KR20030078990A - Semiconductor device loading apparatus of test handler - Google Patents

Abstract

PURPOSE: A semiconductor device loading apparatus of a test handler is provided to be capable of accurately guiding a semiconductor device to a pocket portion of a test tray by using a plurality of guide block fixing plates. CONSTITUTION: A semiconductor device loading apparatus(50) of a test handler is provided with the first and second pick-up part(61,62) including a plurality of pick-up cylinders(63) for adsorbing and transferring test object semiconductor devices by using vacuum force and the first and second guide block fixing plate(71,72) for accurately guiding the semiconductor devices adsorbed and transferred by the pick-up cylinders of the pick-up parts, to a pocket portion of a test tray. Preferably, the first pick-up part is capable of moving up and down and the second pick-up part is capable of moving in all directions.

Description

Semiconductor Device Loading Apparatus of Test Handler}

The present invention relates to a test handler for testing a semiconductor device, and more particularly, to a semiconductor device loading apparatus of a test handler to accurately transfer semiconductor devices loaded on a user tray to each pocket of the test tray.

A test handler for testing a semiconductor device is a device for testing a semiconductor device (hereinafter referred to as a device) completed through a predetermined manufacturing process and classifying and classifying devices according to test results.

The test handler which performs this function is equipped with a semiconductor device loading device for vacuum suctioning and loading a plurality of devices placed on the user tray of the presizing unit by a pick and place operation to increase the test efficiency. The present applicant has applied for a test handler for a semiconductor device equipped with such a device loading device (Application No. 10-1997-0012445) and received a patent registration (Registration No. 10-0243049).

1 and 2 illustrate a conventional semiconductor device loading apparatus (hereinafter referred to as a 'device loading apparatus') disclosed in Korean Patent Publication No. 0243049. As shown in the drawing, the conventional device loading apparatus 100 is moved to the XY axis by the guider 103 and the connecting member 106 moving along the guide rail 102 installed on the X-axis support 101. It is possible.

The frame member 104 and the lifting cylinder 107 for driving the frame member 104 are provided below the connecting member 106.

The lower portion of the frame member 104 is inserted into a pinhole 110d formed in each pocket 10a (see FIG. 3) of the test tray 110, so that the pickup cylinder 112 and the vacuum adsorber 111, which will be described later, are provided in the test tray. A guide pin fixing plate 130 is provided with a plurality of guide pins 131 attached to the corresponding pocket 110a of the 110.

The upper portion of the pickup cylinder 112 is connected to a zigzag-shaped deployment member 121 composed of a plurality of links 119, which deployment member 121 is operated by the expansion and contraction cylinder 122.

3 illustrates a structure of a test tray 110 in which a device 109 sucked by the device loading apparatus 100 is loaded. As shown in the drawing, the test tray 110 includes a pocket 110a in which the device 109 is placed, and a frame 110b formed so that the pocket 110a is coupled to form a plurality of columns and rows. Each pocket 110a is loosely screwed to allow a slight left and right clearance on the surface of the frame 110b, and on both sides in the longitudinal direction of the pocket 110a, the device 109 is mounted when the device 109 is loaded. A pinhole 110d is provided to allow corresponding guide pins 131 of the device loading apparatus 100 to be inserted into the pocket 110a. The sheet portion 110c formed on the bottom surface of the pocket 110a has a size substantially the same as that of the device 109.

In the device loading apparatus 100 and the test tray 110 configured as described above, the device loading apparatus 100 is to accurately position the devices to be tested in the pockets 110a of the test tray 110. The operation of the device loading apparatus 100 will be described with reference to FIG. 4.

First, the device loading apparatus 100 moves upward of the test tray 110 in a state where the devices 109 in the user tray (not shown) are adsorbed by the vacuum adsorber 111. Here, the user tray (not shown) is for supplying a plurality of loaded devices to the test tray 110 through the device loading apparatus 100, and because the width of the left and right and front and rear than the test tray 110 is smaller, In order to transfer the devices placed on the user tray to the test tray 110, the transfer operation must be performed after the pick-up cylinders 112 have been adjusted in front, rear, left, and right widths.

Next, the device loading apparatus 100 moves downward to approach the test tray 110, so that a plurality of guide pins 131 disposed at the bottom of the device loading apparatus 100 are placed in the pocket 110a of the test tray 110. It is inserted into the corresponding pinholes (110d) provided. When the suction force acting on the device 109 is removed from each pickup cylinder 112 in this state, the device 109 is separated from the vacuum absorber 111 and the seat portion 110c of the pocket 110a of the test tray 110 is removed. Is transferred to.

However, as can be seen from the above, the device loading apparatus 100 according to the prior art pockets 110a of the test tray 110 through the guide pin 131 the device 109 adsorbed by the vacuum adsorber 111 There is a disadvantage in that it cannot be positioned accurately at).

That is, in the conventional device loading apparatus 100, the guide pin 131 attached to the guide pin fixing plate 130 is adsorbed to the vacuum adsorber 111 in a state where the guide pin 131 is fixed to the pinhole 110d of the test tray 110. Although the device 109 is transferred to the pocket 110a of the test tray 110, the pocket 110a of the test tray 110 positioned below the device 109 attached to the vacuum absorber 111 is spaced apart at a predetermined interval. Since the dropping process is performed without any guidance, the device 109 may be placed at an angle without being accurately seated in the seat portion 110c of the pocket 110a, so that the test of the device may be precisely performed. It will not be done.

This incorrectly seated device is classified as an error or defective product in the test process and is excluded from the genuine product, which prevents accurate testing of the test handler and results in an increase of the defective rate.

The present invention is to solve the above-mentioned problems of the prior art, an object of the present invention is to provide a device loading device of the test handler having a guide block fixing plate that can guide the device to be accurately placed in the pocket of the test tray will be.

1 is a perspective view showing a semiconductor device loading apparatus of a test handler according to the prior art.

FIG. 2 is a front view of the conventional semiconductor device loading apparatus shown in FIG. 1.

3 is a plan view of a test tray in which semiconductor devices are loaded by a semiconductor device loading apparatus.

4 is a partial cross-sectional view illustrating a process of loading a semiconductor device into a test tray by a conventional semiconductor device loading apparatus.

5 is a perspective view showing a semiconductor device loading apparatus of the test handler according to the present invention.

FIG. 6 is a front view illustrating a state in which the semiconductor device loading apparatus of FIG. 5 is adjusted at intervals for picking up a device from a user tray.

FIG. 7 is a front view illustrating a state in which the semiconductor device loading apparatus of FIG. 5 is adjusted at intervals for loading a device into a test tray.

FIG. 8 is a partial cross-sectional view of the semiconductor device loading apparatus according to the present invention, illustrating a process in which the pickup cylinder and the guide block fixing plate move to the test tray to load the device into the test tray.

9 is a partial cross-sectional view of the semiconductor device loading apparatus according to the present invention, illustrating a process in which a device attached to a pickup cylinder is guided to a pocket of a test tray by a device guide block while the guide block fixing plate is coupled to the test tray. It is.

* Description of symbols on the main parts of the drawings *

50: semiconductor device loading device 51: frame

61: first pickup device 62: second pickup device

63: pickup cylinder 64: vacuum adsorber

71: first guide block fixing plate

72: second guide block fixing plate

75: device guide block 77,78: guide inclined plate

110: test tray 110a: pocket

In order to achieve the above object, the present invention provides a semiconductor device loading apparatus of a test handler for picking up semiconductor devices placed in a user tray and placing the semiconductor devices in pockets of a test tray.

The semiconductor device loading apparatus includes a plurality of pickup devices including a plurality of pickup cylinders for vacuum suction and transport of semiconductor devices for testing, and semiconductor devices adsorbed by the pickup cylinders of the plurality of pickup devices. It characterized in that it comprises a plurality of guide block fixing plate for guiding to be accurately placed in the pockets.

The plurality of pick-up devices are constituted by a pair of first pick-up devices and second pick-up devices arranged in a line with each other, and the first pick-up devices are installed to be movable in Shanghai, and the second pick-up devices are left and right. And Shanghai-dong.

Similarly, the plurality of guide block fixing plates are formed of a pair of first and second guide block fixing plates arranged in line with each other so as to correspond to the first and second pick-up devices. The fixing plate is installed at the lower side of the first pick-up apparatus so as to be movable left and right, and the movable plate is fixed at the bottom of the second pick-up apparatus.

Preferably, each pick-up device is formed by arranging eight pick-up cylinders in a row, and each of the guide block fixing plates corresponding to each of the pick-up cylinders has eight openings in a row to correspond to each of the pick-up cylinders. Be sure to insert the device guide block to guide accurately.

Hereinafter, an embodiment of a semiconductor device loading apparatus of a test handler according to the present invention will be described with reference to the accompanying drawings.

The test handler including the device loading apparatus according to the present invention includes a presizing unit, a pitch fixing hand, a test tray, a preheating chamber and a recovery chamber, a device unloading unit, and the like, to test completed semiconductor devices. The device loading apparatus of the device simultaneously picks up and loads the devices placed in the plurality of user trays of the presizing unit in the test tray and simultaneously moves the tested devices to the device unloading unit. The configuration and operation of the device loading apparatus according to the present invention will be described in detail with reference to FIGS. 8 to 9.

5 is a perspective view showing a semiconductor device loading apparatus of the test handler according to the present invention. As shown therein, the semiconductor device loading apparatus 50 of the present invention has a working area from the presizing unit (not shown) to the device unloading unit (not shown) in the test handler in the front-rear direction and the left-right direction. With the robot provided to be movable, the device loading device 50 is arranged on the frame 51 and left and right inside the frame 51 so as to transfer the devices 109 to the first and second pick-up devices 61. 62, and under each pick-up device 61, 62, the first and second devices 109 to be accurately guided to each pocket 110a (see FIG. 3) of the test tray 110; And a second guide block fixing plate (71) (72).

The first and second pick-up devices 61 and 62 each include a plurality of pick-up cylinders 63 arranged in the longitudinal direction, and a vacuum adsorber attached to the lower portions of the pick-up cylinders 63 to adsorb the device 109 ( 64) (refer to FIG. 8), and the movable copper is installed inside the frame 51 by the motor 52 installed on one side of the frame 51. In addition, the first pick-up device 61 is fixedly installed so as not to move left and right inside the frame 51, while the second pick-up device 62 is installed to move left and right inside the frame 51. do.

The first guide block fixing plate 71 is installed to move left and right and move vertically below the first pickup device 61 so as to correspond to the first pickup device 61. That is, for moving the first guide block fixing plate 71, an air cylinder 81 for horizontal movement is fixed to the upper part of the frame 51, and one bracket 82 is attached to the upper part of the frame 51. The horizontal movement LM (Linear Motion) guide 83 which connects the horizontal movement air cylinder 81 and the bracket 82 is coupled to the left and right movements and is arranged to extend downward, and drives the horizontal movement air cylinder 81. It is arrange | positioned so that it may move to the left-right direction with the bracket 82 by this.

The lower end of the bracket 82 is coupled to the first lifting air cylinder 84 for moving the first guide block fixing plate 71 in the vertical direction, one side of the first lifting air cylinder 84 The first lifting and lowering LM guide 85 is installed in the air cylinder 84 so as to be movable in the vertical direction.

Therefore, the first guide block fixing plate 71 is attached to the lower portion of the `` L '' shaped LM guide 85 and is moved in the left and right directions by driving the horizontal moving air cylinder 81 and the first lifting air cylinder 84. It will be movable in the vertical direction.

The first guide block fixing plate 71 has the same number of openings 73 as the number of pick-up cylinders 63 of the first pick-up apparatus 61, and the devices described later in the openings 73 are described below. The guide block 75 (see FIG. 8) is detachably disposed so that the device 109 can be accurately seated in the pocket 110a of the test tray 110.

The pickup cylinder 63 and the device guide block 75 may be a number corresponding to the number of the pockets 110a of the test tray 110. In the present invention, the pickup cylinders 63 and the device guide blocks 75 are eight.

The second guide block fixing plate 72 is installed to be movable up and down while being fixed so as not to move left and right under the second pick-up device 62 installed on the frame 51 so as to move left and right.

In order to move the second guide block fixing plate 72 up and down, one bracket 86 is coupled to the upper portion of the frame 51 and extended downward, and the second guide block is disposed at the lower end of the bracket 86. A second lifting air cylinder 87 for moving the fixed plate 72 in the vertical direction is coupled, and one side of the second lifting air cylinder 87 is vertically moved by the air cylinder 87. A second lifting LM guide 88 movably coupled thereto is installed.

Therefore, the second guide block fixing plate 72 is attached to the lower portion of the LM guide 88 of the "L" shape is to be movable in the vertical direction by the driving of the second lifting air cylinder 87.

Eight openings 73 are formed in the second guide block fixing plate 72 to detachably couple the device guide block 75 to be described later, and the device 109 together with the first guide block fixing plate 71. ) Are correctly seated in the pockets 110a of the test tray 110.

Here, when the above-described horizontal movement air cylinder 81 and the first and second lifting air cylinders 84 and 87 are installed in the same manner in the rear of FIG. 5, the first and second guide block fixing plates 71 are provided. 72 may move smoothly.

6 and 7 respectively show a state in which the device loading apparatus 50 of the present invention configured as described above is spaced apart so as to pick up devices 109 from a user tray (not shown) and transfer them to the test tray 110. It is.

As shown in FIG. 6, in order to pick up the devices 109 from the user tray, first, the pick-up cylinders 630 of the first and second pick-up devices 61 and 62 have an interval equal to that of the devices placed on the user tray. The second pick-up device 62 is moved to the left to adjust the gap so as to be smaller than the gap between the plurality of columns and rows of the test tray 110 (see FIG. 3). The first guide block fixing plate 71, which can move left and right in this position, does not cover the lower side of the first pickup device 61, and the second pickup device 62 also has a second guide. Moving downward from the block fixing plate 72 is free.

Next, the first and second pick-up devices 61 and 62 are moved downward to suction the devices in the user tray by the operation of the pick-up cylinders 63 and the vacuum adsorber 64 to the original position. Will move upward.

Next, as shown in FIG. 7, to ensure that the spacing between the first and second pick-up devices 61, 62 is equal to the spacing of each row of the test tray 110, and each of the first and second In order to place the first and second guide block fixing plates 71 and 72 directly under the pick-up devices 61 and 62, the second pick-up device 62 is moved to the right to the second guide block. The LM guide 83 and the bracket 82 for horizontal movement are moved to the right by being disposed below the fixed plate 72 and driven by the horizontal guide air cylinder 81 for the first guide block fixing plate 71. As a result, it is placed under the first pickup device 61.

Here, although not described, a pitch adjusting plate (not shown) is disposed on the side surfaces of the first and second pickup devices 61 and 62 to adjust the pitch in the front and rear directions of the pickup cylinders 63.

As described above, the devices 109 are adsorbed to the vacuum adsorber 64 of the first and second pick-up devices 61 and 62, and the first and second pick-up devices 61 and 62 and the first and second pick-up devices. Openings 73 of the pick-up cylinders 63 and the guide block fixing plates 71 and 72 with the guide block fixing plates 71 and 72 adjusted to coincide with the spacing between the rows of the test tray 110. ) Guide blocks 75 disposed in () to move to the test tray 110 to accurately place the devices 109 in the pockets (110a) of the test tray 110, with reference to Figures 8 and 9 This will be described below.

8 and 9 are partial cross-sectional views of the semiconductor device loading apparatus according to the present invention. FIG. 8 illustrates a process of moving the pickup cylinder and the guide block fixing plate to the test tray to load the device into the test tray. 9 shows a process in which the device attached to the pickup cylinder is guided by the device guide block into the pocket of the test tray with the guide block fixing plate coupled to the test tray.

As shown in FIG. 8, the device guide block 75, which is detachably fitted into each opening 73 (see FIG. 5) of the first and second guide block fixing plates 71 and 72, is a device 109. It is provided with an opening hole 76 is opened in the vertical direction to be the same as the shape of), and the front and rear and left and right edges of the opening hole 76 is opened so that the size of the opening hole 76 decreases downward Inclined guide plates 77 and 78 that are inclined toward the inside of the hole 76 are formed.

The size of the opening hole 76 is larger than that of the device 109 so that the device 109 can be easily passed through, and the inclined guide plate 77 disposed downward from the bottom of the opening hole 76 ( The lower end of 78 is provided with a size substantially the same as that of the device 109 so that the device 109 can escape.

A pair of guide pins 74 protrude downward from each lower portion of each of the guide block fixing plates 71 and 72, and the gap between the guide pins 74 is formed in the test tray 110. The interval between the pair of pinholes 110d is the same so that the operation of inserting and removing the guide pin 74 into the pinhole 110d is smoothly performed.

As described above, the device guide blocks 75 are coupled to the first and second guide block fixing plates 71 and 72, and the device 109 is attached to each vacuum absorber 64. When the pick-up devices 61 and 62 and the first and second guide block fixing plates 71 and 72 are moved downward, as shown in FIG. 9, the first and second guide block fixing plates 710 ( Guide pins 74 of 72 are inserted into the corresponding pinholes 110d of the test tray 110 so that the guide block 75 is placed directly above the pocket 110a of the test tray 110, and the vacuum absorber The 64 is placed directly above the opening hole 76 of the guide block 75 so that the device 109 can be guided to the pocket 110a of the test tray 110.

Next, as shown in FIG. 9, when the pick-up cylinder 63 is operated to remove the adsorption force from the vacuum adsorber 64, the device 109 adsorbed to the vacuum adsorber 64 moves the guide block 75. To fall. The device 109 introduced into the guide block 75 passes through the opening hole 76, and then descends along the inclined guide plates 77 and 78 disposed downward from the bottom of the opening hole 76. The device 109 passes through the lower ends of the inclined guide plates 77 and 78 having a size enough to escape. By this operation, the device 109 is accurately placed in the seat portion 110c of the pocket 110a of the test tray 110.

As described above, after the device loading device 50 places the devices 109 in the respective pockets 110a of the test tray 110, the device loading device 50 moves to pick up the devices in the user tray again, or finished the test. The device is moved to move the device to the device unloading unit.

As described above in detail, the device loading apparatus according to the present invention includes a pair of pickup apparatuses on which pickup cylinders are mounted, and a pair of guide block fixing plates disposed under each pickup apparatus, and the guide block fixing. The plate is equipped with a device guide block to accurately seat the device in the pocket of the test tray, which can reduce the occurrence of errors due to incorrect alignment of the device and the ratio of defective products, thereby improving productivity and manufacturing costs. There is a saving effect.

Claims (8)

In the semiconductor device loading apparatus of the test handler for picking up the semiconductor devices placed in the user tray and placed in the pockets of the test tray, The semiconductor device loading apparatus includes a plurality of pickup devices including a plurality of pickup cylinders for vacuum suction and transport of semiconductor devices for testing; And a plurality of guide block fixing plates for guiding the semiconductor devices adsorbed by the pick-up cylinders of the plurality of pick-up devices to be accurately seated in the pockets of the test tray. The method of claim 1, wherein the plurality of pick-up device is composed of a pair of first pick-up device and a second pick-up device arranged in parallel, the first pick-up device is installed so as to be movable Shanghai, the second Pick-up device is a semiconductor device loading device of the test handler, characterized in that the left and right and is installed so as to be movable. According to claim 2, The plurality of guide block fixing plate is composed of a pair consisting of a first guide block fixing plate and a second guide block fixing plate arranged in parallel to correspond to the first and second pickup device. The first guide block fixing plate may be installed at the lower side of the first pick-up apparatus so as to be movable left and right, and the second guide block fixing plate may be installed at the bottom of the second pick-up apparatus. The semiconductor device loading apparatus of the test handler. The pickup device of claim 3, wherein eight pickup cylinders are arranged in a row, and each of the guide block fixing plates corresponding to the pickup device is formed of eight openings in a row so as to correspond to the pickup cylinders. A semiconductor device loading apparatus of a test handler. 5. The semiconductor device loading apparatus of claim 4, wherein each opening is detachably provided with a device guide block for accurately guiding a device to the test tray. The device of claim 5, wherein the device guide block is formed to be slightly larger than the size of the device, and is formed to be inclined inwardly from the edges of the opening and the bottom of the opening. And a tilt guide plate provided to be the same. The apparatus of claim 3, wherein the semiconductor device loading apparatus comprises a frame, a horizontal movable air cylinder fixed to an upper portion of the frame, a bracket coupled to an upper portion of the frame and extending downward, the horizontal movable air cylinder and the bracket; A horizontal moving LM guide arranged to move in a horizontal direction along with the bracket, a first lifting air cylinder coupled to a lower end of the bracket, and a first coupled to one side of the first lifting air cylinder. A device for loading a semiconductor device of a test handler, comprising: a lifting LM guide; and allowing the first guide block fixing plate to be attached to a lower portion of the first lifting LM guide. . The apparatus of claim 7, wherein the semiconductor device loading apparatus includes a bracket coupled to an upper portion of the frame and extending downward, a second lifting air cylinder coupled to a lower end of the bracket, and one of the second lifting air cylinders. And a second lifting LM guide coupled to a side thereof so that the second guide block fixing plate is attached to a lower portion of the second lifting LM guide so as to be movable upward and downward. Device loading device.