KR100383440B1 - Apparatus for eliminating semi-conductor or electrical device moliding comfound and the method of the same - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a packaged semiconductor or electronic component surface remover remover for collectively removing the surface molding resin portion of an electronic component through mechanical milling and chemical wet etching. Support means; A camera for photographing the packaged semiconductor or electronic component to view the surface of the packaged semiconductor or electronic component from the outside; Milling means for mechanically removing the surface molding resin; Wet etching means for chemically removing the surface molding resin; Etching solution supply means connected to one end surface of the wet etching means and supplying the etching solution to the wet etching means; Cleaning means for cleaning the packaged semiconductor or electronic component that is ground and wet etched by the milling means or the wet etching means; And connected to one end of the support means so that the support means can have a three-dimensional movement to move the support means to the camera, milling means, wet etching means or cleaning means, the camera means milling means, the wet etching Means or moving means for providing a predetermined operation in the washing means is characterized in that it effectively removes the molding resin.

Description

FIELD OF ELIMINATING SEMI-CONDUCTOR OR ELECTRICAL DEVICE MOLIDING COMFOUND AND THE METHOD OF THE SAME

The present invention relates to a remover for removing the surface molding resin of a packaged semiconductor or electronic component. More specifically, the semiconductor chip or electronic component prevents deterioration or failure due to moisture or vibration, and a component part of an integrated circuit. For surface-molding resin removal of packaged semiconductors or electronic components which collectively removes the surface-molding resin parts of the electronic parts to remove the resins to be placed, connected, and protected by mechanical milling and chemical wet etching. will be.

In order to analyze a defect of a product which is judged to be defective by quality inspection of a semiconductor or an electronic component, it is necessary to observe a semiconductor chip or a substrate constituting a circuit. Accordingly, the packaged molding resin of the semiconductor and the electronic component is removed and observed. In the related art, the packaged molding resin is removed by manual operation. There are thousands of kinds of semiconductors or electronic components currently used, and their shapes vary and are many. Removal of the molding resin through such manual work is dangerous because it uses chemicals, and it is difficult to carry out a large amount of work due to the complicated process.

Accordingly, an object of the present invention is to solve the problems of the prior art, and to automate and standardize the unit processes for removing the molding resin of the packaged semiconductor or electronic components, various various semiconductor and electronic components used in the past. It is to provide a device applicable to.

In addition, another object of the present invention is to provide a method that can be applied to a variety of conventional semiconductor and electronic components used by automating and standardizing the unit processes for removing the molding resin of the packaged semiconductor or electronic component.

Accordingly, in order to achieve the above object, the surface molding resin remover of the packaged semiconductor and electronic component according to the present invention collectively removes the surface molding resin of the packaged semiconductor or electronic component through mechanical milling and chemical wet etching. A molding resin remover comprising: support means for fixing the packaged semiconductor or electronic component; A camera for photographing the packaged semiconductor or electronic component to view the surface of the packaged semiconductor or electronic component from the outside; Milling means for mechanically removing the surface molding resin; Wet etching means for chemically removing the surface molding resin; Etching solution supply means connected to one end surface of the wet etching means and supplying the etching solution to the wet etching means; Cleaning means for cleaning the packaged semiconductor or electronic component that is ground and wet etched by the milling means or the wet etching means; And connected to one end of the support means so that the support means can have a three-dimensional movement to move the support means to the camera, milling means, wet etching means or cleaning means, the camera means milling means, the wet etching And means for moving to allow a predetermined operation in the cleaning means or means.

In addition, in order to achieve the above object, the method of removing the surface molding resin of the packaged semiconductor and electronic component according to the present invention, the surface molding resin of the packaged semiconductor or electronic component through a mechanical milling method and chemical wet etching. In the molding removal method to remove by, a range determination step of determining the region to be removed of the molding resin; Calculating a volume of a region to be removed of the molding resin; Mechanically removing, by milling means, a region to be removed of the molding resin; Chemically removing the region to be removed of the molding resin using wet etching means; Chemically removing the molding resin by wet etching means; And cleaning the packaged semiconductor or electronic component from which the molding resin is removed.

1 shows a plan view of a molding resin remover according to the invention.

FIG. 2 shows a side view when viewed in the direction of the arrow at point B-B in FIG. 1.

3 shows a front view of the molding resin remover according to the present invention.

FIG. 4 shows a side view of the X, Y, Z axis stages 41, 42, 43 along the rail in FIG. 1 when viewed in the direction of the arrow from the A-A point with the milling device 43 moved.

Fig. 5 shows a cross sectional view of an etchant injection tube used in the present invention.

6 shows a structural diagram in which a molding resin remover according to the present invention is connected to a computer.

Figure 7 shows a flowchart executed in a program of a computer for controlling a molding resin remover according to the present invention.

* Brief description of drawings *

10: support 20: milling apparatus

30: CCD camera 41: X axis stage

42: Y axis stage 43: Z axis stage

50: chemical discharge tube 60: etching liquid injection tube

70: temperature control device 80: cleaning device

90: arm

The above and other objects, advantages and features of the present invention will become more apparent from the following description which is described with reference to the accompanying drawings. FIGS. 1, 2, 3, and 4 are views of a molding resin remover according to the present invention. to be. 1 shows a plan view of a molding resin remover, and FIG. 3 shows a front view. FIG. 2 is a side view when viewed in the direction of the arrow at the BB point in FIG. 1, and FIG. 4 is a view in the direction of the arrow at the AA point with the X, Y, Z axis stages moved along the rail in FIG. Referring to FIGS. 1, 2, 3, and 4, the molding resin remover 100 removes a molding resin on a surface of a finished semiconductor or electronic component molded with epoxy. To expose semiconductor chips and electronic circuits on the surface to analyze structural defects and electrical defects, supporters 10 for fixing specimens of various types, and milling apparatuses for mechanically removing surface molding resin. (milling: 20), CCD camera 30 to observe the state of the specimen, X, Y, Z axis stages (41, 42, 43) to move and fix the specimen to the desired position, chemical supplying the etching solution Water discharge The tube 50, the etching liquid injection tube 60 for wet etching, the etching liquid temperature control device 70 and a cleaning device (80) for cleaning the specimen before and after the process.

Support 10 is a means for fixing the specimen of various forms, the supporter 10 is fixed to the specimen in the supporter 70, the specimen is fixed in the process of working, such as milling, wet etching, washing, As the supporter moves by using the X, Y, Z axis stages 41, 42, 43, it is possible to remove the molding resin of the specimen by contacting the milling apparatus 20 and the etching liquid injection tube 60, and also the cleaning apparatus. It is put into (80) so that cleaning can be performed. In addition, the supporter 10 is connected to the Z-axis stage 43 and the shaft 95 so that the shaft 95 is rotated so that the supporter 10 moves to the Z-axis so that the supporter 10 is not vertically incident to the cleaning apparatus. It is to be inclined at an angle with no fixed angle. And, the support 10 is provided with a connecting means to rotate with an angle of 90 degrees with the shaft.

In addition, the supporter 10 is further provided with a heating wire to heat the specimen using the heating wire.

The CCD camera 30 is a digital camera that photographs a specimen so that a user can view it on a computer. Since a semiconductor product or an electronic component has various kinds and sizes of thousands, the CCD camera 30 is used. Take a picture of the specimen and send it to the computer 200 to determine the range to be removed from the surface of the specimen using the screen displayed on the computer monitor.

The milling device 20 is a means for mechanically removing the molding resin on the surface of a semiconductor or electronic component. The milling device 20 designates a range and depth to be removed by observing a specimen surface on a monitor of the computer 200 arbitrarily. The part is mechanically removed such as polishing.

The chemical discharge tube 50 is a means for supplying the etching liquid to wet-etch the specimen using the etching liquid to chemically remove the molding resin, and the etching liquid may be removed depending on the amount of the molding resin removed by the milling apparatus 20. Adjust the amount. Therefore, the amount of etching liquid to be injected is automatically determined by grasping the amount of molding resin to be removed after photographing the specimen using the CCD camera 30. The etching solution injected through the chemical discharge tube 50 uses strong acids such as sulfuric acid, nitric acid, phosphoric acid, hydrochloric acid, and hydrofluoric acid. The etchant injection tube 60 is attached to the end of the chemical discharge tube.

The etchant injection tube 60 is a means for wet etching the specimen using the etchant, and finely processed the end of the metal wire or metal plate having a thickness of several tens of micrometers or more to have a radius of curvature of several nm, and then a material such as diamond. The etching solution injection tube 60 is prepared by coating and removing the coated both ends and removing the metal tip, which is a substrate material. The etchant injection tube 60 is installed at the end of the chemical discharge tube 50 to inject the etchant into the molding resin of the specimen to chemically cut the molding resin of the specimen. The method of contacting the wet etching liquid with the molding resin from the etching liquid injecting tube 60 employs a non-contact method in which the etching liquid injecting tube 60 contacts only the etching liquid without contacting the molding resin, which is cut by the milling apparatus 20. The grooves are made in the molding resin, and the etching solution is added to the grooves for cutting. The amount of the etchant automatically calculates the amount of the molding resin to be mechanically cut, and chemically cuts the molding resin by supplying the volume of the etchant from the compound discharge tube 50 by the volume of the molding resin that is mechanically removed.

5 shows a cross-sectional view of the etching liquid injection tube 60 used in the present invention. Referring to Figure 3, (a) is a longitudinal cross-sectional view of the etching liquid injection tube showing the shape of the end of the etching liquid injection tube 60 becomes narrower, (b) is a body cylindrical portion of the etching liquid injection tube The cross section is shown, (c) shows the cross-sectional shape of the end portion of the etchant injection tube 60 into which the etchant is introduced. As shown in (a) and (c), the end portion of the etchant injection tube 60 has a diameter of 10 nm to 1 mm.

The etchant injection tube 60 according to the present invention should not be etched into the wet etchant and the etchant injection tube 60 should not be blunt even when frequently contacted with the pattern formed on the substrate. Diamond, cubic boron nitride (c-BN; Cubic It is formed of at least one selected from materials such as Boron Nitride and Sapphire (Al oxide), or the etchant injection tube according to the present invention may be made of Teflon, polyethylene, polypropylene, and acetal. It is preferable to form at least one material selected from polymers, such as these.

The etchant temperature control device 70 is a means which allows the etchant used for wet etching to heat the etchant at an appropriate temperature so as to effectively perform a chemical reaction, and also maintains a constant temperature. The heating method of the radiation method by the halogen lamp can be used, or the heating method can be used by providing a heating wire to the supporter and heating directly by the heating wire. At the temperature of the etching solution, the reaction is effective at 50 ° C or higher or 300 ° C or lower.

The cleaning device 80 is a means for washing a specimen from which a predetermined portion of the molding resin is removed, and the specimen is immersed in acetone using a container containing acetone and washed. In addition, by attaching an ultrasonic oscillator to the cleaning device 80, the residue adhered to the specimen contained in acetone is removed and cleaned using ultrasonic waves. Specimen is attached to the support (10) is put into the cleaning device 80, it is put with a certain inclination to increase the effect of cleaning. In addition, while the specimen is put into the cleaning device 80 is washed, the supporter performs a short vertical reciprocating movement on the Z-axis stage to enhance the cleaning effect.

X, Y, Z axis stages (41, 42, 43) is a means for moving the supporter fixed to the specimen to the desired position, consisting of three axes of the X-axis, Y-axis, Z-axis and the rail ( 41a, 42a, 43a are attached, and the Z-axis stage 43 is arm (ARM: 90) coupled, so that the X, Z-axis stages 41, 43 move independently of each other and the arm 90 By this, the specimen fixed to the support 10 can be moved in three dimensions. And, the Z-axis stage 13 has an arm (ARM) 90 to which the support 10 is coupled to the arm 90. Referring to the operation of the X, Y, Z axis stages 41, 42, 43, for example, the support 10 is coupled to the Z axis stage, the Z axis stage 43 is the X axis stage 41 It is connected to the rail (43a) in the vertical direction (Z axis direction) is configured to allow to move in the Z axis. In addition, between the Z-axis stage 43 and the supporter 10 is provided with an arm extending and decreasing in the Y-axis direction to enable the supporter to move in the Y-axis. Then, the Y-axis stage 42 is configured in the Y-axis direction so that the milling device 20 and the wet etching device 60 are connected to the Y-axis stage 42 so that the specimen fixed to the support 10 is milled during operation. It is possible to support the force received by the device 20 or the wet etching device 60, the rail 42a installed on the Y-axis stage 42 is the wet etching device in the Y-axis stage 42 in the Y-axis direction To move. Then, the X-axis stage 41 connected to the Z-axis stage 43 moves on the rail 41a in the X-axis direction so that the X-axis stage 41 can move in the X-axis direction. Therefore, the specimen fixed to the supporter 10 can be three-dimensionally moved to perform milling, wet etching, and cleaning operations through the milling apparatus 20, the etching solution injection tube 60, or the cleaning apparatus 80. Make sure In addition, the specimen may be moved to the position of the CCD camera 30 so that the specimen can be observed using the CCD camera 30. In particular, in order to increase the cleaning effect during the cleaning operation, the support 10 is moved vertically so that the specimen is not introduced into the cleaning apparatus, but is introduced with a constant inclination.

6 is a structural diagram connecting a molding resin remover according to the present invention with a computer. Referring to FIG. 6, the molding resin remover 100 according to the present invention includes a network connecting means 110, and is connected to the computer 200 by using the network connecting means 11. ) To automatically perform the molding removal process through the computer (200). When the user specifies a range of specimens to be removed using an input means such as a mouse, the computer 200 extracts an area and a depth of a specified range, measures the amount of molding resin, and determines the amount of etching solution to be added. Stage control, milling, etchant injection and temperature maintenance programs are stored to automatically perform processes such as mechanical polishing, chemical wet etching and cleaning.

7 is a flowchart executed in a program of a computer for controlling a molding resin remover according to the present invention. Referring to Figure 7,

First step (ST 100): The specimen is fixed to the supporter 10 and the supporter 10 moves to the lower end of the CCD camera 30 to photograph the specimen, and transfers the photographed specimen to the computer 200. To determine the portion of the specimen to be removed through a monitor of the computer 200. Then, the user grasps the part to be removed and the depth to be milled, and designates it using an input means such as a mouse of the computer 200.

Second Step (ST 110): Through the milling operation using the area of the molding resin to be removed and the depth of the molding operation specified by the user by calculating the area of the molding resin of the specimen specified by the user using an input means such as a mouse. The amount of molding resin to be removed is automatically calculated by the computer.

Third Step (ST 120): Designation depth of the specified specimen of the specimen on the surface of the specimen by milling operation with the milling device 20 on the portion to be removed of the specimen to shorten the overall process time and remove the molding resin. Remove it. In the milling operation, the milling apparatus can be moved by the Y-axis stage, and the molding resin to be removed is brought into contact with the milling apparatus 20 while the specimen is moved up and down and left and right along the stage to which the supporter 10 is connected. Perform milling operation to remove.

Fourth Step (ST 130): After the milling operation is completed, the specimen is moved to the cleaning device 80 to clean the specimen using acetone. During the cleaning process, the support moves to rotate and reciprocate the specimen to ensure efficient cleaning. In addition, the ultrasonic wave is used to remove the residue on the specimen. Specimens are fed into the cleaning apparatus by the supporters moving along the X, Y and Z axis stages.

Step 5 (ST 140): The specimen washed in the cleaning apparatus 80 is moved to the lower end of the etching liquid injection tube 60 to contact the etching liquid injection tube and the molding resin of the specimen to be removed, and wet etching the specimen using the etching liquid. To remove the molding resin. The specimen on which the etchant is placed is heated by radiative heating by a halogen lamp or by direct heating by a heating wire connected to the supporter 10 using the temperature controller 70 so that the etching can be smoothly performed. The temperature of the etching liquid is fed back by temperature measurement by thermocouple or infrared measurement, and is heated and maintained at a desired temperature to start the etching process. In addition, during the etching process, the specimen and the supporter 10 may be repeatedly moved for the purpose of shortening the process time and may be vibrated by the vibrator to promote chemical reaction between the etching solution and the resin. The etchant injection tube 60 used for wet etching has a very small thickness and can perform fine work.

Sixth step (ST 150): After a predetermined time passes to the cleaning device 80 to wash the specimen using acetone. Then, the ultrasonic wave is used to remove the residue on the specimen. In addition, the supporter 10 supporting the specimen while washing the specimen to perform the reciprocating or rotational movement to help the cleaning of the specimen.

The seventh step (ST 160): by observing the specimen to repeat the fifth step (ST 140) in the fourth step (ST 130) to remove as much molding resin as desired.

In order to analyze a defect of a product which is determined to be defective in a quality inspection of a semiconductor or an electronic component, it is necessary to remove a packaged molding resin and observe an internal semiconductor chip or a substrate constituting a circuit. In addition, there are thousands of kinds of semiconductors and electronic components currently used, and their shapes are various and their quantity is large, and thus the demand for defect analysis has increased. However, since the process of removing the molding resin by hand, not only dangerous, but also difficult to go through a complicated process. However, according to the molding resin remover 100 and the removing method according to the present invention, a safe operation can be performed by automatically operating a machine, and various various semiconductors that are conventionally used by automating and standardizing a unit process for removing the molding. It can be applied to electronic parts to perform work.

In addition, the molding resin is removed using a milling apparatus, and the molding resin is removed by wet etching using an etching solution injection tube, which is a fine tube, thereby reducing the time for removing the molding resin, and precisely removing the molding resin. can do.

It should be understood that various modifications to the embodiments of the invention described herein may be employed in implementing the invention. Accordingly, the following claims are intended to define the scope of the invention, and methods and configurations and equivalents thereof within these claims are intended to be encompassed by the claims.

Claims (9)

Molding resin remover which removes the surface molding resin of packaged semiconductor or electronic parts through mechanical milling method and chemical wet etching. Support means for fixing the packaged semiconductor or electronic component; A camera for photographing the packaged semiconductor or electronic component to view the surface of the packaged semiconductor or electronic component from outside; Milling means for mechanically removing the surface molding resin; Wet etching means for chemically removing the surface molding resin; Etching solution supply means connected to one end surface of the wet etching means to supply etching solution to the wet etching means; Cleaning means for cleaning the packaged semiconductor or electronic component polished and wet etched by the milling means or the wet etching means; And The support means is connected to one end surface of the support means so that the support means can have a three-dimensional movement so that the support means can move to the camera, the milling means, the wet etching means or the cleaning means, and the camera Molding resin remover characterized in that it comprises a moving means to perform a predetermined operation in the milling means, the wet etching means or the cleaning means. The method of claim 1, Molding resin remover, characterized in that the support means is composed of a coupling means for coupling with the moving means and a fixing means for fixing the specimen, the fixing means coupled with the coupling means can be vibrated, rotated or reciprocated. The method of claim 2, Molding resin remover, characterized in that the molding resin remover is provided with a network connection means can be connected to the computer. The method of claim 3, wherein On the computer, A range determining step of determining a region to be removed of the molding resin; Calculating a volume of the region to be removed of the molding resin; Mechanically removing, by the milling means, the region to be removed of the molding resin; Chemically removing the region to be removed of the molding resin using the wet etching means; Chemically removing the molding resin by the wet etching means; And And a recording medium on which a program for performing the step of cleaning the packaged semiconductor or electronic component from which the molding resin is removed is recorded. The method of claim 4, wherein And wherein said volume calculation step calculates the amount of molding resin to be removed by said milling means using the area and thickness of said molding resin to be removed. The method of claim 5, And the amount of the etching liquid supplied by the etching liquid supplying means is calculated by the amount of the molding resin to be removed by the milling means. The method of claim 6, And the etching solution is a strong acid. The method of claim 7, wherein Molding resin remover, characterized in that the temperature range of the etching solution is in the range of 50 ℃ to 300 ℃. Molding removal method to remove the surface molding resin of the packaged semiconductor or electronic parts collectively through mechanical milling and chemical wet etching, A range determining step of determining a region to be removed of the molding resin; Calculating a volume of the region to be removed of the molding resin; Mechanically removing, by the milling means, the region to be removed of the molding resin; Chemically removing the region to be removed of the molding resin using the wet etching means; Chemically removing the molding resin by the wet etching means; And And cleaning the packaged semiconductor or electronic component from which the molding resin is removed.