KR20030068293A - Load-lock machine for in-line sputtering system - Google Patents

Abstract

PURPOSE: A load-lock machine for in-line sputtering system is provided to improve system operatability and productivity by performing loading and unloading of substrate smoothly and efficiently. CONSTITUTION: The load-lock machine for in-line sputtering system comprises first chamber body(10) comprising a load-lock chamber(12) the front surface of which is opened; second chamber body(20) coexisting with the first chamber body to open and close the load-lock chamber of the first chamber body; a transport means(30) for moving the second chamber body for the first chamber body; inside panels(40,42) installed to allow loading of the substrate(1) on the inner surface of the first and second chamber bodies; a gate plate installed on both wall surfaces of the first chamber body and equipped with gateway(52) connected to the load-lock chamber; an opening and closing means for opening and closing the gateway of the gate plate; a transfer means(70) for loading a tray(2) on which a plurality of substrates(1) are mounted into the load-lock chamber through the gateway of the gate plate; a vacuum pump(90) for creating vacuum by exhausting air inside the load-lock chamber; and a partial pressure adjusting gas controller(100) for injecting gas into the circumference of the gateway of the gate plate to control partial pressure of the load-lock chamber.

Description

LOAD-LOCK MACHINE FOR IN-LINE SPUTTERING SYSTEM}

The present invention relates to an in-line sputtering system, and more particularly, a load-lock machine for an in-line sputtering system for loading and unloading substrates at the most upstream and downstream side of the system. Machine).

As is well known, sputtering techniques using plasma are commonly used for coating thin films in the manufacturing fields of semiconductors, liquid crystal displays (LCDs), plasma display panels (PDPs), and projection TVs. It is divided into batch type, inter-back and in-line method according to the loading and unloading method of the substrate.

Batch sputtering directly loads a substrate into a coating chamber to coat a thin film on the surface of the substrate. Interbag sputtering includes a subchamber for loading and unloading a substrate in a coating chamber, and coating a thin film on the surface of the substrate while loading and unloading the substrate by the subchamber. In-line sputtering arranges the loading chamber and the unloading chamber inline in the coating chamber, loads the substrate by the loading chamber, and then performs a coating of a thin film on the surface of the substrate, and then unloads the substrate by the unloading chamber. On the other hand, in the field of manufacturing such as LCD and PDP, in-line sputtering is used to continuously coat an ITO (Indium Tin Oxide) film with a silica (SiO ₂ ) film and a conductive film on the surface of the glass substrate.

Looking at an example of such an inline sputtering system of the prior art, the inline sputtering system and the entry side load lock machine having an entry side load lock chamber for switching the atmospheric pressure and the vacuum state for loading the glass substrate; A first sputtering machine having a buffer heating chamber having a buffer heating chamber for heating the glass substrate, a first coating chamber for coating the silica film on the surface of the glass substrate, and a glass substrate coated with the silica film. A cooling machine having a heating machine having a heating chamber for heating, a second sputtering machine having a second coating chamber for coating an ITO film on the surface of the glass substrate, a cooling chamber having a cooling chamber for cooling the glass substrate, and a glass substrate. Exit Load-lock Chamber to switch between atmospheric and vacuum conditions for unloading It is configured the discharge side the load-lock machine are arranged in a line. And the chambers of each of the machines is configured to be opened and closed by a door rotated about the hinge.

However, in the prior art loadlock machine, there is a problem that the loading and unloading of the glass substrate is difficult due to the rapid change of the vacuum state when switching between atmospheric pressure and vacuum of the load lock chamber for loading and unloading the glass substrate. In addition, there is a disadvantage that the stable operation of the system is difficult and the operation and productivity are greatly reduced.

On the other hand, the load lock chamber of the load lock machine is covered by the hinge structure of the door and it is difficult to secure a working space, which involves a lot of difficulties in replacing parts and maintaining the load lock chamber, and requires considerable time and manpower. There is. In the case of the inline sputtering system in which each chamber is connected inline, this problem is aggravated by the inconvenience and inconvenience of opening and closing each chamber individually by the door, which greatly reduces the operation and maintenance convenience of the entire system. there is a problem.

Further, a seal having flexibility is interposed between the chamber body and the door of the load lock machine and the machine adjacent to the load lock machine to maintain the air tightness of the load lock chamber. When the seal is heat-cured, it is very vulnerable to breakage, which makes it difficult to use for a long time. In particular, the breakage of the seal has a fatal problem causing vacuum breakdown of the loadlock chamber. However, there is a situation in which the yarns are periodically replaced because there is no method for preventing the heat curing of the yarns, and there is a problem that the productivity loss due to the suspension of the system for exchanging the yarns must be taken as it is.

The present invention has been made in order to solve the various problems of the prior art as described above, an object of the present invention is to perform the loading and unloading of the substrate smoothly and efficiently to improve the operation and productivity of the system inline To provide a loadlock machine for a sputtering system.

Another object of the present invention is to open and close the entire loadlock chamber in the full open door method to facilitate the replacement of parts and maintenance of the chamber, for inline sputtering system that can greatly improve the convenience of maintenance To provide a loadlock machine.

It is still another object of the present invention to provide a load lock machine for an inline sputtering system that can effectively prevent thermal curing of a seal, thereby extending its life and improving its reliability.

A feature of the present invention for achieving the above object comprises: a first chamber body having a loadlock chamber with an open front surface; A second chamber body compatible with the first chamber body to open and close the load lock chamber of the first chamber body; Conveying means for moving the second chamber body relative to the first chamber body; An inside panel provided on an inner surface of the first and second chamber bodies to allow loading of the substrate; A gate plate provided on both side wall surfaces of the first chamber body, the gate plate having a doorway communicating with the loadlock chamber; Opening and closing means for opening and closing the doorway of the gate plate; Transfer means for loading a tray on which a plurality of substrates are mounted into a load lock chamber through an entrance and exit of the gate plate; A vacuum pump for evacuating air of the load lock chamber to create a vacuum; In a load lock machine for an inline sputtering system comprising a gas regulator for adjusting the partial pressure to inject gas around the entrance of the gate plate to adjust the partial pressure of the load lock chamber.

1 is a cross-sectional view showing the configuration of a loadlock machine according to the present invention,

2 is a cross-sectional view showing a state in which the load lock chamber of the load lock machine according to the present invention in a view similar to FIG.

3 is a cross-sectional view showing the configuration of a loadlock machine according to the present invention;

4 is an enlarged cross-sectional view of a cooling structure of a first and a second chamber body and a seal in a load lock machine according to the present invention;

5 is a front view showing a first chamber body, a conveying device and a trough of a loadlock machine according to the present invention;

6 is a cross-sectional view taken along line II of FIG. 5;

7 is a partial cross-sectional view of a gate plate of a loadlock machine according to the present invention;

8 is a cross-sectional view taken along the line II-II of FIG. 7;

9 is a front view showing a gate plate of the transfer machine according to the present invention.

♣ Explanation of symbols for the main parts of the drawing ♣

10: first chamber body 12: load lock chamber

20: second chamber body 30: conveying device

32: carrier 40, 42: inside panel

50: gate plate 52: doorway

60: gate valve 62: cylinder

66: door 70: feeder

72: upper feed roller 74: high feed roller

76: belt transmission device 80: gutter

90: vacuum pump 100: gas regulator for partial pressure adjustment

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a loadlock machine for an inline sputtering system according to the present invention will be described in detail with reference to the accompanying drawings.

First, referring to Figures 1 and 2, the loadlock machine of the present invention can be loaded and unloaded the substrate with an in-line sputtering system for coating a plurality of layers of a thin film, such as silica film and ITO film on the glass substrate, for example. So that they are installed inline at the top and bottom of the system, i.e. on the entry and exit sides. The loadlock machine of the present invention includes a first chamber body 10 and a second chamber body 20 that are compatible with each other so as to be separated from side to side. In the front of the first chamber body 10 which is in contact with the second chamber body 20, the load lock chamber 12 whose front is open for providing a space for loading and unloading the substrate 1 is vertical. It is formed. Between the first chamber body 10 and the second chamber body 20, a seal 22 for maintaining the airtightness of the load lock chamber 12 is interposed. Although the seal 22 was shown to be attached to the wall surface of the 2nd chamber body 20, you may attach to the wall surface of the 1st chamber body 10. FIG.

1, 2, and 4, a locator pin 14 protrudes from an edge of the first chamber body 10, and a first chamber body is formed at an edge of the second chamber body 20. The locator hole 24 is formed so that the locator pin 14 of 10 may be fitted. By locating the locator pin 14 of the first chamber body 10 and the locator hole 24 of the second chamber body 20, the first chamber body 10 and the second chamber body 20 are accurately aligned. Can be aligned. The coolant passage 26 is formed inside the second chamber body 20 so as to be close to the seal 22. The cooling water flowing through the cooling water passage 26 of the second chamber body 20 cools the chamber 22 to prevent thermal curing.

1 to 3, the load lock chamber 12 of the first chamber body 10 may be opened and closed in a full front opening door form by the movement of the second chamber body 20. It is configured to. The second chamber body 20 is moved to open and close the loadlock chamber 12 of the first chamber body 10 by the conveying device 30. The carrier device 30 includes a carrier 32 on which the second chamber body 20 is mounted, and a plurality of carriers 32 support the movement of the carrier 32 by rolling motion on both lower sides of the carrier 32. The wheel 34 is mounted. The rolling motion of the wheels 34 is guided by the guide rails 36, and the first chamber body 10 is fixed to the frame 38.

In addition, in the load lock machine of the present invention, inside panels of the first and second chamber bodies 10 and 20 may have inside panels 40 and 42 which may reduce the volume of the load lock chamber 12. Each is installed to be compatible. The loadlock chamber 12 should be designed with the smallest possible volume of loading and unloading of the substrate 1 for efficient switching between atmospheric pressure and vacuum. In the in-line sputtering system to which the load lock machine of the present invention is applied, the buffer heating machine, the sputtering machine and the cooling machine constitute respective chambers by the first and second chamber bodies 10 and 20 of the load lock machine. Each chamber must be equipped with components such as heaters, targets, cathodes, and cooling jackets. Accordingly, in order to secure a space for installing components in the chambers of the machines, a space of the chamber is provided, and the load lock chamber 12 of the load lock machine is provided with the installation of the inside panels 40 and 42. By eliminating the free space, the volume of the load lock chamber 12 can be reduced, so that the control of the load lock chamber 12 can be performed quickly and efficiently.

3, 7 to 9, gate plates 50 having vertical entrances 52 communicating with the load lock chambers 12 are installed on both side walls of the first chamber body 10. It is. On the outer surface of the gate plate 50, a channel 54 is formed along the edge of the entrance and exit 52 to form a closed curve. In the channel 54 of the gate plate 50, a seal 56 for holding the airtightness is fixedly mounted. The cooling water passage 58 is annularly formed inside the gate plate 50 so as to be close to the chamber 56, and the cooling water flowing through the cooling water passage 56 of the gate plate 50 cools the chamber 56 to heat. Hardening can be effectively prevented.

When the load lock machine of the present invention is continuously installed in an adjacent machine by such a gate plate 50 and the seal 56, the seal 56 is intimately connected to the gate plate of the adjacent machine. Therefore, the load lock machine of the present invention can realize an optimal inline sputtering system for continuous coating of silica film and ITO film on the surface of a glass substrate, for example.

As shown in FIG. 3, the entrance and exit 52 of the gate plate 50 may be opened and closed by a gate valve 60 as an opening / closing means. The gate valve 60 opens the cylinder 62, the lever 64 connected to be rotatable by the cylinder rod 62a of the cylinder 62, and the inlet and outlet 52 of the gate plate 50. The door 66 is connected to the lever 64 so as to be closed. Although the figure shows that the gate valve 60 is installed in both sides of the inlet and outlet 52 of the gate plate 50, it can also be installed so that the inlet and outlet 52 of the gate plate 50 of one side can be opened and closed. In addition, the gate valve 60 may exclude the entrance and exit 52 of the gate plate 50 in order to continuously communicate the load lock machine of the present invention and the chambers of the machines adjacent to each other to form an inline sputtering system.

Referring again to FIGS. 1 to 3, the loadlock machine of the present invention includes a transfer device 70 for transferring a tray 2 on which a plurality of substrates 1 are mounted, and the substrate 1 has a tray ( Several sheets are mounted on both sides of 2). The conveying device 70 includes a plurality of shank song rollers 72 and 74 arranged above and below the first chamber body 10 so that the upper and lower ends of the tray 2 can be supported and conveyed by rolling motion. The motor 76 provides a driving force capable of rotating the roller 74, and a belt transmission device 78 for transmitting the driving force of the motor 76 to the high feed roller 74. As shown in FIG. The belt transmission device 78 includes a drive pulley 78a connected to the motor 76, a driven pulley 78b connected to the high feed roller 74, a drive pulley 78a and a driven pulley 78b. It consists of a belt 78c wound around.

1, 2, 5 and 6 together, a gutter 80 is formed on the outer surface of each of the first and second chamber bodies 10 and 20 to the first and second chamber bodies 10 and 20. It is comprised so that the cooling water channel | path 82 may be formed in close_contact | adherence. The trough 80 is configured in a "c" shape with an open end 84 open at one side, and the open end 84 of the trough 80 is formed by the first and second chamber bodies 10 and 20. It is tightly fixed by welding with the wall surface of). In the present embodiment, the first and second chamber bodies 10 and 20 of the loadlock machine installed at the most upstream of the inline sputtering system do not need cooling, and the trough 80 is installed at the downstream thereof. It is preferable to comprise only the 1st and 2nd chamber bodies 10 and 20 of a.

In addition, the trough 80 is divided and configured in a rod shape, and the trough 80, which is divided and configured, is connected to each other by welding to substantially cover the entire wall surfaces of the first and second chamber bodies 10 and 20. Attach in a zigzag shape. Accordingly, the front surface of the first and second chamber bodies 10 and 20 by the coolant flowing along the coolant passage 82 formed between the trough 80 and the wall surfaces of the first and second chamber bodies 10 and 20. Can be cooled uniformly. The cooling water passage 82 can be freely bypassed so that interference with components such as the vacuum pump 90 installed on the outer surface of the first chamber body 10 is eliminated by the connection of the trough 80 that is divided and configured. Therefore, the design freedom of the load lock machine can be improved. The vacuum pump 90 exhausts the air in the load lock chamber 12 to create a vacuum. The upper part of the first chamber body 10 is connected with a gas regulator 100 for adjusting the partial pressure to inject nitrogen (N ₂ ) gas to adjust the partial pressure of the load lock chamber 12.

The operation of the load lock machine for the inline sputtering system according to the present invention having such a configuration will now be described.

1 and 4, the operation of the vacuum pump 90 while the locator pin 14 of the first chamber body 10 is fitted into the locator hole 24 of the second chamber body 20. When the air in the load lock chamber 12 is evacuated to form a vacuum, the interface between the first and second chamber bodies 10 and 20 is in intimate contact with each other by evacuating the air. At this time, the seal 22 is in close contact with the front surface of the first chamber body 10 to maintain the airtight of the load lock chamber 12, the coolant flowing through the coolant passage 26 of the second chamber body 20 is the seal ( 22) Cooling effectively prevents thermal curing.

As shown in FIG. 3, the cylinder 62 of the gate valve 60 is operated to open the door 66 that closes the entrance and exit 52 of the gate plate 50, and the motor of the transfer device 70 ( 76 is driven to load the tray 2 on which the substrate 1 is mounted from the chamber of the sputtering machine to the load lock chamber 12 through the entrance and exit 52 of the gate plate 50. When the door 66 of the gate valve 60 is opened, nitrogen gas is injected into the load lock chamber 12 around the doorway 52 by the operation of the partial pressure regulating gas regulator 100, thereby opening the doorway 52. The partial pressure of the load lock chamber 12 which fluctuates accordingly is adjusted. When the loading of the substrate 1 into the load lock chamber 12 of the load lock machine is completed, the cylinder 62 of the gate valve 60 is operated to open the entrance and exit 52 of the gate plate 50 to the door 66. Close by.

1, 5, and 6, the coolant flowing through the coolant passage 82 formed between the wall surfaces of the first and second chamber bodies 10 and 20 and the trough 80 is provided. By directly contacting the two chamber bodies 10 and 20 to cool the first and second chamber bodies 10 and 20, the cooling efficiency of the first and second chamber bodies 10 and 20 can be greatly increased. . Therefore, cooling of the board | substrate 1 loaded in the load lock chamber 12 of a load lock machine can be performed efficiently. By virtue of the split and configured troughs 80, the coolant passage 82 is freely bypassed so that interference with components such as vacuum pumps 90 installed in the first and second chamber bodies 10 and 20 is eliminated. The design flexibility of the loadlock machine can be improved.

4 and 7-9, a seal 22 is provided between the first and second chamber bodies 10, 20 of the loadlock machine to maintain the airtightness of the loadlock chamber 12; Since each of the seals 56 of the gate plate 50 can be cooled by the coolant flowing through the coolant passages 26 and 58, of course, the heat curing of the seals 22 and 56 is prevented to extend the life. It is possible to prevent vacuum breakage of the load lock chamber 12 due to breakage of the seals 22 and 56, thereby improving operability and reliability. Therefore, the in-line sputtering system can be optimally implemented by the load lock machine of this invention.

Referring to FIG. 3 again, the cylinder 62 of the gate valve 60 is operated to reopen the door 66 which closes the entrance and exit 52 of the gate plate 50, and by the operation of the transfer device 70. The tray 2 may be loaded from the loadlock chamber 12 into the chamber downstream or unloaded out of the system. In this way, the tray 2 on which the substrate 1 is mounted can be stably loaded and unloaded into the system, thereby increasing productivity.

The above embodiments are merely illustrative of preferred embodiments of the present invention, and the scope of the present invention is not limited to the described embodiments, and various modifications may be made by those skilled in the art within the spirit and scope of the present invention. Modifications, variations, or substitutions may be made, and such embodiments are to be understood as being within the scope of the present invention.

As described above, according to the load lock machine for the inline sputtering system according to the present invention, the loading and unloading of the substrate can be smoothly and efficiently performed at the upstream and the downstream of the system, thereby greatly improving the operation and productivity of the system. In addition, the entire loadlock chamber can be completely opened and closed using the front open door method, which enables easy replacement of parts and maintenance of the chamber. In addition, there is an effect that can effectively prevent the thermal curing of the seal for maintaining the air tightness of the load lock chamber.

Claims (5)

A first chamber body having a loadlock chamber having an open front surface; A second chamber body compatible with the first chamber body to open and close the load lock chamber of the first chamber body; Conveying means for moving said second chamber body relative to said first chamber body; An inner panel provided on an inner surface of the first and second chamber bodies to allow loading of the substrate; Gate plates provided on both side wall surfaces of the first chamber body, the gate plates having entrances and exits communicating with the load lock chambers; Opening and closing means for opening and closing an entrance and exit of the gate plate; Transfer means for loading a tray having a plurality of substrates into the load lock chamber through an entrance and exit of the gate plate; A vacuum pump for evacuating air of the load lock chamber to create a vacuum; And a partial pressure regulating gas regulator for injecting gas around the entrance and exit of the gate plate to adjust the partial pressure of the load lock chamber. The load lock machine according to claim 1, wherein the conveying means comprises a carrier for mounting and moving the second chamber body, wherein the first chamber body is fixed to a frame. The load lock machine for inline sputtering systems according to claim 1 or 2, wherein a trough for forming a coolant passage is further secured to the outer surfaces of each of the first and second chamber bodies, and the trough is divided and configured. 4. The load lock machine for inline sputtering system according to claim 3, wherein a coolant passage is configured to be close to a seal interposed between the first and second chamber bodies for the airtightness of the load lock chamber. The method of claim 1, wherein the transfer means, A plurality of shank song rollers arranged above and below the first chamber body to support and transport the upper and lower ends of the tray by rolling motion; A motor providing a driving force capable of rotating the high feed roller; A load lock machine for an inline sputtering system, comprising a belt transmission device for transmitting the driving force of the motor to the high feed roller.