KR200262124Y1 - Diffusion apparatus for manufacturing a semiconductor device - Google Patents

Abstract

The present invention relates to a diffusion device for manufacturing a semiconductor device, the front cover 50 is installed on one side of the main body 10 so as to be open and close, the rear cover of the front cover 50, one or two or more internals In the diffusion device for manufacturing a semiconductor device comprising a stocker 80 opened and closed by the cover (60, 70), the wafer cassette (W / C) stored in the stocker (80) from the outside of the main body 10 The front cover 50 and the internal cover 60 and 70 are formed of a transparent material so that the wafer stopped outside the main body of the apparatus when the wafer cassette transferred to or from the stocker is stopped due to mechanical trouble. By identifying the position and situation of the cassette easily and quickly, it has the effect of reducing the time and effort required for the maintenance and repair of the apparatus.

Description

Diffusion apparatus for manufacturing semiconductor device {DIFFUSION APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE}

The present invention relates to a diffusion device for manufacturing a semiconductor device, and more particularly, the position and situation of the stopped wafer cassette outside the main body of the device when the wafer cassette conveyed to or from the stocker is stopped due to mechanical trouble The present invention relates to a diffusion device for manufacturing a semiconductor device that can easily grasp and quickly follow up.

Diffusion apparatus used in the process for manufacturing semiconductor devices is a device for injecting impurities or oxide films on the wafer surface in the solid state by using the high temperature of the furnace. It is divided into type furance and horizontal type furnace, and vertical diffusion furnace is commonly used.

Referring to the diffusion device having a vertical diffusion path provided on the inside using the accompanying drawings as follows.

1 is a partial cutaway view showing a diffusion apparatus for manufacturing a conventional semiconductor device. As shown in the drawing, a diffuser having an outer and inner tube, a heater, a boat, a lifter, a cassette stage, and the like, which are not shown in the inside, has a plurality of processes that can grasp the progress of the process in front of the main body 1. Panel 2, various operation switches (not shown), and an I / O port 3 on which a wafer cassette W / C loaded / unloaded into the body 1 is mounted. The I / O port 3 is provided with a cassette transfer 4 for transferring wafer cassettes W / C.

In addition, a front cover (5) having one side hinged to the front of the main body (1) of the diffusion device is installed, and opened and closed by an internal cover (6, 7) to the rear side of the front cover (5). In addition, a stocker 8, in which the wafer cassette W / C is stored, is installed.

The front cover 5 is provided with a signal tower (not shown) that displays the progress of the process to the outside in the front, and is usually fixed by a screw (not shown) to the main body 1, so the front cover must be unscrewed. (5) can be opened from the main body 1.

The internal covers 6 and 7 are made of one or two or more, and in this embodiment, the first and second internal covers 6 and 7 are sequentially installed on the rear side of the front cover 5, respectively. The first internal cover 6 is provided with a handle 6a at the front side, and is installed at the rear side of the main body 1 by fastening the screw S, and the second internal cover 7 is a flow of air. In view of this, a plurality of air holes 7a are formed and are provided by the screw S on the rear side of the first internal cover 6.

The stocker 8 stores a plurality of wafer cassettes W / C in four stages, and a sensor (not shown) for detecting the position of the wafer cassettes W / C is installed inside the wafer cassette W. / C) is transferred from the I / O port 3 to the stocker 8 by the cassette transfer 4 and from the stocker 8 to the cassette stage not shown or vice versa.

The diffusion device for manufacturing such a conventional semiconductor device is a stocker when the wafer cassette (W / C) transferred to or from the stocker 8 by the cassette transfer 40 is stopped by mechanical trouble. Since the first and second internal covers must be separated, the front cover, the first internal cover and the second internal cover must be removed.

Therefore, the conventional diffusion apparatus has a problem that requires a lot of time and effort for maintenance and maintenance because it is difficult to easily identify when the wafer cassette is stopped due to mechanical trouble.

The present invention is to solve the above-mentioned conventional problems, an object of the present invention is the position and situation of the stopped wafer cassette outside the main body of the apparatus when the wafer cassette to be transported to or from the stocker is stopped due to mechanical trouble It is to provide a diffusion device for manufacturing a semiconductor device that reduces the time and effort required for the maintenance and repair of the device by easily and quickly grasp.

The present invention for realizing the above object is to manufacture a semiconductor device including a front cover which is installed to open and close on one surface of the main body, and a stocker installed to the rear side of the front cover and opened and closed by one or more internal covers. In the diffusion apparatus for the front cover and the internal cover is characterized in that the transparent cover to the wafer cassette stored in the stocker from the outside of the main body.

1 is a partial cutaway view showing a diffusion device for manufacturing a conventional semiconductor device,

2 is a partial cutaway view showing a diffusion device for manufacturing a semiconductor device according to the present invention,

3 is a perspective view showing a diffusion device for manufacturing a semiconductor device according to the present invention.

<Description of Symbols for Main Parts of Drawings>

10; Main body 20; panel

30; I / O port 40; Cassette transfer

50; Front cover 60; 1st internal cover

70; Second internal cover 80; stalker

Hereinafter, with reference to the accompanying drawings, the most preferred embodiment of the present invention will be described in more detail so that those skilled in the art can easily practice.

2 is a partial cutaway view showing a diffusion device for manufacturing a semiconductor device according to the present invention, Figure 3 is a perspective view showing a diffusion device for manufacturing a semiconductor device according to the present invention. As shown, the diffusion device for manufacturing a semiconductor device according to a preferred embodiment of the present invention is a plurality of panels 20 and the various operation switches (figure) to grasp the progress of the process on the front of the main body 10 No), an I / O port 30 on which a wafer cassette (W / C) loaded / unloaded into the body 10 is seated, and a front cover 50 formed of a transparent material, respectively. It is provided with a stocker (80), which is opened and closed by an internal cover (60, 70) formed of a transparent material on the rear side of the front cover 50, and the wafer cassette (W / C) is stored do.

The I / O port 30 is provided with a cassette transfer 40 for transferring a wafer cassette (W / C), and the cassette transfer 40 is a wafer cassette (W / C) loaded in the I / O port 30. Stage (not shown) in which the wafer cassette (W / C) waits when the wafer performs the diffusion process, as well as transferring the wafer to the stocker (80) or vice versa. ) Or vice versa.

The front cover 50 is formed of a transparent material, and is fixed to the main body 10 by a screw (not shown) in a state in which one side is hinged to be rotatable to the main body 10, and the process of the process on the front outside Signal towers (not shown) are installed.

Internal cover (internal cover; 60, 70) may be made of one or two or more, these are all formed of a transparent material. In the present embodiment, the internal covers 60 and 70 include a first internal cover 60 and a second internal cover 70 which are sequentially installed at the rear side of the front cover 50, respectively.

The first internal cover 60 is provided at the rear side of the front cover 10 by the fastening of the screw S and the handle 61 is provided on the front, the second internal cover 70 is the flow of air In view of this, a plurality of air holes 71 are formed and are installed at the rear side of the first internal cover 60 by fastening the screws S.

Meanwhile, the front cover 50 and the first and second internal covers 60 and 70 may be formed of acrylic resin, which is a kind of plastic, in order to be formed of a transparent material.

The stocker 80 has a plurality of wafer cassettes W / C stored in four stages, and a sensor (not shown) for detecting the position of the wafer cassettes W / C is installed inside.

Such a diffusion device for manufacturing a semiconductor device according to the present invention is as shown in Figure 3 when the wafer cassette (W / C) to or from the stocker 80 is stopped by mechanical trouble during transfer. The position and situation of the stopped wafer cassette (W / C) by the operator visually checking the inside of the stocker 80 through the front cover 50 and the first and second internal covers 60 and 70 which are transparent from the outside. Can be easily identified and quickly followed up.

Therefore, it is necessary to separate the front cover 50 and the first and second internal covers 60 and 70 in order to grasp the position and the situation of the suspended wafer cassette W / C inside the stocker 80. This makes it possible to quickly find a mechanical trouble that has stopped the wafer cassette (W / C), thereby maintaining and repairing the device with little time and effort.

As described above, the diffusion apparatus for manufacturing a semiconductor device according to the present invention is to determine the position and situation of the stopped wafer cassette outside the main body of the apparatus when the wafer cassette conveyed to or from the stocker is stopped due to mechanical trouble. By identifying easily and quickly, it has the effect of reducing the time and effort required to maintain and repair the device.

What has been described above is only one embodiment for implementing a diffusion device for manufacturing a semiconductor device according to the present invention, the present invention is not limited to the above-described embodiment, which is claimed in the utility model registration claims below As will be apparent to those skilled in the art to which the present invention pertains without departing from the gist of the present invention, there is a technical spirit of the present invention to the extent that various modifications can be made.

Claims (1)

In the diffusion device for manufacturing a semiconductor device comprising a front cover that is installed to open and close on one surface of the main body, and a stocker provided to the rear side of the front cover and opened and closed by one or more internal covers, The front cover and the internal cover is formed of a transparent material so that the wafer cassette stored in the stocker on the outside of the main body, the diffusion device for manufacturing a semiconductor device.