KR20030050468A - Multilayered directivity coupler - Google Patents

Abstract

PURPOSE: A directional coupler is provided to improve a directionality by opening a line portion connected with an isolation terminal so as to induce a much amount of an induced signal. CONSTITUTION: Main signal lines(62a,62b) consist of a conduction pattern formed on a dielectric layers(52,53) and have an input terminal and an output terminal, respectively. A coupling signal line(63b) consists of a conduction pattern formed on a dielectric layer(55) and has a coupling output terminal(C/O) and an isolation terminal(T). A coupling signal line(63a) consists of a conduction pattern formed on a dielectric layer(53) is opened such that a capacitance coupling region(A) is formed at a line side connected with the isolation terminal(T).

Description

Multi-layer Directional Coupler {MULTILAYERED DIRECTIVITY COUPLER}

The present invention relates to a multi-layered directional coupler, in particular a multi-layered directional coupler to improve the direction by inducing a greater amount of induced signal to the coupling output stage by opening the line portion connected to the isolation end formed on the other end of the coupling signal line It is about.

The coupler used in mobile communication parts is to distribute the transmitted signal at a constant rate.In particular, a certain amount of signal is sampled from the output from the amplifier of the transmitter and transmitted to the automatic output controller so that the antenna always outputs a constant size. It is responsible for transmitting to the outside through. Recently, a coupler used in a mobile communication terminal is a chip coupler mainly having a directionality. In order to provide a sampled signal from a main signal line through a combined signal line, most signals are output to a coupling output terminal provided at one end of the combined signal line. The other end has a structure connected to the isolation terminal. As such, the characteristic that the induced signal is provided only in the intended specific direction, that is, in the direction of the coupling output stage, is called directivity.

In general, the directional coupler is implemented in the form of a multilayer directional coupler composed of a plurality of laminated dielectric layers. 1A and 1B are exploded and schematic perspective views showing a conventional multilayer directional coupler.

Referring to FIG. 1A, ground patterns 21 and 24 are formed on the lowermost dielectric layer 11 and the upper dielectric layer 16, respectively. Two dielectric layers 12 and 13 having main signal lines 22a and 22b are formed on the lower dielectric layer 11, respectively. The two signal lines 22a and 22b are connected to each other through the via hole h1 formed in the dielectric layer 13. In addition, two dielectric layers 14 and 15 having coupling signal lines 23a and 23b are formed on the dielectric layer 13, respectively. The coupling signal lines 23a and 23b are via holes 20b formed in the dielectric layer 10e. Are connected to each other. A dielectric layer 16 having a ground pattern 24 is disposed on the dielectric layer 15, and an upper cover 17 made of a dielectric material is positioned thereon, and the layers are bonded to each other to form side terminals, such as in FIG. 1B. The directional coupler is completed.

Referring to FIG. 1B, a terminal portion is formed on a side surface of the laminated structure in which the dielectric layers 11-17 are bonded to each other. Corresponding to the position of each end of the signal line shown in Figure 1a, the input terminal (IN) and output terminal (OUT) and the first ground terminal (GP1) of the main signal line is formed on the front of the laminated structure, the combined signal on the rear The coupling output terminal C / O, the isolation terminal T, and the second ground terminal GP2 of the line are formed.

Such a conventional multilayer directional coupler is characterized by its coupling properties and its isolation. The coupling degree is determined by the thickness of the main signal line and the dielectric layer of the coupling signal line and the inductance value formed by each signal line, and different values are required depending on the product. It is an important factor that determines the performance of the coupler, which determines the direction of sending.

Conventionally, in order to induce a signal to the coupling output terminal of the coupling signal line, an isolation terminal is formed to consider the design so that the signal is not directed in the opposite direction of the coupling output terminal. However, this method has a limitation in improving the directional characteristics.

Recently, in accordance with the trend of multifunctionalization of mobile communication terminals, dual band couplers for processing signals for different frequency bands have been developed. 2 is an equivalent circuit diagram of a dual band coupler. The first main signal line 10 and the second main signal line 20 are provided to receive signals of different frequency bands, and the combined signal line 30 receives a predetermined amount of signals derived from each main signal line at one end. Provided to the coupling output stage (C / O) prepared. However, since the first main signal line 10 and the second main signal line 20 are combined with each other and the signal is induced at different positions, the first and second main signal lines ( One of the main signal lines 10 and 20 is located at a portion relatively closer to the isolation stage T. Therefore, the main signal line adjacent to the isolation stage T may be relatively deteriorated. In general, such a difference in directionality has a problem of generating a larger difference when the directionality of the coupler itself is low.

As such, in addition to the conventional single band coupler, there is a need for a method of improving the directivity in the dual band coupler so that signals derived from all main signal lines can be transmitted in a desired coupling output terminal direction.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and its object is to open a line portion connected to an isolation stage formed at one end of a combined signal line to induce a larger amount of induced signals to the coupled output stage, thereby improving directionality. To provide a directional coupler.

1A and 1B are exploded and schematic perspective views showing a conventional multilayer directional coupler structure.

2 is an equivalent circuit of a typical dual band coupler.

3 is an exploded perspective view showing a multi-layered directional coupler structure according to an embodiment of the present invention.

4 is an exploded perspective view showing a dual band coupler structure according to another embodiment of the present invention.

<Code Description of Main Parts of Drawing>

61,64: Grounding pattern

62a, 62b: main signal line

63a, 63b: Combined signal line

According to an aspect of the present invention, there is provided a multi-layered directional coupler formed of a laminated structure in which a plurality of dielectric layers are stacked, wherein at least one of the plurality of dielectric layers is formed in a conductive pattern, and both ends thereof are connected to an input terminal and an output terminal, respectively. A main signal line of and a conductive pattern formed on an upper surface of at least one other dielectric layer of the plurality of dielectric layers, the both ends of each of the coupling signal lines being coupled to a coupling output terminal and an isolation terminal, wherein the coupling signal lines are connected to each other. Provided is a multi-layered directional coupler opened at predetermined intervals to form a capacitance coupling on one side connected to the stage.

In one embodiment of the present invention, the present invention can also be applied to a dual band coupler having a main signal line consisting of a first main signal line and a second main signal line. The dual band coupler may include at least one dielectric layer on which the first main signal line and the second main signal line are respectively stacked on or under the at least one other dielectric layer on which the coupling signal line is formed. At least one other dielectric layer in which the coupling signal line is formed may be stacked between at least one dielectric layer in which the first main signal line and the second main signal line are respectively formed. In both of these embodiments, a capacitance coupling may be formed on one side connected to the isolation stage according to the present invention.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

3 is an exploded perspective view of a multilayer directional coupler according to an embodiment of the present invention. Referring to FIG. 3, ground patterns 61 and 64 are formed on the lower first dielectric layer 51 and the upper sixth dielectric layer 56, respectively. Second and third dielectric layers 52 and 53 having main signal lines 62a and 62b are formed on the sixth dielectric layer 51, respectively. One end of the main signal line formed on the second dielectric layer 52 extends to the side to form an output terminal OUT, and one end of the main signal line formed on the third dielectric layer 53 similarly forms an input terminal IN. The two signal lines 62a and 62b are connected to each other through the via hole h11 formed in the third dielectric layer 53.

In addition, fourth and fifth dielectric layers 54 and 55 having coupling signal lines 63a and 63b are formed on the third dielectric layer 53, respectively. An isolation end T is formed at one end of the coupling signal line 63a formed in the fourth dielectric layer 54, and a coupling output end C / is formed at one end of the coupling signal line 63b formed in the fifth dielectric layer 55. O) is formed. The combined signal lines 63a and 63b are connected to each other through a via hole h12 formed in the fourth dielectric layer 54.

Finally, the dielectric layer 56 having the ground pattern 64 is positioned on the dielectric layer 55, and the top cover 17 made of the dielectric material is positioned thereon.

A characteristic of the present invention is that the line portion A connected to the isolation end T is opened in the combined signal line 63a formed in the fourth dielectric layer 54. That is, an open region A having a predetermined interval is formed in the conductive pattern formed in the line portion connected to the isolation end T.

The multilayer directional coupler having such an open area A has a more improved directionality. In more detail, one end of the combined signal line 63a may be formed as an isolation stage T to direct the signal induced from the main signal line 62b to the combined output terminal C / O. However, some signals may be directed to the isolation stage T, which may reduce the directivity of the coupler. In order to solve this problem, in the present invention, capacitance coupling occurs by opening a line connected to the isolation end T at a predetermined interval, such as the open area A. Therefore, since the impedance at the isolation end side becomes very high, it is possible to send a larger amount of signal to the combined signal line.

The shape of the combined signal line as shown in FIG. 3 can be easily applied to the dual band coupler. 4 illustrates an example implemented in a dual band coupler as another embodiment of the present invention.

Referring to FIG. 4, ground patterns 131 and 138 are formed in the first dielectric 121 and the eighth dielectric layer 128, and the first pillars connected to the via holes h21 are formed on upper surfaces of the second and third dielectric layers 122 and 123. The arc lines 132a and 132b are formed, and the fourth and fifth dielectric layers 125 and 126 are formed in the second main signal lines 134a and 134b connected to the other via holes h22.

As described above, the present exemplary embodiment may form the first main signal lines 132a and 132b and the second main signal lines 134a and 134b to process signals of two different frequency bands. The signal flowing through each main signal line is formed in the sixth and seventh dielectrics 126 and 127 and is induced in the coupling signal lines 136a, 136b and 136c connected to two via holes h23 and h24, and coupled to the coupling output terminal C / O. ) Will send out the signal.

However, in the case of the dual band coupler as described above, since the signal is induced from the first and second main signal lines at two different positions, there is a problem in that the direction is relatively reduced in the portion adjacent to the isolation stage T. Therefore, in order to further improve this direction, a portion of the coupling line portion connected to the isolation end T is opened as indicated by A in the same manner as in FIG. 3 to form a capacitance coupling. This greatly increases the impedance at the isolation stage and gives high directionality so that more signals are directed toward the coupled output stage.

The present invention described above is not limited by the above-described embodiment and the accompanying drawings, but by the appended claims. Therefore, it will be apparent to those skilled in the art that various forms of substitution, modification, and alteration are possible without departing from the technical spirit of the present invention described in the claims.

As described above, the multi-layered directional coupler according to the present invention can induce a larger amount of induced signal to the coupling output terminal by forming a capacitance coupling by opening the line portion connected to the isolation terminal formed at one end of the coupling signal line. Thus, a simpler manufacturing process can result in a coupler with higher directivity without changing the overall structure. In this manner, in the dual band coupler, the directionality of the first and second main signal lines can be largely eliminated by increasing the directivity.

Claims (3)

In the multilayer directional coupler consisting of a laminated structure in which a plurality of dielectric layers are laminated, At least one main signal line formed on the upper surface of at least one of the plurality of dielectric layers in a conductive pattern and connected at both ends thereof to an input terminal and an output terminal; And A conductive pattern is formed on a top surface of at least one other dielectric layer of the plurality of dielectric layers, and both ends thereof include coupling signal lines connected to a coupling output terminal and an isolation terminal, respectively. The coupling signal line is a multi-layered directional coupler opened at predetermined intervals so that a capacitance coupling is formed on the line side connected to the isolation end. The method of claim 1, The at least one main signal line includes a first main signal line and a second main signal line, And at least one dielectric layer on which the first main signal line and the second main signal line are formed, respectively, on top or bottom of at least one other dielectric layer on which the coupling signal line is formed. The method of claim 1, The at least one main signal line includes a first main signal line and a second main signal line, And at least one other dielectric layer in which the coupling signal line is formed between at least one dielectric layer in which the first main signal line and the second main signal line are formed, respectively.