KR200272432Y1 - Socket for testing ram module - Google Patents

Abstract

The present invention fixes the intermediate parts of the contact pins of the first and second terminal blocks at insert intervals by insert injection, and at the same time, the back of the first and third plastic injection molded bodies formed by insert injection. Since the projections integrally formed in the second and fourth plastic injection molded bodies are respectively inserted into and fixed in the second receiving grooves formed in the second and fourth plastic injection molded bodies, the positions of the contact pins provided in the first and second terminal blocks are constant, thereby providing In addition to the effect that it can be tested reliably, when the contact pins of the first and second terminal blocks are worn or cut off for a long time, the first and second inserts inserted into the first and second receiving grooves of the housing Since the second terminal block can be easily replaced, maintenance / maintenance can be facilitated, and also the first and third plastic injection molded bodies of the first and second terminal blocks can be Since the terminal pins are arranged in parallel at regular intervals, manufacturing cost can be reduced.

Description

Socket for RAM Module Test {SOCKET FOR TESTING RAM MODULE}

The present invention relates to a ram module test socket, and in particular, a ram which can easily detach a left / right terminal block insert-molded in the middle part of a plurality of contact pins arranged in parallel at regular intervals into a housing groove of a housing. A socket for module testing.

Conventionally, various ram module test sockets have been proposed. Among them, a typical conventional ram module test socket is disclosed in Korean Laid-Open Model Publication No. 1999-8193.

The RAM module test socket disclosed in Korean Patent Application Laid-Open No. 1999-8193 inserts silicone rubber into the upper and lower ends of the socket body and ensures contact between the contact pins of the lower end and the printed circuit board. It has a silicone rubber and a fixing bolt, the upper contact pin is configured to continuously maintain the flatness and elasticity between the contact pins by the silicone rubber at the upper end, the contact pins, etc. are bonded by a thermal adhesive tape to move the position It is configured not to.

However, the conventional RAM module test socket configured as described above may change over time when the IC or RAM module is frequently detached to test the IC or RAM module, thereby changing the position of the contact pins fixed by the thermal adhesive tape. The problem was that the module was limited to long-term testing.

Therefore, the present invention has been made to solve the above problems, an object of the present invention is to test the RAM module that can maintain the position of a plurality of contact pins arranged in parallel at regular intervals even after testing the IC or RAM module for a long time. To provide a socket for.

Another object of the present invention is to provide a RAM module test socket that can easily replace the left and right terminal block.

Another object of the present invention is to provide a RAM module test socket that can reduce the manufacturing cost.

In order to achieve the above object, the present invention provides a housing formed by injection molding an insulating synthetic resin material and inserted into and fixed to the first and second receiving grooves of the housing so as to push the first printed circuit board from the bottom to the top. Vertically with respect to the lower side of both ends of the housing to be inserted into the left and right levers installed on the hinge pins on both sides of the housing so as to be operated up and down, and through holes formed in the lower second printed circuit board to fix the housing. A RAM module test socket having a pair of guide post pins installed downwards, the connecting terminal being inserted into and fixed to the first and second receiving grooves of the housing and formed on both sides of the first printed circuit board. Insert injection of the middle part of the contact pin that is in electrical contact to fix the position of the contact pin, and at the same time The first and the enemy support the claim is characterized in that it includes a second terminal block.

1 is a plan view schematically showing a ram module test socket according to an embodiment of the present invention;

FIG. 2 is a view taken along arrow II-II in FIG. 1, and a longitudinal cross-sectional view showing a state in which a first printed circuit board is inserted through an upper groove of a housing from an upper portion thereof;

3 is a longitudinal sectional view taken along the arrow III-III in FIG. 1, FIG.

4 is an exploded cross-sectional view of a state in which the first and second terminal blocks are removed from the bottom in FIG. 3;

FIG. 5 is an exploded cross-sectional view illustrating the left and right terminal blocks of FIG.

<Explanation of symbols for the main parts of the drawings>

10: housing 11: upper groove

12: hinge pin 13: first receiving groove

14: second receiving groove 15: partition wall

15a: Long central through hole 16: Rib

20: first terminal block 21: contact pin

22: 1st plastic injection molding 22a: protrusion

23: first elastic member 24: second elastic member

25: second plastic injection molding 25a: first receiving groove

25b: second accommodation groove 25c: third accommodation groove

30: second terminal block 40: the first printed circuit board

40a, 40b: Connection terminal 50L: Left lever

50R: Right lever 60: Second printed circuit board

70: guide post pin

Hereinafter, a ram module test socket according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view schematically showing a socket for testing a RAM module according to an embodiment of the present invention, and FIG. 2 is a view taken along arrow II-II in FIG. 3 is a longitudinal cross-sectional view illustrating a state in which a printed circuit board is inserted, and FIG. 3 is a longitudinal cross-sectional view taken along arrow III-III in FIG. 1, and FIG. 4 is a state in which the first and second terminal blocks are removed below in FIG. 3. 5 is an exploded cross-sectional view showing an exploded view of the first and second terminal blocks of FIG.

1 to 5, the RAM module test socket according to an embodiment of the present invention includes a housing 10 formed by injection molding an insulating synthetic resin material, and the first and the first housings 10. A first pin having a plurality of contact pins 21 and 31 inserted into and fixed to second receiving grooves 13 and 14 and electrically contacting connection terminals 40a and 40b formed at both sides of the first printed circuit board 40. And a hinge pin 12 disposed on both sides of the housing 10 so that the first printed circuit board 40 inserted between the second terminal blocks 20 and 30 is pushed upward from the bottom to be discharged. Both ends of the housing 10 are inserted into left and right levers 50L and 50R and through holes (not shown) formed in the lower second printed circuit board 60 to fix the housing 10 in position. It has a pair of guide post pins 70 installed vertically downward with respect to the lower part have.

The housing 10 has a tapered upper groove 11 in which a lower portion thereof is narrowed along a longitudinal direction at an upper center thereof, and first and second receiving grooves symmetrically formed about a center line ℓ at a lower portion thereof. 13 and 14, a partition wall 15 having a long central through hole 15a formed between the upper groove 11 and the first and second receiving grooves 13 and 14, and the first printed circuit board. It is comprised by the rib 16 (rib) integrally formed in the one side wall part between the elongate center through-hole 15a of the said partition wall 15 so that the wrong insertion of 40 may be carried out.

The first and second terminal blocks 20 and 30 are symmetrical to each other.

The first terminal block 20 is made of a synthetic resin material having a plurality of contact pins 21 arranged in parallel with a predetermined interval, and the middle height of the contact pins 21 so as to regulate the positional movement of the contact pins 21. The first plastic injection molded body 22 and the first and second printed circuit boards 40 and 60 are formed to be integrally packed by insert molding into a furnace and are formed to have a fixing protrusion 22a toward the rear side. First and second elastic members 23 and 24 elastically supporting the bent portions on the upper and lower portions of the contact pins 21 so as to be in electrical contact with the first plastic injection molded body 22. At the same time as fixing the position, the second receiving groove 25b for receiving the position fixing projection 22a integrally protruding formed on the back side of the first plastic injection molded body 22 is formed, the contact pin 21 ) First receiving groove for accommodating the first and second elastic members (23, 24) to elastically support It consists of the 2nd plastic injection molded object 25 in which 25a and the 3rd receiving groove 25c were formed.

More specifically, the second plastic injection molded body 25 accommodates the first receiving groove 25a formed on the upper right side to accommodate the first elastic member 23 and the first plastic injection molded body 22. At the same time, the second receiving groove 25b having a wide and narrow two-stage shape at the lower right side to receive the protrusion 22a integrally formed on the rear side of the first plastic injection molded body 22, and the contact pin At the same time, the lower portion of the 21 is elastically supported, and the third receiving groove 25c having a rectangular shape is opened downward in the lower surface to accommodate the second elastic member 24.

The second terminal block 30 inserts a plurality of contact pins 31 arranged in parallel with a predetermined interval and a middle height of the contact pins 31 to regulate the positional movement of the contact pins 31. And the third plastic injection molded body 32 having the position fixing protrusion 32a formed toward the rear side and electrically contacting the contact terminals of the first and second printed circuit boards 40 and 60. Position and fix the third and fourth elastic members 33 and 34 and the third plastic injection molded body 32 to elastically support the bent portions on the upper and lower portions of the contact pins 31 so as to contact each other. At the same time, a second receiving groove 35b is formed on the rear side of the third plastic injection molded body 32 to receive the position fixing protrusion 32a integrally formed thereon, and the contact pin 31 is burned. A first receiving groove 35a for receiving the first and second elastic members 33 and 34 to be sexually supported; It consists of the 4th plastic injection molded object 35 in which the 3rd receiving groove 35c was formed.

More specifically, the fourth plastic injection molded body 35 accommodates the first receiving groove 35a formed on the upper right side to accommodate the first elastic member 33 and the third plastic injection molded body 32. At the same time, the second receiving groove 35b having a wide and narrow two-stage shape at the lower right side to receive the projection 32a integrally formed on the back side of the third plastic injection molded body 32, and the contact pin At the same time, the lower portion of the 31 is elastically supported, and the third receiving groove 35c having a rectangular shape is opened toward the lower portion of the lower surface to accommodate the second elastic member 34.

Next, the operation and effects of the RAM module test socket according to the embodiment of the present invention configured as described above will be described.

First, the first contact pins 21 and 31 are positioned so that the first contact pins 21 and 31 are positioned in parallel at a predetermined interval (a gap of 0.1 to 1 mm) by pressing a metal sheet material, for example, beryllium copper plate. After inserting the middle part of the field (for example, the upper bent portion and the lower bent portion) into the synthetic resin of an insulating material, the first contact pins 21 and 31 are generally processed into L or fish hook shapes. First injection grooves 25a and 35a on one side of the first and fourth plastic injection molded bodies 25 and 35 while injection molding the first and fourth plastic injection molded bodies 25 and 35 with synthetic resin of insulating material. The second receiving grooves 25b and 35b are formed, respectively, and the third receiving grooves 25c and 35c are formed in the bottom surfaces of the first and fourth plastic injection molded bodies 25 and 35, respectively.

Next, the first elastic members 23 and 33 are inserted into the first receiving grooves 25a and 35a respectively formed in the first and fourth plastic injection molded bodies 25 and 35 to fix the positions. The second elastic members 24 and 34 are inserted into and fixed in the third receiving grooves 25c and 35c respectively formed in the fourth plastic injection moldings 25 and 35, and then the first and fourth plastic injection moldings ( Assemble the first and second terminal blocks 20 and 30 by inserting and fixing the first and third plastic injection molded bodies 22 and 32 into the second receiving grooves 25b and 35b formed in the 25 and 35, respectively. To manufacture.

The first and second terminal blocks 20 and 30 assembled as described above are lowered in the first and second receiving grooves 13 and 14 formed in the lower part of the housing 10 constituting the RAM module test socket of the present invention. Insert each from as shown in FIG.

In this case, the contact pins 21 and 31 of the first and second terminal blocks 20 and 30 are disposed to face each other with a predetermined interval with respect to the center line l in FIG. 3.

In the RAM module test socket of the present invention manufactured as described above, the second printing as shown in Figure 2 a pair of guide post pin 70 is installed vertically downward to the lower portion of the housing 10 After inserting a hole (not shown) formed in the circuit board 60, the first inside the elongated central through hole 15a formed in the center of the housing 10 through the upper groove 11 of the housing 10. When the side where the contact terminals 40a and 40b of the printed circuit board 40 are formed is inserted, the contact terminals 40a and 40b of the first printed circuit board 40 and the first and second terminal blocks 20, While the contact pins 21 and 31 of 30 are electrically contacted, the contact terminals (not shown) of the second printed circuit board 60 are contact pins of the first and second terminal blocks 20 and 30. It is electrically connected to (21, 31), and it becomes a state which can test a ram module.

In this state, after testing the ram module using the ram module test socket of the present invention, the left and right levers 50L and 50R to remove the first printed circuit board 40 from the housing 10. ) And the left lever 50L rotates counterclockwise while the right lever 50R rotates clockwise, the first and second ends of the left and right levers 50L and 50R rise upward. The circuit board 40 is removed from the housing 10.

As described above, even if the RAM module continues to test the electrical characteristics frequently, the present invention is a socket for testing the RAM module insert the middle of the contact pins (21, 31) of the first and second terminal blocks (20, 30) The projection is formed integrally on the rear surface of the first and third plastic injection molded bodies 22 and 32 formed by insert injection while fixing the position at a predetermined interval by the injection molding. Since the first and second terminal blocks 22a and 32a are respectively inserted into and fixed in the second receiving grooves 25b and 35b formed in the second and fourth plastic injection molded bodies 25 and 35, respectively. Since the position of (20, 30) is constant (more specifically, the position of the contact pins 21, 31 of the first and second terminal blocks 20, 30 is constant), the ram module can be reliably tested. have.

In addition, the present invention, if the contact pins 21 and 31 of the first and second terminal blocks 20 and 30 are worn or cut by using the RAM module test socket for a long time, the first of the housing 10 And the first and second terminal blocks 20 and 30 inserted in the second receiving grooves 13 and 14 can be easily replaced, thereby making it easy to maintain and maintain the first and second terminal blocks 20 and 30. Since the first and third plastic injection molded bodies 22 and 32 of the second terminal blocks 20 and 30 are integrally arranged in parallel at regular intervals, the manufacturing cost is reduced. You can.

In the above description, the surface on which the first contact pins 21 and 31 of the first and fourth plastic injection molded bodies 25 and 35 are positioned, that is, the right side surface and the fourth plastic of the first plastic injection molded body 25. On the left side of the injection molded body 35, a plurality of grooves (eg, first) are disposed along the longitudinal direction such that the first contact pins 21 and 31 are inserted in a length less than 1/2 of the thickness in the longitudinal direction. Even if the number of the contact pins (21, 31) the number of grooves) is formed of course the concept of the present invention.

In the above description, although illustrated and described with reference to specific embodiments, the present invention is not limited to this, for example, by those of ordinary skill in the art without departing from the concept of the present invention Of course, the design can be changed in various ways.

As described above, according to the RAM module test socket of the present invention, the middle parts of the contact pins of the first and second terminal blocks are fixed at a predetermined interval by insert injection, and the middle parts of the contact pins are inserted by insert injection. Since the protrusions integrally formed on the rear surfaces of the first and third plastic injection molded bodies to be formed are respectively inserted into and fixed in the second receiving grooves formed in the second and fourth plastic injection molded bodies, respectively, the first and second Since the location of the contact pins installed in the terminal block is constant, the ram module can be reliably tested. In addition, if the contact pins of the first and second terminal blocks are worn or cut for a long time, Since the first and second terminal blocks inserted into the first and second receiving grooves can be easily replaced, maintenance and maintenance can be facilitated. In addition, since the terminal pins are arranged in parallel with a predetermined interval by the first and third plastic injection molded bodies of the first and second terminal blocks, the manufacturing cost can be reduced.

Claims (4)

The housing 10 formed by injection molding an insulating resin material and the first and second receiving grooves 13 and 14 of the housing 10 are inserted into and fixed to the first printed circuit board 40 from below. Through-holes formed in the left and right levers 50L and 50R installed on the both sides of the housing 10 so as to be operated up and down on both sides of the housing 10 so as to be pushed out. In the ram module test socket having a pair of guide post pins 70 which are inserted into and installed downwardly perpendicular to the lower end of both ends of the housing 10 so as to fix the housing 10. Contact pins inserted into and fixed to the first and second receiving grooves 13 and 14 of the housing 10 to be in electrical contact with the connection terminals 40a and 40b formed at both sides of the first printed circuit board 40. The first and second terminal blocks 20, which elastically support the connection pins 21 and 31 while simultaneously fixing the connection pins 21 and 31 by inserting the middle part of the 21 and 31 inserts, A socket for testing a RAM module, comprising: 30). According to claim 1, The housing 10 has a tapered upper groove (11) is formed in the lower portion of the upper narrow in the longitudinal direction in the upper center, the first is formed symmetrically around the center line (L) in the lower portion And barrier ribs 15 having second receiving grooves 13 and 14 formed therein, and long central through holes 15a formed between the upper grooves 11 and the first and second receiving grooves 13 and 14. Rib 16 formed integrally with one side wall portion between the elongated central through hole 15a of the partition wall 15 to prevent misinsertion of the first printed circuit board 40, characterized in that RAM module test socket. According to claim 1, The first terminal block 20 is a plurality of contact pins 21 arranged in parallel with a predetermined interval and the contact pins 21 to regulate the position movement of the contact pins 21 The first height of the plastic injection molded body 22 and the first and second printed circuit boards 40 having the position fixing projections 22a formed toward the rear side. First and second elastic members 23 and 24 elastically supporting the bent portions on the upper and lower portions of the contact pins 21 so as to be in electrical contact with the contact terminals of. At the same time, the injection molded body 22 is fixed, and the position fixing protrusion 22a integrally formed on the back side of the first plastic injection molded body 22 is accommodated, and the contact pin 21 is elastic. The first receiving groove 25a and the second accommodating the first and second elastic members 23 and 24 supporting the first and second elastic members 23 and 24. Yonghom (25b) and the third receiving groove (25c) RAM module for the test socket, characterized in that is composed of the second plastic injection molded product 25 is formed. According to claim 3, The second terminal block 30 is a plurality of contact pins 31 arranged in parallel with a predetermined interval and the contact pins 31 to regulate the position movement of the contact pins (31) Of the third plastic injection molded body 32 and the first and second printed circuit boards 40 and 60 formed by insert-injecting and packing the medial height of the field together with the fixing protrusion 32a formed toward the rear side. First and second elastic members 33 and 34 elastically supporting the bent portions on the upper and lower portions of the contact pins 31 to electrically contact the contact terminals, and the third plastic injection molded body 32. ) And at the same time, a second receiving groove (35b) is formed on the rear side of the third plastic injection molded body 32 to receive the position fixing projection (32a) integrally formed, the contact pin Receiving the first and second elastic members 33, 34 to elastically support (31) First receiving recess (35a) and the third receiving groove fourth plastic RAM module for the test socket, characterized in that consists of an injection-molded article (35) (35c) is formed.