KR20030014863A - Stacked thin small outline package - Google Patents

Abstract

PURPOSE: A stacked thin small outline package is provided to simplify a fabrication process of a connection pin by stacking a plurality of thin small outline packages having compatible chip selection pins and compatible dummy pins. CONSTITUTION: A stacked thin small outline package(300) is formed by stacking vertically a plurality of thin small outline packages. The thin small outline package has a couple of package bodies(315,325) including a couple of semiconductor chips(311,321) and a plurality of connection pins projected from the package bodies(315,325). The connection pins are electrically connected with bonding pads(314,324) of the semiconductor chips(311,321) through wires(313,323). A chip selection pin(319) corresponds to a dummy pin(328). The stacked thin small outline package(300) is formed with a thin small outline package(310) and one ore more stacked thin small outline packages(320).

Description

Stacked thin small outline package

The present invention relates to a stacked thin small outline package (stacked TSOP), and more particularly, a connection terminal having a compatible chip selsction pin and a dummy pin. The present invention relates to a stacked ultra thin package having a plurality of ultra thin packages including a pin;

Semiconductor devices such as memory devices are being developed as semiconductor chip packages having various shapes to increase the mounting density when mounted on a substrate, and one of them is provided as a stacked package in which semiconductor chip packages are vertically stacked. . In particular, the stacked ultra-thin package provided by stacking an ultra-thin package has an advantage that the mounting density can be improved by more than twice in the same mounting area while the size thereof is relatively small.

Hereinafter, a stacked ultra-thin package according to the related art will be described with reference to the accompanying drawings.

1A and 1B are cross-sectional views of stacked ultra-thin packages according to the prior art.

As shown in FIG. 1A, the stacked ultra-thin package 100 according to the related art includes a package body 115 and 125 including semiconductor chips 111 and 121, and a connection terminal 117 protruding from the package body 115 and 125. A plurality of ultra-thin packages including a bottom ultra-thin package 110 and a stack ultra-thin package 120 including 127 are stacked, and an intermediate substrate 140 including a substrate lead 141 is interposed between each ultra-thin package. do. The connection terminals 117 and 127 of the ultra-thin package are electrically connected to the substrate leads 141 corresponding to the vertical, respectively, and the connection terminals 117 and 127 of the lowermost ultra-thin package 110 positioned at the lowermost end thereof are substrates (not shown). Is not mounted). The bonding pads 114 and 124 of the semiconductor chips 111 and 121 in each ultra-thin package are electrically connected by the connection terminals 117 and 127 and the wires 113 and 123.

Each ultra-thin package of the stacked ultra-thin package 100 is provided with a chip select terminal and a dummy terminal required to be electrically driven. The bonding pads 124 including chip select pads corresponding to the respective chip select terminals are connected by wires 113 and 123, and the dummy terminals are not connected to the bond pads. The connection terminals 117 and 127 including the dummy terminal and the chip select terminal are configured to protrude out of the package bodies 115 and 125 and are formed to have the same position in each of the ultra-thin packages 110 and 120. Therefore, the intermediate substrate 140 has a function of electrically connecting the chip select terminal and the dummy terminal between the ultra-thin packages for the selective electrical driving of the stacked ultra-thin package 120 or the lowest ultra-thin package 110.

Meanwhile, the stacked ultra-thin package 200 as shown in FIG. 1B may have a reduced thickness since an intermediate substrate (140 of FIG. 1A) is not interposed. The lowest ultra-thin package 210 and the stacked ultra-thin package 220 included in the stacked ultra-thin package 200 include one chip select terminal and a plurality of dummy terminals to enable selective driving. In particular, four stacked ultra-thin packages consisting of the lowest ultra-thin package 210 and three stacked ultra-thin packages 220 are provided to include one chip select terminal and three dummy terminals. However, the shape of the chip select terminal and the dummy terminal is determined according to the number of ultra-thin packages, and there is a problem in that structural change of the ultra-thin package is required.

Therefore, the laminated ultra-thin package according to the prior art requires an additional process by interposing a substrate, and its thickness is increased. In addition, the ultra-thin package is structurally changed due to the control of the number of chip select terminals and dummy terminals, which causes a complicated manufacturing process in mass production.

SUMMARY OF THE INVENTION An object of the present invention is to provide a stacked chip scale package having a connection terminal which is easily compatible with a chip select terminal and a dummy terminal in which an intermediate substrate is not used.

1A and 1B are cross-sectional views of stacked ultra-thin packages according to the prior art,

2A is a side view of a laminated ultra thin package according to the present invention;

FIG. 2B is a cross-sectional view of the stacked ultra thin package along the line A-A of FIG. 2A;

3A is a partial detail view of the lowest ultra-thin package according to the present invention;

3b is a front view of the lowest ultra-thin package according to the present invention;

4A is a partial detail view of a laminate ultra-thin package according to the present invention;

4B is a front view of a laminate ultra-thin package according to the present invention.

Description of the main parts of the drawing

100, 200, 300: stacked ultra-thin packages

110, 210, 310: lowest ultra-thin package

111, 121, 211, 221, 311, 321: semiconductor chip

113, 123, 213, 223, 313, 323: wire

114, 124, 214, 224, 314, 324: bonding pads

Package body: 115, 125, 215, 225, 315, 325

117, 127, 217, 227, 317, 327: connection terminal

120, 220, 320: stack ultra thin package

130, 230, 330: conductive connecting means

140: intermediate substrate 141: substrate lead

143: insulating layer 318, 328: dummy terminal

319, 329: chip select terminal

In order to achieve the above object, the stacked ultra-thin package according to the present invention includes a connection body including a package body including a semiconductor chip and a dummy terminal protruding from the package body and provided in pairs with a chip select terminal and a chip select terminal. The package includes a plurality of ultra-thin packages provided, the ultra-thin packages are located at the bottom layer, the lowest ultra-thin package in which the connection terminals are mounted on the substrate, vertically stacked on the bottom ultra-thin package and electrically connected, and the chip select terminal and the dummy terminal are connected to the package. At least one laminate ultra-thin package having a connection terminal physically connected in the body, the laminated laminate ultra-thin package is the connection terminal protruding from the package body except the dummy terminal is a corresponding electrical and physical Characterized in that connected The.

The dummy terminal of the lowest ultra-thin package is preferably connected to a connection terminal except for the dummy terminal of the stacked ultra-thin package positioned at the lowermost end of the stacked ultra-thin packages. In addition, the dummy terminals of the laminated ultra-thin packages are provided only in the package body and do not protrude out of the package body, and the connection terminal of the lowermost ultra-thin package is bent in a chevron wing shape.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

Figure 2a is a side view of a stacked ultra-thin package according to the present invention, Figure 2b is a cross-sectional view of the laminated ultra-thin package according to the line AA of Figure 2a, Figure 3a is a partial detail view of the bottom ultra-thin package according to the invention, Figure 3b is 4A is a partial detailed view of the laminate ultra-thin package according to the present invention, and FIG. 4B is a front view of the laminate ultra-thin package according to the present invention.

2A and 2B, the stacked ultra-thin package 300 according to the present invention is formed by stacking a plurality of ultra-thin packages vertically. The ultra-thin package includes package bodies 315 and 325 including semiconductor chips 311 and 321, and a plurality of connection terminals 317 and 327 protruding from the package bodies 315 and 325. The connection terminals 317 and 327 are electrically connected by the bonding pads 314 and 324 of the semiconductor chips 311 and 321 and the wires 313 and 323, and are paired with the chip selection terminals 319. At least one dummy terminal 328 is included. In addition, the ultra-thin package is provided as a lowermost ultra-thin package 310 and one or more stacked ultra-thin package (320).

3A and 3B, the lowest ultra-thin package 310 positioned at the bottom of the stacked ultra-thin package 310 has a connection terminal 317 having a chip select terminal 319 and a dummy terminal 318 separated. The connection terminal 317 is exposed to the outside of the package body 315 and mounted on the substrate, and is connected to the laminate ultra-thin package and the conductive connection means (330 of FIGS. 2A and 2B) positioned thereon. In addition, the connection terminal 317 of the lowermost ultra-thin package 310 is bent in a chevron wing shape to facilitate the mounting of the substrate.

As shown in FIGS. 4A and 4B, the stacked ultra-thin package 320 includes a connection terminal 327 to which the chip select terminal 329 and the dummy terminal 328 are physically connected in the package body 325. In particular, the dummy terminal 328 is provided so as not to protrude out of the package body 325 and is not physically and electrically connected to the corresponding connection terminal 327 of the ultra-thin package located at the top or the bottom thereof. The stack ultra-thin package 320 is vertically stacked on the lowest ultra-thin package (310 in FIGS. 2A and 2B) and physically connected by conductive connecting means (330 in FIGS. 2A and 2B).

In particular, the chip select terminal 329 and the dummy terminal 328 of the multilayer ultra-thin package 320 may be provided to be changed. That is, the dummy terminal 328 may be changed to the chip select terminal 329 and the chip select terminal 329 to the dummy terminal 328. After the process of forming the package body 325 is completed during the manufacturing process of the laminated ultra-thin package 320, the package terminal 325 is selected by selecting the connection terminal 327 to be formed as the dummy terminal 328 from two connection terminals 327. ) Cut so as not to protrude to the outside. Therefore, at least two or more of the plurality of laminated ultra-thin packages 320 have the same manufacturing process of the connection terminal 327 of the laminated ultra-thin package 320, thereby simplifying the manufacturing process of the connection terminal 327.

Referring to FIGS. 2A and 2B, the selective electrical driving of the stacked ultra-thin package 300 is as follows.

For example, when only the lowest ultra thin package 310 is driven, the electrical signal transmitted from the substrate is transmitted to the connection terminal 317 of the lowest ultra thin package 310. When an electrical signal is transmitted to the chip select terminal 319 of the lowermost ultra-thin package 310, the lowermost package 310 in which the electrical signal is received on the chip select pad of the bonding pads 224 is driven. However, since the dummy terminal 328 of the stacked ultra-thin package 320 is not electrically connected to the chip select terminal 319 of the lowermost ultra-thin package 310, the stacked terminal ultra-thin, in which no electrical signal is transmitted to the chip select pad, is provided. The package 320 is not driven.

On the other hand, when only the laminate ultra-thin package 320 is driven, the electrical signal transmitted from the substrate is transmitted to the connection terminal 317 of the lowest ultra-thin package 310. In this case, since no electrical signal is transmitted to the chip select terminal 319 of the lowermost ultra-thin package 310, the lowermost ultra-thin package 310 is not driven. The electrical signal transmitted to the dummy terminal of the lowermost ultra thin package 310 is transmitted to the chip select terminal of the stacked ultra thin package 320 connected to the dummy terminal. The electrical signal is transmitted to the chip select terminal of the stack ultra thin package 320, and the stack ultra thin package 320 is driven by the electrical signal received at the chip select pad.

In addition, in the case where the lowermost ultra-thin package and the laminated ultra-thin package are driven, the dummy terminals of the laminated ultra-thin package are not cut, but are physically and electrically connected to the lowermost ultra-thin package. Alternatively, a method of forming the dense terminal of the stacked ultra thin package to correspond to the position of the dummy terminal of the lowermost ultra thin package may be possible.

On the other hand, the embodiments of the present invention disclosed in the specification and drawings are merely presented specific examples to aid understanding and are not intended to limit the scope of the present invention. In addition to the embodiments disclosed herein, it is apparent to those skilled in the art that other modifications based on the technical idea of the present invention may be implemented.

The stacked ultra-thin package according to the structure of the present invention may have a connection terminal that is easily compatible with the chip select terminal and the dummy terminal.

Therefore, since the manufacturing process of the connection terminal is simplified, the productivity of the connection terminal can be increased and the stock of the connection terminal can be reduced.

Claims (4)

A plurality of ultra-thin packages including a package body including a semiconductor chip and connection terminals protruding from the package body and including a chip selection terminal and a dummy terminal provided in pairs with the chip selection terminal, The ultra-thin packages are located at the lowest layer, the lowest ultra-thin package in which the connection terminals are mounted on a substrate, and vertically stacked and electrically connected on the lowest ultra-thin package, and the chip select terminal and the dummy terminal are physically in the package body. At least one laminated ultra-thin package with a connection terminal connected, The laminated stacking ultra-thin package of the laminated ultra-thin package, characterized in that the connection terminals protruding from the package body except the dummy terminal are electrically and physically connected corresponding to the up and down neighboring. The stacked ultra thin package according to claim 1, wherein the dummy terminal of the lowest ultra thin package is connected to a connection terminal except for the dummy terminal of the stacked ultra thin package positioned at a lowermost end of the stacked ultra thin packages. The stacked ultra thin package according to claim 1, wherein the dummy terminals of the stacked ultra thin packages are located only inside the package body. The laminated ultra-thin package according to claim 1, wherein the connection terminal of the lowermost ultra-thin package is bent into a chevron wing shape.