KR20030075681A - A wafer dicing method for preventing a chipping - Google Patents

Abstract

PURPOSE: A wafer dicing method is provided to be capable of preventing the generation of chipping phenomenon due to the driving direction of the first and second spindle by driving the first and second spindle using a top-down and bottom-up dicing method, respectively. CONSTITUTION: A half-cutting process is carried out at a wafer(307) by driving the first dicing blade(303) loaded at the first spindle(301) using a top-down dicing method. Then, a full-cutting process is carried out at the half-cut portion of the wafer by driving the second dicing blade(304) loaded at the second spindle(302) using a bottom-up dicing method. Preferably, the second dicing blade loaded at the second spindle has a smaller width than that of the first dicing blade loaded at the first spindle.

Description

Wafer dicing method to prevent chipping {A WAFER DICING METHOD FOR PREVENTING A CHIPPING}

TECHNICAL FIELD The present invention relates to a wafer dicing process, and more particularly to a wafer dicing method for preventing chipping on a wafer cut surface.

In general, a wafer is used as a substrate in a manufacturing process of a semiconductor or an integrated circuit chip. The manufacturing process of a semiconductor or an integrated circuit chip is a deposition process for depositing chip circuit materials on a wafer and a phenomenon to make a structure suitable for a circuit. Process and etching process, and a plurality of chips formed on the wafer is sliced and packaged for each chip. The present invention relates to a dicing method for scrapping a plurality of chips formed on a wafer during the packaging process. In wafer dicing, a wheel equipped with diamond blades is rotated at high speed, and the chips embedded in the wafer are cut into the required size using the diamond hardness and rotational force, and separated into individual chips.

In the dicing method, a dual type spindle dicing method is conventionally used in which wafer dicing is performed by dividing a cutting depth and a width into two stages using two spindles.

Hereinafter, a conventional dicing method will be described in detail with reference to the accompanying drawings.

1 is a view showing a conventional wafer dicing method. The wafer 107 is fixed to the baum table 110 by the wafer adhesive film tape 109. Half cutting to about half the depth of the semiconductor wafer using the dicing blade mounted on the first spindle, and full cutting to cut the wafer completely using the dicing blade mounted on the second spindle. The heights of the first spindle 101 and the second spindle 102 are set 108 differently for cutting. Then, after setting the rotational speed of the spindle, the wafer is first half-cut by the downward cutting 105 by using the wide dicing blade 103 mounted on the first spindle while transferring the baum table 111. With the dicing blade 104 mounted on the second spindle, which is narrower than the dicing blade mounted on the first spindle, it is also halved by the first spindle into a downward cut 106 which is also in the same cutting direction of the first spindle. A full cut is made to pass through the cut portion. In this method, since both dicing blades are used as the downward cutting method, there is a problem that chipping occurs at the lower end of the cutting surface due to cutting resistance during the full cutting by the dicing blade mounted to the second spindle.

2 is an enlarged cross-sectional view showing chipping generation 201 at the lower end of the wafer cut surface generated by the conventional wafer dicing method.

The occurrence of such chipping causes a defect of a semiconductor or an integrated circuit chip, which causes a decrease in the overall yield, thereby reducing productivity.

Accordingly, the present invention has been invented to solve the above-mentioned conventional problems, and an object thereof is to provide a wafer dicing method capable of solving the occurrence of chipping at the lower end of the wafer cut surface resulting from the use of both of the dual spindles in a downward cutting manner.

1 is a schematic view showing the operation of the dual type spindle dicing method according to the prior art.

Figure 2 is an enlarged cross-sectional view of a wafer cut by the dual type spindle dicing method according to the prior art.

3A is a schematic diagram showing the operation of the new dual type spindle dicing method according to the present invention.

FIG. 3B is a detailed view of a wafer cutting using a dicing blade in a dual type spindle dicing method.

4 is an enlarged cross-sectional view of a wafer cut by the new dual type spindle dicing method according to the present invention.

* Description of the symbols for the main parts of the drawings *

301: first spindle

302: second spindle

303: dicing blade mounted to the first spindle

304: Dicing blade mounted on the second spindle

307: Wafer

309: Wafer Bonding Film Tape

310: vaccum table

As a means for achieving the above object of the present invention, the wafer dicing method according to the present invention,

A dual type spindle dicing method having a first spindle and a second spindle, wherein the wafer is fixed to the bacon table by a wafer adhesive film tape and then mounted on the first spindle with a difference in cutting depths by the two spindles. First, the wafer is half-cut using the wider dicing blade, and the dicing blade is half-cut using the narrow dicing blade mounted on the second spindle, especially the dicing blade mounted on the first spindle. The direction of rotation of the rotating direction is to change the direction of cutting so that the downward cutting, the direction of rotation of the dicing blade mounted on the second spindle is the upward cutting. Thereafter, the bacon table is transferred to perform wafer dicing.

Hereinafter, a wafer dicing method for chipping prevention according to the present invention will be described in detail with reference to the accompanying drawings.

3A and 3B illustrate a new wafer dicing method according to the present invention, and FIG. 3A is cut to about half the depth of a semiconductor wafer using a dicing blade 303 mounted on a first spindle 301. Different heights of the first and second spindles are used for half cutting and for full cutting of the wafer using the dicing blade 304 mounted on the second spindle 302. Setting 308, the dicing blade mounted on the first spindle is rotated in the downward cutting 305 manner, the dicing blade mounted on the second spindle is rotated in the upward cutting 306 manner, and then the rotational speed of the spindle is set. After the bake table 310 is set according to the thickness of the wafer 307, the feed rate is set and then the feed 311 is used to dice the wafer fixed to the bake table by the wafer bonding film 309. The dicing blade mounted on the first spindle of the downward cutting type that generates chipping at the lower end of the wafer cutting surface prevents the chipping of the upper part of the wafer cutting surface, and the dicing blade mounted on the second spindle of the upward cutting type prevents the chipping of the lower wafer cutting surface. This prevents chipping.

FIG. 3B shows a half cut of the dicing blade mounted on the first spindle using a dicing blade mounted on the first spindle, and then a half cut portion of the dicing blade mounted on the first spindle. In order to pass, a full cut with a narrower width than half cutting by a dicing blade mounted to the first spindle is seen in detail from the front.

In the case of the downward cutting method, since chipping is generated at the lower end of the wafer cutting surface where the cutting by the wheel is finished, half cutting in the downward cutting using the dicing blade mounted on the first spindle prevents the chipping of the upper wafer cutting surface. Full cutting with up cutting using dicing blades mounted on two spindles can eliminate chipping at the bottom of the wafer cutting surface.

4 is an enlarged view of a wafer cross section cut by the novel wafer dicing method according to the present invention. Compared with the chipping 201 of the lower end of the wafer cutting surface by the conventional wafer dicing method of FIG. 2, the chipping of the lower end of the wafer cutting surface is prevented (401).

As described above, in the wafer dicing method according to the present invention, the first spindle of the dual-type spindle uses a downward cutting method, and the second spindle uses an upward cutting method, thereby using a dicing blade mounted on the second spindle. In this case, the chipping of the lower end portion of the wafer cut surface generated by the downward cutting method can be prevented, thereby improving the quality of the semiconductor or integrated circuit chip, reducing the defect rate, improving productivity, and reducing the cost.

Claims (2)

Half cutting the wafer in a downward cutting manner using a dicing blade mounted to the first spindle; And And dicing the half-cut by the dicing blade mounted on the first spindle in an upward cutting manner using the dicing blade mounted on the second spindle. The method of claim 1, And a width of the dicing blade mounted to the second spindle is narrower than a width of the dicing blade mounted to the first spindle.