KR200227341Y1 - Teflon film sealing machine for testing sample - Google Patents

Abstract

The present invention is to improve the stability of the chemical during the pretreatment of the sample related to semiconductor manufacturing, and to seal the sample using a Teflon film that can minimize the source of contamination.

To this end, the present invention is the left and right frame (2a) (2b) and the legs (3) coupled to the lower end, the upper and lower support plates (4) (5) installed across the frame, and the top of the frame A top cover 6 to be installed, an elevating plate 7 installed on an upper support plate, an upper heating plate 8a installed on a lower surface of the elevating plate, and a lower heating plate 8b provided on an upper surface of the upper support plate; A guide rod 9 installed through the lower support plate, an elastic member installed between each guide rod and the elevating plate, and a movable rod 11 installed to move up and down along the hollow part of the guide rod through each elastic member; A pressing plate 12 connecting the left and right movable rods, an elastic member that connects the pressing plate and the lower support plate and is tensioned when pressure is applied to the pressing plate, and a cooling fan 14 installed at one side of the frame to cool the sealed sample. And up and down A cooling fan drive switch 16 mounted on the support plate to turn on the cooling fan when the two plates are close to each other by a predetermined distance; a timer 15 to turn off the cooling fan after a predetermined time when the cooling fan is driven; Provided is a Teflon film adhesive for sample sealing, comprising a control box 17 connected to a heating plate, a cooling fan, a timer, and a switch for driving the cooling fan, and having a built-in controller.

Description

Teflon film sealing machine for testing sample

The present invention relates to a Teflon film adhesive for sealing samples, and more particularly, using a Teflon film having the highest chemical stability and the least pollution source during pretreatment of wafers for semiconductor manufacturing and samples for various material analysis. The present invention relates to an adhesive for sealing a sample.

In general, a film adhesive is a device used to seal a sample during packaging of various products or materials or in a pretreatment process of a sample in order to be able to analyze various materials in a sample analyzing apparatus. After sealing a variety of samples associated with the input to the analysis device it is possible to analyze and evaluate the components for them.

Meanwhile, when analyzing various materials related to the semiconductor, a sample is manufactured by sealing a wafer or various materials using a commercially available adhesive machine using a polypropylene film (hereinafter referred to as "PP"). It was.

Here, since the commercial adhesive for commercial use uses a hot wire as the nichrome wire, only a material having a low melting point, such as a PP film, can be bonded because the temperature at the time of the highest rise is about 230 °.

When sealing a sample using such a conventional adhesive machine, insert the power cord into an outlet of 100V (volt), perform test bonding while adjusting the sealing time according to the adhesive material, and then, when setting of the sealing time is completed, Sealing operation is performed.

However, such a conventional adhesive machine can be sealed only for a film having a melting point of about 230 °, such as a PP film, there is a limited problem of the kind of film that can be bonded.

In addition, in the prior art, since an impurity that prevents the analysis of a specific element is eluted from the PP film used at the time of adhesion, the analysis of the specific element is impossible, and thus there is a problem in that the stability of the chemical during the pretreatment of the sample is lowered.

The present invention is to solve the above problems, by improving the stability of the chemical during the pretreatment of the sample, while providing a sealing device that can seal the sample using a Teflon film that can minimize the source of contamination In order to solve the problems such as the element analysis inability due to the elution of impurities when sealing with a PP film as in the prior art, as well as to provide a sample sealing Teflon film adhesive for expanding the selection range of the adhesive film. The purpose is.

1 is a front view showing a Teflon film adhesive for sealing the sample of the subject innovation

2 is a detailed view of the control box of FIG.

3 is a detailed view of the upper and lower heating plate of FIG.

4 is a perspective view showing the guide rod

FIG. 5 is a cross-sectional view taken along line II of FIG. 1.

Explanation of symbols for main parts of the drawings

1: mounting surface 2a, 2b: left and right frame

3: Leg 4: Lower Support Plate

5: Upper support plate 6: Top cover

7: Lifting Plate 8a, 8b: Upper and Lower Heating Plates

80: power supply line 81: temperature sensor

9: Information rod 10: Compression coil spring

11: movable rod 12: pressing plate

13: Tensile coil spring 14: Cooling fan

15: Timer 16: Cooling fan drive switch

17: Control box 18: Suss cover including insulation

19: Main power switch 20a, 20b: Button for raising and lowering the heater temperature

In order to achieve the above object, the present invention is coupled to the left and right frame (2a) (2b) and the lower left and right sides of the left and right frame (2a) (2b) is installed perpendicular to the mounting surface (1) Leg 3 for separating the left and right frames 2a and 2b from the installation surface 1 by a predetermined distance, and a lower support installed horizontally across the lower end of the left and right frames 2a and 2b. Plate 4, the upper support plate 5 which is spaced apart at regular intervals above the lower support plate 4 along the height direction of the left and right frame (2a) (2b), and the left and right frame ( 2a) (2b), the top cover 6 is installed on the upper end, the elevating plate (7) is installed so as to be lifted between the upper support plate 5 and the top cover (6), and the elevating plate (7) An upper heating plate 8a installed on a bottom surface and a lower portion installed to mate with an upper heating plate 8a on an upper surface of the upper support plate 5. A hollow guide rod 9 installed through a heating plate 8b and left and right sides of the lower support plate 4 so that an upper end thereof is fixed to the upper support plate 5, and each guide rod 9; An elastic member installed between the upper end and the elevating plate 7 to receive a compressive force, and an upper end fixed to the elevating plate 7 by passing through the elastic members, and the elevating plate 7 along the hollow of the guide rod 9. In addition to the movable rod 11 is installed to be movable up and down, the pressing plate 12 provided therebetween to connect the left and right movable rod 11, the pressing plate 12 and the lower support plate (4) It is installed on one side of the left and right frame (2a) (2b) of the elastic member is tensioned when the pressure is applied to the pressing plate 12 and the upper support plate (5) and the top cover (6) connected between Cooling fan 1 which serves to cool lower heating plates 8a and 8b. 4) and the upper support plate 5 or the lower support plate 4 are installed at one side, and the contact plate is closed when the elevating plate 7 approaches the upper support plate 5 by a predetermined distance or more, thereby cooling the cooling fan 14. It is installed on one side of the cooling fan drive switch 16 and the left and right frames 2a and 2b that are turned on to operate the cooling fan 14 to turn off the cooling fan 14 after a predetermined time. The power supply to the timer 15 and the upper and lower heating plates 8a and 8b which are connected to the cooling fan 14 and the timer 15 and the cooling fan driving switch 16 to control them. There is provided a Teflon film adhesive for sealing the sample, characterized in that the controller is built-in and having a control box 17 installed on the upper support plate.

Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 5 as follows.

Figure 1 is a front view showing a sample sealing Teflon film adhesive of the present invention, Figure 2 is a detailed view of the control box of Figure 1, Figure 3 is a detailed view of the upper and lower heating plate of Figure 1, Figure 4 is a guide rod It is a perspective view shown, and FIG. 5 is sectional drawing which showed the II line of FIG.

According to the present invention, the left and right frames 2a and 2b are spaced apart from the mounting surface 1 by a predetermined height on both sides of the left and right frames 2a and 2b which are installed perpendicular to the installation surface 1. The leg 3 is provided, and the lower support plate 4 and the upper support plate which cross the left and right frames 2a and 2b in the horizontal direction along the height direction of the left and right frames 2a and 2b. (5) and the top cover 6 are provided in sequence.

In addition, an elevating plate 7 is installed between the upper support plate 5 and the top cover 6 so as to be elevated, and an upper heating plate 8a is installed at the bottom of the elevating plate 7. On the upper surface of the plate 5 is provided a lower heating plate (8b) to mate with the upper heating plate (8a).

In addition, the upper support plate 4 is fixed to the upper end of the hollow guide rod 9 which is installed through the left and right sides of the lower support plate 5, the upper end of each guide rod 9 Between the and the elevating plate (7) is provided a compression coil spring (10) which is an elastic member that receives a compressive force when the elevating plate (7) is lowered.

In addition, the lifting plate 7 is installed through the lower support plate 4, the upper support plate 5, the compression coil spring 10 and the guide rod 9 to receive the guide rod 9 The upper end of the movable rod 11 to be raised and lowered is fixed.

In addition, the pressing plate 12 is applied between the left and right movable rod 11, the operator's stepping force is applied, and when the stepping force is applied to the pressing plate 12 between the pressing plate 12 and the lower support plate 4. Tension coil springs 13 to be tensioned are provided on the left and right sides, respectively.

Meanwhile, one side of the left and right frames 2a and 2b at the position between the upper support plate 5 and the top cover 6 is supplied with air toward the lower heating plate 8b after sealing the sample to cool the sealed sample. Cooling fan 14 is provided, and a timer 15 for turning off the cooling fan 14 after a predetermined time is installed at one side of the left and right frames 2a and 2b.

At this time, one side of the upper support plate 5 or the upper support plate 5 is closed when the lifting plate 7 is approached from the upper support plate 5 by a predetermined distance or more to close the cooling fan 14. A cooling fan driving switch 16 which is turned on and is opened when the lifting plate 7 is separated from the upper support plate 5 by a predetermined distance or more and turns off the cooling fan 14. Is fitted.

In addition, the top cover 6 is supplied with power to the upper and lower heating plates 8a and 8b, and to the cooling fan 14, the timer 15, and the switch 16 for driving the cooling fan. The control box 17 is provided with a built-in controller (not shown) to control them.

In this case, the upper and lower heating plates 8a and 8b include a power supply line 80 for heating the heating plates, and a temperature sensor 81 for detecting and transmitting a temperature of each heating plate to the controller. ) Are connected to each other, and the upper and lower heating plates 8a and 8b are manufactured by heat-treating the material as brass.

In addition, between the upper heating plate (8a) and the elevating plate (7), and between the lower heating plate (8b) and the upper support plate (5) Sus (Sus cover) (18a, 18b) with a built-in insulation Each is interposed.

On the other hand, it is preferable to install a back plate 100 at the rear of the left and right frames 2a and 2b.

The operation of the present invention configured as described above is as follows.

First, the main power switch 19 on the control box 17 shown in FIG. 2 is turned on, and then the up or low power switch is turned on.

Subsequently, the temperature of the upper heating plate 8a and the lower heating plate 8b is adjusted to a desired temperature by operating the heater temperature raising button 20a and the heater temperature lowering button 20b provided on the control box 17. Will be set.

Thereafter, the substrate is waited for about 10 minutes until the temperature of the upper and lower heating plates 8a and 8b is stabilized, and when the temperature is stabilized, sealing is performed on the sample by using a Teflon film. The operation process of is subdivided as follows.

When attaching a sample such as a wafer using a Teflon film, the operator first steps on the pressing plate 12 to lower the pressing plate 12, whereby both movable rods 11 connected to the pressing plate 12 are guide rods ( You will descend with the guidance of 9).

At this time, the upper end of each guide rod 9 is connected to both sides of the elevating plate 7 through the compression coil spring 10, which is an elastic member, and the elevating plate is also lowered at the same time.

Accordingly, the compression coil spring 10 installed between the upper end of the guide rod 9 and the elevating plate 7 is compressed downward because the elevating plate 7 is lowered while the upper support plate 5 is fixed. The tension coil spring 13 installed between the press plate 12 and the lower support plate 4 is tensioned because the press plate 12 descends while the lower support plate 4 is fixed.

Accordingly, the sealing of the sample is performed between the lower heating plate 8a provided on the lower surface of the elevating plate 7 and the lower heating plate 8b provided on the upper surface of the upper support plate 5.

As such, when the sealing of the sample is performed, the timer 15 detects the time at which the bonding operation is performed and transmits the same to the control box 17. Accordingly, the control box 17 operates the cooling fan 14 to operate at a high temperature. The bonded sample and the adhesive film are cooled.

On the other hand, the Teflon film adhesive of the present invention can be applied not only to the analysis work of the semiconductor-related samples, but also to the sealing work of various products and materials.

As described above, the present invention improves the stability of the chemical during the pretreatment of the sample related to the semiconductor manufacturing, while allowing the sample to be sealed by using a film made of Teflon material which can minimize the source of contamination. Will be imported.

First, Teflon, the adhesive film material of the present invention, is not only very resistant to chemicals, but also has a very small amount of contaminants that are eluted, so that the device of the present invention, which can seal and seal a Teflon material having a thickness of 0.05-1 mm, has been developed. It is possible to accurately analyze the level and composition ratio of impurities contained in the bulk of the sample.

In addition, the sealing function that can trap the volatile material allows the accurate evaluation of the composition ratio thereof.

In other words, it is possible to accurately evaluate the composition ratio of BPSG (Boron-Phospho-Silicate Glass), Al-Cu-Si, Wsi, and Barium Strontium Titanium Oxide (BSTO) film, and the amount of metals (ppt: part per trillion) analysis.

In addition, it is possible to analyze the trace amount of impurities contained in a specific pure material such as a wafer, and the size of the sealing bag can be changed fluidly.

On the other hand, the Teflon film adhesive of the present invention is easy to control the temperature and can raise the temperature up to 600 ℃, all the films with melting points of 600 ℃ or less, such as a film of Teflon can be bonded, the film of the applied to the sealing of the sample The effect is to diversify types.

Claims (3)

Left and right frames installed perpendicular to the mounting surface, Legs coupled to both lower ends of the left and right frames to space the left and right frames from a mounting surface by a predetermined distance, A lower support plate installed across the frame in a horizontal direction at the bottom of the left and right frames, An upper support plate installed at a predetermined interval on the lower support plate along a height direction of the left and right frames; A top cover installed at an upper end of the left and right frames, An elevating plate installed to be elevated between the upper support plate and the top cover; An upper heating plate made of brass installed on the bottom of the elevating plate, A lower heating plate of brass material installed to be paired with an upper heating plate on an upper surface of the upper support plate; A sus cover installed between the upper heating plate and the elevating plate and between the lower heating plate and the upper support plate and having a heat insulating material therein; Hollow guide rod which is installed so that the upper end portion is fixed to the upper support plate through the left and right sides of the lower support plate, An elastic member installed between the upper end of each guide rod and the elevating plate to receive a compressive force, A movable rod penetrating the elastic members and having an upper end fixed to the elevating plate and being movable up and down along the elevating plate along the hollow of the guide rod; A pressing plate installed therebetween to connect the left and right movable rods; A tension coil spring connected between the pressure plate and the lower support plate and tensioned when pressure is applied to the pressure plate; A cooling fan installed at a position between the upper support plate and the lifting plate on one side of the left and right frames to cool the sample sealed by the upper and lower heating plates; A cooling fan drive switch installed on one side of the upper support plate or the elevating plate and closing the contact when the elevating plate approaches the upper support plate for a predetermined distance or more to turn on the cooling fan; A timer installed at one side of the left and right frames and operated when the cooling fan is driven to turn off the cooling fan after a predetermined time; A power supply line connected to the upper and lower heating plates; A temperature sensor connected to each of the upper and lower heating plates and detecting a temperature of each heating plate and transferring the temperature to the controller; A power supply is provided to the upper and lower heating plates, and a controller is connected to the cooling fan, the timer, and the switch for driving the cooling fan, and there is a built-in controller to control the sample. Teflon film adhesive for sealing. The method of claim 1, The upper and lower heating plate is a Teflon film adhesive for sealing the sample, characterized in that produced by heat treatment several times. The method of claim 1, Compression coil springs are installed as the elastic members connected between the upper ends of the guide rods and the lifting plates to receive the compressive force. A teflon film adhesive for sealing a sample, characterized in that a tension coil spring is installed as an elastic member connected between the pressing plate and the lower support plate to be tensioned when the stepping force is applied to the pressing plate.