KR20030088992A - Surface acoustic filter package structure - Google Patents

Surface acoustic filter package structure Download PDF

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Publication number
KR20030088992A
KR20030088992A KR1020020026859A KR20020026859A KR20030088992A KR 20030088992 A KR20030088992 A KR 20030088992A KR 1020020026859 A KR1020020026859 A KR 1020020026859A KR 20020026859 A KR20020026859 A KR 20020026859A KR 20030088992 A KR20030088992 A KR 20030088992A
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South Korea
Prior art keywords
input
output
package
signal bus
surface acoustic
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KR1020020026859A
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Korean (ko)
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김주상
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엘지이노텍 주식회사
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Priority to KR1020020026859A priority Critical patent/KR20030088992A/en
Publication of KR20030088992A publication Critical patent/KR20030088992A/en

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H03H9/14541—Multilayer finger or busbar electrode
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6423—Means for obtaining a particular transfer characteristic
    • H03H9/6433—Coupled resonator filters
    • H03H9/644—Coupled resonator filters having two acoustic tracks
    • H03H9/6456—Coupled resonator filters having two acoustic tracks being electrically coupled
    • H03H9/6469—Coupled resonator filters having two acoustic tracks being electrically coupled via two connecting electrodes
    • H03H9/6473—Coupled resonator filters having two acoustic tracks being electrically coupled via two connecting electrodes the electrodes being electrically interconnected

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE: A package structure of a SAW(Surface Acoustic Wave) filter is provided to prevent the interference due to coupling phenomena by bending one end of each of input and output IDTs(InterDigital Transducers). CONSTITUTION: Electronic devices are mounted within a package(50). A plurality of connecting terminals(51) electrically connects the electronic devices mounted within the package(50) to the external. A piezoelectric substrate(61) and input and output IDTs(62,63) are provided within the package(50). The input and output IDTs(62,63) are provided with comb-shaped input and output finger units(62a,63a) and input and output signal bus bars(62b,63b). The input and output signal bus bars(62b,63b) are formed in parallel with a signal transmission direction with respect to ends of the input and output finger units(62a,63a). One end of each of the input and output signal bus bars(62b,63b) is bent.

Description

표면탄성파 필터 패키지 구조{Surface acoustic filter package structure}Surface acoustic filter package structure

본 발명은 표면탄성파 필터 패키지 구조에 관한 것으로서, 특히 표면탄성파 필터를 외부와 와이어를 통해 전기적으로 연결할 경우 와이어와 표면탄성파 필터간에 전기적인 간섭에 의한 커플링(Coupling) 현상이 발생되는 것을 방지하여 필터 특성 및 성능이 향상되는 표면탄성파 필터 패키지 구조에 관한 것이다.The present invention relates to a surface acoustic wave filter package structure, and in particular, when the surface acoustic wave filter is electrically connected to the outside through a wire, a filter is prevented from occurring due to electrical interference between the wire and the surface acoustic wave filter. The present invention relates to a surface acoustic wave filter package structure having improved characteristics and performance.

일반적으로 표면탄성파(Surface Acoustic Wave, 이하 SAW라 함) 소자는 절연성이 큰 기판에 금속 전극을 형성해 압전을 걸면 일시적으로 기판 표면이 뒤틀리는데, 이 작용을 이용해 물리적인 파를 일으키게 된다. 상기 SAW 소자 표면을 전달하는 물결 속도가 전자파보다 느리기 때문에 일시적으로 전기 신호를 지연시키거나 특정 주파수 신호만을 통과시키는 필터로 이용된다.In general, surface acoustic wave (SAW) devices form metal electrodes on highly insulating substrates, and when a piezoelectric is applied, the surface of the substrate is temporarily warped. This action causes a physical wave. Since the wave speed transmitting the SAW element surface is slower than the electromagnetic wave, it is used as a filter to temporarily delay an electric signal or pass only a specific frequency signal.

이러한, SAW 필터는 인터 디지털 트랜스듀어(interdigital transducer, 이하 IDT라고 함)가 입력단 및 출력단에 각각 설치되어 있어 입력단에서 압전 물체에 전기적 신호가 인가되면 이를 기계적 신호로 변환하고, 다시 출력단에서 이를 전기적 신호로 변환 출력하게 됨으로써 특정 주파수 대역은 통과시키고 나머지 주파수 대역은 저지시키게 된다.In the SAW filter, an interdigital transducer (hereinafter referred to as an IDT) is installed at an input terminal and an output terminal, respectively, and when an electrical signal is applied to the piezoelectric object at the input terminal, the SAW filter is converted into a mechanical signal, and then the electrical signal is output at the output terminal. By converting the output frequency into a specific frequency band, the remaining frequency band is blocked.

도 1 은 종래의 기술에 따른 SAW 필터 패키지 구조가 도시된 도면이다.1 is a view showing a structure of a SAW filter package according to the prior art.

종래의 기술에 의한 SAW 필터 패키지 구조는 도 1 에 도시된 바와 같이, 외부와 전기적으로 연결될 수 있도록 하는 복수개의 연결단자(11)가 형성된 패키지(10)와, 상기 패키지(10)내에 실장되어 외부로부터 입력되는 신호를 필터링하여 출력하는 SAW 필터(20)로 구성된다.As shown in FIG. 1, the SAW filter package structure according to the related art includes a package 10 in which a plurality of connection terminals 11 are formed to be electrically connected to the outside, and mounted in the package 10 to the outside. SAW filter 20 for filtering and outputting the signal input from the.

여기서, 상기 SAW 필터(20)는 상기 패키지(10)내에 설치되어 신호가 전달될 수 있도록 하는 압전체 기판(21)과, 상기 압전체 기판(21)에 패턴으로 형성되어 입력되는 신호를 필터링 하여 출력하는 입력 및 출력 IDT(22, 23)와, 상기 입력 및 출력 IDT(22, 23)에서 발생되는 반사파를 흡수하도록 형성되는 흡수부(25a, 25b)와, 신호의 전달시 잡음이 제거되도록 하는 그라운드부(24)로 이루어진다.Here, the SAW filter 20 is installed in the package 10 to transmit a signal and the piezoelectric substrate 21 and the piezoelectric substrate 21 formed in a pattern to filter and output the input signal Input and output IDTs 22 and 23, absorbing portions 25a and 25b formed to absorb reflected waves generated by the input and output IDTs 22 and 23, and ground portions for removing noise during signal transmission. It consists of 24.

한편, 상기 입력 및 출력 IDT(22, 23)은 소정의 간격과 길이를 가지며 빗살무니로 이루어지는 입력 및 출력 핑거부(22a, 23a)와, 상기 입력 및 출력 핑거부(22a, 23a)의 양단에 필터링되는 신호와 나란한 방향으로 형성되는 입력 및 출력 신호버스바(signal bus bar)(22b, 22c)로 구성된다.On the other hand, the input and output IDTs 22 and 23 have predetermined intervals and lengths, and are provided at both ends of the input and output finger portions 22a and 23a and the input and output finger portions 22a and 23a. It consists of input and output signal bus bars 22b and 22c formed in parallel with the signal being filtered.

상기와 같은 구성된 SAW 필터(20)를 외부와 전기적으로 연결할 경우에는 상기 입입력 및 출력 신호버스바(signal bus bar)(22b, 23b)와 상기 복수개의 연결단자(11)를 와이어(40)를 통해 연결하게 된다.When the SAW filter 20 configured as described above is electrically connected to the outside, the input and output signal bus bars 22b and 23b and the plurality of connection terminals 11 are connected to the wire 40. Will be connected via

그러나, 상기와 같은 SAW 필터는 상기 입력 및 출력 IDT에 형성된 입력 및 출력 신호버스바를 반대측에 형성된 연결단자와 와이어를 통해 연결할 경우 상기 와이어가 상기 입력 및 출력 IDT와 걸쳐 연결되므로 상기 와이어와 상기 입력 및 출력 IDT 간에 커플링(Coupling) 현상이 발생하여 원하지 않는 신호성분이 발생되기 때문에 SAW 필터의 특성이 저하되어 결과적으로 SAW 필터의 성능이 저해되는 문제점이 있다.However, in the SAW filter as described above, when the input and output signal busbars formed on the input and output IDTs are connected through wires with connection terminals formed on opposite sides, the wires and the input and output IDTs are connected. Since coupling phenomenon occurs between output IDTs and unwanted signal components are generated, the characteristics of the SAW filter are deteriorated. As a result, the performance of the SAW filter is impaired.

본 발명은 상기한 종래 기술의 문제점을 해결하기 위하여 안출된 것으로서, 그 목적은 SAW 필터와 패키지에 형성된 연결단자를 와이어를 통해 전기적으로 연결할 경우 와이어가 입력 및 출력 IDT에 걸쳐 연결되지 않도록 하여 전기적이 간섭에 의한 커플링(Coupling)현상이 발생되는 것을 방지함으로써, SAW 필터의 특성 및 성능이 향상되는 SAW 필터 패키지 구조를 제공하는데 있다.The present invention has been made to solve the above-mentioned problems of the prior art, the object of the present invention is to prevent the wires from being connected across the input and output IDT when electrically connecting the connection terminal formed in the SAW filter and the package through the wire. The present invention provides a structure of a SAW filter package that prevents coupling from occurring due to interference, thereby improving SAW filter characteristics and performance.

도1 은 종래의 기술에 따른 표면탄성파 필터 패키지 구조가 도시된 도면,1 is a view showing a surface acoustic wave filter package structure according to the prior art;

도2 는 본 발명에 따른 표면탄성파 필터 패키지 구조가 도시된 도면이다.2 is a diagram illustrating a structure of a surface acoustic wave filter package according to the present invention.

<도면의 주요 부분에 관한 부호의 설명><Explanation of symbols on main parts of the drawings>

50: 패키지51: 연결단자50: Package 51: Connector

60: SAW 필터61: 압전체 기판60: SAW filter 61: piezoelectric substrate

62: 입력 IDT62a: 입력 핑거부62: input IDT62a: input finger portion

62b: 입력 신호버스바63: 출력 IDT62b: input signal busbar 63: output IDT

63a: 출력 핑거부63b: 출력 신호버스바63a: output finger portion 63b: output signal bus bar

65a, 65b: 흡수부70: 와이어65a, 65b: absorption part 70: wire

상기한 과제를 해결하기 위한 본 발명에 의한 SAW 필터 패키지 구조의 특징에 따르면, 패키지내에 설치되어 신호가 전달될 수 있도록 하는 압전체 기판과, 상기 압전체 기판에 패턴으로 형성되는 다수개의 신호버스바(signal bus bar) 및 상기 다수개의 신호버스바(signal bus bar)사이에 연결되는 핑거(finger)부로 이루어져 외부 신호를 필터링시키는 입력 및 출력 IDT를 포함하여 구성되는 표면탄성파 필터에 있어서, 상기 신호버스바(signal bus bar)는 상기 패키지에 형성되는 연결단자를 향해 절곡되어 와이어를 통해 연결된다.According to a feature of the SAW filter package structure according to the present invention for solving the above problems, a piezoelectric substrate that is installed in the package so that the signal can be transmitted, and a plurality of signal bus bars (signal) formed in a pattern on the piezoelectric substrate A surface acoustic wave filter comprising an input and an output IDT configured to filter an external signal by a finger unit connected between a plurality of signal bus bars and a plurality of signal bus bars. The signal bus bar is bent toward the connection terminal formed in the package and connected through a wire.

이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2 는 본 발명에 따른 SAW 필터 패키지 구조가 도시된 도면이다.2 is a diagram illustrating a SAW filter package structure according to the present invention.

본 발명에 의한 SAW 필터 패키지 구조는 도 2 에 도시된 바와 같이, 내부에 전자부품이 실장되는 패키지(50)와, 상기 패키지(50)내에 형성되어 상기 패키지(50)에 실장되는 전자부품이 외부와 전기적으로 연결될 수 있도록 하는 복수개의 연결단자(51)와, 상기 패키지(50)에 설치되는 압전체 기판(61) 및 입력 및 출력 IDT(62, 63)으로 이루어진 SAW 필터(60)를 포함하여 구성된다.As shown in FIG. 2, the SAW filter package structure according to the present invention includes a package 50 in which electronic components are mounted therein, and an electronic component formed in the package 50 and mounted in the package 50. And a plurality of connection terminals 51 to be electrically connected to each other, a SAW filter 60 including a piezoelectric substrate 61 installed in the package 50 and input and output IDTs 62 and 63. do.

또한, 상기 입력 및 출력 IDT(62, 63)은 각각 빗살무늬로 형성되는 입력 및 출력 핑거부(62a, 63a)와 상기 입력 및 출력 핑거부(62a, 63a)의 양단에 신호가 전달되는 방향과 나란하게 입력 및 출력 신호버스바(signal bus bar)(62b, 63b)가 형성되는데, 상기 입력 및 출력 전극부(62b, 63b)는 일측이 절곡되어 형성된다.In addition, the input and output IDTs 62 and 63 may include a direction in which signals are transmitted to both ends of the input and output finger parts 62a and 63a and the input and output finger parts 62a and 63a respectively formed in a comb pattern. Input and output signal bus bars 62b and 63b are formed side by side, and the input and output electrode portions 62b and 63b are formed by bending one side thereof.

다시 말해서, 입력 및 출력 신호버스바(signal bus bar)(62b, 63b)와 인접한 위치에 있는 연결단자(51)와 와이어(70)를 통해 연결할 경우에는 상기 와이어(70)가 상기 입력 및 출력 IDT(62, 63)와 겹치지 않게 되나, 상기 입력 및 출력 신호버스바(signal bus bar)(62b, 63b)의 인접하지 않은 연결단자(51)와 와이어(70)를 통해 연결할 경우 상기 입력 및 출력 IDT(62, 63)와 상기 와이어(70)가 겹치게 되므로 상기 입력 및 출력 신호버스바(signal bus bar)(62b, 63b)의 일측을 해당 연결단자(51)를 향해 절곡시켜 와이어(70)를 통해 연결함으로써, 상기 와이어(70)가 상기 입력 및 출력 IDT(62, 63)와 겹쳐지는 것이 방지되기 때문에 상기 입력 및 출력 IDT(62, 63)와 상기 와이어(70)사이에 발생되는 커플링(Coupling)현상을 사전에 방지할 수 있게 되는 것이다.In other words, the wire 70 is connected to the input and output IDT when connecting through the wire 70 and the connection terminal 51 which are adjacent to the input and output signal bus bars 62b and 63b. The input and output IDTs are not overlapped with the terminals 62 and 63, but are connected to the non-adjacent connection terminals 51 of the input and output signal bus bars 62b and 63b through a wire 70. Since the wires 62 and 63 overlap, the one side of the input and output signal bus bars 62b and 63b is bent toward the corresponding connection terminal 51 through the wire 70. Coupling generated between the input and output IDTs 62 and 63 and the wire 70 because the wire 70 is prevented from overlapping with the input and output IDTs 62 and 63 by connecting. The phenomenon can be prevented in advance.

한편, 상기 SAW 필터 패키지는 상기 입력 및 출력 IDT(62, 63)에서 발생되는 반사파를 흡수하는 흡수부(65a, 65b)와, 상기 입력 IDT(62)에서 상기 출력 IDT(63)로 신호가 전달될 경우 잡음이 제거될 수 있도록 하는 그라운드부(64)를 더 포함한다.Meanwhile, the SAW filter package includes absorbers 65a and 65b that absorb reflected waves generated by the input and output IDTs 62 and 63, and a signal is transmitted from the input IDT 62 to the output IDT 63. It further comprises a ground portion 64 to allow noise to be removed if possible.

여기서, 상기 입력 및 출력 전극부(62b, 63b)와 상기 복수개의 연결단자(51)를 와이어(70)를 통해 연결할 경우 상기 입력 및 출력 전극부(62b, 63b)가 절곡되어 형성되므로 상기 와이어(70)가 상기 입력 및 출력 IDT(62, 63)에 걸쳐서 연결되지 않게 된다.In this case, when the input and output electrode portions 62b and 63b and the plurality of connection terminals 51 are connected through a wire 70, the input and output electrode portions 62b and 63b are bent to form the wire ( 70 is not connected across the input and output IDTs 62, 63.

상기와 같은 SAW 필터 패키지는 외부로부터 상기 와이어(70)를 통해 입력되는 전기적 신호가 상기 입력 IDT(62)에 의해 기계적 신호로 변환되고, 상기 출력 IDT(63)를 통해 상기 기계적 신호가 전기적 신호로 변환되어 출력되게 된다.In the SAW filter package as described above, an electrical signal input from the outside through the wire 70 is converted into a mechanical signal by the input IDT 62, and the mechanical signal is converted into an electrical signal through the output IDT 63. The output will be converted.

이때, 상기 입력 및 출력 IDT(62, 63)에서 입력 및 출력 신호버스바(signal bus bar)(62b, 63b)의 일측을 절곡되게 형성함으로써, 상기 입력 및 출력 IDT(21, 22)와 와이어(70)간에 커플링(Coupling) 현상이 발생되는 것을 방지하게 된다.In this case, one side of the input and output signal bus bars 62b and 63b is bent from the input and output IDTs 62 and 63, thereby forming the input and output IDTs 21 and 22 and the wire ( Coupling phenomenon is prevented from occurring between the 70).

결국, 본 발명에 따른 SAW 필터 패키지는 SAW 필터와 패키지에 형성되는 다수개의 연결단자사이에 연결되는 와이어가 상기 SAW 필터에 걸쳐 연결되는 것이 방지되고, 이로 인해 상기 입력 및 출력 IDT(62, 63)와 상기 와이어(70)사이에 발생되는 커플링(Coupling)현상으로 인한 SAW 필터의 특성 및 성능저하가 방지되는 것이다.As a result, the SAW filter package according to the present invention prevents the wires connected between the SAW filter and the plurality of connection terminals formed in the package from being connected across the SAW filter, thereby preventing the input and output IDTs 62 and 63 from being connected. Deterioration of characteristics and performance of the SAW filter due to a coupling phenomenon generated between the wire 70 and the wire 70 is prevented.

상기와 같이 구성되는 본 발명의 SAW 필터 패키지는표면탄성파 필터를 외부와 와이어를 통해 전기적으로 연결할 경우 와이어와 입출력 IDT가 겹쳐지게 형성되어 커플링(Coupling) 현상이 발생되는 것이 방지되도록 상기 입력 및 출력 IDT의 일측을 절곡되게 형성함으로써, 와이어와 입력 및 출력 IDT간에 발생되는커플링(Coupling) 현상에 의한 간섭을 사전에 방지할 수 있기 때문에 SAW 필터의 특성 및 성능이 향상될 수 있는 효과가 있다.In the SAW filter package of the present invention configured as described above, when the surface acoustic wave filter is electrically connected to the outside through a wire, the input and output are formed so that the coupling phenomenon is prevented from occurring because the wire and the input / output IDT overlap each other. By forming one side of the IDT bent, the interference due to the coupling phenomenon between the wire and the input and output IDT can be prevented in advance, so that the characteristics and performance of the SAW filter can be improved.

Claims (1)

패키지내에 설치되어 신호가 전달될 수 있도록 하는 압전체 기판과; 상기 압전체 기판에 패턴으로 형성되는 다수개의 신호버스바(signal bus bar) 및 상기 다수개의 신호버스바(signal bus bar)사이에 연결되는 핑거(finger)부로 이루어져 외부 신호를 필터링시키는 입력 및 출력 인터디지털 트랜스듀서(InterDigital Transducer, 이하 IDT라 함)를 포함하여 구성되는 표면탄성파 필터 패키지 구조에 있어서,A piezoelectric substrate installed in the package to transmit a signal; Input and output interdigital for filtering external signals by consisting of a plurality of signal bus bars formed in a pattern on the piezoelectric substrate and a finger portion connected between the plurality of signal bus bars. In the surface acoustic wave filter package structure including a transducer (InterDigital Transducer, hereinafter referred to as IDT), 상기 신호버스바(signal bus bar)는 상기 패키지에 형성되는 연결단자를 향해 절곡되어 와이어를 통해 연결되는 것을 특징으로 하는 표면탄성파 필터 패키지 구조.The signal bus bar (signal bus bar) is a surface acoustic wave filter package structure, characterized in that bent toward the connection terminal formed in the package is connected via a wire.
KR1020020026859A 2002-05-15 2002-05-15 Surface acoustic filter package structure KR20030088992A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8742645B2 (en) 2009-09-22 2014-06-03 Samsung Electronics Co., Ltd. Surface acoustic wave sensor system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8742645B2 (en) 2009-09-22 2014-06-03 Samsung Electronics Co., Ltd. Surface acoustic wave sensor system

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