KR200299600Y1 - Socket for BGA Type IC Package - Google Patents

Abstract

The present invention relates to a socket for a BIG integrated circuit package, and a pair of ball contacts for contacting a base of a rectangular cross section coupled to a predetermined test PCB, and a ball terminal of a BIG integrated circuit package under test A pair of ball contacting portions and the pair which extend from the ball contact portion and act to open the ball contact portion when pressure is applied from the outside and return the ball contact portion to its original position when the pressure from the outside is released; A contact pin mounted on the base along the height direction such that the free end of the base fixing part, the ball contacting part and the ball contacting part are exposed to the outside with a base fixing part extending from the ball contacting part and tested in a central region; A ball terminal exposure opening is formed to expose the ball terminal region of the target BI integrated integrated circuit package. A mounting adapter coupled to the base to guide the ball terminal exposure opening portion to be located at an upper region of the ball contact portion exposed surface of the base to guide and mount a test-type integrated circuit package to be tested; a package connected to the pressing portion and one end of the pressing portion Fixing the package to an open position in which the upper space of the base is opened so that a test integrated integrated circuit package can be mounted on the mounting adapter when pressure is applied along the thickness direction of the base to the pressing portion. Opposite of the base such that the package fixing action portion can move to a fixed position that presses the test object BI integrated circuit package mounted on the mounting adapter along the mounting direction when the action portion moves and the pressure applied to the pressing portion is released. A pair of rotatably coupled to the A package fixing latch and a rectangular cross-section ball coupled to the base at a lower portion of the mounting adapter so as to move along the height direction of the base, and exposing the ball contact portion with a predetermined length margin in the base coupling state. The contact portion of the contact-contact hole is formed in correspondence with the ball contact portion, and the ball terminal of the test target BIG integrated circuit package mounted on the mounting adapter when the pressure is applied along the thickness direction of the base in the state of base engagement between the ball contact portion. A test object integrated in a test adapter mounted on the mounting adapter when a pressure is applied to the ball contacting part so that the ball contact part is separated into an open position to enter and exit a space and the pressure applied along the thickness direction of the base is released. Ball terminal of the circuit package is free to enter and exit the space between the ball contact portion A rectangular opening / closing adapter for releasing the pressure applied to the ball contacting action portion to approach the ball contact portion to a closed position that cannot be closed, and a package passage opening portion corresponding to the ball terminal exposure opening portion formed in the mounting adapter in the central region. And a pressurized position for applying pressure to the package fixing action portion and the opening / closing adapter in a direction opposite to the height direction and a pressure release position for releasing pressure applied to the package fixing action portion and the opening and closing adapter. In a socket for a BIG integrated circuit package having a cover coupled to the base so as to move along, each ball contact part exposure hole formed in the opening / closing adapter has a step in which the base side has a larger hole length than the mounting adapter side. Formed; Each ball contact part is formed in a shape that can surround the ball terminal of the BIG integrated circuit package under test in cooperation with the other party, and is disposed to move in cross direction with respect to the other party. It is formed to have a shoulder in contact with the formed step area; The opening / closing adapter is linearly extended toward at least one base on at least one pair of opposite sides of the four sides, and has a cam contact portion extending outwardly along the plate surface direction of the base at the end to guide the center region. A linear slide having a long hole formed along a longitudinal direction, and a coupling hole is formed in a central area, and the lower part of the coupling hole and the guide hole communicates with each other, and a lower end is inserted through the side of the base so as to contact the cam contact portion. An arm-shaped opening and closing cam that is coupled to the base by a coupling shaft; The base has a slide guide portion for guiding the slide therein along the thickness direction, and the bearing hole for receiving the coupling shaft is formed along the plate surface direction from the side to communicate with the slide guide portion; The cover is characterized in that it has a cam pressing portion for applying pressure in the opposite direction of the height direction to each of the opening and closing rotation cam in the pressing position. Accordingly, in testing the BIG integrated circuit package, the contact pin receiving hole forming area of the center area of the base can be increased, and the moving distance displacement of the opening / closing adapter can be reduced more than the moving displacement of the cover, and the ball contact part of the contact pin is opened and closed. It is possible to reduce the moving distance of the cover required.

Description

Socket for BGA integrated circuit package {Socket for BGA Type IC Package}

The present invention relates to a socket for testing an integrated circuit package, and more particularly, a bus having a ball grid array arranged in a grid or zigzag form on the bottom of the integrated circuit package. The present invention relates to a socket for a visual integrated circuit package for burn-in test of an A-type integrated circuit package.

An integrated circuit package in which the integrated circuit is sealed with a resin such as a resin is subjected to an electrical property test and a burn-in test to confirm the reliability of the product before shipping.

The electrical characteristic test is to test the electrical characteristics such as input / output characteristics, pulse characteristics and noise tolerance by connecting all input / output terminals of the integrated circuit with a predetermined test signal generation circuit. The circuit package is designed to test for defects for a certain period of time by applying a voltage higher than the rated voltage at a temperature higher than the normal operating environment. The burn-in test is carried out with an integrated circuit package mounted in an integrated circuit socket arranged in an oven having a predetermined heating means.

The integrated circuit package socket includes a base for fixing a contact pin having a pair of ball contacts in an upright state, a mounting adapter fixed to the base so as to be spaced a predetermined distance from an upper portion of the base to mount the integrated circuit package under test; An opening / closing adapter coupled to the base so as to be movable along the height direction of the base between the mounting adapter and the base and moving along the height direction or the plate direction of the base to open and close the ball contact portion of the contact pin in response to the height direction pressure of the base; It is coupled to the base so as to be movable along the height direction of the base from the top of the mounting adapter has a cover for applying the height direction pressure of the base to the opening and closing adapter.

According to the operation relationship between the opening and closing adapter, the cover and the base, the cover interlocking part of the opening and closing adapter should be installed in the base so that the center area of the base can be utilized as a contact pin receiving hole forming area as widely as possible, and the center area on the opening and closing adapter is possible. It is preferable to provide the opening and closing adapter so that it can be widely used as a ball contact part exposure hole forming area.

In addition, a means for reducing the displacement of the opening / closing adapter is smaller than the displacement of the cover so as to reduce the contact failure between the ball contact portion of the contact pin and the ball terminal of the BEG integrated circuit package under test due to the movement amount of the cover. It is desirable to.

In addition, it is preferable to configure the movement distance of the cover required for opening and closing the ball contact portion of the contact pin to be as small as possible so as to reduce the opening and closing operation time of the contact portion of the contact pin.

Various methods have been proposed to open and close the ball contact portion of the contact pin by moving the opening and closing adapter in conjunction with the downward movement of the conventional cover. Methods of opening and closing the ball contact portion of these contact pins can be classified into a method of moving the opening and closing adapter along the plate surface direction of the base and the method of moving the height direction of the base when the cover is lowered along the height direction of the base. In addition, the method of moving the opening and closing adapter along the height direction of the base may be classified into a method of moving upwardly and a method of moving downwardly along the height direction of the base. In addition, the structure of the contact pin is changed according to the movement direction of the opening and closing adapter.

A method of opening and closing a ball contact part of a contact pin by moving an opening / closing adapter along a height direction of a conventional base. Patent application No. 26103 filed on June 30, 1999 (name of the invention: a socket for electric parts) covers a cover at an initial position. A pair of "L" shaped arms with one end contacting the bottom of the shaft are rotatably coupled to the base and the opening and closing adapter, respectively, so that the arm pivots about the axis coupled to the base when the cover moves downward to engage the opening and closing adapter. Disclosed is a technique (hereinafter, referred to as "prior art 1") for moving an opening and closing adapter downward through a fixed shaft. In addition, patent application 49626 filed on June 25, 2000 (name of the invention: a socket for detachably mounting an electronic component having a plurality of conductive terminals such as a BGA package) has both ends of the bottom of the cover and The technology of engaging the lever member in contact with the bottom of the opening and closing adapter so as to rotate from the cover toward the base and moving the opening and closing adapter upward when the cover is lowered (hereinafter referred to as "prior art 2"), the middle when the cover is lowered Disclosed is a technique of lowering the open / close adapter by pressing the open / close adapter directly without a medium (hereinafter referred to as “prior art 3”).

However, according to the related art 1, since the arm (corresponding to the cover interlocking part of the opening and closing adapter) is coupled to the base so as to rotate inward through the two axes, the contact pin fixing area that can be secured in the center area of the base is reduced. Since the arm is in direct contact with the bottom of the cover, there is a problem that the opening and closing operation time of the ball contact portion of the contact pin increases because the moving distance of the cover necessary for opening and closing the ball contact portion of the contact pin increases.

In addition, according to the related art 2, since the lever member (corresponding to the cover interlocking part of the opening and closing adapter) is coupled to the base so as to directly contact the bottom of the cover, the contact pin fixing area that can be secured in the center area of the base is reduced (lever The rotation shaft of the member is installed toward the center area of the base), and the moving distance of the cover required for opening and closing the ball contact portion of the contact pin is increased, thereby increasing the opening and closing operation time of the ball contact portion of the contact pin.

In addition, according to the related art 3, there is no means to make the moving distance displacement of the opening and closing adapter smaller than the moving displacement of the cover during the opening and closing operation of the ball contact portion of the contact pin, so that the moving distance displacement of the cover is represented as the moving distance displacement of the opening and closing adapter. There was a problem that the ball contact of the may not be separated enough to accommodate the ball terminal of the BIG integrated circuit package under test.

Accordingly, an object of the present invention is to increase the contact pin receiving hole forming area of the center area of the base, to reduce the moving distance displacement of the opening and closing adapter than the movement displacement of the cover, the movement of the cover necessary for opening and closing the ball contact portion of the contact pin It is to provide a socket for a busy integrated circuit package that can reduce the distance.

1 is a perspective view of a combination of a socket for a busy-type integrated circuit package according to an embodiment of the present invention,

Figure 2 is an exploded perspective view of a socket for a busy integrated circuit package according to an embodiment of the present invention,

3 is a detailed view of the contact pin shown in FIG.

Figure 4 is a cross-sectional view showing the operating state of the opening and closing adapter and the package fixing latch when the cover of the busy integrated circuit package socket according to an embodiment of the present invention,

Figure 4a is an operating state of the opening and closing adapter,

Fig. 4B is an operational state diagram of the package fixing latch.

FIG. 5 is a cross-sectional view illustrating an operating state of the open / close adapter and the package fixing latch when the cover of the BGA integrated socket package according to the embodiment of the present invention is raised.

5A is an operation state of the open / close adapter;

5b is an operation state of the package fixing latch,

FIG. 6 is a view showing an operation relationship between a contact pin and an opening / closing adapter when the cover of the BIC package socket according to the embodiment of the present invention is lowered.

6A is a cross-sectional view of an operation relationship;

6b is a plan view of an operation relationship;

FIG. 7 is a view showing an operation relationship between a contact pin and an opening / closing adapter when the cover of the BIC package socket according to the embodiment of the present invention is raised.

7A is a cross-sectional view of an operation relationship;

7B is a plan view of an operation relationship;

FIG. 8 is a view showing an operation relationship between a cam pressing part (cover) and an opening / closing rotation cam (opening and closing adapter) of a socket for a busy integrated circuit package according to an embodiment of the present invention.

8A is an operation relationship diagram before the cover is lowered,

8B is an operation relationship diagram when the cover is lowered.

Explanation of symbols on the main parts of the drawings

10: base 30: contact pin

40: mounted adapter 50: opening and closing adapter

60: opening and closing rotation cam 69, 77, 88: return spring

70: package fixing latch 80: cover

100: BI integrated circuit package

The above object is, according to the present invention, a pair of ball contact portions for contacting the base of the rectangular cross-section coupled to a predetermined test PCB ratio, and the ball terminal of the non-VGA integrated circuit package to be tested and formed from each of the ball contact portions And a pair of ball contacting portions and the pair of ball contacting portions which act to open the ball contact portion when pressure is applied from the outside and return the ball contact portion to its original position when the pressure from the outside is released. A contact pin mounted along the height direction of the base so that the free end, the ball contacting portion, and the ball contacting portion of the base fixing portion are exposed to the outside, and a BEG integrated circuit to be tested in the central region. A ball terminal exposure opening is formed to expose the ball terminal region of the package, and the ball terminal exposure opening is A mounting adapter coupled to the base for guiding and mounting the BGA integrated circuit package under test so as to be located in an area adjacent to an upper surface of the ball contact portion of the switch; and a pressing portion and a package fixing action portion connected to one end of the pressing portion. The package fixing action part is moved to an open position in which the upper space of the base is opened so that a test object integrated circuit package can be mounted on the mounting adapter when pressure is applied along the thickness direction of the base. Rotatingly coupled to an opposing area of the base such that the package fixing action portion can be moved to a fixed position that presses a test object integrated integrated circuit package mounted on the mounting adapter along a mounting direction when the pressure applied to the mounting adapter is released. A pair of package fixing latches, The ball contact portion exposure hole of the rectangular upper end surface coupled to the base at the lower portion of the mounting adapter so as to move along this direction and for exposing the ball contact portion with a predetermined length margin in the base engagement state is provided in the ball contact portion. An open position corresponding to the ball terminals of the BIG integrated circuit package under test, which are formed correspondingly and mounted on the mounting adapter when pressure is applied along the thickness direction of the base in the state of base engagement. When the pressure is applied to the ball contacting part so that the ball contact part is separated, and the pressure applied along the thickness direction of the base is released, the ball terminal of the test target BIG integrated circuit package mounted on the mounting adapter is connected to the ball. The ball in a closed position that cannot enter or exit freely between the contact spaces. A rectangular opening and closing adapter for releasing the pressure applied to the ball contact action portion to access the contact portion, and a package passage opening corresponding to the ball terminal exposure opening formed in the mounting adapter in the central region is formed and the package fixing action portion and It is coupled to the base so as to move along the height direction of the base between the pressurized position to apply pressure to the opening and closing adapter in the opposite direction of the height direction and the pressure release position to release the pressure applied to the package fixing portion and the opening and closing adapter A socket for a busy-type integrated circuit package having a cover, wherein each ball contact part exposure hole formed in the open / close adapter has a step formed therein so that the base side has a larger hole length than the mounting adapter side; Each ball contact part is formed in a shape that can surround the ball terminal of the BIG integrated circuit package under test in cooperation with the other party, and is disposed to move in cross direction with respect to the other party. It is formed to have a shoulder in contact with the stepped region formed in the; The opening / closing adapter is linearly extended toward at least one base on at least one pair of opposite sides of the four sides, and has a cam contact portion extending outwardly along the plate surface direction of the base at the end to guide the center region. A linear slide having a long hole formed along a longitudinal direction, and a coupling hole is formed in a central area, and the lower part of the coupling hole and the guide hole communicates with each other, and a lower end is inserted through the side of the base so as to contact the cam contact portion. An arm-shaped opening and closing cam that is coupled to the base by a coupling shaft; The base has a slide guide portion for guiding the slide therein along the thickness direction, and the bearing hole for receiving the coupling shaft is formed along the plate surface direction from the side to communicate with the slide guide portion; The cover is achieved by a bi-directional integrated circuit package socket, characterized in that it has a cam pressing portion for applying pressure to the respective opening and closing cams in the opposite direction in the height direction at the pressing position.

Here, it is preferable that the end rotation cam pressing area of the cam pressing portion is inclined along the longitudinal direction so that the force transfer action between the cam pressing portion of the cover and the opening / closing rotation cam of the opening / closing adapter is efficiently performed.

In addition, it is preferable to form a cutting surface that forms an acute angle with an upper surface of the cam contact portion in the end region of the open / close rotation cam so that a force transfer action between the open / close adapter of the open / close adapter and the cam contact portion of the open / close adapter is efficiently performed.

In addition, the slide is preferably formed on each side of the pair of opposite sides of the opening and closing adapter so that a uniform pressure may be applied to the front and rear plates.

In addition, the guide hole of the slide is preferably formed to have both ends of a semi-circular shape so that the force transfer action between the coupling shaft and the slide of the opening and closing adapter can be made efficiently.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view of a socket for a BIG integrated circuit package according to an embodiment of the present invention, Figure 2 is an exploded perspective view of a socket for a BG integrated circuit package according to an embodiment of the present invention, Figure 3 is Detailed view of the illustrated contact pin.

As shown in these figures, a socket for a busy integrated circuit package according to an embodiment of the present invention is coupled to a predetermined test PCB and has a rectangular top cross-section fixed in a standing state so that the contact pin 30 contacts the test PCB. The base 10 and the mounting adapter 40 fixedly coupled to the base 10 to guide-mount the test-type integrated circuit package 100 to the test position, and reciprocating along the height direction of the base 10. And the mounting adapter 50 coupled to the base 10 at the bottom of the mounting adapter 40 so as to open and close the contact pieces 31a and 31b of the contact pin 30 to be fixed to the base 10. A pair coupled to the base 10 to apply a pressure along the mounting direction to the test target BIG integrated circuit package 100 mounted on the 40 to prevent the flow of the test target BIG integrated circuit package 100. Package fixation Is coupled to the base 10 at the top of the mounting adapter 40 so as to drive the opening and closing adapter 50 and the package fixing latch 70 while reciprocating along the height direction of the base 70 and the base 10. It has a cover 80.

Base 10 is formed on the bottom of the PCB coupling portion (not shown) for coupling with the test PCB. The PCB coupling part may be formed in the shape of the coupling protrusion and the coupling groove in correspondence with the test PCB. On the bottom of the base 10 there is a guide base for protecting the end of the lower base (Under Base) and the end of the contact pin 30 in cooperation with the base 10 to stably support the contact pin (30) Are combined sequentially.

In the central region of the base 10, a contact pin fixing hole 29 for fixing the contact pin 30 is formed in a lattice shape along a thickness direction so as to correspond to a terminal of the BIG integrated circuit package 100 under test. . Outside the contact pin fixing hole forming region of the base 10, four slide guides 21 for guiding the slide 53 of the opening and closing adapter 50 to be described later are formed along the thickness direction so that the interconnection lines have a rectangular shape. have. In addition, the pair of side surfaces of the base 10 are formed along the plate surface such that a bearing hole 29 for receiving a coupling shaft 59 of the opening and closing adapter 50 to be described later communicates with each slide guide portion 21. It is. The opening and closing adapter stopper accommodating part 23 which guides the adapter raising limit stopper 55 of the opening-and-closing adapter 50 which is mentioned later is formed in the thickness direction area | region between the bearing hole 29 of the base 10 along the thickness direction. . The inner wall of the opening / closing adapter stopper accommodating part 23 is provided with a locking groove (not shown) which interacts with the locking step 55a formed in the adapter lift limit stopper 55. The cover stopper accommodating part 25 which guides the cover rise limit stopper 85 of the cover 80 mentioned later is formed along the thickness direction in the longitudinal direction area | region of the bearing hole 29 of the base 10. As shown in FIG. The upper part of the cover stopper accommodating part 25 is provided with a locking groove 25a which interacts with the locking step 85a of the cover lift limit stopper 85. A cover lowering guide part 27 for guiding the lower limit stopper 87 of the cover 80, which will be described later, is formed on the side surface on which the bearing hole 29 of the base 10 is formed. The lower end of the cover lowering guide portion 27 is formed with a locking step (27a) for limiting the movement of the lower limit stopper (87). And the upper surface of the base 10, the lower stop projection 17 of the columnar interaction with the lower stop groove (not shown) formed on the bottom of the mounting adapter 40 to be described later and the rising stop of the mounting adapter 40 to be described later A mounting adapter stopper accommodating portion (not shown) for accommodating the stopper 43 is formed along the thickness direction. The inner wall of the mounting adapter stopper accommodating part (not shown) is provided with a locking groove (not shown) which interacts with the locking step 43a formed in the rising stopper 43 of the mounting adapter 40.

In addition, the latch rotation shaft 73 is rotated toward the plate surface of the base 10 so that the package fixing action portion 75 of the package fixing latch 70, which will be described later, is rotated on the front side and the rear side adjacent area of the base 10. Rotating shaft accommodating part (not shown) is formed one by one.

As shown in FIG. 3, the contact pins 30 are provided with ball contact portions 31a and 31b that contact the ball terminals 101 of the BIG integrated circuit package 100 to be tested during the test, and each ball contact portion. The ball contact portions 31a and 31b extend from 31a and 31b and open the ball contact portions 31a and 31b when the pressure is applied along the longitudinal direction of the contact pin 30 from the outside and when the pressure from the outside is released. ) Has a pair of ball contacting action portions 33 which serve to return the original position to the original position, and a base fixing portion 35 extending from the pair of ball contacting action portions 33.

The pair of ball contact portions 31a and 31b are formed in a rhombus shape to surround the ball terminal 101 of the BEG integrated circuit package 100 under test in cooperation with the other party, and are arranged to cross-move with respect to the other party. It is.

Each ball contacting portion 33 is a straight arm 33c, 33d extending along the longitudinal direction of the contact pin 30 from each ball contacting portion 31a, 31b, and inclined outward from each of the arms 33c, 33d. It has a pair of shoulders (33a, 33b) extending once to form a and bent once parallel to each other in the central region. The upper ends of the pair of shoulder portions 33a and 33b are partially overlapped and the lower ends are completely overlapped, that is, the circumferential distance is reduced.

Base fixing portion 35 and the "??" shaped connection portion 35a for connecting the lower end of the shoulders (33a, 33b) to form a fixed locking jaw (C) in the longitudinal direction of the contact pin 30 , Inclined so as to be disposed in the same direction as the arms 33c and 33d and the inclined portion 35b extending inclined from the connecting portion 35a toward the fixed locking jaw C and partially extending in two upper and lower portions; It has the straight part 35c formed by bending from the part 35b.

The contact pin 30 having such a configuration includes a contact pin fixing hole 29 formed in the base 10 so that the lower ends of the ball contact parts 31a and 31b, the ball contact action part 33 and the straight part 35c are exposed to the outside. It is fixed in a standing state.

The mounting adapter 40 has a ball terminal exposure opening 49 for exposing the ball terminal region of the BIG integrated circuit package 100 to be tested in the center region. The test target BIG integrated circuit package 100 is mounted on the mounting adapter 40 so that the ball terminal 101 is exposed through the ball terminal exposure opening 49. A pair of lowering stop grooves (not shown) are formed in a diagonal direction outside the bottom ball terminal exposure opening 49 of the mounting adapter 40. On the front side and the rear side of the mounting adapter 40, mounting adapter rotating space 49 for providing a rotating space of the package fixing latch 70 to be described later is formed one by one. In addition, a pair of the rising stopper 43 is vertically extended downward from the plate surface at the bottom of the mounting adapter 40 so as to be disposed in a diagonal direction. One locking jaw 43a is formed at each end of each rising stopper 43. The mounting adapter 40 having such a configuration is coupled to the base 10 by receiving the rising stopper 43 in the mounting adapter stopper accommodating portion (not shown) formed in the base 10. At this time, the coupling with the base 10 is made with the opening and closing adapter 50 therebetween. In the engaged state, the ball terminal exposure opening 49 is located in the area adjacent to the upper surface of the ball contact portion exposed surface of the base 10, and the engaging jaw 43a formed on the rising stopper 43 and the mounting adapter stopper accommodating portion of the base 10 are provided. The rising stop is prevented by the interaction of the engaging groove (not shown) formed in (not shown), and the lowering blocking groove formed on the lower surface of the lowering protrusion 17 and the mounting adapter 40 formed on the upper surface of the base 10. The fall is prevented by the interaction of (not shown). When coupled to the base 10, the rising stopper 43 passes through the rising stopper receiving hole 63 of the opening and closing adapter 50, which will be described later, and the mounting adapter stopper receiving portion (not shown) formed in the base 10. Is accommodated in.

Each package fixing latch 70 has a rectangular pressing portion 71 having a circular protrusion (not shown) for mounting the return spring 77 on the bottom surface thereof, and a width direction inside the bottom surface of the pressing portion 71. The latch rotating shaft 73 formed along the side thereof and the hook-shaped package fixing action portion 75 extending from the upper latch rotating shaft corresponding area of the pressing portion 71 are provided. The pair of package fixing latches 70 having such a configuration are coupled to the base 10 by receiving and engaging the latch pivot shaft 73 to a pivot shaft receiving portion (not shown) formed in the base 10. At this time, the pair of package fixing latches 70 are coupled to the base 10 in a state in which the return spring 77 is mounted on a circular protrusion (not shown). Accordingly, when the pressure is applied to the pressing portion 71 of the package fixing latch 70 along the thickness direction of the base 10, the BIG integrated circuit package 100 to be tested may be mounted on the mounting adapter 40. The mounting adapter 40 is moved by the elastic force of the return spring 77 when the package fixing action portion 75 moves to the open position in which the upper space of the base 10 is opened and the pressure applied to the pressing portion 71 is released. The package fixing action unit 75 may be moved to a fixed position for pressing and fixing the test target BI integrated package 100 mounted in the mounting direction. The rotation of the package fixing latch 70 is provided with a mounting adapter rotating space 49 on the front side and the rear side of the mounting adapter 40 so that the mounting adapter 40 is not disturbed even when the mounting adapter 40 is coupled to the base 10. Do not.

Opening and closing adapter 50 is formed in a rectangular shape having a smaller size than the outer shape of the base 10 is coupled to the base 10 in the lower portion of the mounting adapter (40). In the central region of the opening / closing adapter 50, a ball contact portion exposing hole 51 having a rectangular cross section for exposing the ball contact portions 31a and 31b of the contact pin 30 with a predetermined length of freedom in the base coupling state is provided. It is formed so as to correspond to the ball contact portions 31a and 31b. Each ball contact part exposure hole 51 has a base side diameter larger than that of the mounting adapter side, and a step is formed therein. Accordingly, when pressure is applied to the opening / closing adapter 50 along the thickness direction of the base 10, the pressure in the plate surface inner direction of the opening / closing adapter 50 is applied to the ball contact action part 33 of the contact pin 30. Thus, the separation distance between the pair of ball contact portions 31a and 31b increases. Accordingly, the ball terminal 101 of the BIG integrated circuit package 100 to be mounted on the mounting adapter 40 can freely enter and exit between the ball contact portions 31a and 31b. Ball contact of the contact pin 30 When the pressure applied to the acting portion 33 is released, the pressure in the outward direction of the plate surface of the opening / closing adapter 50 is applied to the ball contact acting portion 33 so that the pair of ball contacting portions 31a and 31b return to their original positions. do. Accordingly, the entry and exit between the ball contact portions 31a and 31b of the ball terminal of the BIG integrated circuit package 100 to be mounted on the mounting adapter 40 is restricted.

The opening and closing adapter 50 has four slides 53 extending linearly downward on one side on both sides of the right side and one on both sides of the left side. At the end of each slide 53, the cam contact portion 53a extends outward along the plate surface direction of the base 10, and the guide hole 53b having both ends of semicircular shape in the center area of each slide 53 is provided. It is formed along the longitudinal direction. The bottom outer surface of the cam contact portion 53a is cut out in a triangular cross section along the longitudinal direction.

In addition, the opening-closing adapter 50 has the opening-and-closing rotation cam 60 which transmits the pressure applied from the cam press part 83 mentioned later at the time of lowering of the cover 10 to the cam contact part 53a. As shown in FIG. 3, the opening / closing rotation cam 60 has an arm shape as a whole, and a narrowing portion has a cutting surface 63 formed at an acute angle with the upper surface of the cam contact portion, and a coupling hole ( 60a) is formed. The opening and closing rotation cam 60 is coupled to the base 10 by a coupling shaft 59 is inserted through the bearing hole 29 formed in the base 10. At this time, the coupling with the base 10 of the opening and closing rotation cam 60, the lower portion of the guide hole (53b) formed in the coupling hole (60a) and the slide 53 is in communication, the lower end "A" of the opening and closing rotation cam (60) The portion is made to contact the cam contact portion 53a. The opening and closing rotation cam 60 can use cams of various arm types such as a triangular cam.

On the front side and the rear side of the opening and closing adapter 50, the opening and closing adapter rotating space 57 for providing a rotating space of the package fixing latch 70 is formed. In the region between the right and left bottom slides 53 of the opening / closing adapter 50, an adapter lift limiter 55 extends downward from the plate surface and is formed one by one. A locking jaw 55a is formed at the end of each adapter lift limit stopper 55. Reference numeral 63 denotes a rising stopper receiving hole for accommodating the rising stopper 43 of the mounting adapter 40.

The opening and closing adapter 50 having such a configuration accommodates the slide 53 in the slide guide portion 21 formed in the base 10, and then opens and closes the rotation cam 60 to the coupling hole 60a and guide slot 53b. And the coupling shaft 59 is inserted through the shaft receiving hole 29 formed in the base 10 in a state where the shaft receiving hole 29 formed in the base 10 communicates with the cam contact portion 53a of the slide 53. Thereby engaging the base 10. At this time, the coupling is made by distributing four return springs 69 between the opening and closing adapter 50 and the base 10. In the base coupling state, the opening and closing adapter 50 is movable along the height direction of the base 10, but the upward movement is to accommodate the opening and closing adapter stopper of the locking step 55a and the base 10 formed on the adapter lift limit stopper 55 The lowering movement is limited by the interaction between the engaging grooves (not shown) formed in the part 23 and the lowering movement is limited by the contact between the coupling shaft 59 and the upper end of the guide hole 53b. The rotation of the package fixing latch 70 is prevented even when the opening and closing adapter 50 is coupled to the base 10 because the opening and closing adapter rotation space 57 is formed on the front and rear sides of the opening and closing adapter 50. Do not receive.

The cover 80 has a package passage opening 81 corresponding to the ball terminal exposure opening 49 formed in the mounting adapter 40 in the central region. At each corner of the cover 80, a straight cam pressing portion 83 is formed. Cam pressing portion 83 is formed of a "??" shaped cross-section so as to move along the thickness direction of the base 10 while being in surface contact with the corresponding edge of the base 10, opening and closing rotation of the opening and closing adapter 50 The cam 60 is formed to have a length capable of pressing the cam contact portion 53a. And the rotation cam press area B of the cam press part 83 is cut | disconnected so that it may incline along the longitudinal direction.

A rectangular cover lowering limit stopper 87 is formed one by one in the region between the left and right cam pressing portions 83 of the cover 80, and the cam pressing portions 83 on the front and rear sides of the cover 80 are formed. The pair of cover lift limit stoppers 85 in the form of legs are formed in the inter-area region. A locking jaw 85a is formed at the end of the cover lift limiter 85. In the region between the cover lift limiter 85, a linear latch pressing portion 89 is formed adjacent to the package passage opening 81, one by one.

The cover 80 having such a configuration is coupled to the base 10 by accommodating the cover lift limit stopper 85 in the cover stopper accommodating portion 25 formed in the base 10. The coupling with the base 10 is made with the opening and closing adapter 50 interposed therebetween, and four return springs 88 are distributed and installed between the opening and closing adapter 50 and the base 10. In the coupled state, the package passage opening 81 is located in the upper adjacent area of the ball terminal exposure opening 49 of the mounting adapter 40. Accordingly, the cover 80 is moved to a pressurized position to apply pressure in the opposite direction of the height direction to the package fixing action portion 75 and the opening and closing adapter 50 of the package fixing latch 70 by the pressure applied from the top and the base Pressure applied to the package fixing action portion 75 and the opening and closing adapter 50 of the package fixing latch 70 by the elastic force of the return spring 88 interposed between the upper surface of the 10 and the bottom surface of the cover 80. It is possible to move along the height direction of the base 10 between the released pressure release position. The upward movement of the cover 80 is limited by the interaction of the locking step (85a) formed in the cover lift limit stopper 85 and the locking groove (25a) formed in the cover stopper accommodating portion 25, the downward movement is opened and closed It is limited in conjunction with the downward movement of the adapter 50.

Referring to Figures 4 to 8 a method for testing using a socket for a busy-type integrated circuit package having such a configuration is as follows.

Figure 4 is a cross-sectional view showing the operating state of the opening and closing adapter and the package fixing latch when the cover of the busy integrated circuit package socket according to an embodiment of the present invention, Figure 4a is an operating state diagram of the opening and closing adapter, 4B is an operation state diagram of the package fixing latch, and FIG. 5 is a cross-sectional view illustrating an operation state of the open / close adapter and the package fixing latch when the cover of the BIC package socket according to the embodiment of the present invention is raised. 5A is an operation state diagram of the open / close adapter, FIG. 5B is an operation state diagram of the package fixing latch, and FIG. 6 is a contact pin between the contact pin and the open / close adapter when the cover of the BG package socket according to the embodiment of the present invention is lowered. 6A is a cross-sectional view of the operation relationship, FIG. 6B is a plan view of the operation relationship, and FIG. 7 is a non-GE-type collector according to an embodiment of the present invention. Fig. 7A is a sectional view of the operation relationship, Fig. 7B is a plan view of the operation relationship, and Fig. 8 is a plan view of the operation relationship when the cover of the circuit package socket is raised. Fig. 8A is a view showing an operation relationship between a cam pressing portion (cover) and an opening / closing rotation cam (opening / closing adapter) of the BIC package socket according to the embodiment, and Fig. 8A is an operation relationship diagram before the cover is lowered. 8b is an operation relationship diagram when the cover is lowered.

First, the BIG integrated circuit package according to the embodiment of the present invention is coupled to the test PCB.

Next, the cover 80 is pressed from the upper side. The pressing operation of the cover 80 is made until the upper end of the coupling shaft 59 and the guide hole 53b by the lowering movement of the opening and closing adapter 50. In response to the pressing operation of the cover 80, pressure is sequentially applied downwardly to the opening / closing cam 60 and the cam contact portion 53a of the opening / closing adapter 50 through the cam pressing portion 83 to open / close the adapter 50. Moves downward (see FIGS. 4A and 8). The opening and closing of the opening and closing adapter 50 is possible by the coupling shaft 59 passes along the longitudinal direction of the guide hole 53b formed in the opening and closing adapter 50 and the lowering operation is the coupling shaft 59 and the guide slot 53b. Limited by contact between the top of the

As the opening / closing adapter 50 is lowered downward, pressure is applied to the shoulders 33a and 33b of the contact pin 30 in the inward direction of the plate surface of the base 10 and the ball contact portion 31a of the contact pin 30 is applied. 31b) increases the separation distance (see FIG. 6). In addition, the package fixing latch 70 has a hook-shaped package fixing action 75 mounted on the hook-type adapter 40 by downward pressure applied to the pressing portion 71 through the latch pressing portion 89 of the cover 80. ) Is moved to an open position in which the upper space of the base 10 is opened so that the BIG integrated circuit package 100 to be tested is mounted (see FIG. 4B).

On the other hand, during the pressing operation of the cover 80, the mounting adapter 40 interacts with the lowering projection 17 formed on the upper surface of the base 10 and the lowering blocking groove (not shown) formed on the lower surface of the mounting adapter 40. To maintain the original position.

Next, in the state where the cover 80 is pressed, the test object BI integrated package 100 is mounted on the mounting adapter 40. At this time, it is possible to use a robot system that absorbs the visual integrated circuit package to move to a predetermined position. In the test target BIG integrated circuit package 100, the ball terminals 101 are positioned between the ball contact portions 31a and 31b of the contact pins 30 having increased distances from each other (see FIG. 6).

Next, the pressure applied to the cover 80 is released. At this time, the cover 80 and the opening and closing adapter 50 are returned to their original positions by the return springs 88 and 69, respectively (see Fig. 5A). At this time, the return operation of the cover 80 is due to the interaction between the locking projection 85a formed in the cover lift limiter 85 and the locking groove (not shown) formed in the cover stopper accommodation portion 25 of the base 10. Limited by the, the return operation of the opening and closing adapter 50 is the locking groove (not shown) formed in the locking jaw (55a) formed on the adapter lift limit stopper 55 and the opening and closing adapter stopper receiving portion 23 of the base 10 Limited by the interaction between.

As the opening and closing adapter 50 returns to its original position, the pressure applied to the shoulders 33a and 33b of the contact pin 30 is also released, and the ball contact portions 31a and 31b of the contact pin 30 also return to their original positions. As the ball contact portions 31a and 31b of the contact pins 30 return to their original positions, the ball terminals 101 and the ball contact portions 31a and 31b of the contact pins 30 of the BIG integrated circuit package 100 to be tested are Electrically connected (see FIG. 7).

In addition, the package fixing action part 75 of the package fixing latch 70 has a return spring 77 as the downward pressure applied to the pressing part 71 is released through the latch pressing part 89 of the cover 80. The test target BIG integrated circuit package 100 mounted on the mounting adapter 40 is moved to a fixed position by pressing and fixing along the mounting direction by the elastic force (see FIG. 5B).

Next, the test signal is provided to the test target BGA integrated circuit package 100 mounted on the mounting adapter 40 through the test PCB, and a response signal to the test signal output from the test target BGA integrated package 100 is provided. Detects through test PCB.

Next, the performance of the BIG integrated circuit package 100 under test is evaluated based on the response signal detected through the test PCB.

Next, the cover 80 is pressed again from the upper side. At this time, the lowering operation of the opening / closing adapter 50, the operation of the shoulders 33a and 33b and the ball contacting parts 31a and 31b of the contact pin 30, and the rotation operation of the package fixing latch 70 are performed in a test-type integrated circuit. It is the same as the case of the pressurization operation | movement of the cover 80 which carried out when mounting the package 100 to the mounting adapter 40.

Next, the test target BIG integrated circuit package 100 mounted on the mounting adapter 40 while the cover 80 is pressed is separated from the BIG integrated socket package socket according to the embodiment of the present invention.

After the process described above, the new test target BIG integrated circuit package 100 is mounted on the mounting adapter 40 to continue the performance test.

As described above, according to the embodiment of the present invention, the cam contact portion 53a that corresponds to the vertical movement of the cover 80 linearly up and down, the side of the opening and closing adapter 50 to correspond to the cover interlocking portion of the opening and closing adapter By projecting outward from the plate surface direction, the contact pin fixing area which can be secured on the base 10 increases.

Since the opening and closing rotation cam 60 is interposed between the cam pressing portion 83 of the cover 80 and the cam contacting portion 53a of the opening / closing adapter 50, the ball contact portions 31a and 31b of the contact pin 30 are provided. The moving distance of the cover 80 necessary for opening and closing is reduced.

In addition, the opening and closing adapter 50 is lowered when the cover 80 is lowered and the cam pressing part 83 contacts the opening and closing rotation cam 60, but the lower end of the narrow portion of the opening and closing rotation cam 60 is open and closed adapter 50. Since it is comprised so that it may descend when it contacts the cam contact part 53a of (), the displacement amount of the opening-closing adapter 50 will become smaller than the displacement amount of the cover 80 (refer FIG. 8).

Therefore, according to the present invention, in testing a BIG package, the contact pin receiving hole forming area of the center area of the base can be increased, and the moving distance displacement of the opening / closing adapter can be reduced rather than the moving displacement of the cover. It is possible to reduce the moving distance of the cover required for opening and closing the ball contact portion.

Claims (5)

A base of a rectangular cross section coupled to a predetermined test PCB, a pair of ball contacts for contacting the ball terminals of the BIG integrated circuit package under test, and extending from the respective ball contacts and applied with pressure from the outside; Has a pair of ball contacting action portions that act to open the ball contacting portion and return the ball contacting portion to its original position when the pressure from the outside is released; and a base fixing portion extending from the pair of ball contacting action portions; Contact pins mounted along the height direction on the base to expose the free end of the base fixing part, the ball contact action part and the ball contact part to the outside, and to expose the ball terminal area of the BIG integrated circuit package under test to the central area. A ball terminal exposure opening is formed, and the ball terminal exposure opening is on the ball contact portion of the base. A mounting adapter coupled to the base to be positioned in an adjacent region to guide and mount the test-type integrated circuit package to be tested, and a pressing part and a package fixing action part connected to one end of the pressing part, thereby adjusting the thickness direction of the base to the pressing part. Accordingly, when the pressure is applied, the package fixing action part is moved to an open position in which the upper space of the base is opened so that the test target integrated circuit package can be mounted on the mounting adapter, and the pressure applied to the pressing part is released. A pair of package fixing latches rotatably coupled to an opposing area of the base to move the package fixing action portion to a fixed position that presses the test object BI integrated circuit package mounted on the mounting adapter along a mounting direction; And, can move along the height direction of the base The ball contact part exposure hole of the rectangular cross section which is coupled to the base at the bottom of the mounting adapter and exposes the ball contact part with a predetermined length margin in the base engagement state is formed corresponding to the ball contact part and the base When the pressure is applied along the thickness direction of the base in the coupled state, the ball contact part is separated into an open position where the ball terminal of the BIG integrated circuit package to be mounted on the mounting adapter can enter and exit the space between the ball contact parts. When the pressure is applied to the ball contacting portion so that the pressure applied in the thickness direction of the base is released, the ball terminal of the test target BIG integrated circuit package mounted on the mounting adapter enters and exits the space between the ball contacting portions. The ball to approach the ball contact in a closed position that is not free A rectangular opening and closing adapter for releasing the pressure applied to the touching portion, and a package passage opening corresponding to the ball terminal exposure opening formed in the mounting adapter in the central region is formed and the package fixing action portion and the opening and closing adapter in the height direction Visigature integration having a cover coupled to the base to move along the height direction of the base between the pressurized position to apply pressure in the opposite direction and the pressure release position to release the pressure applied to the package fixing action portion and the opening and closing adapter In the socket for a circuit package, Each ball contact part exposure hole formed in the opening / closing adapter has a step formed therein so that the base side has a larger hole length than the mounting adapter side; Each ball contact part is formed in a shape that can surround the ball terminal of the BIG integrated circuit package under test in cooperation with the other party, and is disposed to move in cross direction with respect to the other party. It is formed to have a shoulder in contact with the stepped region formed in the; The opening / closing adapter is linearly extended toward at least one base on at least one pair of opposite sides of the four sides, and has a cam contact portion extending outwardly along the plate surface direction of the base at the end to guide the center region. A linear slide having a long hole formed along a longitudinal direction, and a coupling hole is formed in a central area, and the lower part of the coupling hole and the guide hole communicates with each other, and a lower end is inserted through the side of the base so as to contact the cam contact portion. An arm-shaped opening and closing cam that is coupled to the base by a coupling shaft; The base has a slide guide portion for guiding the slide therein along the thickness direction, and the bearing hole for receiving the coupling shaft is formed along the plate surface direction from the side to communicate with the slide guide portion; And the cover has a cam pressing portion for applying pressure to each of the opening and closing rotation cams in a direction opposite to the height direction in the pressing position. The method of claim 1, The end of the cam pressing portion of the cam pressing portion of the cam pressing socket is characterized in that the inclined along the longitudinal direction. The method according to claim 1 or 2, And a cut surface forming an acute angle with an upper surface of the cam contact portion in an end region of the opening and closing rotation cam. The method of claim 3, And one or two slides are formed on opposite sides of the pair of side surfaces of the opening / closing adapter. The method of claim 3, The guide hole of the slide is a bi-directional integrated circuit package socket, characterized in that it is formed to have both ends of a semi-circular shape.