KR20030008483A - Apparatus for eliminating semi-conductor or electrical device moliding comfound, the method of eliminating and the system of eliminating - Google Patents

Abstract

PURPOSE: An apparatus and a method for removing surface molding resin of a packaged semiconductor or an electronic component are provided to remove the surface molding resin by using a mechanical milling method or a chemical wet etch method. CONSTITUTION: A supporter(10) is used for supporting a sample. A CCD(Charge Coupled Device) camera(30) is used for photographing a shape of the sample. An X, a Y, and a Z-axis stage(41,42,43) are used for shifting or fixing the sample to a desired position. A chemical discharge tube is used for supplying an etching solution in order to remove chemically molding resin. An etching solution injection tube is adhered on an end portion of the chemical discharge tube. The etching solution injection tube is used for performing a wet etch process by using the etching solution. An etching solution heating portion(70) heats the etching solution to a predetermined temperature. A cleaning portion performs a cleaning process for the sample.

Description

FIELD OF ELIMINATING SEMI-CONDUCTOR OR ELECTRICAL DEVICE MOLIDING COMFOUND, THE METHOD OF ELIMINATING AND THE SYSTEM OF ELIMINATING}

The present invention relates to a remover and a removal system for removing the surface molding resin of a packaged semiconductor or electronic component. More specifically, the semiconductor chip or electronic component prevents deterioration or failure due to moisture or vibration, and an integrated circuit. Surface of packaged semiconductor or electronic component that collectively removes the molded resin part by mechanical milling or chemical wet etching, etc. Molding resin remover and removal system.

In order to analyze a defect of a product which is judged to be defective by quality inspection of a semiconductor or an electronic component, it is necessary to observe a semiconductor chip or a substrate constituting a circuit. Accordingly, the packaged molding resin of the semiconductor and the electronic component is removed and observed. In the related art, the packaged molding resin is removed by manual operation. There are thousands of kinds of semiconductors or electronic components currently used, and their shapes vary and are many. Removal of the molding resin through such manual work is dangerous because it uses chemicals, and it is difficult to carry out a large amount of work due to the complicated process.

Accordingly, an object of the present invention is to solve the problems of the prior art, and to automate and standardize the unit processes for removing the molding resin of the packaged semiconductor or electronic components, various various semiconductor and electronic components used in the past. It is to provide a device applicable to.

In addition, another object of the present invention is to provide a system that can be applied to a variety of conventional semiconductor and electronic components used by automating and standardizing the unit processes for removing the molding resin of the packaged semiconductor or electronic component.

Therefore, in order to achieve the above object, the surface molding resin remover of the packaged semiconductor and electronic component according to the present invention, the molding resin for collectively removing the surface molding resin of the packaged semiconductor or electronic component through a mechanical milling method With eliminator,

Support means for fixing the packaged semiconductor or electronic component; A camera for photographing the packaged semiconductor or electronic component to view the surface of the packaged semiconductor or electronic component from the outside; Milling means for mechanically removing the surface molding resin; Washing means for washing the packaged semiconductor or electronic component polished by a milling means; And a moving means connected to one end surface of the supporting means and allowing the supporting means to move to the camera, the milling means or the washing means, to perform a predetermined operation in the camera, the milling means or the washing means. Features,

Support means for fixing the packaged semiconductor or electronic component; A camera for photographing the packaged semiconductor or electronic component to view the surface of the packaged semiconductor or electronic component from the outside; Wet etching means for chemically removing the surface molding resin; Etching solution supply means connected to one end surface of the wet etching means and supplying the etching solution to the wet etching means; Cleaning means for cleaning a packaged semiconductor or electronic component that is ground and wet etched by the wet etching means; And a moving means connected to one end surface of the supporting means and allowing the supporting means to move to the camera, the wet etching means or the cleaning means, to perform a predetermined operation in the camera, the wet etching means or the cleaning means. It features.

In addition, in order to achieve the above object, according to the molding resin removing system according to the present invention, it is characterized in that the molding resin remover can be controlled from a computer by connecting a network connection means and a computer to the molding resin remover.

1 shows a plan view of a molding resin remover according to the invention.

FIG. 2 shows a side view when viewed in the direction of the arrow at point B-B in FIG.

3 shows a front view of a molding resin remover according to the present invention.

FIG. 4 shows a side view of the X, Y, Z axis stages 41, 42, 43 along the rail in the direction of the arrow at the A-A point with the milling device 20 moved.

Fig. 5 shows a cross sectional view of an etchant injection tube used in the present invention.

6 is a structural diagram of a molding resin removing system connected to a molding resin remover and a computer according to the present invention.

7 is a flowchart of a program of a computer for controlling a molding resin remover according to the present invention.

The above and other objects, advantages and features of the present invention will become more apparent from the following description set forth with reference to the accompanying drawings.

1, 2, 3, and 4 are views of the molding resin remover according to the present invention. 1 shows a plan view of a molding resin remover, and FIG. 3 shows a front view. FIG. 2 is a side view when viewed in the direction of the arrow at the BB point in FIG. 1, and FIG. 4 is a view in the direction of the arrow at the AA point with the X, Y, Z axis stages moved along the rail in FIG. The side view is shown.

Referring to FIGS. 1, 2, 3, and 4, the molding resin remover 100 removes a molding resin on a surface of a completed semiconductor or electronic component molded with epoxy to remove a semiconductor chip and an electronic circuit onto a surface. As a means of revealing structural defects and electrical defects by revealing them, a support 10 for fixing various types of specimens, a CCD camera 30 for observing specimens, and a specimen in a desired position X, Y, Z axis stages (41, 42, 43) for moving and fixing, chemical discharge pipe (50) for supplying etching liquid, etching liquid injection tube (60) for wet etching, etching liquid temperature control device (70) And a cleaning device 80 for cleaning the specimen before and after the process.

The supporter 10 is a means for fixing various types of specimens. The supporter 10 supports the X, Y, and Z axis stages 41, 42, and 43 after the user fixes the specimen to the supporter 10. While moving by using, it is possible to remove the molding resin of the specimen in contact with the etchant injection tube 60, it is also introduced into the cleaning device 80 to perform the cleaning operation. In addition, the supporter 10 is connected to the Z-axis stage 43 and the shaft 95 so that the shaft 95 is rotated so that the supporter 10 moves to the Z-axis to be inserted into the cleaning device 80. It is to be incident at an angle with no fixed angle. And, the support 10 is provided with a connecting means to rotate with an angle of 90 degrees with the shaft.

In addition, the supporter 10 is further provided with a heating wire to heat the specimen using the heating wire.

The CCD camera 30 is a digital camera that photographs a specimen so that a user can view it on a computer. Since a semiconductor product or an electronic component has various kinds and sizes of thousands, the CCD camera 30 is used. Take a picture of the specimen and send it to the computer 200 to determine the range to be removed from the surface of the specimen using the screen displayed on the computer monitor.

The chemical discharge tube 50 is a means for supplying the etching liquid to wet-etch the specimen using the etching liquid to chemically remove the molding resin, and the etching liquid may be removed depending on the amount of the molding resin removed by the milling apparatus 20. Adjust the amount. Therefore, the amount of etching liquid to be injected is automatically determined by grasping the amount of molding resin to be removed after photographing the specimen using the CCD camera 30. The etching solution injected through the chemical discharge tube 50 uses strong acids such as sulfuric acid, nitric acid, phosphoric acid, hydrochloric acid, and hydrofluoric acid. The etchant injection tube 60 is attached to the end of the chemical discharge tube.

The etchant injection tube 60 is a means for wet etching the specimen using the etchant, and finely processed the end of the metal wire or metal plate having a thickness of several tens of micrometers or more to have a radius of curvature of several nm, and then a material such as diamond. The etching solution injection tube 60 is prepared by coating and removing the coated both ends and removing the metal tip, which is a substrate material. The etchant injection tube 60 is installed at the end of the chemical discharge tube 50 to inject the etchant into the molding resin of the specimen to chemically cut the molding resin of the specimen. The wet etching solution is brought into contact with the molding resin from the etching solution injection tube 60 by using a non-contact method in which the etching solution injection tube 60 contacts only the etching solution without contacting the molding resin, and the amount of the etching solution is the molding resin to be cut. The amount of etch is automatically calculated and the volume of the etching solution is supplied from the compound discharge pipe 50 to chemically cut the molding resin.

5 shows a cross-sectional view of the etching liquid injection tube 60 used in the present invention. Referring to FIG. 5, (a) is a longitudinal cross-sectional view of the etching liquid injecting tube showing a shape in which an end portion of the etching liquid injecting tube becomes narrower, and (b) is a body cylindrical portion of the etching liquid injecting tube. The cross section is shown, (c) shows the cross-sectional shape of the end portion of the etching liquid injection pipe 60 into which the etching liquid is injected. As shown in (a) and (c), the end portion of the etchant injection tube 60 has a diameter of 10 nm to 1 mm.

The etchant injection tube 60 according to the present invention should not be etched into the wet etchant and the etchant injection tube 60 should not be blunt even when frequently contacted with the pattern formed on the substrate. Diamond, cubic boron nitride (c-BN; Cubic It is formed of at least one selected from materials such as Boron Nitride and Sapphire (Al oxide), or the etchant injection tube according to the present invention may be made of Teflon, polyethylene, polypropylene, and acetal. It is preferable to form at least one material selected from polymers, such as these.

The etchant temperature control device 70 is a means which allows the etchant used for wet etching to heat the etchant at an appropriate temperature so as to effectively perform a chemical reaction, and also maintains a constant temperature. The heating method of the radiation method by the halogen lamp can be used, or the heating method can be used by providing a heating wire to the supporter and heating directly by the heating wire. At the temperature of the etching solution, the reaction is effective at 50 ° C or higher or 300 ° C or lower.

The cleaning device 80 is a means for washing a specimen from which a predetermined portion of the molding resin is removed, and the specimen is immersed in acetone using a container containing acetone and washed. In addition, by attaching an ultrasonic oscillator to the cleaning device 80, the residue adhered to the specimen contained in acetone is removed and cleaned using ultrasonic waves. Specimen is attached to the support (10) is put into the cleaning device 80, it is put with a certain inclination to increase the effect of cleaning. In addition, in the process of the specimen is put into the cleaning device 80 and the cleaning process, the supporter to shortly reciprocate up and down the Z-axis stage to enhance the effect of cleaning.

X, Y, Z axis stages (41, 42, 43) is a means for moving the supporter fixed to the specimen to the desired position, consisting of three axes of the X-axis, Y-axis, Z-axis and the rail ( 20, 21, 22 are attached and the Z-axis stage 43 is arm (ARM: 90) is coupled, the X, Z-axis stage (41, 43) move independently of each other and the operation of the arm 90 By this, the specimen fixed to the support 10 can be moved in three dimensions. In addition, the Z-axis stage 43 includes an arm 90, and the support 10 is coupled to the arm 90. Referring to the operation of the X, Y, Z axis stages 41, 42, 43, for example, the support 10 is coupled to the Z axis stage 43, the Z axis stage 43 is the X axis stage It is connected to the rail 22 of the vertical direction (Z axis direction) comprised in 41, and it can move to a Z axis | shaft. In addition, between the Z-axis stage 43 and the supporter 10 is provided with an arm 90 that extends and decreases in the Y-axis direction so that the supporter 10 can move in the Y-axis. Then, the Y-axis stage 42 is configured in the Y-axis direction so that the wet etching apparatus 60 is connected to the Y-axis stage 42 so that the specimen fixed to the support 10 is in the wet etching apparatus 60 during operation. The supporting force can be supported, and the rail 21 installed in the Y-axis stage allows the wet etching device 60 to move in the Y-axis direction from the Y-axis stage 42. In addition, the X-axis stage 41 connected to the Z-axis stage 43 moves on the rail 20 in the X-axis direction to allow the X-axis stage 41 to move in the X-axis direction. Accordingly, the specimen fixed to the supporter 10 may be moved in three dimensions to perform wet etching, cleaning, and the like through the etching solution injection tube 60 or the cleaning device 80. In addition, the specimen may be moved to the position of the CCD camera 30 so that the specimen can be observed using the CCD camera 30. In particular, the support 10 is moved vertically to increase the cleaning effect in the course of the washing operation so that the specimen is not introduced into the cleaning device 80, it is introduced with a constant inclination.

6 is a structural diagram of a molding resin removing system connected to a molding resin remover and a computer according to the present invention. Referring to FIG. 6, the molding resin remover 100 according to the present invention includes a network connecting means 110, and is connected to the computer 200 by using the network connecting means 11. ) To automatically perform the molding removal process through the computer (200). When the user specifies a range of specimens to be removed using an input means such as a mouse, the computer 200 extracts an area and a depth of a specified range, measures the amount of molding resin, and determines the amount of etching solution to be added. In order to automatically perform a process such as chemical wet etching or cleaning, the stage control, etching solution injection or temperature maintenance program is stored so that molding removal can be automatically performed.

7 is a flowchart of a program of a computer for controlling a molding resin remover according to the present invention. Referring to Figure 7,

First step (ST 100): The specimen is fixed to the supporter 10 and the supporter 10 moves to the lower end of the CCD camera 30 to photograph the specimen, and transfers the photographed specimen to the computer 200. To determine the portion of the specimen to be removed through a monitor of the computer 200. Then, the user grasps the part to be removed and designates it using an input means such as a mouse of the computer 200.

Second Step (ST 110): Through the milling operation using the area of the molding resin to be removed and the depth of the molding operation specified by the user by calculating the area of the molding resin of the specimen specified by the user using an input means such as a mouse. The amount of molding resin to be removed is automatically calculated by the computer.

Step 3 (ST 120): The support 10 is moved to bring the specimen to the lower end of the etching liquid injection tube 60 so that the etching liquid injection tube and the molding resin of the specimen to be removed are wet-etched using the etching liquid. To remove the molding resin. The specimen on which the etchant is placed is heated by radiative heating by a halogen lamp or by direct heating by a heating wire connected to the supporter 10 using the temperature controller 70 so that the etching can be smoothly performed. The temperature of the etching liquid is fed back by temperature measurement by thermocouple or infrared measurement, and is heated and maintained at a desired temperature to start the etching process. In addition, during the etching process, the specimen and the supporter 10 can be repeatedly moved for the purpose of shortening the process time, and the supporter is provided by installing a vibrator on the surface supporting the specimen of the supporter 10. 10 can be vibrated by the vibrator to promote chemical reaction between the etching liquid and the resin. The etchant injection tube 60 used for wet etching has a very small thickness and can perform fine work.

Step 4 (ST 130): After a predetermined time passes to the cleaning device 80 to wash the specimen using acetone. Then, the ultrasonic wave is used to remove the residue on the specimen. In addition, the supporter 10 supporting the specimen while cleaning the specimen to perform the reciprocating motion or rotational movement to help clean the specimen.

Fifth Step (ST 140): Observe the specimen to repeat the fifth step (ST 140) in the fourth step (ST 130) to remove the desired amount of molding resin.

Unlike FIG. 8, the molding resin remover is provided with a milling device 150 which is a mechanical milling means instead of a chemical etching means, so that only mechanical milling can be performed. Fig. 100 shows the drawing. Referring to FIG. 8, in this case, if the range of the molding resin to be removed by observing the specimen through the camera 30 is input through the computer 200 through an input means such as a mouse, the support 10 is X. The molding resin can be removed by moving to the milling apparatus 150 by the Y, Z-axis stages 41, 42 and 43 and mechanically milling by the predetermined movement of the support 10. The milling device 150 is a means for mechanically removing molding resin so that the molding resin of the specimen may be polished and removed or cut by a grinding or cutting process.

And, by chemical etching means and mechanical milling means at the same time to enable mechanical milling and chemical wet etching. In this case, in particular, the groove of a certain size is first dug into the molding resin to be removed by the milling means, and the etching solution may be supplied to the groove to enable wet etching. The amount of the etchant supplied is calculated by calculating the amount of molding resin to be removed by the milling means to supply an etchant having a volume equal to the amount of molding resin to be removed.

In addition, the support 10 is connected to the X, Y, Z-axis stage (41, 42, 43) to perform the molding resin removal while the support 10 is moved, the milling means or chemical etching means X, Y, It is obvious from the viewpoint of those skilled in the art to be connected to the Z-axis stage (41, 42, 43) to perform the molding resin removal operation.

In order to analyze a defect of a product which is determined to be defective in a quality inspection of a semiconductor or an electronic component, it is necessary to remove a packaged molding resin and observe an internal semiconductor chip or a substrate constituting a circuit. In addition, there are thousands of kinds of semiconductors and electronic components currently used, and their shapes are various and their quantity is large, and thus the demand for defect analysis has increased. However, since the process of removing the molding resin by hand, not only dangerous, but also difficult to go through a complicated process. However, according to the molding resin remover and removal system according to the present invention, it is possible to safely work by automatically operating the machine, and to automate and standardize the unit processes for removing the molding to a variety of conventional semiconductor and electronic components Can be applied to perform the task.

It should be understood that various modifications to the embodiments of the invention described herein may be employed in implementing the invention. Accordingly, the following claims are intended to define the scope of the invention, and methods and configurations and equivalents thereof within these claims are intended to be encompassed by the claims.

Claims (10)

Molding resin remover which removes the surface molding resin of packaged semiconductor or electronic parts through mechanical milling Support means for fixing the packaged semiconductor or electronic component; A camera for photographing the packaged semiconductor or electronic component to view the surface of the packaged semiconductor or electronic component from outside; Milling means for mechanically removing the surface molding resin; Washing means for washing the packaged semiconductor or electronic component polished by the milling means; And A movement connected to one end surface of the support means and allowing the support means to move to the camera, the milling means or the washing means, to allow a predetermined operation in the camera, the milling means or the washing means; Molding resin remover comprising a means. Molding resin remover which removes the surface molding resin of packaged semiconductor or electronic parts through chemical wet etching. Support means for fixing the packaged semiconductor or electronic component; A camera for photographing the packaged semiconductor or electronic component to view the surface of the packaged semiconductor or electronic component from outside; Wet etching means for chemically removing the surface molding resin; Etching solution supply means connected to one end surface of the wet etching means to supply etching solution to the wet etching means; Cleaning means for cleaning the packaged semiconductor or electronic component polished and wet etched by the wet etching means; And It is connected to one end surface of the support means, so that the support means can be moved to the camera, the wet etching means or the cleaning means, so as to perform a predetermined operation in the camera, the wet etching means or the cleaning means. Molding resin remover characterized in that it comprises a moving means to. The method according to claim 1 or 2, Molding resin remover, characterized in that the support means is composed of a coupling means for coupling with the moving means and a fixing means for fixing the specimen, the fixing means coupled with the coupling means can be vibrated, rotated or reciprocated. The method according to claim 1 or 2, And a rail for moving the moving means, and an arm having a variable length between the moving means and the supporting means to allow the supporting means to move in three dimensions. The method of claim 2, Molding resin remover, characterized in that the etching solution supplied by the etching solution supply means is a strong acid. The method of claim 2, Molding resin remover characterized in that the molding resin remover further comprises an etching solution temperature control device temperature range of the etching solution is 50 ℃ ~ 300 ℃. The method according to claim 1 or 2, Molding resin removal system, characterized in that the molding resin remover can be controlled from the computer by connecting a network connection means and a computer to the molding resin remover. The method of claim 6, On the computer, A range determining step of determining a region to be removed of the molding resin; Mechanically removing the region to be removed of the molding resin by the milling means; And And a recording medium having recorded thereon a program for performing the step of cleaning the packaged semiconductor or electronic component from which the molding resin has been removed. The method of claim 6, On the computer, A range determining step of determining a region to be removed of the molding resin; Calculating a volume of the region to be removed of the molding resin; Chemically removing the region to be removed of the molding resin using the wet etching means; And And a recording medium having recorded thereon a program for performing the step of cleaning the packaged semiconductor or electronic component from which the molding resin has been removed. The method according to claim 7 or 8, Wherein said volume calculation step calculates the amount of molding resin to be removed using an area and a thickness of the range of the molding resin to be removed.