KR20030066040A - The manufacturing method of triple cladded copper sheet using stainless steel sheet, aluminum sheet, and copper sheet - Google Patents
The manufacturing method of triple cladded copper sheet using stainless steel sheet, aluminum sheet, and copper sheet Download PDFInfo
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- KR20030066040A KR20030066040A KR1020020006194A KR20020006194A KR20030066040A KR 20030066040 A KR20030066040 A KR 20030066040A KR 1020020006194 A KR1020020006194 A KR 1020020006194A KR 20020006194 A KR20020006194 A KR 20020006194A KR 20030066040 A KR20030066040 A KR 20030066040A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/04—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
- B23K2103/05—Stainless steel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Description
본 발명은 동(銅)판, 알루미늄판 및 스테인레스강판으로 이루어진 3중 적층 구조의 커퍼 클래드판 제조 방법에 관한 것으로, 더 자세하게는 동이 산화되기 직전의 온도에서 동판을 가열하고, 별도의 가열장치에서 동판의 가열 온도보다 높은온도로 알루미늄판과 스테인레스강판을 적층하여 동시에 가열한 후, 상이한 온도로 가열된 동판과 적층된 알루미늄판 및 스테인레스강판을 함께 적층하여 롤링에 의해 접착시킨 커퍼 클래드판의 제조 방법에 관한 것이다.The present invention relates to a copper clad plate manufacturing method of a triple laminated structure consisting of a copper plate, an aluminum plate and a stainless steel plate, and more particularly, to heat the copper plate at a temperature just before the copper is oxidized, and in a separate heating device A method of manufacturing a cupper clad plate in which an aluminum plate and a stainless steel sheet are laminated and heated simultaneously at a temperature higher than the heating temperature of the copper plate, and then the copper plate, the laminated aluminum sheet and the stainless steel sheet, which are heated at different temperatures are laminated together and bonded by rolling. It is about.
주방 용품인 프라이 팬이나 냄비 등과 같이 뜨거운 불에 직접 접촉되는 그릇들은 돌이나 세라믹 등이 사용되기도 하나, 그러한 재질은 내충격성이 부족한 측면이 있기 때문에 특별한 용도가 아닌 경우에는, 충격에 의해 파손되지 않아 사용상 편리한 스테인레스강, 동 내지는 알루미늄 및 그 합금 등의 금속 판재를 드로잉 가공하여 제작하는 것이 일반적이다.Bowls that are in direct contact with hot fires, such as pans and pots, which are kitchen utensils, may be made of stone or ceramics.However, such materials are not impact resistant. It is common to manufacture metal plate materials, such as stainless steel, copper or aluminum, and its alloys which are convenient for use, by drawing.
그러나, 동이나 동 합금은 장시간 방치할 경우 인체에 해로운 녹청이 발생하게 되고, 알루미늄이나 알루미늄 합금의 경우에는 다양한 음식물에 대한 내식성이 부족할 뿐 아니라, 끓는 물과 접촉 시에는 수산화알미늄과 같은 화합물이 그 표면에 생성되어 표면 색상이 검게 변색되는 단점이 있으며, 알츠하이머병을 유발한다하여 선진국에서는 직접적인 사용을 금하고 있기도 하다.However, copper or copper alloys are harmful to humans when left for a long time, and aluminum or aluminum alloys lack corrosion resistance to various foods, and when contacted with boiling water, compounds such as aluminum hydroxide are used. It is created on the surface and the color of the surface discolored, there is a disadvantage, and it causes the Alzheimer's disease, so the developed countries are prohibited to use it directly.
더욱이, 프라이 팬이나 냄비와 같은 주방 용품은 주로 판재를 드로잉 가공하여 제조되나, 동 내지는 알루미늄 및 그 합금 판재들은 철강재에 비하여 연질임에도 불구하고 금속의 결정 조직상의 차이로 인하여 철강재에 비하여 드로잉 가공성이 떨어지고 강도가 다소 부족하여 충격에 의한 변형이 쉬울 뿐 아니라, 상대적으로 고가이기 때문에, 적절한 드로잉 가공성과 함께 가격이 상대적으로 저렴하고 강도, 내부식성 및 표면 광택성 등이 우수한 철강계 합금인 스테인레스강판이 주로 사용되고 있다.Moreover, kitchen utensils, such as pans and pots, are mainly manufactured by drawing plates, but copper or aluminum and its alloy plates, although softer than steel, are less workable than steel due to differences in the crystal structure of the metal. Not only is it easy to deform due to impact due to its lack of strength, but is relatively expensive, and stainless steel sheet, which is a steel-based alloy that is relatively inexpensive and has excellent strength, corrosion resistance, and surface gloss, with appropriate drawing workability, is mainly used. It is used.
그러나, 상기 스테인레스강판은 고내식성을 가지나 열전도성이 나쁘기 때문에 국부가열이 되는 단점이 있다. 즉, 에너지 절약의 중요성이 커지면서 음식물에 열을 가하여 조리하는 경우 음식에 열을 신속히 전달해주는 효율 측면에서 볼 때, 상기 스테인레스강판은 알루미늄이나 동에 비하여 그 열 전달 성능이 떨어져 열 손실이 증가하게 되는 단점이 있다.However, the stainless steel sheet has a high corrosion resistance but poor thermal conductivity has a disadvantage of localized heating. In other words, in the aspect of efficiency of transferring heat to food when cooking by heating the food as the importance of energy saving increases, the heat transfer performance of the stainless steel sheet is lower than that of aluminum or copper, resulting in increased heat loss. There are disadvantages.
따라서, 상기와 같이 열전도성이 떨어지는 스테인레스강판의 단점을 해결하기 위하여 다소의 단점이 있음에도 불구하고 알루미늄이나 동과 같이 열전도성이 우수한 이종의 금속 판재를 스테인레스 강판에 접합시킨 클래드판이 개발되었으며, 대표적인 것이 알루미늄판과 스테인레스강판의 클래드판이다.Therefore, in order to solve the shortcomings of the stainless steel sheet inferior in thermal conductivity as described above, a clad plate in which a heterogeneous metal sheet material such as aluminum or copper is bonded to the stainless steel sheet has been developed. Clad plate of aluminum plate and stainless steel plate.
상기 알루미늄판은 타금속재료에 비하여 가볍고 열전도성이 뛰어난 금속이기는 하나 내식성이 약한 단점이 있기 때문에 음식에 닿지 않고 불에 닿게 되는 외표면이나, 두 장의 스테인레스강판 사이에 접합되는 것이 일반적이다.The aluminum plate is a metal that is lighter than other metal materials and has excellent thermal conductivity, but has a disadvantage of weak corrosion resistance. Therefore, the aluminum plate is generally joined to an outer surface or two stainless steel sheets that do not come into contact with food.
그리고, 생활수준의 향상과 함께 조리 용구가 고급화 됨에 따라 장식성과 외관성이 우수한 동판을 스테인레스에 접착시킨 커퍼 클래드판이 개발되었으며, 그 수요가 점차 증가하고 있으나 종래 커퍼 클래드판의 제조 방법에는 다음과 같은 문제가 있다.In addition, with the improvement of living standards and the high quality of cooking utensils, cupper cladding boards having a copper plate having excellent decorative and appearance characteristics are bonded to stainless steels have been developed, and the demand thereof is gradually increasing. there is a problem.
상기 클래드판은 일반적으로 가열된 상태의 금속 판재를 대상으로 하는 열간 압연 방법에 의해 제조되기 때문에 판재 사이의 표면 접합을 방해하는 산화물층이 형성되지 않도록 환원성 분위기 하에서 금속 판재를 가열하는 것이 중요하다.Since the clad plate is generally manufactured by a hot rolling method for a metal sheet in a heated state, it is important to heat the metal sheet under a reducing atmosphere so that an oxide layer that prevents surface bonding between the plates is not formed.
특히, 가열시 동판 표면에 생성되는 동 산화물은 취성을 가져 표면으로부터충격 등에 의해 쉽게 탈락되기 때문에 접합에는 치명적이다.In particular, copper oxide, which is formed on the surface of the copper plate upon heating, has brittleness and is easily released from the surface due to impact or the like, which is fatal for bonding.
따라서, 환원성 분위기가 보장되는 특수 가열로에서 동판을 가열하거나, 동판의 표면에 니켈이나 크롬 등을 도금하여 일반 가열로에서 가열하였기 때문에 분위기 가스가 공급되는 특수 가열로 또는 도금에 의해 설비 장치가 복잡해지고 제조 원가가 상승되는 문제가 있었다.Therefore, since the copper plate is heated in a special heating furnace that guarantees a reducing atmosphere, or nickel or chromium is plated on the surface of the copper plate and heated in a general heating furnace, the equipment is complicated by a special heating furnace or plating supplied with an atmospheric gas. There was a problem of rising manufacturing costs.
본 발명은 종래 커퍼 클래드판의 제조 방법이 갖는 제반 문제점들을 해결하기 위한 것으로, 환원성 분위기가 아닌 일반 대기와 같은 분위기에서 동판을 가열하여도 클래드판의 제조가 가능하여 커퍼 클래드판의 제조 설비를 단순화 할 수 있으며, 그 제조 원가를 떨어뜨릴 수 있는 간편한 커퍼 클래드판의 제조 방법을 제공함에 본 발명의 목적이 있다.The present invention is to solve all the problems of the conventional manufacturing method of the cupper clad plate, it is possible to manufacture the clad plate even if the copper plate is heated in an atmosphere such as a general atmosphere, not a reducing atmosphere to simplify the manufacturing equipment of the cupper clad plate It is an object of the present invention to provide a method for producing a simple cupper clad plate that can be made, and the manufacturing cost can be reduced.
도 1은 본 발명 방법의 공정 흐름도.1 is a process flow diagram of the method of the present invention.
도 2는 본 발명 방법에 의한 커퍼 클래드판의 단면 모식도.2 is a schematic cross-sectional view of a cupper clad plate according to the method of the present invention.
도 3은 동판-알루미늄판 사이의 접합력 시험 시편의 정면도.Figure 3 is a front view of the bonding test test specimen between the copper plate and aluminum plate.
((도면의 주요 부분에 대한 부호의 설명))((Explanation of symbols for main part of drawing))
21. 알루미늄판 22. 스테인레스강판21. Aluminum plate 22. Stainless steel plate
23. 동판 25. 커퍼 클래드판23. Copper Plate 25. Cupper Clad Plate
본 발명의 상기 목적은 스테인레스강판에 알루미늄판을 적층한 스테인레스/알루미늄 적층판과 동판을 대기 중에서 서로 다른 온도로 가열함에 의하여 달성된다.The above object of the present invention is achieved by heating a stainless / aluminum laminate and a copper plate in which an aluminum plate is laminated on a stainless steel plate to different temperatures in the air.
본 발명은, 스테인레스강판/알루미늄판/동판의 순서로 적층하여 3중으로 접합시킨 커퍼 클래드판의 제조 방법에 관한 것으로, 동판과 스테인레스/알루미늄 적층판을 환원성 분위기가 아닌 일반 대기 분위기에서 가열하되, 적층판의 표면에는산화물이 생성되고 동판의 표면에는 산화물이 생성되지 않도록 적층판과 동판의 가열 온도를 달리함에 그 기술적 특징이 있다.The present invention relates to a method of manufacturing a copper clad plate laminated in the order of stainless steel sheet / aluminum plate / copper plate and bonded in triplicate, wherein the copper plate and the stainless / aluminum laminate plate is heated in a general atmospheric atmosphere, not reducing atmosphere, The technical feature is that the heating temperature of the laminate and the copper plate is different so that oxides are formed on the surface and no oxides are formed on the surface of the copper plate.
이때, 상기 동판은 150∼200℃에서 15∼20분 동안 가열되며, 이 온도 범위가 동판 표면에 산화물을 생성시키지 않고 가열할 수 있는 최고 온도 범위가 된다.At this time, the copper plate is heated for 15 to 20 minutes at 150 to 200 ℃, this temperature range is the highest temperature range that can be heated without generating oxide on the surface of the copper plate.
즉, 가열 온도가 200℃를 초과하게 되면 판재간 접합에 치명적인 동 산화물이 동판 표면에 생성되기 시작하며, 150℃에 미치지 못하면 압연시 압연에 의한 판재간의 접합에 필수적인 계면에서의 확산이 충분치 못하고, 접합에 필요한 압연 가공량을 얻기가 어렵게 된다.That is, when the heating temperature exceeds 200 ℃, the copper oxide, which is fatal for the joining between the plates starts to form on the surface of the copper plate, if it does not reach 150 ℃, the diffusion at the interface necessary for the bonding between the plates by rolling during rolling is not sufficient, It becomes difficult to obtain the rolling amount required for joining.
그리고, 가열된 동판에 접합시키기 위한 스테인레스강판과 알루미늄판은 적층된 상태에서 300∼500℃ 범위의 온도로 25∼30분간 가열되며, 가열 분위기는 상기 동판과 동일한 대기 분위기로서, 적층된 스테인레스/알루미늄 적층판의 가열은 상기 동판의 가열과 달리 판재의 표면에 산화물층을 형성시키기 위한 목적도 있다.Then, the stainless steel plate and the aluminum plate to be bonded to the heated copper plate is heated for 25 to 30 minutes at a temperature in the range of 300 to 500 ℃ in the laminated state, the heating atmosphere is the same atmospheric atmosphere as the copper plate, laminated stainless / aluminum The heating of the laminated plate also has the purpose of forming an oxide layer on the surface of the plate unlike the heating of the copper plate.
이때, 상기 가열 온도가 300℃ 미만일 경우에는 표면 산화물층의 생성이 불완전하게 되어 열간 압연 후 접합력이 부족하게 되고, 500℃를 초과하게 되면 산화물층의 생성이 과다하고 필요 이상으로 치밀하게 되어 안정화됨으로써 열간 압연시 산화물층의 균열이 불충분하여 오히려 접합력을 떨어뜨리게 된다.At this time, when the heating temperature is less than 300 ℃, the formation of the surface oxide layer is incomplete, and the bonding strength after the hot rolling is insufficient, when the temperature exceeds 500 ℃, the formation of the oxide layer is excessive and more dense than necessary to stabilize In hot rolling, the crack of the oxide layer is insufficient so that the bonding strength is lowered.
즉, 본 발명 방법으로 제조되는 클래드판에 있어서, 상기 스테인레스/알루미늄 적층판 사이의 접합력은, 가열 온도 300℃ 부근에서부터 적절한 값을 갖게 되며, 온도 상승과 함께 상승되어 400℃부근에서 가장 높은 값을 보인 후 온도 상승에 따라 감소하여 500℃에서 바람직한 접합력의 최소 값을 보인 다음 급격히 감소하게 된다.That is, in the clad plate manufactured by the method of the present invention, the bonding force between the stainless steel / aluminum laminate plate has an appropriate value from around 300 ° C of heating temperature, and increases with temperature rise, showing the highest value near 400 ° C. After decreasing with increasing temperature, the minimum value of the desired bonding force is shown at 500 ° C., and then rapidly decreases.
따라서, 본 발명 방법에 의한 커퍼 클래드판은 표면 산화물이 생성되지 않은 동판과, 표면 산화물이 생성된 스테인레스/알루미늄 적층판을 압연에 의해 접합시킨 것으로, 압연시 표면에 생성된 산화물층에 미세한 균열이 발생되고, 이 균열된 산화물층이 종래 클래드판의 제조 방법에서 부식에 의해 금속 판재 표면에 형성된 요철부의 역할을 대행토록 하였다.Therefore, the copper clad plate according to the method of the present invention is obtained by joining a copper plate without surface oxides and a stainless / aluminum laminate with surface oxides formed by rolling, so that minute cracks are generated in the oxide layer formed on the surface during rolling. The cracked oxide layer acts as a convex-concave portion formed on the surface of the metal sheet by corrosion in the conventional method for producing a clad plate.
즉, 압연시 상기 산화물층의 틈새를 통하여 이종 금속간 계면에서 압접과 확산이 일어나 금속 판재 사이의 접합이 이루어지고, 스테인레스/알루미늄 적층판의 경우에는 접합된 두 금속 표면의 균열된 산화물층이 서로 엇갈려 정합되며, 동판과 알루미늄판의 계면에서는 알루미늄판의 균열된 표면 산화물이 동판 표면에 직접 인터록 된다.In other words, when rolling, pressure bonding and diffusion occur at the interface between dissimilar metals through gaps of the oxide layer, and bonding between metal sheets is performed. In the case of a stainless / aluminum laminate, cracked oxide layers of two joined metal surfaces are staggered. In the interface between the copper plate and the aluminum plate, the cracked surface oxide of the aluminum plate is directly interlocked with the copper plate surface.
그리고, 동판과 스테인레스/알루미늄 적층판의 가열은 각각의 가열로에서 동시에 이루어져 함께 인출되어 적층된 후 압연된다.In addition, the heating of the copper plate and the stainless / aluminum laminate is carried out at the same time in each heating furnace, drawn together, laminated, and rolled.
상기 본 발명의 목적과 기술적 구성을 비롯한 그에 따른 작용 효과에 관한 자세한 사항은 본 고안의 바람직한 실시예를 도시하고 있는 도면을 참조한 아래의 설명에 의해 명확하게 이해될 것이다.Details of the effects and the resulting effects, including the object and technical configuration of the present invention will be clearly understood by the following description with reference to the drawings showing a preferred embodiment of the present invention.
도 1에 본 발명 방법의 공정 흐름도를, 도 2에 본 발명 방법으로 제조된 커퍼 클래드판의 단면 모식도를 도시하였다.The process flowchart of the method of this invention is shown in FIG. 1, and the cross-sectional schematic diagram of the cupper clad board manufactured by the method of this invention is shown in FIG.
도시된 바와 같이, 본 발명 커퍼 클래드판의 제조 방법은 알루미늄판(21)의 양면에 브러싱 내지는 샌드 블라스팅을 실시하여 표면에 스크래치와 요철을 형성시키는 단계(100)와; 상기 알루미늄판(21)을 스테인레스강판(22)의 일면에 적층하여 스테인레스/알루미늄 적층판(21/22)을 구성하는 단계(200)와; 스테인레스/알루미늄 적층판(21/22)과 동판(23)을 대기 분위기인 각각의 가열로에서 가열하는 단계(300)(301)와; 가열된 상기 스테인레스/알루미늄 적층판(21/22)의 알루미늄판(21) 표면에 동판(23)을 적층하여 3중 적층판(24)을 만드는 단계(400)와; 상기 3중 적층판(24)을 압연하는 단계(500)로 이루어진다.As shown, the method of manufacturing the cupper clad plate according to the present invention by brushing or sand blasting on both sides of the aluminum plate 21 to form scratches and irregularities on the surface (100); Stacking the aluminum plate (21) on one surface of the stainless steel plate (22) to construct a stainless / aluminum laminate (21/22); Heating (300) (301) the stainless / aluminum laminate (21/22) and copper plate (23) in respective heating furnaces in an air atmosphere; Stacking (400) the copper plate (23) on the surface of the aluminum plate (21) of the heated stainless / aluminum laminate (21/22) to form a triple laminate (24); Rolling the triple laminate 24 is a step (500).
상기와 같이 제조되는 본 발명 방법에 의한 3중 구조의 커퍼 클래드판(25)은 스테인레스강판의 표면에 알루미늄판이, 알루미늄판의 표면에 동판이 적층된 구조로서, 3중 적층판(24)의 압연은 알루미늄판 기준으로 30∼40%의 압하율이 부여되도록 이루어진다.The cupper clad plate 25 having the triple structure according to the present invention manufactured as described above has a structure in which an aluminum plate is laminated on the surface of a stainless steel plate and a copper plate is laminated on the surface of the aluminum plate, and the rolling of the triple laminated plate 24 is performed. A reduction ratio of 30 to 40% is given based on the aluminum plate.
이때, 상기 알루미늄판 기준의 압하율이 30%에 미치지 못하면 금속판들 상이에 충분한 접합력이 형성되지 못하고, 40%를 초과하게 되면 가공경화량이 과다하게 되어 커퍼 클래드판의 가공성이 떨어지게 된다.In this case, if the reduction ratio of the aluminum sheet is less than 30%, sufficient bonding force may not be formed between the metal plates. If the reduction rate exceeds 40%, the amount of hardening of the copper plate becomes excessive, resulting in poor workability of the cupper clad plate.
그리고, 알루미늄판의 양면에 브러싱 내지는 샌드 블라스팅을 실시하는 것은, 알루미늄판 표면에 스크래치와 요철을 형성시켜 알루미늄판의 표면적을 증가시켜 표면의 활성도를 상승시킴으로써 표면 산화물층을 쉽게 생성시키고, 생성된 산화물층에서 균열이 잘 일어나도록 하기 위해서이다.Brushing or sandblasting both surfaces of the aluminum plate forms scratches and irregularities on the surface of the aluminum plate to increase the surface area of the aluminum plate to increase the activity of the surface, thereby easily producing a surface oxide layer, and forming the produced oxide. This is to ensure that cracks occur in the layer well.
또한, 상기의 브러싱 내지는 샌드 블라스팅은 알루미늄판의 계면 에너지를 증가시킴으로써 열간 압연시 계면에서의 확산을 조장하는 역할을 하게 되어 두 금속간의 접합력을 향상시켜 주는 효과도 있다.In addition, the brushing or sand blasting is to increase the interfacial energy of the aluminum plate to promote diffusion at the interface during hot rolling, thereby improving the bonding strength between the two metals.
상기와 같이 일반 대기 중에서 온도를 달리하여 가열한 후 접합하는 본 발명 방법에 의한 커퍼 클래드판(발명품)과, 환원성 분위기에서 동판과 알루미늄판 및 스테인레스강판을 함께 가열한 후 압연한 커퍼 클래드판(종래품 1)과, 동판의 표면에 크롬도금한 후 대기 중에서 가열하여 압연한 커퍼 클래드판(종래품 2)의 각 기계적 성질 및 동판-알루미늄판 사이의 결합력을 다음의 표 1에 나타내었다.As described above, the copper clad plate (invention) according to the method of the present invention, which is bonded after heating at a different temperature in a general atmosphere, and the copper clad plate rolled after heating copper plate, aluminum plate, and stainless steel plate together in a reducing atmosphere (conventionally) The mechanical properties of the copper clad plate (former article 2) and the bonding force between the copper plate and the aluminum plate were shown in Table 1 below.
상기 표 1의 항복 강도(Y.S.)와 인장 강도(T.S.) 및 연신율은 표준 인장시험에 의해 측정된 것이며, 접합력은 각 커퍼 클래드판으로 폭 20mmm, 길이 150mm되는 시편을 제작한 후 스테인레스강판과 알루미늄판은 접합된 상태로 유지하면서 알루미늄판과 동판을 분리하되 분리된 부분의 길이를 30mm로 하여 도 3에 도시된 바와 같이 "T"자형으로 만들고, 분리된 동판(23)과 스테인레스/일루미늄 접합판(26)을 시편의 길이 방향에 수직한 방향으로 힘을 가하여 분리할 때 측정된 힘을 시편의 폭으로 나눈 값이다.Yield strength (YS), tensile strength (TS) and elongation of Table 1 are measured by standard tensile test, and the bonding force is made of stainless steel sheet and aluminum plate after fabricating a specimen having a width of 20mm and a length of 150mm with each cupper cladding plate. The aluminum plate and the copper plate are separated while maintaining the silver bonded state, but the length of the separated part is 30 mm, and the shape is made of a “T” shape as shown in FIG. 3, and the separated copper plate 23 and the stainless / aluminium plate When (26) is separated by applying a force perpendicular to the longitudinal direction of the specimen, the force measured is divided by the width of the specimen.
본 발명 방법에 의해 제조된 클래드판은, 상기 표 1에서 알 수 있듯이 산화물층을 형성시키지 않는 종래의 방법에 의해 제조된 클래드판과 동일한 수준의 기계적 성질과 동판-알루미늄판 접합력을 보여주고 있으며, 이는 적절한 산화물층의미세 균열에 의한 계면 사이의 정합이 이종 금속판 사이의 접합력을 감소시키지 않음을 보여주는 것이다.The clad plate produced by the method of the present invention, as shown in Table 1, shows the same level of mechanical properties and copper-aluminum plate bonding strength as the clad plate produced by a conventional method that does not form an oxide layer, This shows that the matching between the interfaces by fine cracks in the appropriate oxide layer does not reduce the bonding force between dissimilar metal plates.
이상에서 살펴본 바와 같이, 본 발명 커퍼 클래드판의 제조 방법은 판재의 가열시 환원성 분위기를 만들어 주기 위한 설비나, 동판 표면의 산화물 생성 방지를 위한 도금이 필요 없기 때문에 클래드판의 제조 설비가 단순화되어 설비 투자비가 경감될 뿐 아니라, 생산성이 향상되고 제조 원가가 현저히 떨어지게 되는 이점이 있다.As described above, the manufacturing method of the cupper clad plate according to the present invention does not require a facility for creating a reducing atmosphere when the plate is heated, or plating for preventing the generation of oxide on the surface of the copper plate, thereby simplifying the equipment for manufacturing the clad plate. In addition to reduced investment costs, productivity is improved and manufacturing costs are significantly reduced.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100489680B1 (en) * | 2002-08-30 | 2005-05-17 | 재단법인 포항산업과학연구원 | Method for cladding copper plate on aluminum plate |
| KR100662727B1 (en) * | 2006-01-04 | 2006-12-28 | 동아대학교 산학협력단 | Clad metal manufacturing method using steel and aluminum and centrifugal casting machine |
| KR101005804B1 (en) * | 2008-09-04 | 2011-01-05 | 유재형 | Method of manufacturing copper-aluminum-stainless steel clad plate |
| CN115625490A (en) * | 2022-11-03 | 2023-01-20 | 浙江爱博复合材料有限公司 | Preparation method of stainless steel-copper-titanium graphene pot body composite plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US3952938A (en) * | 1973-12-10 | 1976-04-27 | Clad Metals, Inc. | Method of making multiple member composite metal products |
| US4246045A (en) * | 1979-04-24 | 1981-01-20 | Clad Metals, Inc. | Multiple member clad metal products and methods of making the same |
| JP4689040B2 (en) * | 1998-05-04 | 2011-05-25 | クラッド・メタルズ・エルエルシー | Manufacturing method of five-layer composite metal cooking container |
| KR100376555B1 (en) * | 2001-05-28 | 2003-03-17 | 배동현 | Manufacturing method of triple clad sheets using stainless steel and Al sheet |
| KR20010088990A (en) * | 2001-08-31 | 2001-09-29 | 김진영 | Antibiotic Metal Vessel |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100489680B1 (en) * | 2002-08-30 | 2005-05-17 | 재단법인 포항산업과학연구원 | Method for cladding copper plate on aluminum plate |
| KR100662727B1 (en) * | 2006-01-04 | 2006-12-28 | 동아대학교 산학협력단 | Clad metal manufacturing method using steel and aluminum and centrifugal casting machine |
| KR101005804B1 (en) * | 2008-09-04 | 2011-01-05 | 유재형 | Method of manufacturing copper-aluminum-stainless steel clad plate |
| CN115625490A (en) * | 2022-11-03 | 2023-01-20 | 浙江爱博复合材料有限公司 | Preparation method of stainless steel-copper-titanium graphene pot body composite plate |
| CN115625490B (en) * | 2022-11-03 | 2024-05-28 | 浙江爱博复合材料有限公司 | Preparation method of stainless steel-copper-titanium graphene pot body composite board |
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