KR200241407Y1 - Apparatus for rinsing semiconductor wafer and using quick dump - Google Patents

Abstract

The present invention relates to a quick dump rinse apparatus for a semiconductor wafer, wherein the air pressure is reduced when a quick dump is turned on by a valve control unit 300 that selectively controls a path of the air pressure supplied from the air pressure supply unit 400. A plurality of dump valves opened and closed by a plurality of pneumatic cylinders 210 to which the first supply tube 310 to be supplied and the second supply tube 320 to which air pressure is supplied when the quick dump is turned off ( In the quick dump rinse apparatus for a semiconductor wafer having a dump valve (200), each of which is installed in the first supply tube (310), the air pressure regulating valve 500 for adjusting the air pressure supplied through the first supply tube (310) By adjusting the air pressure of the pneumatic cylinder of the dump valve, it is possible to prevent unnecessary replacement of the pneumatic cylinder and save the maintenance cost of the device. It has a rinsing effect, which has the effect that it is possible to always hold optimal.

Description

Quick dump rinsing device for semiconductor wafers {APPARATUS FOR RINSING SEMICONDUCTOR WAFER AND USING QUICK DUMP}

The present invention relates to a quick dump rinse device for semiconductor wafers, and more particularly, to prevent unnecessary replacement of pneumatic cylinders, thereby reducing the maintenance cost of the device. The present invention relates to a quick dump rinse device for semiconductor wafers that can always be maintained in an optimal state.

In general, one of the most basic processes of manufacturing semiconductor wafers is the cleaning process, which is performed in a cleaning equipment called a wet station, and in the process of performing various steps to manufacture semiconductor wafers. Remove any contaminants attached to the wafer.

Among these cleaning processes, a rinse process is a process of finally cleaning the semiconductor wafer after the etching process and the chemical cleaning process using deionized water, and for this purpose, the ultrapure water supplied to the rinse bath is overflowed. The rinsing process is performed by repeatedly performing the over flow step and the quick dump of the ultrapure water of the rinse bath.

The quick dump rinse apparatus of the semiconductor wafer which performs the rinsing process as described above will be described with reference to the accompanying drawings.

1 is a schematic cross-sectional view of a quick dump rinse apparatus for a semiconductor wafer according to an exemplary embodiment. As shown in the drawing, a conventional quick dump rinse apparatus for a semiconductor wafer has a rinse bath 10 for rinsing with ultrapure water by mounting a semiconductor wafer W, and a quick dump of ultrapure water on the bottom of the rinse bath 10. It consists of a dump valve (20).

In the rinse bath 10, a wafer support 11 for mounting a plurality of semiconductor wafers W is formed inside the rinse bath 10, and a megasonic 12 for generating ultrasonic waves is provided under the rinse bath 10, and the lower surface 13 of the rinse bath 10 is provided. ) Is provided with two dump valves 20.

The dump valve 20 has two outlets formed on the bottom surface 13 of the rinse tank 10 and a pneumatic cylinder 21 having a packing 21a coupled to the outlets at the end of the piston rod 21b. It consists of.

The pneumatic cylinder 21 is a single rod double acting type, and has first and second ports 21c and 21d formed therein, and air pressure is supplied to the respective ports 21c and 21d, and the piston is provided in the direction in which the air pressure is supplied. Reciprocate.

2 is a control block diagram of a pneumatic cylinder provided in a quick dump rinse apparatus for a semiconductor wafer according to an exemplary embodiment. As shown, the pneumatic cylinder 21 receives the air pressure from the valve control unit 30 for selectively controlling the path of the air pressure supplied from the air pressure supply unit 40. Accordingly, the first port 21c of the pneumatic cylinder 21 is connected to the first supply tube 31 to which air pressure is supplied from the valve control unit 30 at the time of quick dump on, and the first port 21c of the pneumatic cylinder 21 The second port 21d is connected to the second supply tube 32 to which air pressure is supplied from the valve control unit 30 at the time of quick dump off.

The valve control unit 30 includes a direction control valve (not shown), and the direction control valve selectively controls the path of the air pressure supplied. Therefore, when the quick dump is turned on according to an operator's operation or a predetermined control signal, the pneumatic pressure supplied from the pneumatic pressure supply unit 40 is supplied to the pneumatic cylinder through the first supply tube 31 by the direction control valve of the valve control unit 30. By supplying to the first port 21c of the 21, the dump valve 20 is opened from the outlet. Accordingly, the ultrapure water stored in the rinsing tank 10 by the dump valve 20 opening from the discharge port is instantaneously drained through the discharge port so that the photoresist, solvent residue, and slurry adhered to the surface of the semiconductor wafer mounted in the rinsing tank 10. Impurities).

In addition, when the quick dump is turned off according to the operator's operation or a predetermined control signal, the pneumatic pressure supplied from the pneumatic pressure supply unit 40 is supplied to the pneumatic cylinder through the second supply tube 32 by the direction control valve of the valve control unit 30. By supplying to the second port 21d of the 21, the dump valve 20 closes the outlet. When the discharge port is closed by the dump valve 20, ultrapure water is filled in the rinse bath 10 to rinse another semiconductor wafer.

As described above, the conventional quick dump rinsing device for semiconductor wafers rinses the semiconductor wafer mounted in the rinsing tank by quick dumping ultrapure water from the rinse tank by opening two dump valves at the same time. If ultra-pure water penetrates into the pneumatic cylinder, the two dump valves are not balanced with each other. If one of the dump valves is opened first, the ultra-pure water flows toward the open outlet port and the quick dump is not performed properly. There is a problem.

To solve this problem, it is necessary to replace the dump valves.When replacing the pneumatic cylinders in which the dump valves are not balanced, the balance between the newly replaced pneumatic cylinder dump valves and the continuously used pneumatic cylinder dump valves is balanced. If the pneumatic cylinder is replaced, two new pneumatic cylinders should be replaced. Therefore, there is a problem in that parts replacement and maintenance cost of the rinsing device are expensive by replacing two expensive pneumatic cylinders at once.

The present invention is to solve the above-mentioned problems, the object of the present invention is to adjust the air pressure of the pneumatic cylinder of the dump valve to prevent unnecessary replacement of the pneumatic cylinder to reduce the maintenance cost of the device, dump valve The present invention provides a quick dump rinsing device for semiconductor wafers that can keep the rinsing effect of semiconductor wafers in an optimal state at the same time.

The present invention for realizing the above object, the first supply tube to supply the air pressure when the quick dump on and the second when the air pressure is supplied when the quick dump off by the valve control unit for selectively controlling the path of the air pressure supplied from the air pressure supply unit In the quick dump rinsing apparatus of a semiconductor wafer having a plurality of dump valves that are opened and closed by a plurality of pneumatic cylinders connected to the supply tube, each of which is installed in the first supply tube, the first supply tube It characterized in that it comprises an air pressure control valve for adjusting the air pressure supplied through the tube.

The pneumatic control valve is characterized in that the needle valve (needle valve).

1 is a cross-sectional view schematically showing a quick dump rinse apparatus of a semiconductor wafer according to an embodiment of the present invention;

2 is a control block diagram of a pneumatic cylinder provided in a quick dump rinse apparatus for a semiconductor wafer according to a conventional embodiment;

3 is a cross-sectional view schematically showing a quick dump rinse apparatus for a semiconductor wafer according to one embodiment of the present invention;

4 is a control block diagram of a pneumatic cylinder provided in a quick dump rinse apparatus of a semiconductor wafer according to an embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

100: rinse tank 200: dump valve

210: pneumatic cylinder 213: first port

214: second port 300: valve control unit

310: first supply tube 320: second supply tube

400: air pressure supply unit 500: air pressure control valve

Hereinafter, with reference to the accompanying drawings, the most preferred embodiment of the present invention will be described in more detail so that those skilled in the art can easily practice.

3 is a cross-sectional view schematically showing a quick dump rinsing device of a semiconductor wafer according to an embodiment of the present invention, Figure 4 is a pneumatic cylinder of the quick dump rinsing device of a semiconductor wafer according to an embodiment of the present invention Control block diagram. As shown, the rinse tank 100 for rinsing the mounted semiconductor wafer W with ultrapure water and the outlet formed on the lower surface 130 of the rinse tank 100 are opened and closed by a pneumatic cylinder 210. Two dump valves (200) and each of the pneumatic cylinder (210) is composed of a pneumatic pressure control valve 500 that can adjust the air pressure supplied when the quick (quick dump on).

The rinse bath 100 has a wafer support 110 for mounting a plurality of semiconductor wafers W therein, and a megasonic 120 for generating ultrasonic waves under the wafer support 110. do. In addition, two dump valves 200 are provided on the lower surface 130 of the rinse tank 100.

Dump valve 200 is a pneumatic cylinder (not shown) formed on the lower surface 130 of the rinse tank 100, and the packing 211 is coupled to the discharge port formed at the end of the piston rod (212) ( 210).

The pneumatic cylinder 210 is a single rod double acting type so that the first and second ports 213 and 214 are formed, respectively, and selectively pneumatic by the valve control unit 300 for controlling the supply path of the air pressure provided from the air pressure supply unit 400. Air pressure is provided to the first port 213 or the second port 214 of the cylinder 210.

The valve control unit 300 includes a direction control valve (not shown). The direction control valve selectively controls a supply path of the air pressure provided from the air pressure supply unit 400 according to an operator's operation or a predetermined control signal. do.

Accordingly, the valve control unit 300 is connected to the ports 213 and 214 of the respective pneumatic cylinders 210 by the first and second supply tubes 210 and 220. That is, the valve control unit 300 supplies the air pressure provided from the air pressure supply unit 400 to the first port 213 of the pneumatic cylinder 210 through the first supply tube 310 when quick dump on. At the time of dumping off, the air pressure supplied from the air pressure supply unit 400 is supplied to the second port 214 of the pneumatic cylinder 210 through the second supply tube 320.

An air pressure control valve 500 is installed in the first supply tube 310, and the air pressure control valve 500 adjusts the air pressure in the first supply tube 310.

Pneumatic pressure control valve 500 is preferably a needle valve (needle valve 500) in order to accurately adjust the air pressure in the first supply tube 310, the gap of the needle valve 500 on the outside of the needle valve 500 Adjusting knob 510 is provided to adjust. Therefore, the air pressure of the first supply tube 310 can be adjusted easily and accurately by rotating the adjusting knob 510 of the needle valve 500.

The operation of the quick dump rinse apparatus for a semiconductor wafer having such a structure is performed as follows.

When the semiconductor wafer W is mounted in the rinse bath 100, the air pressure supplied from the air pressure supply unit 400 is controlled by the valve control unit 300 operated by an operator's operation or a predetermined control signal. The dump valve 200 is opened and closed by being supplied through the second supply tube 220.

In this case, when the two dump valves 200 are not balanced with each other by repeatedly using the dump valve 200 continuously or by infiltrating the ultrapure water into the pneumatic cylinder 210, the operator may have a first supply tube 210. By operating the air pressure control valve 500 installed in the air pressure by adjusting the two dump valves 200 are opened to each other to coincide with each other.

According to the most preferred embodiment as described above, when the dump valves are not balanced with each other, by operating the air pressure control valve installed in the first supply tube can be adjusted to balance the two dump valves, each one of the two If an error occurs in the pneumatic cylinder, after replacing the pneumatic cylinder in which the error occurs, operate the pneumatic control valve to adjust the balance between the newly replaced pneumatic cylinder side dump valve and the continuously used pneumatic cylinder side dump valve. .

As described above, the quick dump rinsing device of the semiconductor wafer according to the present invention can be adjusted by the air pressure of the pneumatic cylinder of the dump valve to prevent unnecessary replacement of the pneumatic cylinder, saving the maintenance cost of the device, opening the dump valve It has the effect of keeping the rinsing effect of semiconductor wafers in an optimal state at the same time.

What has been described above is just one embodiment for implementing a quick dump rinsing device for a semiconductor wafer according to the present invention, the present invention is not limited to the above-described embodiment, as claimed in the utility model registration claims below As described above, any person having ordinary knowledge in the field of the present invention without departing from the gist of the present invention has the technical spirit of the present invention to the extent that various modifications can be made.

Claims (2)

A first supply tube supplied with air pressure at the time of quick dump on and a second supply with air pressure at the time of quick dump off by a valve controller for selectively controlling a path of air pressure supplied from the air pressure supply part In the quick dump rinsing apparatus of a semiconductor wafer having a plurality of dump valves that are opened and closed by a plurality of pneumatic cylinders connected to the supply tube, And a pneumatic pressure regulating valve, respectively installed on the first supply tube, for adjusting the air pressure supplied through the first supply tube. 2. The quick dump rinse apparatus of a semiconductor wafer according to claim 1, wherein said air pressure regulating valve is a needle valve.