KR20030012238A - Package having passive element - Google Patents

Abstract

PURPOSE: A semiconductor having passive elements is provided to prevent deterioration of signal characteristics and to enhance circuit density of the board by mounting three-dimensionally passive elements(capacitors, inductors, resistances, filters, etc,.) onto a semiconductor chip. CONSTITUTION: The semiconductor package includes a substrate base(110) on which a semiconductor chip(112) is mounted only. A plurality of passive elements(116), such as capacitors, inductors, resistors, filters, etc. are mounted within the space among pads which is formed at a uniform interval underneath the substrate base(110). Each passive device is electrically connected with the semiconductor chip(112). There is provided with a housing(120) for connecting the substrate base(110) with a PCB board(130). A plurality of connecting pins(122), corresponding to each pad, are provided to penetrate the housing from the lower side to the top side thereof so as to be protruded at a designated height. The lower part of each connecting pin(122) is connected to input/output nodes of the PCB board(130) via a solder(124). A compressing member(150) is provided to be fixed around the top of the substrate base and the PCB board for electrically connecting the corresponding pad, the connecting pin, and an input/output node.

Description

Passive device built-in package {PACKAGE HAVING PASSIVE ELEMENT}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, and more particularly, to a passive device embedded package suitable for implementing a high density SiP (System in Package) in which at least passive devices are mounted.

As is well known, a conventional semiconductor package has a form in which one semiconductor chip is mounted (Single Chip Package) or at least two semiconductor chips (Multi Chip Package).

On the other hand, implementing a specific set of electronic circuits using a semiconductor package requires not only the semiconductor package but also various functional elements (capacitors, inductors, resistors, filters, etc.) essential for signal transmission without characteristic deterioration. These functional devices are mounted on a PCB board on which a semiconductor package is mounted.

However, in this method, there is a problem that the area of the PCB board becomes unnecessarily large (a problem of lowering board density) because the functional elements essential for preventing deterioration of signal characteristics are mounted on the PCB board. It acts as a factor that inhibits shortening.

In addition, the conventional method directly mounts a functional element on the PCB board, so that the length of the signal line is long, resulting in a delay in signal transmission or noise being inserted in the signal transmission process. There was no limit to preventing deterioration.

Accordingly, as a way to overcome these problems, there are a System on Chip (SoC) in which a functional device is integrally formed on a semiconductor chip, and a System in Package (SiP) in which a functional device is packaged.

In the above, the SoC has a problem that the development period of the semiconductor chip is longer and the manufacturing process is complicated and difficult as the many functions are added to the semiconductor chip. Therefore, in recent years, the development time of the SiP is short, easy to manufacture, and low cost. The use is expanding. Here, the present invention relates to the improvement of the structure of SiP.

As is well known, SiP is generally a ball grid array (BGA) using solder balls. An example of a BGA package is as shown in FIG.

4 is a cross-sectional view of a conventional passive device embedded package mounted on a PCB board, and includes a substrate base 420, a semiconductor chip 422, a functional device 424, and a protective film 426. Is electrically bonded onto the PCB board 410 through solder balls 412.

That is, the conventional package die-bonds (wire bonds) the semiconductor chip 422 having a plurality of external leads (not shown) on a substrate base 420 made of polymer, ceramic, or the like, and has one or more required for signal processing. After the functional elements 424 are bonded onto the substrate base 420, the entire surface of the substrate base 420 is encapsulated with an epoxy resin or the like to complete its manufacture.

The semiconductor package manufactured through such a series of processes is mounted (electrically bonded) to the target position on the PCB board 410 using the solder balls 412. That is, the solder balls electrically bond between each input / output node of the package and each corresponding input / output node in the PCB board.

However, since the conventional package as described above mounts the functional elements required for signal processing on the substrate base, the deterioration of signal characteristics can be suppressed to some extent as compared with the method of directly mounting the functional elements on the PCB board. However, there is still a problem that the area of the substrate base is unnecessarily large, and there is a disadvantage that the circuit density of the substrate base must be lowered because the pad size for mounting the functional element is much larger than the wire bonding pad size.

Accordingly, the present invention is to solve the above-mentioned problems of the prior art, by mounting a functional device in a three-dimensional structure with a semiconductor chip to prevent the deterioration of signal characteristics and at the same time to improve the circuit density of the board package The purpose is to provide.

According to one aspect of the present invention, there is provided a passive element-embedded package having at least one semiconductor chip and a plurality of functional elements, comprising: a substrate base having at least one semiconductor chip mounted thereon; A plurality of functional elements mounted in spaces between the pads formed under the substrate base and electrically connected to the semiconductor chips; A plurality of connecting pins corresponding to the pads penetrate the inside from the bottom and uniformly protrude by a predetermined height from the upper surface thereof, and the lower portion of each connecting pin is bonded to each corresponding input / output node in the PCB board through solder. A housing in which the protruding upper portion of each connection pin is in electrical contact with a corresponding pad; And a crimping means, one end of which contacts the upper outer portion of the substrate base by a predetermined length and the other end is fixed by contact on the PCB board, thereby electrically contacting corresponding pads, connecting pins, and input / output nodes, respectively. Packages with passive components are available.

According to another aspect of the present invention, there is provided a passive device embedded package having at least one semiconductor chip and a plurality of functional elements, comprising: a substrate base having at least one semiconductor chip mounted thereon; A heat dissipation element mounted on the semiconductor chip; A plurality of functional elements mounted in spaces between the pads formed under the substrate base and electrically connected to the semiconductor chips; A plurality of connecting pins corresponding to the pads penetrate the inside from the bottom and uniformly protrude by a predetermined height from the upper surface thereof, and the lower portion of each connecting pin is bonded to each corresponding input / output node in the PCB board through solder. A housing in which the protruding upper portion of each connection pin is in electrical contact with a corresponding pad; And a crimping means for contacting the upper outer portion of the heat dissipating element by a predetermined length and fixing the other end on the PCB board so as to electrically contact corresponding pads, connection pins, and input / output nodes, respectively. Packages with passive components are available.

1 is a cross-sectional view of mounting a passive element embedded package according to a first embodiment of the present invention on a PCB board;

FIG. 2 is an enlarged cross-sectional view of part A of FIG. 1;

3 is a cross-sectional view of mounting a passive element embedded package according to a second embodiment of the present invention on a PCB board;

Figure 4 is a cross-sectional view of a conventional passive element embedded package mounted on a PCB board.

<Description of the code | symbol about the principal part of drawing>

110: substrate base 112: semiconductor chip

114: pad 116: functional element

120 housing 122 connection pin

124: solder 130: PCB board

The above and other objects and various advantages of the present invention will become more apparent from the preferred embodiments of the present invention described below with reference to the accompanying drawings by those skilled in the art.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

A key technical aspect of the present invention is that unlike a conventional package in which a semiconductor chip and a plurality of functional elements are mounted on an upper portion of a substrate base and a substrate is attached to a PCB board using solder balls, a semiconductor chip is placed on an upper portion of the substrate base. And one or more functional elements (e.g., capacitors, inductors, resistors, filters, etc.) required in the space between each pad to prevent deterioration of signal characteristics (i.e., semiconductor chips and Three-dimensional mounting of functional elements), and the solder is formed so that one side (i.e., the bottom side) of each connection pin is connected to the corresponding input / output node on the PCB board. By means of a pressing member, and by using a crimping member, the respective contact pins corresponding to each pad are electrically contacted and held in contact with each other. Through it is possible to easily accomplish what the purpose of the present invention.

Example 1

1 is a cross-sectional view of a passive element embedded package according to a first embodiment of the present invention mounted on a PCB board.

Referring to FIG. 1, the passive element embedded package according to the present invention is different from the above-described conventional technology in which a semiconductor chip and a plurality of functional elements are mounted on a substrate base. In the center portion, only the semiconductor chip 112 is mounted, and a number of functional elements 116 (eg, a capacitor, an inductor, a resistor, a filter, etc.) required for preventing deterioration of signal characteristics are formed on the substrate base 110. As shown in FIG. 2 showing an enlarged cross-section of each pad formed at regular intervals in the lower portion, that is, the portion A of FIG. 1, it is mounted on the space between the pads 114. As shown in FIG.

1 illustrates an example in which the semiconductor chip 112 is mounted on the substrate base 110 through flip chip bonding, but the present embodiment is not limited thereto. It is not necessary to employ a structure in which a semiconductor chip is mounted using wire bonding and a protective layer, or a structure mounted in other ways.

In addition, the housing 120 is a member for electrically connecting the substrate base 110 and the PCB board 130, and includes a plurality of connection pins corresponding to the respective pads 114 formed under the substrate base 110. 122 is formed so as to penetrate the inside from the lower portion of the housing 120 to a predetermined height than the upper portion of the housing 120, wherein the height of each connection pin 122 needs to be maintained uniformly, the connection pin ( 122), a copper connecting pin etc. can be used, for example.

On the other hand, the lower side of each connecting pin 122 formed to penetrate the interior of the housing 120 is electrically bonded to each input and output node not shown in the PCB board 130 through the solder 124. Accordingly, each of the connection pins 122 having one side connected to the corresponding input / output node of the PCB board 130 through the solder 124 and protruding outwardly through the inside of the housing 120 may include the housing 120. It is supported by the form.

Next, each of the pads 114 below the substrate base 110 on which the functional elements 116 are mounted between the respective pads 114 is connected to the corresponding respective connecting pins 122 supported through the housing 120. The pressing member 150 is placed to be aligned in the form, the one end is contacted in a form surrounding the upper outer portion of the substrate base 110 by a predetermined length, and the other end is contacted by a predetermined width on the PCB board 130. At this time, the other end of the pressing member 150 in contact with the PCB board 130 is formed with a fixing member 152 that can be fixed through the pressing member 150 and the PCB board 130. Here, for example, a fixing pin, a screw, or the like may be used as the fixing member 152.

Accordingly, as described above, the housing 120 having the plurality of connection pins 122 formed thereon is bonded onto the PCB board 130 through the solder 124, and the semiconductor chip 112 and the plurality of functional elements 114 are formed. ) Is mounted on the substrate base 110 is aligned with the upper portion of the connection pins 122 supported through the housing 120, one end of the pressing member 150 covers the upper portion of the substrate base 110 When the fixing member 152 at the other end of the crimping member 150 is assembled in the raised state, the connection pins 122 and the PCB boards corresponding to the pads 114 formed on the lower portion of the substrate base 110 are assembled. The corresponding input / output nodes in the 130 are electrically connected.

Therefore, the passive element embedded package according to the present embodiment is mounted on the lower side of the substrate base (ie, the space portion between each pad) without directly mounting a plurality of functional elements on the substrate base as in the conventional package. This can significantly increase the circuit density on the board while suppressing the increase in the length of the signal lines required for the connection of the functional elements.

Therefore, the package according to the present embodiment can greatly contribute to realizing light and small reduction of various electronic products by remarkably increasing the circuit density by mounting the three-dimensional structure of the functional element.

Example 2

3 is a cross-sectional view of a passive element embedded package according to a second embodiment of the present invention mounted on a PCB board.

Referring to FIG. 3, the passive element embedded package according to the present exemplary embodiment further includes a heat dissipation element 140 for dissipating heat generated from the semiconductor chip 112 mounted on the substrate base 110. The remaining components, which are different, are substantially the same as those of the above-described embodiment. Therefore, in order to avoid unnecessary overlapping description, the description of the substantially identical structural member is abbreviate | omitted here.

That is, the heat dissipation element 140 is mounted on the upper portion of the semiconductor chip 112, one end of the crimping member 150 contacts the upper outer portion of the heat dissipation element 140 by a predetermined length, and the other end is connected to the PCB board ( It is mounted on the 130 in contact with a predetermined width and assembled by the fixing member 152.

Therefore, the passive element built-in package according to the present embodiment can obtain the same result as in the above-described first embodiment.

3 illustrates an example in which the semiconductor chip 112 is mounted on the substrate base 110 through flip chip bonding, but the present embodiment is not limited thereto. It is not necessary to employ a structure in which a semiconductor chip is mounted using wire bonding and a protective layer, or a structure mounted in other ways.

As described above, according to the present invention, unlike the conventional package in which the functional element is mounted on the same plane as the semiconductor chip, the semiconductor chip is mounted on the upper part of the substrate base, and the signal characteristics on the space between the pads are lower than the semiconductor chip. Each one or more functional elements required to prevent deterioration are mounted, and a plurality of connection pins corresponding to each pad penetrate the inside from the bottom to be uniformly protruded by a predetermined height from the upper surface thereof to be supported by the housing. One side of the connection pin (ie, the lower side) is bonded using solder so that it is connected to the corresponding input / output node on the PCB board, and each contact pin corresponding to each pad is connected by using a crimping member that captures the substrate base. By making electrical contact and keeping in contact, at the same time suppressing the increase in the length of the signal line required for the connection of the functional elements The circuit density on the board can be significantly increased.

Claims (4)

In the passive element embedded package having at least one semiconductor chip and a plurality of functional elements, A substrate base on which at least one semiconductor chip is mounted; A plurality of functional elements mounted in spaces between the pads formed under the substrate base and electrically connected to the semiconductor chips; A plurality of connecting pins corresponding to the pads penetrate the inside from the bottom and uniformly protrude by a predetermined height from the upper surface thereof, and the lower portion of each connecting pin is bonded to each corresponding input / output node in the PCB board through solder. A housing in which the protruding upper portion of each connection pin is in electrical contact with a corresponding pad; And One end of the substrate base is contacted in a shape that surrounds the upper portion of the substrate by a predetermined length, and the other end is fixed by contact on the PCB board, so that each of the pads, connecting pins and the pressing means consisting of the pressing means for electrically contacting each other between the input and output nodes, respectively. Device embedded package. The package of claim 1, wherein the crimping means is fixed on the PCB board by a fixing pin or a screw. In the passive element embedded package having at least one semiconductor chip and a plurality of functional elements, A substrate base on which at least one semiconductor chip is mounted; A heat dissipation element mounted on the semiconductor chip; A plurality of functional elements mounted in spaces between the pads formed under the substrate base and electrically connected to the semiconductor chips; A plurality of connecting pins corresponding to the pads penetrate the inside from the bottom and uniformly protrude by a predetermined height from the upper surface thereof, and the lower portion of each connecting pin is bonded to each corresponding input / output node in the PCB board through solder. A housing in which the protruding upper portion of each connection pin is in electrical contact with a corresponding pad; And One end of the heat dissipating element in contact with the shape surrounding the upper portion by a predetermined length and the other end is fixed on the PCB board, the passive means consisting of the crimping means for electrically contacting the corresponding pads, connecting pins and input and output nodes, respectively Device embedded package. 4. The package of claim 3, wherein the crimping means is fixed in contact with the PCB board through a fixing pin or a screw.