KR20030038047A - Semiconductor manufacturing apparatus for semiconductor wafer back grinding - Google Patents

Abstract

PURPOSE: A semiconductor device manufacturing apparatus for a back grinding process is provided to be capable of easily replacing a grinding plate at a grinding body by using a magnetic connection member. CONSTITUTION: A plurality of grinding pedestals(51) are installed on a substrate support table(50) for loading a semiconductor substrate. A grinding assembly(40) is installed at the upper portion of the substrate support table(50), wherein the grinding assembly(40) is provided with a grinding plate(43) for grinding the rear surface of the semiconductor substrate and a grinding body(41) having a revolving member for rotating the grinding plate(43). A magnetic connection member is located between the grinding plate(43) and the grinding body(41) for connecting between the grinding plate and body. Preferably, the magnetic connection member includes the first magnetic substance installed at the grinding plate(43) and the second magnetic substance installed at the grinding body(41).

Description

Semiconductor manufacturing apparatus for semiconductor wafer back grinding}

The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a semiconductor manufacturing apparatus for a backside lapping process.

The backgrinding process is polished to a thickness thin enough to mount the back side of the semiconductor substrate to the package so that it can be easily mounted on the package after the device forming process is completed on the semiconductor substrate before the packaging process. It is a process to do it. Such a back grinding process includes a taping process for attaching a tape to a front surface of a semiconductor substrate, a grinding process for polishing a back surface of a semiconductor substrate, and a tape attached to a front surface of a semiconductor substrate. It consists of three processes, the tape removing process. The semiconductor manufacturing apparatus used in the grinding process includes a support for stably supporting the semiconductor substrate, and a grinding assembly provided on the upper portion of the semiconductor substrate so as to polish the lower surface of the semiconductor substrate. The polishing assembly may include a polishing body provided at an upper portion spaced apart from the semiconductor substrate by a predetermined distance, a plate-shaped polishing plate provided at a lower portion of the grinder mount to be in contact with the lower surface of the semiconductor substrate, and the polishing And a rotating member mounted to the polishing body to rotate the plate.

5 is a cross-sectional view illustrating a polishing assembly of a semiconductor manufacturing apparatus for a conventional backgrinding process. Referring to this, in order to bond between the polishing body 141 and the polishing plate 143, a bolt hole 1412 is formed in the polishing body 141 through the polishing body 141, and the bolt hole 1412 and Correspondingly, a nut hole 1413 is formed in the upper plate surface of the polishing plate 143 to be recessed to a predetermined depth. Thus, the bolt member 1411 is used to pass through the bolt hole 1412 of the abrasive body 141 to be coupled to the nut hole 1413 of the abrasive plate 143.

However, in the conventional polishing assembly 140, the bolt member 1411 is aligned with the lower surface of the polishing body 141 whenever the polishing plate 143 is mounted on the polishing body 141. Since it is necessary to fasten with the nut hole 1413 by using, since the degree of tightening the bolt 1 member 1411 is different for each person in charge of maintenance, it is never easy to match the horizontal leveling (leveling) of the abrasive plate 143. Therefore, when the polishing plate is replaced during regular maintenance or irregular maintenance of the equipment, the maintenance time is high and the contents of the work are difficult.

Accordingly, the technical problem to be achieved by the present invention is to configure the polishing plate of the semiconductor manufacturing apparatus for the backgrinding process of the semiconductor substrate to be easily detached from the polishing body, so that the regular maintenance of the equipment is easy and the time and cost required It is to provide a backgrinding semiconductor manufacturing apparatus that can reduce the.

1 is a schematic plan view of a semiconductor manufacturing apparatus for a backgrinding process according to the present invention.

2 is a cross-sectional view of a semiconductor manufacturing apparatus for a backgrinding process according to the present invention.

3A and 3B are cross-sectional views illustrating a state in which a polishing plate and a polishing body of a polishing assembly are separated from each other in a semiconductor device for a backgrinding process according to the present invention.

4A to 4B are schematic cross-sectional views showing the formation of a magnetic field when the abrasive plate and the abrasive body are bonded to and separated from each other.

5 is a cross-sectional view illustrating a polishing assembly of a semiconductor manufacturing apparatus for a conventional backgrinding process.

In order to achieve the above technical problem, the semiconductor manufacturing apparatus for the backgrinding process of the present invention, a substrate support having at least one polishing table on which the semiconductor substrate can be placed, and is installed on the substrate support, and on one side thereof, A polishing assembly having a polishing body mounted to face the back surface of the semiconductor substrate, the polishing body having a rotating member for rotating the polishing plate on the other side thereof, and provided between the polishing plate and the polishing body to be mutually fastened by magnetism. It includes a magnetic fastening member arranged to be.

Here, the abrasive plate is formed in a circular plate shape, and a plurality of abrasive protrusions are formed in the edge region along the outer circumference of the cylinder. The abrasive projections contain diamond particles and are effective for polishing silicon semiconductor substrates.

In addition, the polishing body and the polishing plate are formed such that the sex contact portions are unevenly coupled, so that the mating coupling is easy. That is, the abrasive body has an iron-shaped coupling portion formed, and the abrasive plate is formed with a concave-shaped receiving portion to mutually uneven coupling.

The magnetic fastening member is provided with a first magnetic body having a magnet of one pole provided on the polishing plate, and a second magnetic body having a magnet of the other pole is provided in the polishing body so that the magnetic coupling can be performed. One of the first magnetic body and the second magnetic body includes a magnetic pad formed of a magnetic material, and is formed of a permanent magnet made of a paramagnetic body. On the other hand, the polishing plate or the entire polishing body may be formed of a first magnetic body rather than a pad type. In this case, it is preferable that the magnetic pad is attached to the polishing plate to reduce the manufacturing cost.

The second magnetic body of the polishing body is a magnetic generator capable of generating a magnetic field arbitrarily, and includes a magnetic field adjusting device composed of an electromagnet and capable of arbitrarily adjusting the direction of the magnetic field. At this time, the magnetic field regulating device includes a direct current magnetic field converter for changing the direction of the magnetic field by adjusting the direction of the direct current, so that when the bonding plate and the polishing body are combined, they are adjusted to have opposite magnetic poles, When separating, it is possible to adjust the magnetism of the polishing body so that the same magnetic pole as that of the abrasive plate is formed.

Thus, the present invention provides a magnetic fastening means between the abrasive plate and the abrasive body of the polishing assembly, so that it is easy to handle when the abrasive plate is separated from or bonded to the abrasive body. This can greatly improve equipment utilization and productivity.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention; However, embodiments of the present invention illustrated below may be modified in many different forms, and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.

1 is a schematic plan view of a semiconductor manufacturing apparatus for a backgrinding process according to the present invention. As illustrated, the semiconductor manufacturing apparatus for the backgrinding process of the present invention includes a loading unit 10 capable of raising a cassette 101 containing a plurality of semiconductor substrates, and a substrate half for inverting the semiconductor substrate 100 to the rear surface. The electric support 20, the substrate support 50 for placing the back surface of the semiconductor substrate 100, and the polishing assembly 40 provided on the substrate support 50 for polishing the back surface of the semiconductor substrate 100. ).

2 is an enlarged cross-sectional view of the polishing body and the polishing plate of the polishing assembly in order to explain the semiconductor manufacturing apparatus for the backgrinding process of the present invention in detail.

Referring to this, the substrate support 50 is formed in a circular plate shape, and at least one polishing plate 51 formed in a circular plate shape is formed on the upper plate surface so that the semiconductor substrate 100 can be placed thereon. The polishing table 51 has an area to place one semiconductor substrate, and an annular support portion 511 formed of a synthetic resin of rubber material is formed on at least part of the surface of the polishing table 51. Typically, the polishing table 511 is composed of a plurality of about four, the substrate support 50 is rotated to position the polishing substrate 40 to selectively polish the semiconductor substrate of each polishing table 511. Convert.

3A to 3B are cross-sectional views illustrating a state in which the polishing plate and the polishing body of the polishing assembly are separated from each other.

Referring to these, as shown in the drawing, the polishing assembly 40 is installed on the upper side of one side of the substrate support 50 at a predetermined distance, and has a cylindrical polishing body 40 and one side of the polishing body 40. The lower surface includes an abrasive plate 43 provided, and a rotation drive device (not shown) installed on the other side to rotate the abrasive plate 43. The abrasive plate 43 is formed in a circular plate shape similarly to the shape of the semiconductor substrate, and a plurality of abrasive protrusions 431 protrude downward from the plate surface on the lower surface of the abrasive plate 43 facing the semiconductor substrate. It is. Here, the grinding protrusion 431 is a diamond wheel (DIAMOND WHEEL) containing a powder of diamond. Thus, the semiconductor substrate matrix silicon made of a very hard material can be easily polished.

The upper surface of the abrasive plate 43 is formed with a concave shape receiving portion 433 which is recessed a predetermined depth from the plate surface, the magnetic surface of the receiving portion 433 is provided with a magnetic first magnetic material 435 have. The first magnetic body 435 is a magnetic pad 435 formed of a magnetic material, and is attached to occupy at least a portion of the area on the plate surface of the receiving portion 433. The magnetic pad 435 is formed of a permanent magnet. The plate surface portion always shows the magnetism of the N or S pole. On the other hand, the abrasive plate 43 may be formed of a magnetic material as a whole body.

The polishing body 41 has a coupling portion 411 protruding from the plate surface so as to be coupled to the receiving portion 433 of the polishing plate 43 on the surface corresponding to the substrate support 50. The second magnetic body 413 is formed in the coupling portion 411. The second magnetic body 413 is equipped with a magnetic field generating device 413 so as to form an appropriate magnetic pole on the surface of the coupling portion 411 in response to the magnetic pole of the polishing plate 43. Here, when the magnetic field generating device 413 applies a DC voltage as an electromagnet, an N pole or an S pole is formed on the plate surface of the coupling portion 411 of the polishing body 41. In addition, the magnetic field generating device 413 includes a magnetic field converting device (not shown) that can change the direction of the magnetic field by using a DC current, and can change the magnetic properties of the second magnetic body 413 arbitrarily. Thus, the abrasive plate 43 may be attached to the abrasive body 41 to be coupled and separated.

4a and 4b are schematic cross-sectional views showing the bonding and separation of the abrasive plate and the abrasive body.

Referring to FIG. 4A, when the polishing plate 43 is to be coupled to the coupling portion 411 of the polishing body 41, the magnetic pad 534 of the polishing plate 43 has an N pole (or S pole) of polarity. In the case of a pole, the magnetism of the plate surface of the coupling portion 411 of the abrasive body 41 is formed as the S pole (or N pole), which are opposite poles, so as to be inside the receiving portion 433 of the abrasive plate 43. Coupling portions 411 of the abrasive body 41 are bonded to each other by magnetic attraction.

On the contrary, if the abrasive plate 43 is to be separated and disassembled from the coupling part 411 of the abrasive body 41, referring to FIG. 4B, the abrasive plate 43 and the abrasive body 41 are polished in a combined state. When the electric field is applied to the magnetic field generating device 413 so that the pole of the main body 41 is formed to the same N pole as the abrasive plate 43, magnetic mutual repulsion is generated and the abrasive plate 43 is removed from the abrasive body 41. Can be easily separated.

In the semiconductor manufacturing apparatus for the backgrinding process of the semiconductor substrate of the present invention having the above-described configuration, when the process proceeds, the semiconductor substrate is moved to the substrate inverter 20 from the cassette 101 mounted on the loading section 10. Let's do it. Then, the substrate inverter 20 flips the back side of the semiconductor substrate upward, and the substrate transfer device 30 puts it on the polishing table 51 of the substrate support 50. Then, the polishing assembly 40 installed above the substrate support 50 moves downward toward the substrate support 50 so that the polishing plate 43 is the semiconductor of any one of the polishing tables 511 of the substrate support 50. Make contact with the substrate. As the polishing plate 43 rotates, the polishing protrusion 431 polishes the silicon on the back surface of the semiconductor substrate to remove the predetermined thickness. Usually several hundred um is left out. Then, the semiconductor substrate is moved to the cassette 101 of the loading unit 10 using the substrate transfer device 30. When this backgrinding process is repeated for a long time and the time for replacing the polishing plate 43 is changed, the polishing plate 43 is separated from the polishing body 41. At this time, the polarity of the magnetic field generating device is generated in the same manner as the abrasive plate 43, and the abrasive plate 43 is separated and removed from the abrasive body 41 by magnetic repulsion. Then, after aligning with the receiving portion 433 of the new polishing plate 43 and the coupling portion 411 of the polishing body 41, the magnetic field of the magnetic field generating device is generated at a different polarity than that of the polishing plate 43 to obtain a suction force. Combine. Then, the replacement operation is completed.

As described above, the back grinding semiconductor device of the present invention is separated and bonded by using a magnetic field box when the abrasive plate is replaced, so that the work is easy, the replacement time is shortened, and the device is easy to maintain. It has the advantage of being less expensive.

On the other hand, the semiconductor manufacturing apparatus for the backgrinding process of the present invention, unlike the embodiment described above, is equipped with a magnetic pad formed of a magnetic material as a second magnetic body on the polishing body (41 in Fig. 2), and the polishing plate (Fig. 2). 43) may be constructed by mounting a magnetic field generating device as the first magnetic body.

In addition, magnetic pads formed of permanent magnets are mounted on both sides, and the magnetic pads on one side are configured to switch directions, so that the magnetic body (41 in FIG. 2) and the polishing plate (43 in FIG. 2) are controlled by magnetic force. It can also be combined and separated.

In addition, the magnetic pad 435 formed on the abrasive plate (43 in Fig. 2), as in this embodiment, may be in the form of a pad on the plate, in addition to the bar magnet group in which a plurality of bar-shaped magnets are arranged It may be. In addition, a metal pad made of only a magnetic metal belonging to a transition metal such as iron in which the magnetic pad is attracted to the magnet may be applied.

As described above, the semiconductor manufacturing apparatus for the backgrinding process of the present invention is configured to be fastened by using magnetism between the abrasive body and the abrasive plate, thereby facilitating mounting and detachment of the abrasive plate and the abrasive body. It can facilitate regular maintenance or irregular maintenance.

In addition, when the abrasive plate is replaced, the attachment and detachment with the abrasive body is convenient, so that fewer errors are required during maintenance and the time required for equipment maintenance is shortened, thereby improving the operation rate of the equipment.

Claims (14)

A substrate support having at least one polishing table on which a semiconductor substrate can be placed; A polishing assembly installed on an upper portion of the substrate support, having an abrasive body on one side of which is mounted an abrasive plate for polishing the rear surface of the semiconductor substrate and on the other side accommodating a rotating member for rotating the abrasive plate; And a magnetic fastening member provided between the abrasive plate and the abrasive body, respectively, and disposed so as to be fastened to each other by magnetism. The apparatus of claim 1, wherein the polishing plate has a plurality of polishing protrusions formed in an edge region of the circular plate along a circumferential outer surface thereof. The apparatus of claim 2, wherein the abrasive protrusion comprises diamond particles. 2. The semiconductor manufacturing apparatus for a backgrinding process according to claim 1, wherein the polishing body and the polishing plate have concave-convex contact portions. 5. The apparatus of claim 4, wherein the abrasive body has an iron-shaped coupling portion formed with a recessed portion in the abrasive plate. The method of claim 1, wherein the magnetic fastening member. A first magnetic body having a magnet of one pole provided on the polishing plate; And And a second magnetic body having magnetic properties of the other electrode provided in the polishing body. The apparatus of claim 6, wherein at least one of the first magnetic body and the second magnetic body is a magnetic pad formed of a magnetic material. The apparatus of claim 7, wherein the first magnetic material is a magnetic pad. 10. The apparatus of claim 8, wherein the magnetic pad is formed of a permanent magnet which is paramagnetic. The apparatus of claim 6, wherein at least one of the first magnetic body and the second magnetic body is a magnetic generator. The apparatus of claim 10, wherein the second magnetic body is a magnetic generator capable of generating a magnetic field arbitrarily. 12. The semiconductor device according to claim 11, wherein the magnetic generator is an electromagnet. The apparatus of claim 10, wherein the magnetic generator includes a magnetic field converter capable of arbitrarily adjusting a magnetic field direction. The semiconductor device according to claim 13, wherein the magnetic field converter is a DC magnetic field converter which converts the direction of the magnetic field by adjusting the direction of the DC current.