KR20020087519A - Transformer having thin plate of plane type - Google Patents

Abstract

PURPOSE: A thin film plane transformer is provided to reduce size and weight of the transformer and achieve improved efficiency, while allowing a wide range of operating frequency. CONSTITUTION: A thin film plane transformer comprises a substrate including a first substrate(100) and a second substrate(200). The first substrate includes a circular copper foil(110) having a magnetic passage hole(111) formed at the center of the copper foil, and first and second passage holes(112,113) formed at both sides of the copper foil; terminal frames(120,130) having first to fourth terminal holes(121,122,131,132), respectively, and which are formed symmetrically with each other at both sides of the copper foil; and band type copper foils(114,115) arranged at upper and lower surfaces of the first substrate. The band type copper foil arranged at the upper surface of the first substrate, is started from the first passage hole of the circular copper foil, wound by two turns along the arc of the circular copper foil, and extended to the second terminal hole.

Description

Thin Film Planar Transformers {TRANSFORMER HAVING THIN PLATE OF PLANE TYPE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to thin film planar transformers, and more particularly, to a thin film planar transformer that enables the power supply portion of a switch mode power supply (hereinafter, abbreviated as " SMPS ") to be compact and lightweight.

In general, SMPS is widely used as a DC stabilized power supply for electronic communication devices such as electronic calculators, electronic exchangers, and office automation equipment. The SMPS is controlled by using a switch processor of a semiconductor device to control power flow. In comparison, it can be said to be a stabilized power supply having a great advantage in high efficiency, small size and light weight.

However, in such an electronic communication device, the system part is rapidly miniaturized and lightened with the development of a semiconductor integrated circuit, while the power supply part is not miniaturized and lightened at the speed as expected.

In terms of small size and light weight of electronic communication devices, small size and light weight of SMPS are relatively large.

SMPS can achieve small size and light weight by increasing the switch frequency and miniaturizing the power supply element, which requires the development of a high speed semiconductor switching element. However, the high frequency of the switch frequency increases the power loss such as switching loss and inductor loss, and the surge noise generated by the high frequency switching increases. As shown in FIG. There was a limit of weight reduction.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a thin film planar transformer capable of miniaturizing and reducing the power supply portion of a switch mode power supply.

The present invention is a circular plate body formed with a magnetic passage hole in order to achieve the above object, the copper plate portion is formed on both sides and a rectangular plate body forming a pair of two, two terminal holes side by side And a terminal frame which is formed symmetrically while forming the same horizontal plane on both sides of the copper plate part, and starts from any one terminal hole of the terminal frame, and is wound one or more rounds on the upper surface of the copper plate part, and close to the terminal hole. The present invention provides a thin-film plane transformer composed of a winding substrate having one or more rounds wound on the lower surface via a through-hole, in which a copper plate is connected to one terminal hole of the terminal hole.

1 is a circuit diagram of the present invention,

2 is an exploded perspective view of the present invention;

3 is an exploded perspective view of a winding PCB according to the present invention;

4A is a plan view of the first winding PCB of FIG. 3;

4B is a bottom view of the first winding PCB of FIG. 3,

4C is a plan view of the second winding PCB of FIG. 3;

4D is a bottom view of the second winding PCB of FIG. 3,

5 is a cross-sectional view of the combination of FIG.

6 is a cross-sectional view of the combination of FIG.

7 is a side view of a conventional article.

* Explanation of symbols on the main parts of the drawings *

A ... winding substrate A100 ... primary and secondary additional winding substrate

A200 ... primary winding substrate 100 ... primary winding substrate

110,210 ... copper plate 111,211 ... magnetic passage hole

112,113,212,213 ... Passing holes

114,115,214,215 ... Copper Plate

120,130,220,230 ... terminal frame

121,122,131,132,221,222,231,232 ... terminal hole

200 ... Volume 2 Substrate 300 ... Top E Core

301,401 ... turning 400 ... bottom E core

500 ... I-core 600 ... Secondary winding

P ... Primary Side Pin

Next, embodiments of the present invention will be described in detail with reference to the drawings.

1 and 2 illustrate a thin film planar transformer according to the present invention. The thin film planar transformer has a primary and secondary auxiliary winding substrate A100, a primary side winding substrate A200, and an upper and lower E core. 300, 400, an I core 500, and a secondary winding 600, wherein the primary and secondary additional winding substrates A100 and the primary winding substrate A200 are wound wires A. FIGS. It is composed of

The winding substrate A is composed of a first winding substrate 100 and a second winding substrate 200 as shown in FIG. 3, insulated with insulating paper, and overlapping with each other up and down. A magnetic passage hole 111 is formed at the center thereof, and a circular copper plate portion 110 having the same center as the magnetic passage hole 111 is formed. The terminal frame 120 is formed at both sides of the copper plate portion 110. 130 is formed. One side of the terminal frame 120, the terminal holes 121 and 122 are formed side by side, it is formed to penetrate vertically, one side of the opposite terminal frame 130 in a diagonal with the terminal holes 121, 122 Terminal holes 131 and 132 to be positioned are formed, and are vertically penetrated, and are formed through the holes 112 perpendicular to the center of the boundary between the copper plate 110 and the terminal frame 120, 130. 113 is formed through. In the first winding substrate 100, strip-shaped copper plates 114 and 115 are formed on upper and lower surfaces, and the upper surface of the first winding substrate 100 starts from the terminal hole 121 as illustrated in FIG. 4A. Winding one circle along the circular arc to the through-hole 112, the lower surface starting from the through-hole 112 as shown in Figure 4b is wound two times along the arc of the copper plate 110 terminal hole 122 The copper plate 114 of the upper surface is wound to the outside of the through hole 113, while the copper plate 115 of the lower surface is wound to the inside and the outside of the through hole 113. The upper and lower copper plates 114 and 115 are electrically connected to each other by nickel plating filled in the passage holes 112.

The second winding substrate 200 has a magnetic passage hole 211 is formed, the circular copper plate portion 210 is formed to be the same center as the magnetic passage hole 211, the copper plate portion 210 Terminal frames 220 and 230 are formed at both sides, and are formed while forming the same shape as the first winding substrate 100, while the magnetic passage hole 211 forms the same center as the magnetic passage hole 111. do. One side of the terminal frame 220, the terminal holes 221, 222 are formed side by side, it is formed through the vertical, one side of the opposite terminal frame 230 in a diagonal with the terminal holes (221, 222) Terminal holes 231 and 232 to be positioned are formed, and are vertically penetrated, and the through holes 212 perpendicular to the center of the boundary between the copper plate 210 and the terminal frame 220, 230. 213 is formed through. In the second winding substrate 200, strip-shaped copper plates 214 and 215 are formed, and the upper surface of the second winding substrate 200 starts from the terminal hole 231, as shown in FIG. 4C, along two circular arcs of the copper plate 210. Winding is formed to the through-hole 213, the lower surface is started from the through-hole 213 as shown in Figure 4d is wound two times along the arc of the copper plate portion 210 is formed to the terminal hole 232 The copper plate 214 of the upper surface is wound to the outside of the passage hole 212, while the copper plate 215 of the bottom surface is also wound to the outside of the passage hole 212. The upper and lower copper plates 214 and 215 are electrically connected to each other by nickel plating filled in the passage holes 213.

The first winding substrate 100 and the second winding substrate 200 are overlapped with an insulating paper interposed therebetween, and the terminal holes 121, 221, 122, 222 of the frames 120, 220 are overlapped. ) And the terminal pins are connected to the terminal holes 131, 231, and 132, 232 of the frames 130, 230, respectively, to be electrically connected to the primary and secondary relief winding substrates A100. ) Is a state in which the first and second winding substrates 100 and 200 overlap each other, and the primary winding substrate A200 is in a state in which the first and second winding substrates 100 and 200 overlap. You will use two chapters.

In the above description, the copper plates 114, 115, 214, and 215 have a limit of a printed circuit board at a high output of 150 이상 or more.

The upper plate E core 300 is a ferrite core, and a circular protrusion 301 is formed at the center thereof so that the magnetic passage holes of the primary and secondary auxiliary winding substrates A100 may be fitted to each other. The fence is formed. The lower plate E core 400 is a ferrite core having the same shape as the upper plate E core 300, and a circular protrusion 401 is formed at the center thereof to fit a magnetic passage hole of the primary winding substrate A200. The fence is formed on both sides to prevent it from falling off. The I core 500 is a ferrite core and is formed in the same shape as the upper and lower E cores 300 and 400, and is formed while forming a flat plate. The secondary side winding 600 is formed by forming a pair of two circular plate body is formed in a vertically penetrating hole (the same size as the magnetic passage hole) in the center side by side, up and down, one side is connected.

5 and 6, the present invention configured as described above allows the primary winding substrate A200 to be stacked on the lower plate E-core 400, and the secondary winding 600 is positioned thereon, but the lower surface is 1 To be interviewed on the upper surface of the secondary winding substrate (A200), the I core 500 is inserted therebetween, so that the primary and secondary auxiliary winding substrate (A100) is located on the upper surface of the secondary winding (600). At the same time, the upper surface E core 300 is to be seated and coupled to the upper surface.

Referring to FIG. 1, the primary winding substrate A200 is positioned between the lower E core 400 and the I core 500, and two winding substrates A are connected in parallel. 2) The secondary winding 600 is located between the primary winding substrate 300 and is connected to the copper plate together with the output inductor winding (pins 3 & 4). It is located between the core 300 and is connected to the copper plate together with the secondary winding 600 (pins 3 & 5 or 10). The primary and secondary additional winding substrates A100 are the I core 500 and the output inductor. Located between the upper plate E core 300 at the top of the winding, both the additional primary and secondary windings were wound in the same substrate (primary-side pins 7 & 8, secondary-side pins 6 & 9).

In other words, a) the lower plate E core 400 is made of PL-FL or FM-4 for the high frequency material.

b) The primary winding substrate A200 is located between the lower plate E core 400 and the I core 500, and is connected by using the primary side pin P with two winding substrates A in parallel. do.

c) positioned between the two primary side winding substrates A200 and connected to the copper plate together with an output inductor winding lead frame.

d) The output inductor winding is positioned between the I core 500 and the upper plate E-core 300 and is connected to the copper plate together with the secondary side winding 600.

e) The primary and secondary additional winding substrates A100 are located between the I core 500 and the upper plate E core 300 at the upper end of the output inductor, and both the primary and secondary windings are wound on the same substrate. .

As described above, according to the present invention, the copper plate is wound up and down on a printed circuit board (PCB), and a plurality of layers or pieces are formed, and the upper and lower plate E cores are formed in a thin film, thereby reducing the size and weight of the conventional bobbin. It can solve all the problems of the wire-wound transformers. First, it is efficient, and secondly, it is flat for installation of high power density equipment, and it is small. Fourth, it is light in weight, and has the effect of minimizing electromagnetic interference.

Claims (4)

A circular plate body in which a magnetic passage hole is formed. A copper plate part having passage holes formed on both sides, and a rectangular plate body forming two pairs. Two terminal holes are formed side by side. And one or more rounds on the upper surface of the copper plate, starting from one terminal hole of the terminal frame and symmetrically formed, and passing through the through-hole which is close to the terminal hole. Thin-film flat transformer characterized in that the winding substrate is configured to be wound over the copper plate is connected to the terminal hole on one side of the terminal hole. The thin film planar transformer of claim 1, wherein the winding substrate is stacked in a plurality of layers insulated for the order of division winding number. The thin film planar transformer of claim 2, wherein the winding substrate has a plurality of sheets for parallel winding. 4. The winding according to claim 2 or 3, wherein the multi-layered winding substrate is used as a primary and secondary secondary winding substrate so as to be coupled to an upper plate E core made of a flat plate, and the winding substrate having several sheets is wound on a primary side winding. A thin film plane characterized in that the substrate is bonded to the lower plate E core, which becomes a flat plate, and the I core, which is a flat plate, is interposed therebetween, and secondary windings are interposed on the upper and lower surfaces of the I core. Transformer.