that the lapping surface and the disk are mutually worn by the wrapping compound. Through the uneven surface is flattened.

래핑완료 단계는 래핑면에 소요의 평면이 얻어 지면 지지대 고정자(100)를 풀어해체하고, 래핑면은 청소한 후 밸브를 조립할 수 있도록 준비하는 것을 의미한다.The lapping completion step means that when the required plane is obtained on the wrapping surface, the support stator 100 is released and dismantled, and the wrapping surface is cleaned and ready for assembly of the valve.

이후 밸브를 조립하여 소요의 플랜트 시스템을 정상화 시키게 된다.The valves are then assembled to normalize the required plant systems.

본 발명의 결과 래핑 면압을 일정하게 유지할 수 있게 되었다.As a result of the present invention, the lapping surface pressure can be kept constant.

Claims (2)

래핑장치를 밸브위에 안착시키는 단계와Placing the wrapping device on the valve 래핑면과 디스크가 개략적으로 접촉이 되도록 조절하는 개략적 위치 조절단계와A rough positioning step for adjusting the lapping surface and the disk to be in rough contact 상기한 래핑면 미세 조정단계와 래핑면위에 래핑 콤파운드를 주입하는 단계와Finely adjusting the lapping surface and injecting the lapping compound onto the lapping surface; 디스크 면압을 조절하는 단계와 래핑 디스크를 회전시켜 래핑면과 디스크가 래핑 콤파운드에 의하여 상호 마모됨으로서 요철이 있던 표면이 평탄화되게 하는 래핑작업 단계와Adjusting the surface pressure of the disk and rotating the wrapping disk so that the wrapping surface and the disk are worn out by the wrapping compound to make the uneven surface flat. 소요의 평면이 가공되어 래핑장치를 철거하는 래핑완료 단계로 이루어진 래핑 면압을 조절하는 밸브 래핑 방법Valve wrapping method to adjust the lapping surface pressure, which consists of a lapping completion step in which the required plane is processed to remove the lapping device. 래핑장치를 밸브위에 안착시키는 장치와A device for seating the wrapping device on the valve 래핑면과 디스크가 개략적으로 접촉이 되도록 조절하는 개략적 위치 조절장치와A coarse position adjuster for roughly contacting the lapping surface and the disc 상기한 래핑면 미세 조정단계와 래핑면위에 래핑 콤파운드를 주입하는 장치와A device for injecting the wrapping compound on the lapping surface and the lapping surface fine adjusting step 디스크 면압을 조절하는 단계와 래핑 디스크를 회전시켜 래핑면과 디스크가 래핑 콤파운드에 의하여 상호 마모됨으로서 요철이 있던 표면이 평탄화되게 하는 래핑작업 장치로 이루어져 래핑 면압을 조절하는 밸브 래핑 장치The valve wrapping device for adjusting the wrapping pressure by adjusting the disk surface pressure and the wrapping operation device which rotates the wrapping disk to make the wrapping surface and the disk wear out by the wrapping compound to make the uneven surface flat.
KR1020020030949A 2002-06-03 2002-06-03 The Method and Apparatus of Valve Lapping KR20030093402A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4169487A (en) * 1977-06-20 1979-10-02 Watson Robert L Globe-valve locking apparatus for valve lapping
US4715149A (en) * 1986-08-25 1987-12-29 Kelsey John R Steady rest for valve grinding apparatus
US5931728A (en) * 1995-02-20 1999-08-03 Larslap Ab Device for carrying out mechanical tooling of a valve seat
KR100283696B1 (en) * 1999-01-04 2001-02-15 백수곤 The automatic valve lapping system
KR20010061065A (en) * 1999-12-28 2001-07-07 김형국 Working and grinding tool of valve seat

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4169487A (en) * 1977-06-20 1979-10-02 Watson Robert L Globe-valve locking apparatus for valve lapping
US4715149A (en) * 1986-08-25 1987-12-29 Kelsey John R Steady rest for valve grinding apparatus
US5931728A (en) * 1995-02-20 1999-08-03 Larslap Ab Device for carrying out mechanical tooling of a valve seat
KR100283696B1 (en) * 1999-01-04 2001-02-15 백수곤 The automatic valve lapping system
KR20010061065A (en) * 1999-12-28 2001-07-07 김형국 Working and grinding tool of valve seat

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