KR20030037168A - packaging structure and liquid crystal display devices using the same - Google Patents

Abstract

PURPOSE: A stacking structure and a liquid crystal display device in the structure are provided to widen the selection in the attaching position between a drive IC and a PCB by forming a COF or a TCP in the dual wire structure to be attached to a lower substrate of the LCD, thereby reducing the volume of the LCD. CONSTITUTION: A stacking structure of a liquid crystal display device includes a base film(110) having first and second contact holes(111,112), first signal wires(121) formed on the base film by a predetermined interval, second signal wires(122) formed on the base film corresponding to the first signal wires one by one, a driving IC(160) formed on the first and second signal wires in connection with the first and second signal wires, and third and fourth signal wires(123,124) respectively formed below the base film and connected to the first and second signal wires via the first and second contact holes.

Description

Packaging structure and liquid crystal display devices using the same}

The present invention relates to a liquid crystal display device, and more particularly, to a structure for mounting a driving circuit and a liquid crystal display device using the same.

Recently, with the rapid development of the information society, there is a need for a flat panel display having excellent characteristics such as thinning, light weight, and low power consumption, among which a liquid crystal display has a resolution, It is excellent in color display and image quality, and is actively applied to notebooks and desktop monitors.

In general, a liquid crystal display device arranges two substrates on which electrodes are formed so that the surfaces on which the two electrodes are formed face each other, injects a liquid crystal material between the two substrates, and applies a voltage to the two electrodes to generate an electric field. By moving the liquid crystal molecules, the image is expressed by the transmittance of light that varies accordingly.

In recent years, the liquid crystal display device has been characterized by light weight, thinness, low power consumption, and the like, and the image quality is being accelerated by the improvement of the liquid crystal material and the development of the fine pixel processing technology, and the application range is gradually getting wider. to be. The application range of the liquid crystal display device is an application device for a small high-precision display such as a project display such as a clock, an electronic desk calculator, a measuring instrument, and a notebook (personal computer) or a workstation. Background Art [0002] A wide range of applications are underway in large, multi-pixel display applications such as televisions. In particular, when a liquid crystal display device is used in a portable device such as a notebook computer, the liquid crystal display device should be manufactured in a portable type so as to be convenient for the user to carry.

The liquid crystal display includes a liquid crystal panel in which liquid crystal is injected between two substrates, a backlight disposed under the liquid crystal panel and used as a light source, and a driving unit for driving the liquid crystal panel, which is located outside the liquid crystal panel. The liquid crystal panel is composed of pixels arranged in a matrix between two glass substrates and a switching element that controls signals supplied to these pixels, that is, a thin film transistor.

Meanwhile, the driver is connected to a printed circuit board (PCB) on which components generating various control signals, data signals, and the like are mounted, and is connected to the liquid crystal panel and the printed circuit board to apply signals to the wiring of the liquid crystal panel. It includes a drive circuit (hereinafter referred to as a drive integrated circuit (IC)), a chip on glass (COG: chip on glass), a tape carrier package (TCP: tape carrier package) and chip on film (COF).

Since COG mounts the drive IC on the array substrate of the liquid crystal panel, the volume of the liquid crystal display device becomes large, whereas TCP or COF mounts the drive IC using a separate film, so that the film containing the drive IC is liquid crystal. It can be bent to the back of the panel to have a compact structure. Therefore, in recent years, TCP or COF is mainly used, and in general, TCP or COF also refers to the film itself in which the drive IC is embedded.

A schematic structure of a liquid crystal display using TCP or COF is shown in FIG. 1.

As shown in FIG. 1, the liquid crystal panel 10 includes an array substrate 11 and a color filter substrate 12, and a liquid crystal layer (not shown) is injected between the two substrates 11 and 12. . Here, since the array substrate 11 has a larger area than the color filter substrate 12, there is a portion that is not covered by the color filter substrate 12, and this portion provides a signal to the wiring of the liquid crystal panel 10. A pad (not shown) for application is located.

The pad of the array substrate 11 is connected to the TCP (or COF) 30, and the TCP (or COF) 30 includes a drive IC 31 for driving the liquid crystal panel 10. In addition, the TCP (or COF) 30 is also connected to the PCB 20.

Meanwhile, as described above, a backlight (not shown) used as a light source is disposed under the liquid crystal panel 10.

Anisotropic conductive film (ACF) is used to connect the liquid crystal panel and TCP (or COF), or to connect TCP (or COF) and PCB. ACF is a kind of thermosetting resin film containing small conductive particles.The ACF is attached on the pad of the liquid crystal panel to be conductively bonded, and the TCP (or COF) is adhered to the pad of the panel, and then thermally pressed to make electrical contact in the vertical direction. Becomes At this time, it is preferable to apply appropriate heat and pressure in consideration of the materials of TCP and ACF. TCP (or COF) and PCB can be connected in the same way.

As mentioned above, both TCP and COF have a compact structure because they can be bent and use a film, which is illustrated in FIG. 2. Here, since the metal wiring thickness of the COF is smaller than the metal wiring thickness of TCP, and thus advantageous in patterning, the COF may have a finer structure than that of TCP. Thus, an example in which COF is applied will be described below.

As shown in FIG. 2, the first and second substrates 41 and 42 are disposed to face each other, and the first and second polarizing plates 43 are disposed outside the first and second substrates 41 and 42. , 44), respectively. Here, since the area of the second substrate 42 and the second polarizing plate 44 is smaller than that of the first substrate 41, one end of the first substrate 41 is exposed. Next, a backlight 45 is disposed below the first polarizer 43, and one end of the COF 47 is connected to one exposed end of the first substrate 41, and the backlight 45 is connected from one end to the other. As the thickness of the structure is gradually changed, the thickness becomes thicker from right to left as shown. Meanwhile, the COF 47 includes a drive IC 46 on one surface in contact with the first substrate 41, and the other end of the COF 47 is connected to the PCB 48.

Here, the portion A of FIG. 2, that is, the portion of the COF 47 in which the drive IC 46 is formed is enlarged in FIGS. 3 and 4, which is an enlarged plan view of the portion A of FIG. 2, and FIG. 4. 3 is a cross-sectional view taken along line IV-IV in FIG. 3.

3 and 4, a plurality of first and second signal wires 52a and 52b extending in the horizontal direction and corresponding to one-to-one are formed on the base film 51, and the first and second signals are formed. Solder resists 53a and 53b are formed on the wirings 52a and 52b, respectively, and the solder resists 53a and 53b expose portions of the first and second signal wires 52a and 52b, respectively.

Next, bumps 54a and 54b are formed on the exposed first and second signal wires 52a and 52b, respectively, and the drive ICs 56 are disposed on the bumps 54a and 54b so that the first and second signals are provided. The wirings 52a and 52b and the drive IC 56 are connected through the bumps 54a and 54b.

Next, resins 55 are formed on both sides of the drive IC 56, so that the resin 55 includes solder resists 53a and 53b, first and second signal wires 52a and 52b, and bumps. 54a, 54b).

By the way, in the conventional COF, since the signal wirings 54a and 54b are formed only on one side of the base film 51, the PCB 48 and the drive IC 46 are formed of the first substrate (Fig. 2). 2), 41), which should be attached to one side of the COF (47 in FIG. 2). Therefore, the position and the area where the PCB 48 and the drive IC 46 are attached are limited so that the drive IC 46 and the PCB 48 are positioned under the backlight 45, and the second polarizing plate 44 and the Since the space B above the first substrate 41 exposed by the second substrate 42 cannot be used, the volume of the liquid crystal display device becomes large.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a liquid crystal display device having a compact structure using a mounting structure in which signal wirings are formed on both surfaces.

1 is a plan view of a conventional liquid crystal display device.

2 is a cross-sectional view of a conventional liquid crystal display device.

3 is an enlarged plan view of a portion A of FIG.

4 is a cross-sectional view taken along the line IV-IV of FIG. 3.

5 is a plan view of a COF according to a first embodiment of the present invention.

6 is a cross-sectional view taken along the line VI-VI in FIG. 5.

7A and 7B are cross-sectional views of a liquid crystal display device using a COF according to a first embodiment of the present invention.

8 is a plan view of a COF according to a second embodiment of the present invention.

9 is a cross-sectional view taken along the line VII-VII of FIG. 8.

10A and 10B are cross-sectional views of a liquid crystal display using COF according to a second embodiment of the present invention.

11 is a plan view of a COF according to a third embodiment of the present invention.

FIG. 12 is a cross-sectional view taken along the line II-II of FIG. 11. FIG.

13 is a cross-sectional view of a liquid crystal display device using a COF according to a third embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

110: base film 111: first contact hole

112: second contact hole 121: first signal wiring

122: second signal wiring 123: third signal wiring

124: fourth signal wiring 131: first solder resist

132: second solder resist 133: third solder resist

141, 142 bump 150 resin

160: Drive IC

In the mounting structure of the liquid crystal display according to the present invention for achieving the above object, the first signal wires are formed at a predetermined interval on the base film having the first contact hole, and are in parallel with the first signal wires and have a one-to-one correspondence. The second signal wiring is formed. A driving circuit connected to the first and second signal wires is disposed above the first and second signal wires, and a third signal wire connected to the first signal wire through the first contact hole is disposed below the base film. Formed.

The base film may further include a second contact hole under the second signal wire, and may further include a fourth signal wire connected to the second signal wire through the second contact hole under the base film.

In the liquid crystal display device using the mounting structure according to the present invention, the first polarizing plate is disposed under the first substrate, and the backlight is located under the first substrate. A second substrate exposing one side of the first substrate is disposed on the first substrate, and a second polarizing plate is disposed on the second substrate. Next, a mounting structure is connected to the exposed side of the first substrate, the mounting structure of which the first side is connected to the exposed side of the first substrate and one end to which the driving circuit is attached to the second side, and a printed circuit for generating a signal. The other end of the substrate is connected.

Here, the mounting structure is a) a base film having a first contact hole; B) first signal lines formed on the base film at regular intervals; C) a second signal wire formed on the base film and parallel to the first signal wire and corresponding one-to-one; D) a third signal line formed under the base film and connected to the first signal line through the first contact hole.

At this time, the printed circuit board may be connected to the second surface of the other end of the mounting structure, the other end of the mounting structure may be located under the backlight, or may be located on the side of the backlight.

In the present invention, the base film may further include a second contact hole under the second signal wire, and may further include a fourth signal wire connected to the second signal wire through the second contact hole under the base film.

In this case, the printed circuit board may be connected to the first surface of the other end of the mounting structure, and the other end of the mounting structure may be located under the backlight or on the side of the backlight.

In another liquid crystal display device using the mounting structure according to the present invention, the first polarizing plate is disposed under the first substrate, and the backlight is disposed below the first polarizing plate. A second substrate exposing one side of the first substrate is disposed on the first substrate, and a second polarizing plate is disposed thereon. The mounting structure is connected to the exposed side of the first substrate, and the mounting structure has one end connected to the exposed side of the first substrate on the first side and the other end to which the printed circuit board which generates the signal is connected to the second side. The driving circuit is connected to the first surface corresponding to the side surface of the backlight.

Here, the mounting structure is a) a base film having a contact hole; B) first signal lines formed on the base film at regular intervals; C) a second signal wire formed on the base film and parallel to the first signal wire and corresponding one-to-one; D) a third signal line formed under the base film and connected to the second signal line through a contact hole;

As described above, in the present invention, the mounting structure of the liquid crystal display device is formed by double wirings at the top and the bottom thereof, and it is attached to the lower substrate of the liquid crystal display device, whereby the selection position of the driving circuit and the printed circuit board can be widened. The volume of the liquid crystal display device can be reduced.

Hereinafter, a mounting structure and a liquid crystal display using the same according to the present invention will be described in detail with reference to the accompanying drawings.

5 and 6 illustrate a COF structure of a liquid crystal display according to a first exemplary embodiment of the present invention. FIG. 5 is a plan view of the COF structure, and FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG. 5. .

As shown in FIGS. 5 and 6, the first and second signal wires 121 and 122 extending in the horizontal direction and corresponding in one-to-one correspondence on the base film 110 having the first and second contact holes 111 and 112. ), And a plurality of first and second solder resists 131 and 132 are formed on the first and second signal wires 121 and 122, respectively. Here, the first and second solder resists 131 and 132 expose portions of the first and second signal wires 121 and 122, respectively.

Next, bumps 141 and 142 are formed on the exposed first and second signal wires 121 and 122, and the drive IC 160 is disposed thereon, so that the first and second signal wires 121 and 122 are disposed thereon. ) And drive IC 160 are connected via bumps 141 and 142.

Next, resins 150 are formed at both sides of the drive IC 160, and the solder resists 131 and 132, a part of the first and second signal wires 121 and 122, and the bumps 141 and 142 are formed. Covering.

Subsequently, third and fourth signal wires 123 and 124 are formed at the lower portions of the base film 110 at positions corresponding to the first and second signal wires 121 and 122, respectively. The signal wires 123 and 124 are connected to the first and second signal wires 121 and 122 through the first and second contact holes 111 and 112, respectively, and the third and fourth signal wires 123 and 124 are connected to each other. ), A third solder resist 133 is formed below.

7A and 7B illustrate the structure of a liquid crystal display using COF according to the first embodiment of the present invention.

As shown in FIG. 7A, there are first and second substrates 171 and 172 disposed facing each other and including a liquid crystal layer (not shown), and the first and second substrates 171 and 172. Outside of the first and second polarizing plates 173 and 174 are located, respectively. Here, since the area of the second substrate 172 and the second polarizing plate 174 is smaller than that of the first substrate 171, part of the first substrate 171 is exposed.

Next, a backlight 175 is disposed below the first polarizing plate 173. The backlight 175 has a structure in which the thickness of the backlight 175 becomes thicker from the lower portion of the exposed first substrate 171 to the opposite side from the right side of the drawing. COF 177a is attached to one end of the exposed first substrate 171. As described above, the COF 177a has signal wirings formed on both the upper and lower portions of the base film, and a first surface of one end of the COF 177a is in contact with the first substrate 171, and one end of the COF 177a. The drive IC 176a is connected to a second surface of the substrate, that is, the surface opposite to the surface in contact with the first substrate 171. Next, the other end of the COF 177a is bent and positioned below the backlight 175. The PCB 178a is connected to the first surface of the other end of the COF 177a.

As described above, in the liquid crystal display device using the COF according to the first embodiment of the present invention, signal wirings are formed on both sides of the base film so that the drive IC is positioned on the first substrate exposed by the second substrate and the second polarizing plate. do. Therefore, the volume of the liquid crystal display device can be reduced by placing the PCB under the thin portion of the backlight.

On the other hand, by using the COF according to the first embodiment of the present invention it is possible to arrange the PCB on the side of the first substrate, the first polarizing plate and the backlight. As shown in FIG. 7B, a COF 177b is attached to one end of the exposed first substrate 171. The COF 177b has signal wirings formed on both the upper and lower portions of the base film, and the COF 177b. ) The first surface of one end is in contact with the first substrate 171, and the drive IC 176b is connected to the second surface of one end of the COF 177b, that is, the surface opposite to the surface that is in contact with the first substrate 171. It is. The other end of the COF 177b is bent and positioned on the right side of the first substrate 171, the first polarizing plate 173, and the backlight 175. The first side of the other end of the COF 177b is connected to the PCB 178b. have. Therefore, in the present invention, it is possible to reduce the volume of the liquid crystal display device to have a compact structure.

In the first embodiment of the present invention, the signal wirings are formed by the upper and lower double wiring on both the left and right sides of the drive IC, but may be formed by the double wiring only on one side of the drive IC.

8 and 9 illustrate a COF according to a second embodiment of the present invention. FIG. 8 is a plan view of a COF according to a second embodiment of the present invention, and FIG. It is a cut section.

8 and 9, a plurality of first and second signal wires 221 and 222 extending in the horizontal direction and corresponding to one-to-one are formed on the base film 210 having the contact hole 211. First and second solder resists 231 and 232 are formed on the first and second signal wires 221 and 222, respectively. Here, the first signal wire 221 is positioned on the contact hole 211, and the first and second solder resists 231 and 232 expose portions of the first and second signal wires 221 and 222, respectively.

Next, bumps 241 and 242 are formed on the first and second signal wires 221 and 222, respectively, and a drive IC 260 is disposed thereon, so that the first and second signal wires 221 and 222 are disposed thereon. ) And the drive IC 260 are connected through bumps 241 and 242.

Next, resins 250 are formed at both sides of the drive IC 260 to partially solder the solder resists 231 and 232, the first and second signal wires 221 and 222, and the bumps 241 and 242. Covering.

Subsequently, a third signal wire 223 is formed at a lower portion of the base film 210 at a position corresponding to the first signal wire 221, and the third signal wire 223 is formed through the contact hole 211. The first solder wire 221 is connected, and a third solder resist 233 is formed under the third signal wire 223.

The structure of the liquid crystal display using the COF according to the second embodiment of the present invention is shown in FIGS. 10A and 10B, wherein the liquid crystal display of FIG. 7A and 7B is excluded except for the COF and PCB portions. Since the same structure as the device, the description of the same parts will be omitted.

First, as illustrated in FIG. 10A, a COF 277a is attached to one end of the first substrate 271 exposed by the second substrate 272 and the second polarizing plate 274, and the COF 277a is described above. As described above, signal wiring is formed at both the upper and lower portions of the base film at one side of the drive IC 276a, that is, at the left side, and only at the side where the drive IC 276a is connected at the right side of the drive IC 276a. Signal wiring is formed. Therefore, the first surface of one end of the COF 277a is in contact with the first substrate 271, and the drive IC is formed on the second surface of the one end of the COF 277a, that is, on the opposite side of the surface in contact with the first substrate 271. 276a is connected. The other end of the COF 277a is bent and positioned below the backlight 275, and the PCB 278a is connected to the second surface of the other end of the COF 277a.

In addition, by using the COF according to the second embodiment of the present invention, the PCB may be disposed on the side of the first substrate, the first polarizing plate, and the backlight. As shown in FIG. 10B, a COF 277b is attached to one end of the exposed first substrate 271, and a first surface of one end of the COF 277b is in contact with the first substrate 271, and the COF ( 277b) The drive IC 276b is connected to the second surface at one end, that is, the surface opposite to the surface contacting the first substrate 271. The other end of the COF 277b is bent and positioned at the right side of the first substrate 271, the first polarizing plate 273, and the backlight 275, and the second surface of the other end of the COF 277b is connected to the PCB 278b. have.

As described above, in the liquid crystal display device using the COF according to the second embodiment of the present invention, the drive IC is positioned above the first substrate exposed by the second substrate and the second polarizing plate, thereby reducing the volume of the liquid crystal display device and making it compact. You can have a structure.

On the other hand, in the COF according to the third embodiment of the present invention, double wiring is formed on the right side of the drive IC. FIG. 11 is a plan view of a COF according to a third embodiment of the present invention, and FIG. 12 is a cross-sectional view taken along the line II-II of FIG. 11.

11 and 12, a plurality of first and second signal wires 321 and 322 extending in the horizontal direction and corresponding to one-to-one are formed on the base film 310 having the contact hole 312. First and second solder resists 331 and 332 are formed on the first and second signal wires 321 and 322, respectively. Here, the second signal wires 322 are positioned on the contact hole 312, and the first and second solder resists 331 and 332 expose portions of the first and second signal wires 321 and 322, respectively.

Next, bumps 341 and 342 are formed on the exposed first and second signal wires 321 and 322, respectively, and a drive IC 360 is disposed thereon, so that the first and second signal wires 321 and 322 are disposed. ) And drive IC 360 are connected via bumps 341 and 342.

Next, resins 350 are formed at both sides of the drive IC 360, so that the solder resists 331 and 332, a part of the first and second signal wires 321 and 322, and the bumps 341 and 342 are formed. Covering. Here, the contact hole 312 is located on the right side of the drive IC 360.

Subsequently, a third signal wire 323 is formed at a lower portion of the base film 310 at a position corresponding to the second signal wire 322, and the third signal wire 323 is formed through the contact hole 312. The second solder wire 322 is connected, and a third solder resist 333 is formed under the third signal wire 323.

As shown in FIG. 13, the structure of the liquid crystal display using the COF according to the third exemplary embodiment of the present invention has the structure of the first substrate 371 exposed by the second substrate 372 and the second polarizing plate 374. One end is attached to the COF (377), the other end of the COF (377) is bent below the backlight 375. Here, the COF 377 is formed on one side of the drive IC 376, that is, on the right side of the drive IC (360 of FIG. 12) only in the upper and lower portions of the base film, and the drive is formed. In the left portion of the IC (360 in FIG. 12), signal wiring is formed only on the surface to which the drive IC 376 is connected. Accordingly, the first surface of one end of the COF 377 is in contact with the first substrate 371, and a curved portion of the COF 377, that is, the first substrate 371, the first polarizing plate 373, and the backlight 375. The drive IC 376 is connected to the first surface of the portion located at the right side of the circuit board, and the PCB 378 is connected to the second surface of the other end of the COF 377.

As described above, in the present invention, by forming the COF or the TCP by the upper and lower double wirings, the volume of the liquid crystal display can be reduced to have a compact structure.

The present invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit of the present invention.

In the mounting structure of the liquid crystal display device according to the present invention, in the use of COF or TCP, COF or TCP is formed by double wiring of upper and lower portions and attached to the lower substrate of the liquid crystal display, thereby selecting the attachment position of the drive IC and the PCB. The width of the liquid crystal display can be reduced, and the volume of the liquid crystal display can be reduced.

Claims (13)

A base film having a first contact hole; First signal wires formed on the base film at predetermined intervals; A second signal wire formed on the base film and parallel to the first signal wire and corresponding one-to-one; A driving circuit connected to the first and second signal wires on the first and second signal wires; A third signal line formed under the base film and connected to the first signal line through the first contact hole; Mounting structure of the liquid crystal display device comprising a. The method of claim 1, The base film further includes a second contact hole under the second signal wire, and further includes a fourth signal wire connected to the second signal wire through the second contact hole under the base film. Mounting structure of the device. A first substrate; A first polarizer disposed under the first substrate; A backlight under the first polarizer; A second substrate disposed to expose one side of the first substrate on the first substrate; A second polarizer disposed on the second substrate; A printed circuit board generating a signal; An exposed side of the first substrate is connected to a first surface, and a mounting structure having one end to which a driving circuit is attached to the second surface and the other end to which the printed circuit board is connected. Liquid crystal display comprising a. The method of claim 3, wherein The mounting structure includes a) a base film having a first contact hole; B) first signal lines formed on the base film at a predetermined interval; C) a second signal wire formed on the base film and parallel to the first signal wire and corresponding one-to-one; And a third signal line formed under the base film and connected to the first signal line through the first contact hole. The method of claim 4, wherein The printed circuit board is connected to the second surface of the other end of the mounting structure. The method of claim 5, The other end of the mounting structure is located below the backlight. The method of claim 5, The other end of the mounting structure is located on the side of the backlight. The method of claim 4, wherein The base film further includes a second contact hole under the second signal wire, and further includes a fourth signal wire connected to the second signal wire through the second contact hole under the base film. Device. The method of claim 8, The printed circuit board is connected to the first surface of the other end of the mounting structure. The method of claim 9, The other end of the mounting structure is located below the backlight. The method of claim 9, The other end of the mounting structure is located on the side of the backlight. A first substrate; A first polarizer disposed under the first substrate; A backlight under the first polarizer; A second substrate disposed to expose one side of the first substrate on the first substrate; A second polarizer disposed on the second substrate; A printed circuit board generating a signal; A mounting structure having one end connected to one side of the first substrate connected to a first surface and the other end connected to the printed circuit board on a second surface, and a driving circuit connected to a first surface corresponding to a side surface of the backlight; Liquid crystal display comprising a. The method of claim 12, The mounting structure includes a) a base film having a contact hole; B) first signal lines formed on the base film at a predetermined interval; C) a second signal wire formed on the base film and parallel to the first signal wire and corresponding one-to-one; And a third signal line formed under the base film and connected to the second signal line through the contact hole.