KR20030038598A - The method of making the Fine Pitch Stencil used by Laser - Google Patents

The method of making the Fine Pitch Stencil used by Laser Download PDF

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Publication number
KR20030038598A
KR20030038598A KR1020030023858A KR20030023858A KR20030038598A KR 20030038598 A KR20030038598 A KR 20030038598A KR 1020030023858 A KR1020030023858 A KR 1020030023858A KR 20030023858 A KR20030023858 A KR 20030023858A KR 20030038598 A KR20030038598 A KR 20030038598A
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South Korea
Prior art keywords
laser
fine pitch
stencil
thin plate
pitch stencil
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KR1020030023858A
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Korean (ko)
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정해상
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정해상
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Priority to KR1020030023858A priority Critical patent/KR20030038598A/en
Publication of KR20030038598A publication Critical patent/KR20030038598A/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80—Etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE: A fine pitch stencil fabrication method is provided to reduce a shadow phenomenon by minimizing a hole size, an interval between holes, an hole integration and a stencil thickness and to coat an organic material uniformly. CONSTITUTION: A fine pitch stencil fabrication method comprises a step of half-etching a use portion on a fine pitch stencil to minimize a thickness of the fine pitch stencil and a step of processing a resultant structure using a laser. The fine pitch stencil fabrication method comprises a step of cutting a use portion of the first thin plate, a step of joining a cut portion with the second thin plate and a step of processing the use portion using a laser. The fine pitch stencil fabrication method comprises a step of processing the first metal thin plate using a laser and a step of coating the remaining portion except the use portion.

Description

Laser를 이용한 Fine Pitch Stencil 제작방법{The method of making the Fine Pitch Stencil used by Laser}Fine Pitch Stencil manufacturing method using Laser {The method of making the Fine Pitch Stencil used by Laser}

본 발명은 유기EL Display 제조 공정에 사용되는 Fine Pitch Stencil 제작방법에 관한 것으로, 더욱 상세하게는 금속박판(薄板)또는 유리박판(薄板)에 미세한 Hole을 Laser로 가공하여 유기물질을 증착시키는데 이용하고자 한다.The present invention relates to a method of manufacturing a fine pitch stencil used in an organic EL display manufacturing process, and more particularly, to use in depositing an organic material by processing a fine hole in a metal sheet or a glass sheet with a laser. do.

일반적으로 유기 물질을 증착하는데 사용되는 Fine Pitch Stencil은 Hole size가 작을수록, Hole의 집적(集積)도가 높을수록, 그리고 Stencil의 두께가 얇을수록 유기EL Display의 기능이 뛰어난데, 이는 일정 부분 안에 화소의 수가 많을수록 화질의 선명도가 높아지고 Stencil의 두께가 얇을수록 유기 물질 증착 시 Shadow 현상이 줄어들어 유기 물질의 도포가 균일하게 되기 때문이다.In general, the fine pitch stencil used for depositing organic materials is excellent in organic EL display as the hole size is smaller, hole density is higher, and the thickness of the stencil is thinner. This is because the higher the number, the higher the sharpness of the image quality, and the thinner the thickness of the stencil, the smaller the shadow phenomenon occurs when the organic material is deposited.

지금까지는 Fine Pitch Stencil 제작 시 Etching 방법이나 Electro-Forming방법으로 제작을 하였으나 두 방법 모두가 Hole의 집적(集積)화와 Stencil 두께에 대한 한계성을 지니고 있다. Etching에 의한 방법은 Hole과 Hole 사이의 간격이 30um(0.03mm)이하는 거의 불가능하며 또한 사각형의 모양이 구현되지 못하여 직각부분이 라운드 처리 되는 단점을 가지고 있다. Electro-Forming 방법은 니켈이 주성분이라 열에 약한 단점이 있으며, 또한 Hole과 Hole 사이의 간격이 Stencil 두께의 90％ 밖에 되지 못하므로 Hole의 집적(集積)화에 어려움이 있고, 제작기간이 약 5일 정도 소요되어 생산일정에 대응하기가 쉽지 아니한 단점을 가지고 있다 할 수 있다.Up to now, the fine pitch stencil has been manufactured by etching or electro-forming method, but both methods have limitations on hole integration and stencil thickness. Etching method has a disadvantage that the spacing between holes is less than 30um (0.03mm), and the rectangular shape is not implemented so that the right angle is rounded. Electro-Forming method is weak in heat because nickel is the main component, and the gap between holes is only 90% of the thickness of the stencil, which makes it difficult to integrate the holes and the production period is about 5 days. It can be said that it has a disadvantage that it is not easy to cope with the production schedule.

본 발명은 상기와 같은 문제점을 해결하고자 Laser를 이용한다는 것이다. Laser는 속성상 재질이 얇을수록 가공성이 뛰어난 점을 이용하여 사용부위를 얇게 만든 후 Laser로 가공하고 나머지 부위는 찌그러짐이나 구겨짐을 방지하기 위하여 두께를 좀더 두껍게 하여 취급을 용이하게 한다. Laser로 가공 시 Hole과 Hole사이의 간격은 10um(0.01mm)이하도 가능하고, Hole size도 10um(0.01mm)이하도 가능하여 Hole의 집적(集積)화가 가능하다. 또한 지금까지는 Stencil 제작 시 금속재료를 이용하였으나 Laser 사용 시 유리박판도 가공이 가능하므로 재질선택의 폭도 넓어 졌으며, 또한 유리는 가공면 뿐만 아니라 표면도 균일하고 깨끗하여, 열에도 강하므로 유기EL Display 의 제작에 사용되는 Fine Pitch Stencil 로는 최적의 재질로 평가된다 하겠다.The present invention uses a laser to solve the above problems. The thinner the material, the better the processability, and the thinner the laser to be used.The laser is processed and the remaining part is made thicker to prevent crushing or wrinkling. When machining with laser, the distance between the hole and the hole can be less than 10um (0.01mm), and the hole size can be less than 10um (0.01mm), so the hole can be integrated. In addition, until now, metal materials have been used in the fabrication of stencils, but glass thin plates can be processed when using lasers, so the range of material selection has been expanded. In addition, the glass is not only processed, but the surface is uniform and clean, and it is also resistant to heat. Fine Pitch Stencil is used to evaluate the optimum material.

도1은 Half-Etching 한 후 제작 방법1 is a manufacturing method after half-etching

도2는 두개의 박판을 이용한 제작 방법2 is a manufacturing method using two thin plates

도3은 박판 가공 후 도금하는 방법Figure 3 is a method of plating after thin plate processing

이하 첨부된 도면에 의해 상세히 설명하면 다음과 같다.Hereinafter, described in detail by the accompanying drawings as follows.

도1은 금속 박판에 미세 Hole이 들어갈 부위만 Half-etching을 하여 Stencil의 두께를 최소화한 다음에 그 부위에 Laser로 미세 Hole들을 가공하는 방법이다.1 is a method of processing fine holes with a laser after minimizing the thickness of a stencil by half-etching only a portion of a metal hole into a metal sheet.

도2는 금속이나 유리 박판 두개를 이용하여 하나는 미세 Hole이 들어갈 부위를 절단한 다음 다른 하나와 결합하여 미세Hole을 Laser로 가공하는 방법이다.Figure 2 is a method of cutting a fine hole by using a metal or glass thin plate two to cut a portion to enter a fine hole and then combine with the other one by a laser.

도3은 금속박판을 Laser로 가공 후 미세 Hole 부위만을 제외하고 나머지 부분을 도금하여 취급이 용이하도록 하는 방법이다.Figure 3 is a method for easy handling by plating the remaining portion except for the minute hole after processing the metal thin plate with a laser.

이렇게 미세 Hole 부위의 두께는 얇게 하고 다른 부위는 좀더 두껍게 하는 이유는 Stencil이 너무 얇으면 쉬 찌그러지고 구겨지므로 이를 방지하고자 전채적인 두께는 두껍게 하고 미세 Hole 가공부위만 좀더 얇게 하여 Laser의 가공성을 높이고, 또한 Shadow 현상을 줄여 유기 물질의 도포가 균일하게 이루어지게 하기 위함이다.This is because the thickness of the micro hole area is made thinner and other parts are thicker. The stencil is so thin that it is easily crushed and crumpled. In addition, it is to reduce the shadow phenomenon and to uniformly apply the organic material.

이상에서 상술한 바와 같이 본 발명은 유기 EL Display에서 화질의 선명도를 좌우하는 Pixel의 최소화와 집적(集積)도를 높였으며, 두께의 최소화로 Shadow현상을 줄였고, 제작기간을 대폭 단축한 것이 특징이며 또한 유리박판의 소재를 개발해 내어 소재의 폭을 넓혔을 뿐만 아니라 지금까지의 소재보다는 열에 더 강한 강점을 지녀 Stencil의 수명을 더 길게 했다는데 있다.As described above, the present invention has improved the minimization and integration degree of pixels, which influence the clarity of the image quality in the organic EL display, reduced the shadow phenomenon by minimizing the thickness, and greatly shortened the production period. In addition, the material of glass sheet was developed to extend the width of the material, and it has a stronger strength to heat than the material so far to extend the life of Stencil.

Claims (1)

1과 같이 금속박판을 사용부위만 Half-etching하여 Laser를 이용하여 미세 Hole를 가공하는 방법,As shown in Fig. 1, half-etching only the part using a metal thin plate to process fine holes using a laser, 도2와 같이 금속이나 유리 박판 두개를 이용하여 하나는 미세 Hole이 들어갈 부위를 절단한 다음 다른 하나와 결합하여 미세Hole을 Laser로 가공하는 방법,Using two metal or glass thin plates as shown in Figure 2 one by cutting a portion to enter the fine hole and then combined with the other to process the fine hole with a laser, 도3과 같이 금속박판을 Laser로 가공 후 미세 Hole 부위만을 제외하고 나머지 부분을 도금하여 취급이 용이하도륵 하는 방법.Method for easy handling by plating the remaining portion except for the fine hole portion after processing the metal thin plate with a laser as shown in FIG.
KR1020030023858A 2003-04-15 2003-04-15 The method of making the Fine Pitch Stencil used by Laser KR20030038598A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9595674B2 (en) 2015-02-24 2017-03-14 Samsung Display Co., Ltd. Method of manufacturing mask
US9972810B2 (en) 2015-12-04 2018-05-15 Samsung Display Co., Ltd. Method of manufacturing mask assembly using electroforming and laser processes and method of manufacturing display apparatus using mask assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9595674B2 (en) 2015-02-24 2017-03-14 Samsung Display Co., Ltd. Method of manufacturing mask
US9972810B2 (en) 2015-12-04 2018-05-15 Samsung Display Co., Ltd. Method of manufacturing mask assembly using electroforming and laser processes and method of manufacturing display apparatus using mask assembly

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