KR20020090436A - flying type slider head and fabrication method for the same - Google Patents

Abstract

PURPOSE: A bearing type slider head and a method of manufacturing the slider head are provided to automatically generate a taper of the slider used for a magnetic recorder and a pick-up of a high-density near-field optical information storage through batch fabrication using a micro-machining technique and a semiconductor device fabrication process. CONSTITUTION: A bearing type slider head having an air-bearing surface(5) includes a substrate, a pad(2,3) having a predetermined height, formed on the substrate, an adhesive formed between the pad and the edge of the substrate. The air-baring surface is formed of a predetermined material on the pad. The slider head further includes a taper structure formed of the predetermined material from the edge of the air-bearing surface via the adhesive to the edge of the substrate. The extended portion of the taper structure has a predetermined slope.

Description

Floating type slider head and fabrication method for the same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pickup device of a high density information storage device, and more particularly, to a floating slider head capable of minutely maintaining a gap between a storage substrate and a pickup device by hydrodynamic flotation, and a manufacturing method thereof.

That is, among the pickup devices of the high-density information storage device using the near field optical system that can provide a resolution exceeding the diffraction limit of light, air-bearing (hereinafter referred to as air-bearing) that can maintain a small gap from the disk as the recording medium to the pickup head Air-bearing) surface slider structure and manufacturing method.

Recently, in order to meet the demand for clearer images and large-capacity information data and the demand for small and light-capacity large-capacity information storage devices, which are essential for personal information terminals, it has been necessary to increase the information recording density.

As a technical countermeasure, the recording density of a magnetic information recording medium of a hard disk used as an auxiliary storage device of a computer continues to be improved. The information performance of an optical information storage device such as a CD or a DVD is not only high data recording density but also information. Data access for recording and reproducing data must also be speeded up.

An increase in data recording density means a reduction in the physical size of the data bits, which is an information storage unit, and correspondingly, the data track pitch is reduced.

Therefore, the tracking accuracy of the pickup head for recording and reproduction must also be increased in response to an increase in data recording density.

In order to improve the tracking speed and accuracy as described above, it is necessary to reduce the size and weight of the pickup device.

In addition, in order to increase the recording density and to obtain a stable signal-to-noise ratio from the reduced bit signal, both the optical information storage device and the magnetic information storage device must reduce the gap between the pickup head and the recording medium disc, so that the gap is kept constant. shall.

It is the so-called airborne slider head technology that uses hydrodynamic flotation to lift the structure on which the pick-up device is mounted by a certain height from the substrate surface using such a fine gap control technique.

However, for the initial injury of the floating head, a tapered portion having a constant inclination is required on one side of the head, which is conventionally processed by lapping and polishing after cutting the slider heads individually. BACKGROUND ART A technique of forming an inclined surface by polishing by a polishing method is mainstream.

However, the above method has a disadvantage in that, since the individual slider heads must be processed separately, the mass productivity is low and the reproducibility of the tapered shape is also low.

Accordingly, the present invention has been made to solve the above problems, by using a micromachining technology and a semiconductor device manufacturing process, the taper of the slider head used in the pickup device of the magnetic recording device and the high-density near-field optical information storage device in a batch process ( The purpose is to provide a floating slider head suitable for mass production by automatically generating by batch fabrication and a method of manufacturing the same.

Another object of the present invention is to provide a floating slider head and a method of manufacturing the same, since the taper formation is performed by a batch process, the productivity and the uniformity of the taper are improved.

1A and 1B are schematic diagrams of an air flying type slider head for a high density information storage device having an automatically formed taper structure according to the present invention.

2A-2C are simplified manufacturing process diagrams at the wafer level of the slider head as in FIG. 1A.

3A to 3K are detailed manufacturing process diagrams of the slider head with reference to the AA ′ section of FIG. 2C.

* Explanation of symbols for main parts of the drawings

1: board 2, 3: pad

4: adhesive 5: air-bearing surface

5a: suspended structures 5b: tapered structures

6: sacrificial layer 7, 8: thin film layer

9: dimple 16: sacrificial layer forming material

A feature of the floating slider head according to the present invention for achieving the above object is an external optical system in a floating slider head having an air-bearing surface for maintaining a predetermined gap with an information recording medium. A substrate having a light exit port for transmitting light therefrom; At least one pad on the substrate having a predetermined distance from the light emitting port and having a predetermined height; An adhesive formed between the pad and an edge of the substrate; The air-bearing surface formed of a predetermined material on the pad; The predetermined material is formed from the edge of the air-bearing surface to the edge of the substrate via the adhesive, the extended portion comprises a tapered structure having a predetermined slope.

The pad is formed integrally with or separately from the substrate on the substrate, and the pad is further formed below the light exit port to support a lens for focusing light incident on the light exit port. Consists of

The predetermined material is formed of at least two thin film layers, and includes a metal having a large thermal expansion coefficient of the thin film layer formed below the upper portion.

Features of the floating slider head according to the present invention for achieving the above object is to provide an air bearing surface (air-bearing surface) and the light injection port to produce a floating slider head to maintain a predetermined gap with the information recording medium A method, comprising: forming a plurality of unit pads formed of at least one pad by forming and patterning a thin film integrally with or separately from the substrate; Forming an adhesive on one side of the pad, and forming a sacrificial layer on the pad and the substrate on which the adhesive is formed to be the same as the height of the pad; Sequentially forming at least two thin film layers, patterning the thin film layers to extend over the adhesive and removing the sacrificial layer; Attaching the adhesive and the thin film layer formed on the adhesive to have a predetermined slope by applying a predetermined temperature; And cutting the substrate to have a predetermined angle of inclination for each of the unit pads.

The method may further include forming a pad facing the light exit port by patterning the thin film of the substrate to support a lens for focusing light incident on the light exit port.

After the patterning of the thin film layer to extend to the upper part of the adhesive, further comprising forming an adhesive on a predetermined area of the substrate opposite the substrate on which the thin film layer is formed, to assemble the slider head and the other parts of the optical pickup apparatus. Or adhesive.

The action according to the characteristics of the present invention is to process a thin film layer on a sacrificial layer according to a predesigned shape, remove the sacrificial layer to form a suspended microstructure of a bimetal thin film layer, and then give a suspension under a predetermined temperature. Since the thin film layer is automatically bent toward the substrate, the suspended thin film layer is bonded to the adhesive formed on the substrate, thereby forming a taper structure, thereby improving mass productivity and taper uniformity.

Other objects, features and advantages of the present invention will become apparent from the following detailed description of embodiments taken in conjunction with the accompanying drawings.

Referring to the accompanying drawings, a preferred embodiment of a floating slider head and a method of manufacturing the same according to the present invention are as follows.

1A and 1B show an air flying type slider head for a high density information storage device having an automatically formed taper structure according to the present invention.

As shown in Fig. 1A, the slider head for a high-density information storage device having a tripad structure according to the present invention includes a substrate 1 having a light ejection opening for transmitting light from an external optical system, and a predetermined height on the substrate 1; At least one pad 2, 3, an adhesive 4 formed between the pad 2 and the leading edge of the substrate 1, and an air bearing formed of a predetermined material on the pads 2, 3. A surface 5, the predetermined material being formed from the edge of the air-bearing surface 5 to the edge of the substrate 1 via the adhesive 4, the extended portion of which And a tapered structure 5b having.

That is, as shown in Fig. 1B, the surface micromachining technique spaces the pads 2 and 3 from the substrate 1 and is formed of a predetermined material and fixed to the pads 2 and 3 by air-bearing. Suspended structure 5a, which is the surface of the surface 5 and is formed of the remaining predetermined material, is intentionally deformed in the direction of the substrate 1 to form an adhesive, such as a solder, which is previously formed on a part of the substrate 1. (4) When the external environment such as temperature is adjusted so as to be attached to the area for permanent adhesion, the tapered structure 5b as shown in FIG. 1A is formed.

In this case, the pad 2 may be formed extending to the trailing edge.

The structure and shape of the air-bearing surface 5 including the three pads 2 and 3 are determined by the height lifted from the surface of the information storage disk, so that the height and area of the pads 2 and 3 and between the pads are in between. The distance and the tapered structure 5b are appropriately designed.

2A to 2C briefly illustrate a process of mass-producing a flying type slider head for a high density information storage device as shown in FIG. 1A at the wafer level.

As shown in Fig. 2A, the structures 5a, the adhesive 4 patterns, and the tri pads 2 and 3 suspended on a wafer basis are preliminarily processed by a semiconductor batch manufacturing process and a surface micromachining technique.

Subsequently, as shown in FIG. 2B, when a specific temperature is applied, a deformation force that causes the suspension structure 5a to bend toward the substrate 1 is generated to contact the adhesive 4 part, and then the molten adhesive 4 Upon cooling by bonding to the tapered taper structure 5b which is inclined to the order of several milli radians, the wafer is processed at the wafer level.

Therefore, the initial floating force of the slider at the initial rotation of the magnetic disk is easily obtained by the automatically formed tapered structure 5b.

Although only an example of one wafer is shown, using a furnace or an oven that can be heated to a temperature that allows the tapered structure 5b to be automatically formed makes it possible to batch process a plurality of wafers, thereby facilitating mass production. .

When the automatic forming process of the tapered structure 5b in the wafer unit is completed, the slider head parts are separated into individual chip shapes as shown in FIG. 2C.

This process may use a dicing method, such as dicing a semiconductor integrated circuit device into chips, and in addition, reactive ion etching may be performed on a dicing lane for separating individual slider head components. May be performed using the RIE method.

3A to 3K illustrate a manufacturing process diagram of a slider head having such a new automatic forming taper structure. Referring to FIG.

As shown in Fig. 3A, a substrate 1 such as a silicon wafer is cleaned.

As shown in FIG. 3B, the pads 2 and 3 are patterned on one surface of the substrate 1. The processing method may be formed by etching portions of the substrate 1 other than the pads 2 and 3 by the heights of the pads 2 and 3, and forming pads having the required height by deposition, plating, or the like on the substrate 1. You may form a (2,3) pattern.

As shown in FIG. 3C, an adhesive 4 is formed by depositing and patterning an adhesive material such as solder, such as an alloy composition, through a photo-writing process and a thin film forming process.

As shown in FIG. 3D, the sacrificial layer forming material 16 is formed on the surface on which the pads 2 and 3 and the adhesive 4 are formed by coating or vapor deposition. At this time, the thickness of the sacrificial layer forming material 16 is formed to be at least greater than the height of the pad (2, 3) pattern.

As shown in Fig. 3E, the formed sacrificial layer forming material 16 is planarized by a method such as lapping or polishing. The planarization is performed so that the thickness of the planarized sacrificial layer 6 matches the thickness of the pads 2 and 3.

As shown in Fig. 3F, thin film layers 7 and 8 are sequentially formed on the flattened surface by the required thickness. In the formation method, it is selected according to the necessary materials such as deposition, plating, epitaxial growth. Two or more layers may be sufficient as the said thin film layer as needed.

As shown in Fig. 3G, the thin film layers 7 and 8 are patterned by using a photographic drawing process, a thin film etching technique or a plating process to have a predetermined shape.

In order to provide the convenience of assembling the slider head to a suspension such as a swing arm or a linear actuator on the opposite side of the substrate 1 on which the thin film layers 7 and 8 are formed as shown in FIG. The assembly dimple (9) shape is integrated using two-sided alignment, thin film deposition and patterning techniques among micromachining techniques.

As shown in FIG. 3I, the sacrificial layer 6 is removed so that the suspended structure 5a composed of the thin film layers 7 and 8 has a predetermined gap from the substrate 1.

The sacrificial layer 6 may be removed by using an etching solution, an etchant, an etching plasma, and the like that have selective etching characteristics between the sacrificial layer 6 and other slider components. In particular, the sacrificial layer 6 is selected from a material that does not affect other slider components during this release.

As shown in FIG. 3J, the suspended material 4 of the suspended structure 5a having a predetermined gap with the substrate 1 is deformed in the direction of the substrate 1 so that the adhesive 4 is formed on the surface of the substrate 1 in advance. The wafer is heated to a specific temperature so as to come in contact with it so that the tapered structure 5b is automatically formed.

When the thin film layers 7 and 8 are made of metal, the process temperature of the contact step between the suspended structure 5a and the substrate 1 by thermal deformation using a bimetal principle is the adhesive of the lower portion of the suspended structure 5a. (4) has a temperature range that is melted to have an adhesive force at the same time.

In order to cause bending of the suspended structure 5a in the direction of the substrate 1, the thermal expansion coefficient of the upper thin film layer 8 is greater than the residual stress and thermal expansion coefficient of the lower thin film layer 7 so that the thin film layer 7, 8) The material selection and process conditions should be adjusted so that the suspended structure 5a consisting of 8) can bend sufficiently towards the substrate 1.

Then, the tapered shape is maintained by the capillary force of the melted adhesive 4, and when the adhesive 4 is cured by lowering the temperature, a permanent tapered shape is completed.

As shown in Fig. 3K, the wafer 1 on which the air-bearing surface 5 and the tapered structure 5b are formed is separated into individual slider head shapes. In this process, a dicing technique commonly used in a semiconductor integrated circuit manufacturing process may be utilized.

In addition to the above process, a process of forming a etch cavity for transmitting light from an external optical system by etching the substrate 1 formed on the pad 2 side, and adding a solid immersion lens (SIL) to the etch cavity Assemble the solid immersion lens.

Instead of forming SIL, only the light exit port having a diameter smaller than the input light wavelength may be formed.

As described above, the floating slider head and the method of manufacturing the same according to the present invention have the following effects.

Semiconductor device fabrication technology and surface micromachining technology, using bimetal principle strain to automatically form tapered structures with air-bearing surfaces for early rise of slider heads at wafer level, tapering between individual slider heads Shape uniformity can be improved and mass production of slider head is improved.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the spirit of the present invention.

Therefore, the technical scope of the present invention should not be limited to the contents described in the embodiments, but should be defined by the claims.

Claims (9)

A floating slider head having an air-bearing surface for maintaining a predetermined gap with an information recording medium, A substrate having a light exit port for transmitting light from an external optical system; At least one pad on the substrate having a predetermined distance from the light emitting port and having a predetermined height; An adhesive formed between the pad and an edge of the substrate; The air-bearing surface formed of a predetermined material on the pad; Floating slider, characterized in that the predetermined material is formed from the edge of the air-bearing surface to the edge of the substrate via the adhesive, the extended portion comprises a tapered structure having a predetermined slope head. The floating slider head of claim 1, wherein the pad is formed integrally with or separately from the substrate. The float type slider head of claim 1, wherein the pad is further formed under the light ejection opening. 4. The floating slider head of claim 3 wherein the pad is a transparent material. The floating slider head of claim 1, wherein the predetermined material is at least two thin film layers, and the coefficient of thermal expansion of the thin film layer formed below the upper portion is greater. The floating slider head of claim 1, wherein the thin film layer comprises a metal. A method of manufacturing a floating slider head having an air-bearing surface and a light ejection outlet to maintain a predetermined gap with an information recording medium, Forming a plurality of unit pads formed of at least one pad by forming and patterning a thin film integrally or separately from the substrate; Forming an adhesive on one side of the pad, and forming a sacrificial layer on the pad and the substrate on which the adhesive is formed to be the same as the height of the pad; Sequentially forming at least two thin film layers, patterning the thin film layers to extend over the adhesive and removing the sacrificial layer; Attaching the adhesive and the thin film layer formed on the adhesive to have a predetermined slope by applying a predetermined temperature; And cutting the substrate to have a predetermined angle of inclination for each of the unit pads. The method of claim 1, further comprising forming a pad facing the light exit port by patterning a thin film of the substrate. The method of claim 1, further comprising: forming an adhesive on a predetermined region of the substrate opposite the substrate on which the thin film layer is formed after patterning the thin film layer to extend to the upper portion of the adhesive. Slider head manufacturing method.