KR20030082741A - Structure for PAD of Plasma Display Panel and method for protecting PAD - Google Patents

Abstract

PURPOSE: A structure of a pad of a plasma display panel and a method for protecting a pad are provided to prevent the short circuit between electrode pads by forming an inorganic coating layer on an electrode pad portion. CONSTITUTION: A structure of a pad of a plasma display panel includes an electrode pad portion(100'), a signal apply portion, a sealing member(200), and an inorganic layer(300). The electrode pad portion(100') is formed on the outside of a display region of a plasma display panel. The signal apply portion is adhered to an end portion of the electrode pad portion(100') in order to apply a signal to an electrode pad(100). The sealing member(200) is formed on the predetermined region of the display region. The organic layer(300) is used for coating the electrode pad portion(100').

Description

Pad structure and pad protection method of plasma display panel {Structure for PAD of Plasma Display Panel and method for protecting PAD}

The present invention relates to a pad structure and a pad protection method of a plasma display panel.

Plasma display panels and liquid crystal displays (LCDs) are spotlighted as next generation display devices with the highest practicality among flat panel display devices. In particular, the plasma display panel has a higher luminance and wider viewing angle than a liquid crystal display device, and thus has wide applicability as a large, thin display such as an outdoor advertising tower, a wall display TV, or a theater display. Unlike the CRT CRT, the plasma display panel displays a screen by discharge of each discharge cell.

In the typical three-electrode surface discharge plasma display panel, as shown in FIG. 1A, the upper substrate 10 and the lower substrate 20 installed to face each other are bonded to each other.

FIG. 1B illustrates a cross-sectional structure of the plasma display panel illustrated in FIG. 1A, and the lower substrate 20 is rotated 90 ° for convenience of description.

The upper substrate 10 is composed of a pair of sustain electrodes 16 and 17, a dielectric layer 11 applying the sustain electrodes 16 and 17, and a protective film 12. The lower substrate 20 is formed of an address. It consists of the electrode 22, the partition 23 formed between the address electrodes 22, and the fluorescent substance 24 formed around the address electrode 22. As shown in FIG. The space between the upper substrate 10 and the lower substrate 20 is filled with an inert gas to form a discharge region.

In such a structure, when a driving voltage is applied between the pair of upper electrodes 16 and 17, surface discharge occurs in the discharge region on the surface of the dielectric layer 11 and the passivation layer 12 to generate ultraviolet rays. The phosphor 24 is excited by the ultraviolet rays, and color display is performed by the emitted phosphor 24.

That is, while the electrons inside the discharge cell accelerate to the cathode (-) by the applied driving voltage, helium (He) is filled with the inert mixed gas filled with the pressure of about 400 to 500 torr in the discharge cell. As the main component, it collides with a Penning mixed gas to which xenon (Xe), neon (Ne) gas, etc. are added, and the inert gas is excited to generate ultraviolet rays having a wavelength of 147 nm. The ultraviolet rays collide with the phosphor 24 surrounding the lower electrode 22 and the partition 23 to emit light in the visible region.

In addition, as shown in FIG. 2, the electrode pad part 22 ′ is formed at the end of the sustain electrode and the address electrode 22 to receive a signal from an external driving circuit.

As illustrated in FIG. 2, the electrode pad part 22 ′ is formed outside the display area of the plasma display panel, that is, outside the sealing material 30. In general, the electrode pad part 22 'is made of a metal having a very low resistance, such as silver (Ag).

The electrode pad part 22 ′ and the driving circuit of the plasma display panel are connected by a flexible printed circuit (FPC) to apply a signal to the sustain electrodes 16 and 17 and the address electrode 22.

Looking at the structure of the plasma display panel, the electrode pad portion 22 'of the lower substrate 20 of the plasma display panel is exposed to the outside for connection with an external circuit, and the electrode pad portion 22' is an electrode extended portion. It is formed in the pad portion and is mainly formed of silver (Ag).

Since the electrode pad part 22 ′ is exposed to external air, the electrode becomes unstable by reaction with external air when the plasma display panel is operated.

For example, the reaction mechanism between the electrode pad part 22 'and the external air causes silver ionization-external air inflow-potential difference-electrolytic movement-deposition of silver-electrode short.

That is, since the distance between the electrode pads made of silver is small, when a voltage is applied to the pads when the panel is driven, an electric field is applied due to a potential difference between the pads. Oxidation reaction), resulting in electrolytic migration.

As a result, ions combined with silver bind to the pads, and ions cause a reduction reaction with the pads, thereby causing silver to precipitate on the pads. If this phenomenon is repeated, gaps between adjacent pads gradually decrease and short-circuiting of electrodes occurs.

That is, the electrode pad part 22 'is often exposed to the atmosphere during the manufacturing process, and there is a problem in that the portion sealed with silicon after FPC bonding is poor.

Therefore, the electrode pad portion 22 'made of silver (Ag) reacts with moisture (H ₂ O) in the air, and there is a possibility that the electrode pad portion 22' is short-circuited as shown in FIG.

In FIG. 3, reference numeral 22 ″ shows that silver migration occurs due to reaction of silver with moisture.

When silver migration occurs, the electrode pad portions 22 'of the electrodes of the plasma display panel are short-circuited with each other. Therefore, when such silver (Ag) reacts with moisture, the plasma display panel may be broken.

The electrode pad structure of the conventional plasma display panel has a problem in that a short circuit occurs between electrode pads adjacent to each other due to a movement phenomenon caused by the electrode pad formed of silver (Ag) reacting with moisture in the air.

Accordingly, an object of the present invention is to solve the problem of preventing the inflow of external air completely, thereby increasing the safety of the plasma display panel product.

1A is a perspective view showing a schematic structure of a typical plasma display panel.

1B is a cross-sectional view showing a discharge cell of the plasma display panel.

2 is a plan view showing a conventional plasma display panel electrode structure.

3 is a view showing that adjacent pads are short-circuited due to silver migration in the electrode structure shown in FIG.

Figure 4 is a plan view of the protective structure of the electrode pad of the plasma display panel according to the present invention.

Fig. 5 is a cross-sectional view showing a process for protecting an electrode pad of a plasma display panel according to the present invention, respectively, according to the present invention.

* Explanation of symbols for main parts of the drawings

10: upper substrate 20: lower substrate

25 mask 100 electrode wiring

100: electrode pad 200: sealing material (SEAL)

300: inorganic layer 400: signal applying means

The pad structure of the plasma display panel according to the present invention for achieving the above object is characterized in that, in the plasma display panel, an electrode pad unit formed on the outside of the display area of the plasma display panel; Signal applying means attached to an end of the electrode pad part and applying a signal to the electrode pad; An encapsulant formed on a predetermined area outside the display area; It is configured to include an inorganic material layer formed to apply the electrode pad portion.

The inorganic layer is made of any one of SiO ₂ , TiO ₂ , the electrode pad portion is composed of silver (Ag), the signal applying means is made of a film-type element having a wiring for connection with an external drive part, The FPC is used as the film type device.

A feature of the pad protection method of the plasma display panel according to the present invention for achieving the above object is in the manufacture of a plasma display panel having an electrode pad portion for applying an electrical signal to the electrode by a signal applying means, the plasma display panel Forming a sealing material outside the display area of the panel; Forming an inorganic layer to cover the electrode pad portion formed outside the display area of the plasma display panel; And a third step of adhering the signal applying means to an end of the electrode pad portion to conduct the electrode pad portion and the signal applying means.

The second step is to form an inorganic layer by applying a liquid inorganic material to dry / heat treatment, or to form a mask on the upper plate of the plasma display panel, and to form an inorganic material layer by sputtering method, the coating The thickness of the inorganic layer is 0.5 to 5㎛ to facilitate the conduction of the signal applying means and the electrode pad to the external electrode connected to the signal applying means to apply a signal to the electrode pad.

The action according to the characteristics of the present invention is to form a dense inorganic coating layer (SiO ₂ , TiO ₂ ) does not have a coating material on the electrode electrode electrode pad silver electrode to prevent the inflow of external air to remove the instability of the electrode

Other objects, features and advantages of the present invention will become apparent from the following detailed description of embodiments taken in conjunction with the accompanying drawings.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of a pad structure and a pad protection method of a plasma display panel according to the present invention will be described with reference to the accompanying drawings.

4 is a plan view showing a protective structure of an electrode pad of the plasma display panel according to the present invention.

As shown in FIG. 4, an electrode pad part 100 ′ formed outside the display area C of the plasma display panel and an end of the electrode pad part 100 ′ are bonded to the electrode pad part 100 ′. Applying a signal applying means 400 for applying a signal to the outer surface of the display area (C), the sealing member 200 formed to cross the upper side of the electrode 100, and to apply the electrode pad portion (100 ') It is configured to include the inorganic layer 300 formed.

The electrode pad part 100 ′ is formed outside the display area of the plasma display panel. The electrode pad portion 100 'is formed at each end of the address electrode wiring and the sustain electrode wiring of the plasma display panel, and is made of a low resistance metal. The electrode pad part 100 ′ is preferably made of silver (Ag) having a lower cost than gold (Au) as a low resistance metal.

The signal applying means 400 is adhered to the end of the electrode pad part 100 'and applies a signal to the electrode pad part 100'. The signal applying means 400 is connected to a substrate on which an external driving circuit is installed, that is, a printed circuit board (PCB) to receive a signal.

The signal applying means 400 is contacted with each electrode of the electrode pad part 100 'by a tape automated bonding and has a film type device (COF, FPC, etc.) having wiring for connection with a driving part (not shown). TCP, etc.)

The inorganic layer 300 is made of any one of SiO ₂ , TiO ₂ , the inorganic layer 300 is the electrode pad portion 100 except for the end of the electrode pad portion 100 ′ to which the signal applying means 400 is bonded. ') Is formed to apply the whole.

5 is a cross-sectional view illustrating a process of protecting an electrode pad of a plasma display panel according to an embodiment of the present invention, in which the inorganic layer 300 as shown in FIG. 4 is formed.

Forming a dense inorganic layer 300 to suppress the inflow of external air is possible by the following method.

First, Figure 5 in the front uses a particulate inorganic sol.

The method may include forming a sealing member 200 outside the display area C of the plasma display panel to bond the plasma display panel to prevent the introduction of external air into the display area C of the panel. In order to cover the electrode pad portion 100 ′ formed outside the display area C, liquid inorganic material is coated and dried / heated to form the inorganic material layer 300.

In the case of using an inorganic sol having a size of several nanometers, a dense film sufficient to block the silver electrode 100 from the outside is formed when the liquid is applied to the electrode pad part 100 'in a liquid state and subjected to drying / heat treatment.

And adhering a signal applying means (not shown) to an end of the electrode pad part 100 'to conduct the electrode pad part 100' and the signal applying means.

This is a bonding process necessary for connecting with an external electrode, and in this case, the inorganic layer 300 has a coating thickness of about 0.5 to 5 μm in order to conduct the signal applying means and the electrode pad part 100 ′.

In the case of heat treatment using the inorganic sol of the fine particles, a dense film can be formed even at a heat treatment temperature lower than the temperature at which the upper and lower substrates 10 and 20 of the plasma display panel are bonded.

And, Figure 2 is to use the inorganic coating method by the sputtering method.

The method may include forming a sealing member 200 outside the display area C of the plasma display panel to bond the plasma display panel to prevent the introduction of external air into the display area C of the panel. Forming an inorganic layer 300 by sputtering to cover the electrode pad portion 100 ′ formed outside the display area C.

In order to obtain the dense inorganic layer 300, the plasma display panel portion is covered by the mask 25 in a vacuum state in the sputtering chamber and coated on the electrode pad part 100 ′ to form the dense inorganic layer 300.

This is a bonding process necessary for connecting with an external electrode, and in this case, the inorganic layer 300 has a coating thickness of about 0.5 to 5 μm in order to conduct the signal applying means and the electrode pad part 100 ′.

If the sputtering method is used, no heat treatment is required, and the inorganic layer 300 is very dense so that the silver electrode pad part can be protected from external air even with a thin coating.

As described above, the pad structure and the pad protection method of the plasma display panel according to the present invention have the following effects.

By introducing the inorganic coating film into the electrode pad portion of the plasma display panel, the electrode pad portion can prevent the reaction with external air or foreign substances, it is possible to control various phenomena such as short circuit of the pad by protecting from moisture in the air, Thus, stable driving of the plasma display panel is ensured.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the spirit of the present invention.

Therefore, the technical scope of the present invention should not be limited to the contents described in the embodiments, but should be defined by the claims.

Claims (9)

In the plasma display panel, An electrode pad unit formed outside the display area of the plasma display panel; Signal applying means attached to an end of the electrode pad part and applying a signal to the electrode pad; An encapsulant formed at an outer predetermined area of the display area; And an inorganic layer formed to apply the electrode pad part. The pad structure of claim 1, wherein the inorganic layer comprises one of SiO ₂ and TiO ₂ . The pad structure of a plasma display panel according to claim 1, wherein the electrode pad part is made of silver (Ag). 2. The pad structure of a plasma display panel according to claim 1, wherein the signal applying means is made of a film type element having wiring for connection with an external driving part. The pad structure of claim 4, wherein the film type device is an FPC. In the manufacture of a plasma display panel having an electrode pad portion for applying an electrical signal to an electrode by signal applying means, Forming a sealing material outside the display area of the plasma display panel; Forming an inorganic layer to cover the electrode pad portion formed outside the display area of the plasma display panel; And attaching the signal applying means to an end of the electrode pad portion to conduct the electrode pad portion and the signal applying means. 7. The pad protecting method of claim 6, wherein the second step is to form an inorganic layer by applying a liquid inorganic material and drying / heat treatment. The method of claim 6, wherein the second step includes forming a mask on the upper plate of the plasma display panel and forming an inorganic layer by sputtering. The method of claim 6, wherein the thickness of the inorganic layer is about 0.5 μm to about 5 μm.