KR200287986Y1 - An apparatus for cutting Si-wafer using laser beam - Google Patents

Abstract

The present invention relates to an apparatus for cutting a silicon wafer (Si-wafer) using a laser beam. Conventionally, when cutting a silicon wafer using a laser beam, the laser beam is irradiated while spraying water through a high pressure water jet nozzle, wherein the water jet nozzle is about every 4 hours due to mechanical wear caused by high pressure. Since there is a need to replace with a new nozzle, there were many problems such as the inconvenience in the process, the productivity decrease, and the cost burden. On the contrary, the features of the present invention can solve all the problems of the prior art while maintaining the advantages of the prior art by performing laser cutting in a state of simply flowing water without using a high pressure water jet nozzle as in the prior art. The present invention relates to an apparatus capable of cutting a silicon wafer.

Description

{An apparatus for cutting Si-wafer using laser beam}

The present invention relates to an apparatus for cutting a silicon wafer using a laser beam.

A device for cutting a silicon wafer using a laser beam has a number of advantages over mechanical cutting devices.

As one of the most advanced cutting devices among them, an apparatus for cutting while guiding a laser beam with water sprayed through a high pressure water jet nozzle is known as illustrated in FIG.

However, in a device that irradiates a laser beam while spraying water through such a high pressure water jet nozzle, the water jet nozzle has to be replaced with a new nozzle every four hours due to severe mechanical wear caused by high pressure. As well as hassle, there are many problems such as productivity loss and cost burden.

On the other hand, silicon wafer cutting technology is mainly applied to the semiconductor process, but due to the characteristics of the semiconductor process, the cutting should be performed with a line width of about 50 micrometers (μm) or less. It was extremely difficult to get the line width, so it could not be applied to the actual process.

In the present invention was devised to solve the problems of the prior art as described above, the laser cutting in the state of simply flowing water without vortex without using a high-pressure water jet nozzle as in the prior art while still having the advantages of the prior art as it is It is an object of the present invention to provide a silicon wafer cutting apparatus that can solve all of the problems.

1 is a block diagram of an apparatus for cutting a silicon wafer by the prior art.

2 is an embodiment of a drainage system employing a general jumping nozzle.

3 is a block diagram of an apparatus for cutting a silicon wafer according to the present invention.

The components of the apparatus for cutting a silicon wafer using a laser beam according to the present invention, which are designed to achieve the above object, will be described with reference to FIG. 3.

That is, the silicon wafer cutting device using a laser beam according to the present invention

An inlet for receiving water from the outside, a through-hole formed in the center portion of the bottom surface for discharging water to the outside, and a water tank for discharging water;

A drainage device including a jumping nozzle which vertically coupled to the outside direction of the water tank from the through hole to allow the water discharged to the outside to be discharged smoothly without vortex;

A focusing lens located at a distance from the tank in a vertical direction,

A substrate support for positioning the silicon wafer to be cut at a position vertically spaced apart from the lower end of the tank,

Moving means for moving the substrate support at a constant speed in the cutting direction of the silicon wafer;

And a laser source for outputting a laser beam.

In this case, the laser beam output from the laser source is focused on the surface of the silicon wafer through the lens, but the laser beam passing through the lens is focused on the silicon wafer through the through-hole of the tank together with the discharged water, thereby focusing the silicon wafer. Configure to cut.

As an embodiment of the apparatus for cutting a silicon wafer using a laser beam according to the present invention, the laser source is a Niodymium-YAG Laser (Nd-YAG Laser) having an output of 300 Watts (Watt) ), And the diameter of the jumping nozzle is configured to be about 8 millimeters (mm).

The jumping nozzle applied to the present invention is commercially available and has a structure as illustrated in FIG. 2. Since the jumping nozzle itself and the drainage device itself including the jumping nozzle do not fall within the scope of the present invention, detailed drawings and detailed descriptions are omitted. However, as an example in which the jumping nozzle is used, there is a tunnel fountain of an outdoor concert hall or a jumping fountain installed indoors. The water discharged through the jumping nozzle looks like a smooth glass tube with no fluctuations.

The device for cutting a silicon wafer using a laser beam according to the present invention has all the advantages of the conventional cutting device using a high pressure water jet nozzle. That is, there is a cooling effect by water, a laser beam guiding effect by water, and water removal of a substance generated during cutting.

However, the device for cutting a silicon wafer using the laser beam according to the present invention, unlike the conventional cutting device using a high pressure water jet nozzle while maintaining the advantages of the prior art as described above, the general jumping to discharge water without vortex By using the nozzle there is almost no nozzle wear, there is no process hassle, which is a problem of the prior art that must be replaced with a new nozzle from time to time, thereby improving the productivity as well as the economic savings effect is very large.

In addition, an apparatus for cutting a silicon wafer using a laser beam according to the present invention has a great advantage that can be applied to a semiconductor process requiring a line width of 50 micrometers or less.

Claims (2)

In the apparatus for cutting a silicon wafer (Si-wafer) using a laser beam, An inlet for receiving water from the outside, and a through hole formed in the center portion of the bottom surface for discharging water to the outside, and a water tank for discharging water; and A device vertically coupled from the through-hole to the outside of the water tank, the apparatus including a jumping nozzle for allowing the water discharged to the outside to be discharged smoothly without vortices; A focusing lens located at a distance spaced apart in a vertical direction above the tank; A substrate support for positioning the silicon wafer to be cut at a position vertically spaced apart from the bottom of the tank; Moving means for moving the substrate support at a constant speed in the cutting direction of the silicon wafer; It comprises a laser source for outputting a laser beam, The laser beam output from the laser source is focused on the surface of the silicon wafer through the lens, and the laser beam passing through the lens is focused on the silicon wafer through the through-hole of the tank together with the discharged water, thereby cutting the silicon wafer. An apparatus for cutting a silicon wafer using a laser beam, characterized in that configuration so as to. The laser source of claim 1, wherein the laser source is a Niodymium-YAG Laser (Nd-YAG Laser) having an output of 300 Watts, and the diameter of the jumping nozzle is 8 millimeters (mm). An apparatus for cutting a silicon wafer using a laser beam, characterized in that configuration so as to.