KR200255756Y1 - Titanuim-copper busbar submerged under the plati ng solution - Google Patents
Titanuim-copper busbar submerged under the plati ng solution Download PDFInfo
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- KR200255756Y1 KR200255756Y1 KR2020010024331U KR20010024331U KR200255756Y1 KR 200255756 Y1 KR200255756 Y1 KR 200255756Y1 KR 2020010024331 U KR2020010024331 U KR 2020010024331U KR 20010024331 U KR20010024331 U KR 20010024331U KR 200255756 Y1 KR200255756 Y1 KR 200255756Y1
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Abstract
본 고안은 인쇄회로기판 등과 같이 정밀도금이 요구되는 제품을 도금할 때 사용되는 티타늄-동 수중 부스바에 관한 것으로서, 동판(11)이 티타늄 커버(13)에 의해 커버되며, 티타늄 커버(13)의 양측면이 압착되어 티타늄 커버(13)가 동판(11)에 완전 밀착되는 것을 특징으로 한다.The present invention relates to a titanium-copper underwater busbar used when plating a product requiring precision gold, such as a printed circuit board, and the copper plate 11 is covered by the titanium cover 13, the titanium cover 13 Both sides are compressed so that the titanium cover 13 is completely in contact with the copper plate 11.
Description
본 고안은 인쇄회로기판 등과 같이 정밀도금이 요구되는 제품을 도금할 때 사용되는 티타늄-동 수중 부스바에 관한 것으로서, 보다 상세하게는 동(銅)판을 커버하는 티타늄 커버를 측면에서 압착하여 티타늄 커버가 동판에 완전 밀착되는 티타늄-동 수중 부스바에 관한 것이다.The present invention relates to a titanium-copper underwater busbar used when plating a product requiring precision gold, such as a printed circuit board. More specifically, the titanium cover covering the copper plate is pressed from the side to cover the titanium cover. It relates to a titanium-copper underwater busbar that is completely in contact with the copper plate.
일반적으로, 동(Cu)으로만 이루어진 부스바는 약품에 의해 부식되기 때문에 도금액속에 침수시키지 못하여 사용환경이 매우 제한되었다. 이를 개선하기 위해 약품에 의해 부식되지 않도록 동(Cu)을 티타늄으로 감싼 티타늄-동 부스타가 제안되었다.In general, a bus bar made only of copper (Cu) is corroded by a chemical and thus cannot be immersed in the plating solution, thereby limiting the use environment. In order to improve this, a titanium-copper buster has been proposed in which copper is wrapped in titanium to prevent corrosion by chemicals.
도 1 및 도 2를 참조하면, 종래의 티타늄-동 부스바(1)는 단순하게 동판(3)이 티타늄 커버(5)에 의해 커버되어 있기 때문에 동판(3)과 티타늄 커버(5) 사이에 간극이 발생하여 전기전도도가 저하되며, 불안정한 전기전도에 의해 열 및 통전손실이 발생하는 문제점이 있었다.1 and 2, the conventional titanium-copper busbar 1 is simply between the copper plate 3 and the titanium cover 5 because the copper plate 3 is covered by the titanium cover 5. There is a problem that the gap occurs, the electrical conductivity is lowered, heat and current loss caused by unstable electrical conductivity.
따라서, 본 고안의 목적은 동(銅)판을 커버하는 티타늄 커버를 측면에서 압착하여 티타늄 커버를 동판에 밀착시키므로서 전기전도도를 향상시킬 수 있는 티타늄-동 수중 부스바를 제공하는 것이다.Accordingly, an object of the present invention is to provide a titanium-copper underwater busbar that can improve electrical conductivity by pressing the titanium cover covering the copper plate from the side to closely adhere the titanium cover to the copper plate.
상기와 같은 목적을 달성하기 위한 본 고안은 동판이 티타늄 커버에 의해 커버되며, 티타늄 커버의 양측면이 압착되어 티타늄 커버가 동판에 완전 밀착되는 것을 특징으로 하는 티타늄-동 수중 부스바.The present invention for achieving the above object is a copper plate is covered by a titanium cover, the titanium cover is characterized in that both sides of the titanium cover is pressed and the titanium cover is completely in close contact with the copper plate.
상기 티타늄 커버는 롤러 또는 압착기 등에 의해 양측면이 압착되므로서, 양측면에 오목한 홈이 형성되는 것을 특징으로 한다.The titanium cover is characterized in that both sides are compressed by rollers or presses, so that recessed grooves are formed on both sides.
이하 첨부도면을 참조하여 본 고안의 실시예를 상세하게 설명하기로 한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 종래의 티타늄-동 수중 부스바를 도시한 측면도1 is a side view showing a conventional titanium-copper underwater busbar
도 2는 도 1의 A-A선에 따른 단면도2 is a cross-sectional view taken along the line A-A of FIG.
도 3은 본 고안에 따른 티타늄-동 수중 부스바를 도시한 측면도Figure 3 is a side view showing a titanium-copper underwater busbar according to the present invention
도 4는 도 3의 B-B선에 따른 단면도4 is a cross-sectional view taken along the line B-B of FIG.
*도면의 주요부분에 대한 부호설명** Description of Signs of Main Parts of Drawings *
11 : 동판 13 : 티타늄 커버11: copper plate 13: titanium cover
15 : 홈15: home
도 3 및 도 4를 참조하면, 본 고안에 따른 티타늄-동 수중 부스바(10)는 동판(11)이 티타늄 커버(13)에 의해 커버되며, 티타늄 커버(13)의 양측면이 압착되어 티타늄 커버(13)가 동판(11)에 완전 밀착된다.3 and 4, the titanium-copper underwater busbar 10 according to the present invention has a copper plate 11 covered by a titanium cover 13, and both sides of the titanium cover 13 are compressed to cover a titanium cover. 13 is in close contact with the copper plate 11.
상기 티타늄 커버(13)는 롤러 또는 압착기 등에 의해 양측면이 압착되므로서, 양측면에 오목한 홈(15)이 형성된다.Since the titanium cover 13 is pressed at both sides by a roller or a press, etc., recesses 15 are formed at both sides.
상기와 같은 구성에 의해 본 고안에 따른 티타늄-동 수중 부스바는 티타늄 커버(3)와 동판(11)이 완전 및착되기 때문에 전기전도가 불안정하지 않게 된다.By the configuration as described above, the titanium-copper underwater busbar according to the present invention is because the titanium cover 3 and the copper plate 11 is completely attached and the electrical conductivity is not unstable.
위에서 설명한 바와같이 본 고안에 따른 티타늄-동 수중 부스바는 전기전도도가 안정하여 열 발생이 저감되며, 통전손실이 절감되는 효과가 있다.As described above, the titanium-copper underwater busbar according to the present invention has a stable electric conductivity, thereby reducing heat generation and reducing current loss.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2020010024331U KR200255756Y1 (en) | 2001-08-10 | 2001-08-10 | Titanuim-copper busbar submerged under the plati ng solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2020010024331U KR200255756Y1 (en) | 2001-08-10 | 2001-08-10 | Titanuim-copper busbar submerged under the plati ng solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR200255756Y1 true KR200255756Y1 (en) | 2001-12-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2020010024331U KR200255756Y1 (en) | 2001-08-10 | 2001-08-10 | Titanuim-copper busbar submerged under the plati ng solution |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190139999A (en) * | 2018-03-22 | 2019-12-18 | 도야마 스미토모 덴코우 가부시키가이샤 | Plating processing equipment |
-
2001
- 2001-08-10 KR KR2020010024331U patent/KR200255756Y1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190139999A (en) * | 2018-03-22 | 2019-12-18 | 도야마 스미토모 덴코우 가부시키가이샤 | Plating processing equipment |
| KR102211583B1 (en) | 2018-03-22 | 2021-02-02 | 도야마 스미토모 덴코우 가부시키가이샤 | Plating processing device |
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