KR200293802Y1 - Device for inspecting lamp of rapid thermal processing equipment - Google Patents
Device for inspecting lamp of rapid thermal processing equipment Download PDFInfo
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- KR200293802Y1 KR200293802Y1 KR20020023625U KR20020023625U KR200293802Y1 KR 200293802 Y1 KR200293802 Y1 KR 200293802Y1 KR 20020023625 U KR20020023625 U KR 20020023625U KR 20020023625 U KR20020023625 U KR 20020023625U KR 200293802 Y1 KR200293802 Y1 KR 200293802Y1
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- lamp
- thermal processing
- present
- heat treatment
- rapid thermal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
Abstract
본 고안의 목적은 RTP 장비에 설치되는 모든 램프에 각각 검출계를 연결하여 각각의 램프의 작동 상태를 확인할 수 있도록 된 급속열처리장비의 램프 상태 확인장치를 제공함에 있다.It is an object of the present invention to provide a lamp status checking device of a rapid heat treatment equipment, which is capable of checking the operation status of each lamp by connecting a detector to each lamp installed in the RTP equipment.
이에 본 고안은 하우징 내에 설치된 다수개의 램프의 가열에 의해 웨이퍼를 열처리하는 장치에 있어서, 상기 각 램프는 램프의 작동상태를 검출하기 위한 검출계와 일대일로 연결된 급속열처리장비의 램프 상태 확인장치를 제공한다.Accordingly, the present invention provides a device for heat treating a wafer by heating a plurality of lamps installed in a housing, wherein each lamp provides a lamp state checking device of a rapid thermal processing apparatus connected in one-to-one with a detector for detecting an operating state of the lamp. do.
Description
본 고안은 반도체 제조용 급속 열처리 장비(rapid thermal processing equipment: 이하 'RTP 장비'라 한다)에 관한 것으로, 더욱 상세하게는 RTP 장비에 설치되는 가열용 램프(lamp)의 상태를 용이하게 확인할 수 있도록 된 급속열처리장비의 램프 상태 확인장치에 관한 것이다.The present invention relates to a rapid thermal processing equipment (hereinafter, referred to as 'RTP equipment') for semiconductor manufacturing, and more specifically, it is possible to easily check the state of the heating lamp installed in the RTP equipment. The present invention relates to a lamp status checking apparatus for rapid heat treatment equipment.
일반적으로, 반도체웨이퍼는 예컨데 열처리공정같은 다수의 처리공정을 격게된다. 또한, 고속열처리로 공지된 이들의 열처리시, 반도체웨이퍼는, 단시간,바람직하게는 수초간,바람직하게 500~1200℃의 온도로 가열된다.In general, semiconductor wafers undergo a number of processing processes, such as, for example, heat treatment processes. In addition, during these heat treatments known as high-speed heat treatment, the semiconductor wafer is heated to a temperature of 500 to 1200 ° C for a short time, preferably for several seconds.
이러한 열처리는, 예컨데 결정결함을 어닐링하기 위해, 엷은 표면코팅을 생성하기 위해 또는 청소목적을 위해 사용되며,또 열처리는, 예컨데 램프와 같은 제어가능 열원을 제공하는 RTP 장비에서 시행된다.This heat treatment is used, for example, to anneal crystal defects, to produce a thin surface coating or for cleaning purposes, and the heat treatment is also carried out in RTP equipment providing a controllable heat source such as a lamp.
상기한 RTP 장비는 내부에 고온의 열공정을 위하여 수백개의 램프가 설치되어 웨이퍼를 가열하게 되는 데, 급속가열 및 급속냉각 뿐아니라, 반도체웨이퍼상에 균일한 온도분포 및 1군의 반도체웨이퍼의 동일한 열처리는 성공적인 처리를 위해 중요하다.The RTP equipment is equipped with hundreds of lamps for the high temperature thermal process inside the wafer to heat the wafer, as well as the rapid heating and rapid cooling, uniform temperature distribution on the semiconductor wafer and the same group of semiconductor wafers. Heat treatment is important for successful treatment.
그런데, 종래의 RTP 장비는 상기 수백개의 램프를 다수개의 지역으로 구분하여 램프가 작동되지 않는 경우 지역별로 비작동 램프의 검출은 가능하나 지역 내에서 어느 특정 램프가 작동되지 않는 지는 검출할 수 없다는 문제점이 있다.By the way, the conventional RTP equipment divides the hundreds of lamps into a plurality of areas, and when the lamps do not operate, it is possible to detect non-operational lamps for each area, but cannot detect which specific lamps do not operate in the area. There is this.
따라서 일정 지역 내에서 비작동되는 램프를 검출하기 위하여 일일이 모든 램프를 점검해야하는 불편함이 있으며, 램프 고장에 따른 신속한 대응이 불가능하여 생산성을 약화시키게 된다.Therefore, it is inconvenient to check all the lamps one by one in order to detect non-operating lamps in a certain area, and it is impossible to promptly respond to the lamp failure, thereby weakening productivity.
이에 본 고안은 상기와 같은 제반 문제점을 해결하기 위하여 안출된 것으로, RTP 장비에 설치되는 모든 램프에 각각 검출계를 연결하여 각각의 램프의 작동 상태를 확인할 수 있도록 된 급속열처리장비의 램프 상태 확인장치를 제공함에 그 목적이 있다.The present invention has been devised to solve the above problems, the lamp status checking device of the rapid heat treatment equipment that can check the operation status of each lamp by connecting a detector to each lamp installed in the RTP equipment The purpose is to provide.
도 1은 본 고안에 따른 램프 상태 확인장치가 설치된 급속열처리장비를 도시한 개략적인 도면이다.Figure 1 is a schematic diagram showing a rapid heat treatment equipment is installed lamp status check apparatus according to the present invention.
상기한 바와 같은 목적을 달성하기 위하여 본 고안은, 램프의 전류 또는 전압을 검출하기 위한 검출계가 다수개 구비되어 각각의 램프에 연결된 것을 특징으로 한다.In order to achieve the above object, the present invention is characterized in that a plurality of detection systems for detecting the current or voltage of the lamp is provided and connected to each lamp.
이하 본 고안의 바람직한 실시예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 고안에 따른 급속열처리장비의 램프 상태 확인장치를 도시한 개략적인 도면이다.1 is a schematic view showing a lamp state checking device of the rapid heat treatment equipment according to the present invention.
상기한 도면에 의하면, 본 고안의 급속 열처리 장비(10)는 웨이퍼(20)가 장입되어 가열이 이루어지는 하우징(11)과, 이 하우징(11) 내에 설치되어 고온의 열을 발생시키기 위한 램프(12)를 포함하며, 상기 램프(12)는 각각 램프(12)의 전류 또는 전압을 검출하기 위한 검출계(30)와 전기적으로 연결된 구조로 되어 있다.According to the above drawings, the rapid heat treatment equipment 10 according to the present invention includes a housing 11 into which the wafer 20 is loaded and heated, and a lamp 12 installed in the housing 11 to generate high temperature heat. The lamp 12 has a structure electrically connected to the detection system 30 for detecting the current or voltage of the lamp 12, respectively.
즉, 각 램프(12)와 검출계(30)가 일대일로 대응되어 연결된 구조로 되어 있다.That is, each lamp 12 and the detection system 30 correspond to one-to-one, and have a structure connected.
이에 따라 검출계(30)의 신호를 통해 해당 램프의 작동 여부를 즉각 확인할 수 있고, 비작동되는 램프를 단번에 찾을 수 있는 것이다.Accordingly, it is possible to immediately determine whether the corresponding lamp is operating through the signal of the detector 30, and to find the non-operating lamp at once.
여기서 상기 검출계는 램프의 전류 또는 전압을 검출하는 것에 한정되지 않으며, 램프의 작동상태와 비작동상태를 비교 검출할 수 있으면 어떠한 검출계를 사용해도 무방하다.Here, the detection system is not limited to detecting the current or voltage of the lamp, and any detection system may be used as long as it can detect the operation state and the non-operation state of the lamp.
상기한 장치의 작용을 살펴보면, 각 램프(12)는 전기적 연결라인을 통해 검출계(30)와 연결되어 있어서 각 램프(12)의 작동상태는 각 검출계(30)에 표시된다. 이 상태에서 어느 특정 램프가 작동되지 않게 되면 상기 램프와 연결되어 있는 해당 검출계에 램프의 비작동상태가 표시된다.Looking at the operation of the device, each lamp 12 is connected to the detection system 30 through an electrical connection line so that the operating state of each lamp 12 is displayed on each detection system 30. In this state, when a particular lamp is not operated, the non-operational state of the lamp is displayed on the corresponding detector connected to the lamp.
이때 작동상태 또는 비작동상태의 표시는 가시적 신호 또는 청각적 신호 등 다양한 방법이 사용될 수 있다.In this case, a variety of methods, such as a visual signal or an audio signal, may be used for displaying the operating state or the non-operating state.
이상에서 본 고안은 기재된 구체예에 대해서만 상세히 설명되었지만 본 고안의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the embodiments described, it will be apparent to those skilled in the art that various modifications and changes are possible within the technical spirit of the present invention, and such modifications and modifications belong to the appended claims.
이상 설명한 바와 같은 본 고안에 따른 급속열처리장비의 램프 상태 확인장치에 의하면, 비정상적으로 작동되는 램프를 바로 확인하여 조치할 수 있게 됨으로써 장비 관리에 소요되는 시간과 노력을 줄일 수 있으며, 가열 불균일에 의한 제품 품질 저하를 방지할 수 있게 된다.According to the lamp status check device of the rapid heat treatment equipment according to the present invention as described above, it is possible to immediately check the action of the abnormally operated lamp to reduce the time and effort required to manage the equipment, due to uneven heating Product quality can be prevented.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20020023625U KR200293802Y1 (en) | 2002-08-07 | 2002-08-07 | Device for inspecting lamp of rapid thermal processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20020023625U KR200293802Y1 (en) | 2002-08-07 | 2002-08-07 | Device for inspecting lamp of rapid thermal processing equipment |
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| KR200293802Y1 true KR200293802Y1 (en) | 2002-11-01 |
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| KR20020023625U KR200293802Y1 (en) | 2002-08-07 | 2002-08-07 | Device for inspecting lamp of rapid thermal processing equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009082119A2 (en) * | 2007-12-26 | 2009-07-02 | Kornic Systems Corp. | Apparatus and method for controlling heating lamp |
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2002
- 2002-08-07 KR KR20020023625U patent/KR200293802Y1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009082119A2 (en) * | 2007-12-26 | 2009-07-02 | Kornic Systems Corp. | Apparatus and method for controlling heating lamp |
| WO2009082119A3 (en) * | 2007-12-26 | 2009-09-11 | Kornic Systems Corp. | Apparatus and method for controlling heating lamp |
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