KR20030037564A - Plasma display panel - Google Patents

Abstract

PURPOSE: A plasma display panel is provided to be capable of preventing a barrier rib and a dielectric layer from damaging by sticking the dielectric layer on the barrier rib, and securing a voltage margin and reducing charging errors by forming a uniform panel. CONSTITUTION: An upper substrate(38) and a lower substrate(30) are arranged opposite each other. A barrier rib(33) is formed between the upper substrate and the lower substrate to define a discharging space. An upper dielectric layer(36) is formed on the bottom of the upper substrate and a lower dielectric layer(32) is formed between the lower substrate and the barrier rib. The upper and the lower dielectric layers cover the electrodes formed on the upper and the lower substrate, and have a sticking unit(100) for contacting closely with a longitudinal end of the barrier rib.

Description

Plasma display panel {Plasma display panel}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel, and more particularly, to a plasma display panel that controls a thickness of a dielectric layer corresponding to an end portion in a longitudinal direction of a partition wall to prevent breakage of the partition wall and dielectric breakdown of the dielectric layer.

In general, the conventional plasma display panel generates light by exciting a fluorescent material or a special gas, and forms an image by using the light. The AC type, the DC type, and the hybrid type In FIG. 1, an example of an AC plasma display panel is shown.

As shown, the plasma display panel includes a lower dielectric layer 12 formed on the lower substrate 10, the address electrode 11 formed on the lower substrate 10, and the lower substrate 10 on which the address electrode 11 is formed. And a partition wall 13 formed on the lower dielectric layer 12 to maintain a discharge distance and to prevent electro-optical crosstalk between cells. The barrier rib that prevents cross talk between the pixels may be formed in a strip type or a lattice shape. In addition, the barrier ribs 13 are coupled to the lower substrate 10 on which the barrier ribs 13 are formed, and the sustain electrodes 14 and 15 of a predetermined pattern are formed on the lower surface of the barrier ribs 13 so as to be orthogonal to the address electrodes 11, and the upper dielectric layers in which they are embedded 16) and an upper substrate 18 having an MgO film 17 formed on an upper surface of the upper dielectric layer 16, wherein at least one side of the discharge space partitioned by the partition 13 is formed of R, G, and B. The phosphor layer 19 is formed.

In the plasma display panel configured as described above, as a predetermined voltage is applied to each electrode, positive ions are accumulated in the lower dielectric layer 12, and these ions and one of the sustain electrodes 14 and 15 and the address electrode Preliminary discharge occurs between (11) to form charged particles, and a discharging occurs between sustain electrodes 14 and 15 formed on the upper substrate 18. The phosphor layer 19 is excited by the light rays generated at the time of discharging the kitchen to form an image.

Meanwhile, a method of manufacturing partition walls of such plasma display panels is disclosed in Korean Laid-Open Patent No. 2001-039033. In this method, the bulkhead is formed of two materials, and the lower bulkhead is formed of a material having a higher density than the upper bulkhead to reduce the amount of organic matter adsorbed on the bulkhead, and the upper bulkhead has a relatively low density. It is formed of a material lower than the partition wall to prevent destruction of the partition wall by external impact.

However, as shown in FIG. 2, in the case of firing the partition wall 13, both ends 13a and 13b in the longitudinal direction of the partition wall protrude and are formed higher than the central portion 13c. In this case, the protrusion 20 at the end portion in the longitudinal direction of the partition wall is not parallel to the upper dielectric layer 16 when combined with the upper dielectric layer 16 formed on the upper substrate 18 and thus MgO on the upper dielectric layer 16 or the upper dielectric. The problem is that the membrane 17 can be easily broken and the partition 13 can also be broken.

In addition, the contact between the partition 13 and the upper dielectric layer 16 is not in close contact with the protrusion 20 at the end portion in the longitudinal direction of the partition wall, and an empty space is formed therebetween, or the joining surface is not uniform. There is a problem that abnormal charging of the charge occurs and thereby overdischarge or misdischarge may occur.

In addition, when a part of the partition wall is broken, it may cause cell defects, which may cause cross talk between cells.

SUMMARY OF THE INVENTION The present invention has been made to solve the problems described above, and by forming a close contact with the dielectric so that the dielectric layer corresponding to the protrusion of the end portion in the longitudinal direction of the partition wall is in close contact with the partition wall to prevent breakage of the partition wall and dielectric breakdown of the dielectric. The purpose of the present invention is to provide a plasma display panel capable of securing a voltage margin and reducing overdischarge and misdischarge by forming a uniform panel.

1 is an exploded perspective view of a conventional plasma display panel;

Figure 2 is a side view showing that both ends in the longitudinal direction of the partition wall of Figure 1 protrudes higher than the central portion,

3A is an exploded perspective view of a plasma display panel according to an embodiment of the present invention;

3B is an enlarged side view of an end portion of a partition of the embodiment of FIG. 3A;

4 is an exploded perspective view of a plasma display panel coated differently from a form in which an upper dielectric layer of the embodiment of FIG. 3A is applied;

5 is an exploded perspective view of a plasma display panel according to another embodiment of the present invention;

6 is a top view illustrating a state in which the lower dielectric layer of the embodiment of FIG. 5 is applied;

7 is an exploded perspective view of a plasma display panel according to another embodiment of the present invention.

<Description of the reference numerals for the main parts of the drawings>

10, 30 ... bottom substrate 11, 31 ... address electrode

12, 32 Lower dielectric layer 13, 33 Bulkhead

13a, 33a ... end of bulkhead 13c, 33c ... central of bulkhead

14, 15, 34, 35 holding electrode 16, 36 upper dielectric layer

17, 37 ... Phosphor layer 18, 38 ... Upper substrate

39 ... fried glass 20, 40 ... projection

41 ... first zone 42 ... second zone

44.Reinforced bulkhead 100 ...

Plasma display panel according to an embodiment of the present invention for achieving the above object is formed between the upper and lower substrates facing each other, the partition wall formed between the upper and lower substrates to partition the discharge space, and the upper and lower substrates And upper and lower dielectric layers formed between the bottom surface of the upper substrate and the lower substrate and the partition wall so as to fill electrodes formed therein, and having close contact means for closely contacting end portions in the longitudinal direction of the partition wall. It is characterized by.

In addition, the contact means is characterized in that the corresponding portion of the upper dielectric layer corresponding to the protrusion of the end portion in the longitudinal direction of the partition wall is inclined.

In addition, the contact means is characterized in that only the corresponding portion of the upper dielectric layer corresponding to the protrusion of the end portion in the longitudinal direction of the partition wall is not applied.

In addition, the contact means is characterized in that the corresponding portion of the lower dielectric layer corresponding to the protrusion of the end portion in the longitudinal direction of the partition wall is not applied.

In addition, a reinforcing partition is formed in a portion of the lower dielectric layer to which the address electrode is exposed.

According to another aspect of the present invention, a plasma display panel includes a lower substrate, a predetermined address electrode formed on an upper surface of the lower substrate, and an upper surface of the lower substrate to bury the address electrode. A lower dielectric layer that is not applied to a portion corresponding to the protruding portion of the end portion in the longitudinal direction of the partition wall; a barrier rib formed in the lower dielectric layer to be parallel to the address electrode to partition a discharge space, and the lower portion by frittglass; An upper substrate which is combined with a substrate to form a discharge space, and is applied to the upper substrate and is applied from a portion corresponding to the central portion in the longitudinal direction of the barrier rib to a portion corresponding to the protrusion of the end portion in the longitudinal direction of the barrier rib and the protrusion portion. Corresponding portion includes an upper dielectric layer that is applied obliquely; The features.

Hereinafter, a plasma display panel according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 3A, a plasma display panel according to an exemplary embodiment of the present invention includes a lower substrate 30, predetermined address electrodes 33 formed on an upper surface 30a of the lower substrate 30, and the lower substrate 30. The lower dielectric layer 32 is formed on the upper surface 30a of the substrate 30. The address electrode 33 is buried in the lower dielectric layer 32. A partition wall 33 is formed on the lower dielectric layer 32 to partition the discharge space. An upper substrate 38 coupled to the lower substrate 30 to form a discharge space above the partition 33, and formed on the upper substrate 38 to form a predetermined angle with the address electrode 31. A plurality of pairs of sustain electrodes 34 and 35 formed of a set of first and second electrodes and an upper dielectric layer 36 formed on the upper substrate 38 to fill the sustain electrodes 34 and 35 are formed. do.

As described above, the lower substrate 30 having the partition 33 formed thereon is combined with the transparent upper substrate 38 to seal the space, and is sealed at the outer side by the frit glass 39. The plurality of sustain electrodes 34 and 35 formed of a transparent conductive material on the upper substrate 38 in a direction orthogonal to the address electrodes 31 are formed in a pair of first and second electrodes 34 and 35. Is formed. Bus electrodes 34a and 35a are formed along the first and second electrodes 34 and 35, respectively, to reduce line resistance. The bus electrodes 34a and 35a are made of metal such as aluminum, silver, silver alloy, and the like, and are formed to have a width narrower than that of the first and second electrodes 34 and 35. Red, blue and green phosphor layers 37 (R) (G) and (B) are formed on the inner surfaces of the spaces partitioned by the partition walls 33, respectively.

The upper dielectric layer 36 is formed with a close contact means 100 so that the end portion 33a in the longitudinal direction of the partition wall is in close contact. The contact means 100 is a corresponding portion 26 of the upper dielectric layer corresponding to the end portion 33a in the longitudinal direction of the partition wall. The counterpart 26 of the upper dielectric layer is formed to be inclined. The upper dielectric layer 36 is not formed outside the outer side 36a of the corresponding portion 26 of the upper dielectric layer. That is, in FIG. 3, the upper dielectric layer 36 is not coated from the frit glass 39 to the outer edge of the end portion 33a in the longitudinal direction of the partition wall. In the end portion 33a of the barrier rib in the longitudinal direction, the protruding portion 40 by the firing process is formed to about 20 μm in the longitudinal direction of the barrier rib 33. The upper dielectric layer 36 is coated to correspond to the protrusion 40 of the partition wall.

In detail, as shown in FIG. 3B, the protrusion 40 has a lower inner portion 40b having the same height as the central portion of the partition wall and a higher outer portion 40a of the protrusion 40 due to the firing process. 40 is formed to be inclined. That is, the portion 36a of the upper dielectric layer 36 corresponding to the outer side 40a of the protrusion is applied low, and the portion corresponding to the inner side 40b of the protrusion is the central portion 36c of the upper dielectric layer 36. Apply to the same height as). This formation is possible when the dielectric layer is printed one or more times while reducing the area of the screen mask rather than one time or one time firing. Therefore, when the barrier rib 33 and the upper dielectric layer 36 are coupled, both the protrusion 40 and the central portion 33c of the end portion of the barrier rib contact each other. In this case, since the contact area is widened, the bond is stabilized, thereby preventing the upper dielectric layer 36 and the MgO film formed thereon from being broken and preventing the partition wall from being broken. In addition, since the coupling between the partition 33 and the upper dielectric layer 36 is stabilized, overdischarge or misdischarge due to abnormal charging of the wall charge during address discharge does not occur.

Alternatively, as shown in FIG. 4, the contact means 100 is an upper dielectric layer 36 corresponding to the end portion 33a in the longitudinal direction of the partition wall, and corresponds to an upper portion corresponding to the protrusion 40 at the end of the partition wall. The upper dielectric is not applied only to the corresponding portion 36d of the dielectric layer. That is, it is not applied using a mask having a width of about 40 μm in the form of a strip provided in parallel with the sustain electrodes 34 and 35. Therefore, the upper dielectric is applied to a portion other than the corresponding portion 36d of the upper dielectric layer corresponding to the protrusion 40 at the end of the partition wall, and the upper dielectric is applied only to the corresponding portion 36d corresponding to the protrusion. It doesn't work. This is possible because the corresponding portion 36d corresponding to the protruding portion of the end portion of the partition wall is a non-discharge region and thus does not need to be coated with the upper dielectric.

Referring to the operation of the plasma display panel according to the present invention configured as described above are as follows.

First, when a predetermined pulse voltage is applied to one of the first and second electrodes 34 and 35 constituting the address electrode 31 and the sustain electrodes 34 and 35, an address discharge is generated therebetween to form an inner surface of the discharge space. Wall charges are formed. The wall charge generated at this time is charged on the surface of the dielectric layer between the first and second electrodes 34 and 35. In this case, abnormal charging may occur when there is an empty space or an uneven contact between the protrusion 40 of the end of the partition wall and the upper dielectric layer 36. Therefore, it is possible to prevent the occurrence of abnormal charging by applying the upper dielectric layer 36 to the same as the outline of the protrusion 40 of the end of the partition wall.

In this state, when a voltage is applied to the first and second electrodes 34 and 35 constituting the sustaining electrode, sustaining discharge occurs between them to generate a main beam. The discharge start voltage for the sustain discharge can be lowered by the charges charged between the partition walls 33. However, when the above abnormal charging occurs, the sustain discharge may be over discharge or mis discharge. Therefore, by applying the upper dielectric layer 36 in the same manner as the outline of the protrusion 40 at the end of the partition, the sustain discharge can be prevented from being over-discharged or mis-discharged.

The mother beam generated by the selected sustain discharge is excited by the phosphor layer 37 applied to the discharge space to emit light. In addition, since the discharge space is blocked by the close coupling between the partition 33 and the upper dielectric layer 36, cross talk between pixels can be prevented.

5 shows a plasma display panel according to another embodiment of the present invention. Here, the same reference numerals as in the above-described drawings refer to the same member having the same function, and are substantially the same as described above, and thus detailed description thereof will be omitted.

Referring to FIG. 5, a plasma display panel according to another exemplary embodiment of the present invention includes an upper substrate 38 and a plurality of pairs of sustain electrodes formed on the upper substrate 38 and having a set of first and second electrodes. 34 and 35 and an upper dielectric layer 36 formed on the upper substrate 38 to bury the sustain electrodes 34 and 35. The upper substrate 38 is combined with the lower substrate 30 at its edge by fritted glass 39 to form a discharge space between the upper substrate 38 and the lower substrate 39. A predetermined address electrode 31 having a predetermined angle with the sustain electrodes 34 and 35 is formed on the upper surface 30a of the lower substrate, and the lower dielectric layer 32 filling the address electrode 31 is formed on the upper surface 30a of the lower substrate. It is formed on the upper surface 30a of the lower substrate. A partition 33 is formed on the upper surface of the lower dielectric layer 32 to be parallel to the address electrode 31 to define a discharge space.

The lower dielectric layer 32 is formed with a close contact means 100 so that the end portion 33a in the longitudinal direction of the partition wall is in close contact. The contact means 100 is a corresponding portion 26 of the lower dielectric layer corresponding to the end portion 33a in the longitudinal direction of the partition wall.

It is not applied to the second region 42 which is a corresponding portion of the lower dielectric layer corresponding to the protrusion of the end portion in the longitudinal direction of the partition wall. In addition, as shown in FIG. 5, the lower dielectric layer 32 is also not applied to the first region 41 from the fritted glass 39 to the outer region of the end portion 33a in the longitudinal direction of the partition 33. . The lower dielectric layer 32 is applied from the outer edge of the partition 33a to the end 33a of the partition. The corresponding portion of the lower dielectric layer corresponding to the protruding portion 40 of the longitudinal end of the partition wall, that is, the second region 42 which is about 20 μm from the fritted glass 39 to a distance of 12.06 mm to 12.08 mm The lower dielectric layer 32 is not applied. The lower dielectric layer 32 is coated from the second region 42 to a portion corresponding to the central portion 33c of the partition wall. 6 illustrates a state in which the lower dielectric layer 32 is applied to the lower substrate 32.

In the firing process, the protrusions 40 formed by inflating the end portions 33a of the barrier ribs form an empty space in the coupling face between the end portions 33a of the barrier ribs and the upper dielectric layer 36, resulting in uneven coupling surfaces. In order to prevent this, the lower dielectric layer 32 is applied as described above. That is, the lower dielectric layer 32 is not applied to the second region 42 corresponding to the protrusion 40 of the partition wall. The second region 42 is formed in a strip shape in a direction parallel to the sustain electrodes 34 and 35.

In this case, a portion in which the address electrode 31 is exposed is formed in the second region 42. When the address electrode 31 is exposed to the discharge space, a normal plasma display panel does not operate by abnormal discharge. Therefore, in the process of forming the barrier rib layer at the time of forming the barrier rib and forming the barrier rib 33 by sandblasting at a predetermined interval thereafter, the address electrode 31 is exposed so that the address electrode 31 is not exposed. Reinforcing partition wall 44 to remain. Therefore, the address electrode 31 is not directly exposed to the discharge space by the reinforcing partition 44.

In addition, as shown in FIG. 7, the upper dielectric layer 36 and the lower dielectric layer 32 are simultaneously formed as described above, thereby preventing damage to the upper dielectric layer 36 and the partition wall 33 and abnormal charging of wall charges. It prevents the overdischarge caused by this, shortens the life of the panel and improves the product yield.

As described above, the plasma display panel according to the present invention forms a close contact with the upper dielectric layer corresponding to the end portion in the longitudinal direction of the partition wall so that both the end portion and the central portion of the partition wall in contact with the upper dielectric material are damaged. There is an advantage of preventing dielectric breakdown.

In addition, by forming a close contact with the lower dielectric layer corresponding to the end portion of the barrier rib in the longitudinal direction, the protrusion is formed at the end portion of the barrier rib in the longitudinal direction, thereby preventing breakage of the barrier rib and dielectric breakdown of the dielectric.

In this case, by securing a uniform panel, it is possible to secure voltage margins, reduce overdischarge, and misdischarge, thereby improving the yield of products and extending the life of the plasma display panel. have.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Could be. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (7)

Upper and lower substrates opposed to each other; Barrier ribs formed between the upper and lower substrates to partition discharge spaces; Upper and lower portions having a bottom surface of the upper substrate and the lower substrate and the partition wall so as to bury the electrodes formed on the upper and lower substrates, respectively, and the adhesion means for closely contacting the end portions in the longitudinal direction of the partition wall. A plasma display panel comprising a dielectric layer. The method of claim 1, And the adhesion means is a corresponding portion of the upper dielectric layer applied to be inclined to correspond to the protrusion of the end portion in the longitudinal direction of the partition wall. The method of claim 1, And said contact means corresponds to a protruding portion of the end portion in the longitudinal direction of the partition wall and is a corresponding portion of the upper dielectric layer which is not applied. The method according to any one of claims 1 to 3, And said contact means corresponds to a protruding portion of the end portion in the longitudinal direction of the partition wall and corresponds to a portion of the lower dielectric layer which is not applied. The method of claim 4, wherein And a reinforcing partition is formed at a portion of the lower dielectric layer to which the address electrode is exposed. A lower substrate; A predetermined address electrode formed on an upper surface of the lower substrate; A lower dielectric layer formed on an upper surface of the lower substrate and not embedded in a portion corresponding to the protruding portion of the end portion in the longitudinal direction of the partition wall; a lower dielectric layer formed on the lower dielectric layer to be parallel to the address electrode; A partition wall defining a discharge space; An upper substrate coupled to the lower substrate by frit glass to form a discharge space; An upper dielectric layer applied to the upper substrate and applied from a portion corresponding to the central portion in the longitudinal direction of the barrier rib to a portion corresponding to the protrusion of the end portion in the longitudinal direction of the barrier rib, and the portion corresponding to the protrusion portion is inclinedly coated; Plasma display panel characterized in that. The method of claim 6, And a reinforcing partition is formed at a portion of the lower dielectric layer to which the address electrode is exposed.