TWI553675B - Electronic device - Google Patents

Description

Electronic device

The present invention relates to electronic devices in the field of power electronics, and more particularly to electronic devices containing magnetic components.

A planar transformer, in contrast to a conventional transformer, replaces a copper wire in a conventional transformer with a single-layer or multi-layer printed circuit board (PWB), copper foil, etc., and the conductor in the planar transformer is actually a planar conductor. The current will flow away from the center towards the edge, but the current will still flow through the conductor, so a very high current density can be obtained. In addition, since the magnetic core used in the planar transformer has a small volume, a large area, a flat shape, and a good heat dissipation effect, higher efficiency can be obtained. Furthermore, since the planar transformer has the advantages of compact structure, good coupling, and excellent insulation performance, the planar transformer is adapted to the miniaturization of the product, and has been applied to many products, such as power converters.

Referring to Figure 1, Figure 1 is a circuit diagram of a power converter including a planar transformer.

As can be seen from Fig. 1, the power converter 1 includes a planar transformer 11, a secondary circuit module 12, and a primary circuit module 13. Secondary circuit module 12 and the primary circuit module 13 are respectively coupled to the secondary side and the primary side of the planar transformer 11.

Referring again to FIG. 2, FIG. 2 is a schematic diagram showing the structure of a power converter having a conventional planar transformer.

The planar transformer 11 includes a core group and a winding (not shown); the secondary circuit module 12 is connected to the winding through the secondary output line; the primary circuit module 13 is connected to the winding through the primary output.

However, for the conventional planar transformer 11, the current loop formed by the winding outlet and its external circuit module stores a large magnetic field energy, thereby forming a large leakage inductance, for example, the secondary side of the winding and the secondary side. The circuit formed by the circuit module 12 will have a large leakage inductance. The leakage inductance is an important indicator of the planar transformer. For example, in the switching power supply, if there is leakage inductance, when the switching device is turned off, the back electromotive force is generated due to the leakage inductance, and the reverse electromotive force is easy to turn the switching device. Overvoltage breakdown. In addition, the leakage inductance can also form an oscillating circuit with the distributed capacitance in the external circuit and the planar transformer winding, thereby generating oscillation and radiating electromagnetic energy outward, thereby causing electromagnetic interference. Furthermore, for some transformers, such as flyback transformers, the leakage inductance can also cause losses, thereby reducing the efficiency of the flyback transformer.

In view of this, how to design a converter, by changing the structure of its planar transformer, to reduce the magnetic field energy stored in the loop formed by the outgoing line of the planar transformer and its external circuit, thereby reducing the leakage inductance, is a related technology in the industry. One of the technical problems that people need to solve urgently.

In order to solve the above technical problem, an aspect of the present invention provides an electronic device comprising: a magnetic component comprising a magnetic core group and a winding, the winding comprising a first winding and a second winding, and the winding is assembled to the magnetic a first circuit module coupled to the first winding of the magnetic component; and a second circuit module coupled to the second winding of the magnetic component; wherein the first circuit module or/and The vertical projection area of the second circuit module and the winding of the magnetic element on a first plane has an overlapping portion, and the first plane is a plane in the horizontal direction of the winding.

Another aspect of the present invention provides an electronic device comprising: a magnetic component including a magnetic core group and a winding, and the winding is assembled on the magnetic core group; and a first circuit module coupled to the magnetic component a winding; wherein the vertical projection area of the first circuit module and the magnetic core group on a first plane has an overlapping portion, and the first plane is a plane in a horizontal direction of the winding.

In an embodiment of the invention, the magnetic component is a transformer module, and the first winding is a primary winding, and the second winding is a secondary winding.

In an embodiment of the invention, the transformer module is a planar transformer.

In an embodiment of the invention, the magnetic core group includes a first magnetic core component and a second magnetic core component corresponding thereto, the first magnetic core component has a magnetic core column, a magnetic core cover plate, and a first a side pillar, a second side pillar, a primary side opening and a side opening, the primary side opening and the secondary side opening are located at both ends of the first side column and the second side column, and the winding is sleeved on the magnetic core On the column.

In an embodiment of the invention, the magnetic core group includes a first magnetic core component And a second core member corresponding thereto, the first core member has a magnetic core column and a magnetic core cover, and the winding is sleeved on the magnetic core column.

In an embodiment of the invention, the first core member includes at least one side pillar, and at least one of the pillars is disposed around the core post to form at least one side opening.

In an embodiment of the invention, the first core member or the second core member has a stepped structure, and at least a portion of the first circuit module or at least a portion of the second circuit module is received in the stepped structure .

In an embodiment of the invention, the vertical projection area of the first core member or the second core member on the first plane and the vertical projection area of the winding on the first plane have at least one non-covered area, so that at least a part of The first circuit module or/and the second circuit module are vertically projected in the non-covered area, and have overlapping portions with the vertical projection area of the winding on the first plane.

In an embodiment of the invention, when there is at least one non-covered area in the vertical projection area of the first core member and the winding on the first plane, the thickness of the core cover of the first core member is greater than the thickness of the second core member. thickness of.

In an embodiment of the invention, when the second core member and the vertical projection area of the winding on the first plane have at least one non-covered area, the thickness of the core cover of the first core member is smaller than the second core member. thickness of.

In an embodiment of the invention, the primary side opening and the secondary side opening are asymmetrical with respect to the magnetic core post.

In an embodiment of the invention, the vertical projection areas of the first core member and the second core member on the first plane are at least one non-covered area with the vertical projection area of the winding in the first plane, so that at least a part of First A circuit module or/and the second circuit module are vertically projected in the non-covered area and have overlapping portions with the vertical projection area of the winding on the first plane.

In an embodiment of the invention, the vertical projection areas of the first core member and the second core member on the first plane do not overlap.

In an embodiment of the invention, the first core member overlaps the vertical projection area of the second core member on the first plane.

In an embodiment of the invention, the first side leg and the second side leg are asymmetrical with respect to the magnetic core post.

In an embodiment of the invention, the length of the first side leg between the primary side opening and the secondary side opening is greater than the length of the second side leg.

In an embodiment of the invention, the first core member and the second core member are inwardly curved along the primary side opening or the secondary side opening.

In an embodiment of the invention, the vertical projection areas of the first core member and the second core member on the first plane both cover the vertical projection area of the winding on the first plane, wherein the first core or the second The core member has a recess having an overlapping portion with a vertical projection area of the winding on the first plane, at least a portion of the first circuit module or at least a portion of the second circuit module being received in the recess.

In an embodiment of the present invention, both ends of the primary winding are coupled to the first circuit module through a primary side outgoing line, and the primary side outgoing line includes a primary inner layer outgoing line, a primary side outgoing line hole, and An outer side outer layer is taken out, wherein the inner side inner layer outlet line is electrically connected to the primary outer layer outlet line through the primary side outlet hole; the two sides of the secondary side winding respectively pass through a side edge outlet line and the second circuit module Coupling, the secondary side outlet includes a pair of inner side outlet lines, a pair of side outlet lines, and a pair of outer side outlet lines, The secondary inner layer outlet line is electrically connected to the secondary outer layer outlet line through the secondary side outlet hole.

In an embodiment of the invention, the primary side outlet hole is disposed in a region between the primary winding and the magnetic core column, a region of the primary winding or an outer region of the primary winding; the secondary outlet hole is disposed in the secondary winding and The area between the magnetic core columns, the area of the secondary winding, or the outer area of the secondary winding.

In an embodiment of the invention, when the primary side outlet hole is disposed in an outer area of the primary winding, the leakage sensitive component of the first circuit module is disposed on a side of the primary side outlet hole in the direction of the magnetic core column; When the secondary side outlet hole is disposed in the outer side region of the secondary winding, the leakage sensitive element in the second circuit module is disposed on the side of the secondary side outlet hole in the direction of the magnetic core column.

In an embodiment of the invention, the winding is a planar winding of a PCB winding or a round wire.

In an embodiment of the invention, the converter is a flyback converter.

In an embodiment of the invention, the second circuit module is a rectifier circuit module.

In an embodiment of the invention, at least one of the first circuit module and the second circuit module and the corresponding winding form an AC loop, wherein an area of the vertical projection area of the AC loop on the first plane is coupled to The ratio of the areas of the overlapping portions of the vertical projection areas of all the loops on the same core in the core group in the core group ranges from 1 to 1.2. Among them, the aforementioned AC circuit contains a large amount of AC current components, so it is defined as an AC circuit.

In an embodiment of the invention, the first winding is a primary winding And the first circuit module and the primary winding form an AC circuit, wherein an area of the vertical projection area of the AC circuit on the first plane and all loops coupled to the same core column in the core group are The ratio of the areas of the overlapping portions of the vertical projection areas on the first plane ranges from 1 to 1.2.

In an embodiment of the invention, the second winding is a secondary winding, and the second circuit module and the secondary winding form an AC loop, wherein the area of the vertical projection area of the AC loop on the first plane is The ratio of the areas of the overlapping portions of the vertical projection regions of all the loops coupled to the same core column in the core group on the first plane ranges from 1 to 1.2.

In an embodiment of the invention, the secondary winding includes a first secondary winding portion and a second secondary winding portion, and the rectifier circuit module includes a first switch module, a first capacitor module, and a second switch module. The second capacitor module. The first capacitor module and the first switch module are coupled to the first secondary winding portion, and the first switching module and the first capacitor module are disposed on the upper surface of the first secondary winding portion. The second capacitor module and the second switch module are coupled to the second secondary winding portion, and the second switch module and the second capacitor module are disposed on the lower surface of the second secondary winding portion.

In an embodiment of the invention, the secondary winding includes a first secondary winding portion and a second secondary winding portion, and the rectifier circuit module includes a first switching module, a capacitor module, and a second switching module. The first switch module is coupled to the first secondary winding portion. The capacitor module is coupled to the first switch module, and is disposed on the upper surface of the first secondary winding portion with the first switch module. The second switch module is disposed on the lower surface of the second secondary winding portion, and the second switch module is coupled to the capacitor module through a via.

In an embodiment of the invention, the first switch module, the first capacitor module, the second switch module or the second capacitor module are disposed inside the PCB board.

In an embodiment of the invention, the first switch module or the second switch module is a chip and is disposed inside the PCB.

In an embodiment of the invention, the capacitor module is formed by doping a dielectric material on a substrate of the PCB.

In an embodiment of the invention, the magnetic core group has an overlapping portion with a vertical projection area of the first circuit module or the second circuit module on the first plane.

In an embodiment of the invention, the primary side opening and the secondary side opening are asymmetric with respect to the magnetic core column, and the first circuit module or the second circuit module is disposed on the primary side opening and the secondary side opening. The larger of the widths.

In an embodiment of the invention, the second core member falls within the vertical projection area of the first plane into the vertical projection area of the core cover of the first core member in the first plane.

In an embodiment of the invention, the thickness of the second core member is greater than the thickness of the core cover of the first core member.

In an embodiment of the invention, the first core member and the second core member are recessed along the primary side opening or the secondary side opening, and at least a portion of the first circuit module or the second circuit module At least a portion of the portion is disposed in an arcuate region.

In an embodiment of the invention, the magnetic core group further includes a receiving portion. The accommodating portion is configured to accommodate the first circuit module or the second circuit module.

In an embodiment of the invention, the receiving portion is a groove, and the groove is disposed on the first core member or the second core member, and at least the first circuit module A portion or at least a portion of the second circuit module is received within the recess.

In an embodiment of the invention, the receiving portion is disposed on a side of the magnetic core column adjacent to the first circuit module or the second circuit module.

In an embodiment of the invention, the magnetic core post has a first diameter and a second diameter, wherein the second diameter is smaller than the first diameter, and the receiving portion is disposed on one side of the magnetic core column along the direction of the second diameter.

In an embodiment of the invention, the receiving portion is disposed on a side of the first side pillar or the second side pillar adjacent to the first circuit module or the second circuit module.

In an embodiment of the invention, the width of the first side pillar is smaller than the width of the second side pillar, and the receiving portion is disposed on a side of the first side pillar adjacent to the first circuit module or a side of the second circuit module.

In an embodiment of the invention, the magnetic core group includes a first core cover, a second core cover and a plurality of magnetic cores, and the plurality of magnetic cores and the first magnetic core cover and the second The core cover is connected to form a closed magnetic path.

In an embodiment of the invention, the magnetic core group includes a first core cover, a second core cover and a plurality of side posts. A plurality of side legs are disposed around a magnetic core column of the magnetic core group, and the plurality of side legs are connected with the first magnetic core cover plate and the second magnetic core cover plate to form a plurality of side openings.

In an embodiment of the invention, the magnetic core group comprises an EQ core, a U core, an EE core, an EI core, an EFD core, an RM core, a can core or a PJ type magnetic core.

In an embodiment of the invention, the shape of a section of the U-shaped core includes a circle, a racetrack shape, a rectangular shape, a curved corner rectangle or an elliptical shape.

In an embodiment of the invention, the second circuit module includes the first bridge An arm, a second bridge arm and a capacitor module, the first bridge arm comprises a first switch module and a second switch module, and the second bridge arm comprises a third switch module and a fourth switch module, wherein the first switch mode The second switch module includes a first end and a second end, and the second end of the first switch module and the first end of the second switch module are coupled to the second winding First end. The third switch module includes a first end and a second end, and the fourth switch module includes a first end and a second end, wherein the first end of the third switch module is coupled to the first end of the first switch module The second end of the third switch module is coupled to a second end of the second winding, the first end of the fourth switch module is coupled to the second end of the third switch module, and the fourth switch mode The second end of the group is coupled to the second end of the second switch module. The capacitor module is coupled between the first end of the third switch module and the second end of the fourth switch module.

In an embodiment of the invention, the capacitor module includes a first capacitor and a second capacitor. The first switch module, the fourth switch module and the first capacitor are disposed on the first side of the second winding close to the magnetic core column, and the second switch module, the third open block mold and the second capacitor are disposed in the second A second side of the winding relative to the first side.

In an embodiment of the invention, the first switch module and the second switch module are disposed on the first surface of the second winding, and the third switch module and the fourth switch module are disposed on the first surface of the second winding or The second surface.

In an embodiment of the invention, the first switch module and the third switch module are disposed on the first side of the second winding close to the magnetic core column, and the second switch module and the fourth switch module are disposed on the second winding Upper side relative to the second side of the first side.

In an embodiment of the invention, the first switch module and the third switch module are disposed on the first surface of the second winding, and the second switch module and the fourth switch module are disposed on the first surface of the second winding Or a second surface.

In an embodiment of the invention, the first switch module and the fourth switch module are disposed on the first surface of the second winding, and the second switch module and the third switch module are disposed on the second surface of the second winding .

In an embodiment of the invention, the capacitor module includes at least one capacitor. When at least one capacitor is disposed on the first surface, the at least one capacitor is coupled to the second switch module and the third switch module through the via, and when at least one capacitor is disposed on the two surfaces, the at least one capacitor is coupled through the via The first switch module and the fourth switch module are connected.

In an embodiment of the invention, the capacitor module is disposed on the first surface or the second surface of the second winding.

In an embodiment of the invention, when the second winding is a plurality of parallel winding portions or a single winding portion, the capacitor module is further disposed to traverse the second winding.

In an embodiment of the invention, there is a plurality of distances between any edge of the first circuit module or the second circuit module and any edge of the magnetic core post, the first side pillar or the second side pillar, One of the plurality of distances is less than 2 mm.

It can be seen from the above that the electronic device proposed by the present invention reduces the secondary side outlet circuit by changing the outgoing structure of the first circuit module or/and the second circuit module and the magnetic component and changing the structure of the magnetic core group. Or / the energy stored in the magnetic field generated by the primary side outlet circuit, thereby reducing the leakage inductance of the secondary side outlet circuit or/and the primary side outlet circuit.

It can be seen from the above that the electronic device proposed by the present invention reduces the secondary side outlet circuit by changing the outgoing structure of the first circuit module or/and the second circuit module and the magnetic component and changing the structure of the magnetic core group. Or / the energy stored in the magnetic field generated by the primary side outlet circuit, thereby reducing the leakage inductance of the secondary side outlet circuit or/and the primary side outlet circuit.

In order to make the disclosure more obvious, the attached symbols are as follows:

3‧‧‧Electronic devices

31‧‧‧Magnetic components

311‧‧‧Magnetic core group

311a‧‧‧First core part

3111‧‧‧ magnetic core column

3112‧‧‧Second side opening

3113‧‧‧ original side opening

3114, 3115‧‧‧ magnetic core column

3116‧‧‧ Groove

3116a‧‧‧stepped structure

3119‧‧‧Magnetic core cover

311b‧‧‧second core component

312‧‧‧ winding

1‧‧‧Power Converter

11‧‧‧ Planar transformer

312a‧‧‧second winding

312b‧‧‧First winding

312c‧‧‧First secondary winding

312d‧‧‧second secondary winding

312e‧‧‧First primary winding

312f‧‧‧second primary winding

313‧‧‧Separate side inner line

314‧‧‧Second side outlet

315‧‧‧The inner side of the original line

316‧‧‧ original side outlet

32‧‧‧Second circuit module

321‧‧‧ Deputy side outer outlet

33‧‧‧First Circuit Module

331‧‧‧ original outer layer outlet

S‧‧‧Overlapping part

13‧‧‧ primary circuit module

12‧‧‧Sub-side circuit module

1400‧‧‧ Full-wave rectifier circuit

1420‧‧‧First AC circuit

1422‧‧‧Second AC circuit

2020‧‧‧First core cover

2040‧‧‧ magnetic core column

W1, w2‧‧‧ width

Ta, Tb‧‧‧ thickness

D1~d6‧‧‧distance

2200‧‧‧Full bridge circuit

2202‧‧‧First bridge arm

2110, 2112, 2114, 2116‧‧‧ side columns

Edge of 3111a, 2106a, 2106b, 2116a‧‧

SW1‧‧‧ first switch module

SW2‧‧‧Second switch module

SW3‧‧‧ third switch module

SW4‧‧‧fourth switch module

C‧‧‧Capacitor Module, Capacitor

C1‧‧‧First Capacitor Module, Capacitor

C2‧‧‧Second capacitor module, capacitor

2022‧‧‧Second core cover

B1‧‧‧first diameter

B2‧‧‧second diameter

D‧‧‧Switching device

Q‧‧‧ switch

2204‧‧‧second bridge arm

32a, 32b, 2100, 2102, 2104, 2106‧‧‧ circuit modules

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. 1 is a schematic circuit diagram of a power converter including a planar transformer; FIG. 2 is a schematic structural view of a power converter having a conventional planar transformer; FIG. 3A is a view showing a first embodiment of the present invention; FIG. 3B is an exploded view of the electronic device shown in FIG. 3A; FIG. 4 is an exploded view of the electronic device according to the second embodiment of the present invention; Explosion diagram of the electronic device of the third embodiment of the invention; FIG. 5B is a schematic view showing a magnetic core group of the electronic device shown in FIG. 5A; and FIG. 6 is a view showing a magnetic core group of the fourth embodiment of the present invention. Structure FIG. 7 is a schematic structural view of a magnetic core group according to a fifth embodiment of the present invention; FIG. 8 is a schematic structural view showing a magnetic core group according to a sixth embodiment of the present invention; A schematic structural view of an electronic device according to a seventh embodiment of the present invention; FIG. 9B is a schematic structural view of a magnetic core group of the electronic device shown in FIG. 9A; and FIG. 10 is a view showing a magnetic structure of an eighth embodiment of the present invention. FIG. 11 is a schematic structural view of an electronic device according to a ninth embodiment of the present invention; FIG. 12A is a schematic structural view of an electronic device according to a tenth embodiment of the present invention; FIG. 13 is a schematic diagram showing the circuit of the transformer of the eleventh embodiment of the present invention; FIG. 14A is a schematic diagram of a center-tapped full-wave rectifier circuit of the eleventh embodiment of the present invention; Figure 14B is an exploded view of the electronic device of the twelfth embodiment of the present invention; and Figure 14C is a top view of the second winding of Figure 14B; Figure 14D is a plan view of the second sub-edge group in Figure 14B; Figure 14E is a side view of the second winding in Figure 14B; Figure 15A shows the thirteenth aspect of the present invention FIG. 15B is a schematic structural view of a magnetic core group in FIG. 15A; FIG. 16A is a schematic structural view of an electronic device according to a fourteenth embodiment of the present invention; FIG. 16C is a schematic view showing the structure of the magnetic core group in FIG. 16B; FIG. 16D is a view showing the 15th embodiment of the present invention; FIG. 17 is a schematic structural view of an electronic device according to a seventeenth embodiment of the present invention; and FIG. 18 is a schematic structural view of an electronic device according to an eighteenth embodiment of the present invention; FIG. 20A is a schematic structural view of an electronic device according to a twentieth embodiment of the present invention; FIG. 20B is a schematic view showing the structure of the electronic device according to the twentieth embodiment of the present invention; Schematic diagram of the structure; 20C to 20F are schematic views showing a plurality of shapes of a cross section of the magnetic core column of FIG. 20A, and FIG. 21 is a schematic structural view of the electronic device according to the 21st embodiment of the present invention; A schematic diagram of a full-bridge rectifier circuit in a twenty-second embodiment of the present invention is shown; FIG. 22B is a schematic plan view showing a full-bridge circuit of a twenty-second embodiment of the present invention; and FIG. 22C is a diagram showing the present invention. FIG. 22D is a schematic view showing the first surface structure of the full bridge circuit of the 22nd embodiment of the present invention, and FIG. 22E is a schematic view showing the first surface structure of the full bridge circuit of the 22nd embodiment of the present invention; A schematic diagram of a second surface structure in which the full-bridge circuit is disposed in the second winding in the 22nd embodiment; and a 22A is a cross-sectional structural view of the full-bridge circuit in the 22nd embodiment of the present invention.

The following is a detailed description of the embodiments and the accompanying drawings, but the embodiments are not intended to limit the scope of the present invention, and the description of the structure operation is not intended to limit the order of execution thereof, and any structure reassembled by components. The devices produced with equal efficiency are all covered by the present invention. In addition, the drawings are for illustrative purposes only and are not drawn to the original dimensions.

First embodiment:

Referring to FIGS. 3A and 3B, FIG. 3A is a schematic structural view of an electronic device according to a first embodiment of the present invention, and FIG. 3B is an exploded view of the electronic device shown in FIG. 3A.

As shown in FIG. 3A and FIG. 3B , the electronic device includes a magnetic component 31 (eg, a transformer module), a second circuit module 32 , and a first circuit module 33 .

The magnetic component 31 includes a core set 311 and a winding 312. The core group 311 includes a first core member 311a and a second core member 311b corresponding thereto. The first core member 311a has a core post 3111, a secondary side opening 3112, and a primary side opening. 3113 and magnetic core cover 3119. The winding 312 includes a second winding (eg, a secondary winding) 312a and a first winding (eg, a primary winding) 312b. The winding 312 is assembled on the core group 311, specifically, the winding 312 is assembled. Between the first core member 311a and the second core member 311b, it is sleeved on the magnetic core post 3111. Generally, a portion in which a winding is wound in a magnetic core is referred to as a magnetic core column (such as a magnetic core column 3111), and the magnetic core column may be generally cylindrical or rectangular parallelepiped, and the magnetic core cover plates are disposed in parallel with each other on the magnetic core. The opposite sides of the stem (such as the core cover 3119), and the core cover and the core post are perpendicular to each other. Further, the side legs (such as the magnetic core side legs 3114, 3115 described later) are disposed in parallel with the magnetic core column and perpendicular to the magnetic core cover.

The second circuit module 32 is coupled to the second winding 312a of the magnetic component 31 (eg, the secondary winding); the first circuit module 33 is coupled to the first winding 312b of the magnetic component 31 (eg, a primary side) Winding). For example, the second electricity The circuit module 32 can be a rectifier circuit module, such as a half-wave rectifier circuit, a center-tap full-wave rectifier circuit, and the like.

The two ends of the second winding (eg, the secondary winding) 312a are coupled to the second circuit module 32 through a secondary output line. The secondary output line includes a secondary inner layer outgoing line 313 and a secondary side output. The line hole 314 and a pair of outer side outer line outlets 321 are electrically connected to the secondary outer layer outlet line 321 through the secondary side outlet line 314. Similarly, the two ends of the first winding (eg, the primary winding) 312b are coupled to the first circuit module 33 through a primary outgoing line, and the primary outgoing line includes a primary inner layer outgoing line 315, a The primary side outlet hole 316 and the primary outer layer outlet line 331 are electrically connected to the primary outer layer outlet line 316 through the primary side outlet line 316. The secondary side outlet hole 314 may be disposed in an outer region of the second winding (eg, the secondary winding) 312a, but not limited thereto, or may be disposed in a region of the second winding 312a or the second winding 312a and the magnetic core The area between the columns 3111. For the same reason, the primary side outlet hole 316 may be disposed in the outer region of the first winding 312b, but not limited thereto, or may be disposed in the region of the first winding 312b or between the first winding 312b and the magnetic core column 3111. Area.

At least one non-coverage region exists between the vertical projection regions of the first core member 311a and the second core member 311b of the core group 311 on the first plane and the vertical projection regions of the winding 312 on the first plane (non- The portion of the coverage area where the vertical projection area of the winding 312 on the first plane is not covered by the vertical projection area of the first core member 311a or the second core member 311b on the first plane may be located on the secondary side, or The primary side is the plane in the horizontal direction of the second winding 312a.

In the present embodiment, the first core member 311a of the core group 311 and the vertical projection region of the second core member 311b on the first plane overlap. There is a non-covered area on the secondary side between the vertical projection area of the first core member 311a and the second core member 311b on the first plane and the vertical projection area of the winding 312 on the first plane (not shown in the drawing) At this time, the second circuit module 32 is moved toward the magnetic core column 3111, and is vertically projected in the non-covered area, so that the second circuit module 32 and the winding 312 (specifically, the second winding 312a) are The vertical projection on the first plane has an overlapping portion S, whereby the lengths of the secondary inner layer outgoing line 313 and the outer layer outgoing line 321 can be reduced, so that the second circuit module 32 and the secondary outer layer outgoing line 321 The secondary side outlet circuit formed by the secondary side outlet hole 314 and the secondary side inner layer outlet line 313 is reduced in area relative to the secondary side outlet circuit of the prior art, thereby reducing the secondary side outlet line. The energy stored in the magnetic field generated by the loop reduces the amount of leakage.

In this embodiment, the magnetic component 31 may be a planar transformer, that is, the winding 312 is a planar winding, for example, may be a PCB planar winding, or may be a foil planar winding, or may be a planar winding composed of a circular wire. .

In the present embodiment, only the second circuit module 32 is described because the number of turns of the secondary winding in the planar transformer is usually small, and the leakage inductance of the secondary output is often in the total of the planar transformer. Leakage inductance accounts for a high proportion. However, in other embodiments, the vertical projection area of the first core member 311a and the second core member 311b on the first plane and the vertical projection area of the winding 312 on the first plane may be present on the primary side. Non-covered area, the first circuit module 33 is directed to the magnetic core column 3111 Moving closer, the vertical projection is in the non-covered area, so that the vertical projection area of the first circuit module 33 and the winding 312 (specifically the first winding 312b) on the first plane has overlapping portions, thereby being The leakage inductance formed by the small primary side outlet circuit. In other embodiments, the vertical projection area of the first core member 311a and the second core member 311b on the first plane and the vertical projection area of the winding 312 on the first plane may be between the secondary side and The non-coverage area exists on the original side, and the second circuit module 32 and the first circuit module 33 are simultaneously moved toward the magnetic core column 3111 so that the second circuit module 32 and the first circuit module 33 are respectively perpendicular. Projecting on the non-coverage area on the secondary side and the non-coverage area on the primary side, thereby causing the second circuit module 32 and the first circuit module 33 and the vertical projection area of the winding 312 on the first plane to have overlapping portions, This reduces the leakage inductance formed by the secondary side outlet circuit and the primary side outlet circuit.

Second embodiment:

In this embodiment, the difference between the present embodiment and the first embodiment is that the vertical projection areas of the first core member 311a and the second core member 311b on the first plane do not overlap, and the first circuit module 33 Or the second circuit module 32 and the core group 311 have overlapping portions in a vertical projection area of the first plane. Referring to FIG. 4, FIG. 4 is an exploded view of the electronic device of the second embodiment of the present invention. There is a non-covered area on the secondary side between the vertical projection area of the first core member 311a on the first plane and the vertical projection area of the winding 312 on the first plane, while the second core member 311b is on the first plane. There is a non-covered area on the primary side between the vertical projection area and the vertical projection area of the winding 312 on the first plane. At this time, the second circuit module 32 and the first circuit module 33 are both moved closer to the magnetic core column 3111. The second circuit module 32 and the first circuit module 33 are vertically projected on the non-covered area on the secondary side and the non-covered area on the primary side, respectively, so that the second circuit module 32 and the first circuit module 33 are further Each of the vertical projections of the winding 312 on the first plane has an overlapping portion. As can be seen from the figure, the second circuit module 32 is located on the side of the second core member 311b and moved closer to the second core member 311b. The vertical projection of the second circuit module 32 and the second winding 312a on the first plane has an overlapping portion, and the first circuit module 33 is located on the side of the core cover 3119 of the first core member 311a, and moves closer to the first The core member 311a has an overlapping portion of the vertical projection of the first circuit module 33 and the first winding 312b on the first plane. It should be noted that, in other embodiments, the second circuit module 32 may be located on the core cover 3119 side of the first core component 311a, or the first circuit module 33 may be located on the second core component 311b. Side, not limited to this. Thereby, the leakage inductance formed by the secondary side outlet circuit or/and the primary side outlet circuit can be reduced.

In this way, the first circuit module 33 or the second circuit module 32 and the core group 311 have overlapping portions in the vertical projection area of the first plane, thereby further reducing the volume of the electronic device 3.

Third embodiment:

Referring to FIGS. 5A and 5B, FIG. 5A is an exploded view of the electronic device according to the third embodiment of the present invention, and FIG. 5B is a schematic view showing a magnetic core group of the electronic device shown in FIG. 5A.

In the present embodiment, the vertical projection area of the first core member 311a on the first plane completely covers the vertical projection area of the winding 312 on the first plane, and the vertical projection of the second core member 311b on the first plane Area There is a non-covered area between the field and the vertical projection area of the winding 312 on the first plane, or the vertical projection area of the second core part 311b on the first plane completely covers the vertical projection of the winding 312 on the first plane. There is a non-covered area between the vertical projection area of the first core member 311a on the first plane and the vertical projection area of the winding 312 on the first plane, but not limited thereto. As can be seen from the figure, the vertical projection area of the first core member 311a on the first plane completely covers the vertical projection area of the winding 312 on the first plane. At this time, there is a non-overlapping region (not shown) on the secondary side between the second core member 311b and the vertical projection region of the winding 312 on the first plane, that is, the vertical projection region of the winding 312 on the first plane. A portion that is not covered by the vertical projection area of the second core member 311b on the first plane, for example, a portion of the vertical projection area of the winding 312 on the first plane is not partially on the first plane by the second core member 311b. Covered by the vertical projection area, the second circuit module 32 is moved closer to the second core component 311b, thereby causing at least a portion of the second circuit module 32 to be vertically projected in the non-covered area, and the second circuit module 32 is The vertical projection area of the winding 312 on the first plane has overlapping portions, whereby the leakage inductance formed by the secondary side outlet circuit can be reduced. It should be noted that, in some other embodiments, the second magnetic core component 311b and the vertical projection area of the winding 312 on the first plane may have a non-overlapping area on the primary side, and the first circuit module is 33 moves closer to the second core member 311b, whereby at least a portion of the first circuit module 33 is vertically projected in the non-covered area, and the first circuit module 33 and the winding 312 have a vertical projection area on the first plane. The stacking portion can thereby reduce the leakage inductance formed by the primary side outlet circuit.

Similarly, in this embodiment, the first circuit module 33 or the second circuit module 32 and the core group 311 also have overlapping portions in a vertical projection area of the first plane. Compared with the first embodiment, the volume of the electronic device 3 in the present embodiment can be further reduced.

Fourth embodiment:

Referring to Fig. 6, Fig. 6 is a view showing the structure of a magnetic core group of a fourth embodiment of the present invention.

The difference between this embodiment and the third embodiment is that the thickness Ta of the core cover 3119 of the first core member 311a is smaller than the thickness Tb of the second core member 311b. With this magnetic core group structure, compared with the third embodiment, the magnetic core structure has a lower core loss than the magnetic core structure shown in FIG. 5B under the condition of the same magnetic core material. . In other embodiments, the thickness of the core cover 3119 of the first core member 311a may be greater than the thickness of the second core member 311b, thereby reducing the loss of the core.

Fifth embodiment:

Referring to Fig. 7, Fig. 7 is a view showing the structure of a magnetic core group according to a fifth embodiment of the present invention.

The difference between this embodiment and the first embodiment is that the side pillars 3114 and the side pillars 3115 of the magnetic core group 311 are asymmetrical with respect to the magnetic core pillars 3111. As can be seen from the figure, the side pillars 3114 and the side pillars 3115 of the magnetic core group 311 The length is different, that is, the length of the side post 3114 is greater than the length of the side post 3115. Therefore, the preparation of the primary side outlet hole or the secondary side outlet hole is facilitated, and the wiring of the first circuit module or the second circuit module is facilitated, which is advantageous for reducing the volume of the converter and reducing the formation of the primary side outlet circuit. The leakage inductance or the leakage inductance formed by the secondary side outlet circuit.

Sixth embodiment:

Referring to Fig. 8, Fig. 8 is a view showing the structure of a magnetic core group of a sixth embodiment of the present invention.

In the present embodiment, in addition to the third to fifth embodiments, the secondary side opening 3112 of the magnetic core group 311 and the primary side opening 3113 are asymmetrical with respect to the magnetic core post 3111. Specifically, the two core side legs 3114, 3115 can be extended along the arc toward the primary side opening 3113, increasing the volume of the side legs 3114, 3115, thereby reducing core loss.

Seventh embodiment:

Referring to FIG. 9A and FIG. 9B, FIG. 9A is a schematic structural view of an electronic device according to a seventh embodiment of the present invention, and FIG. 9B is a schematic structural view showing a magnetic core group of the electronic device shown in FIG. 9A.

In this embodiment, the vertical projection areas of the first core member 311a and the second core member 311b of the core element 311 on the first plane completely cover the vertical projection area of the winding on the first plane, and the core group A recess 3116 is defined in the second core member 311b of the 311, and the second circuit module 32 is received in the recess 3116, thereby causing the projection of the second circuit module 32 and the winding in the first plane. The overlapping portion reduces the leakage inductance formed by the secondary side outlet circuit. It should be noted that, in other embodiments, a groove may be defined on the first core member 311a, and at least a portion of the second circuit module 32 may be received in the recess 3116. The first circuit module may also be At least a portion of the group 33 is received in the recess to reduce the leakage inductance formed by the primary outgoing loop.

In other words, the side surface of the first core member 311a or the second core member 311b having the recess 3116 substantially forms a stepped structure 3116a, At least a portion of the second circuit module 32 or the first circuit module 33 may be disposed within the stepped structure 3116a. In addition, the above-mentioned 5B, 6th, and 8th drawings have similar stepped structures, and the description thereof will not be repeated here.

Through the above arrangement, at least a portion of the second circuit module 32 or the first circuit module 33 can be disposed in the core group 311 such that the first circuit module 33 or the second circuit module 32 and the core group The vertical projection area of the first plane 311 has overlapping portions, thereby reducing the volume of the electronic device 3.

Eighth embodiment:

Referring to Fig. 10, Fig. 10 is a view showing the structure of a magnetic core group of an eighth embodiment of the present invention.

The difference between the first embodiment and the first embodiment is that the first core member 311a and the second core member 311b are indented along the secondary side opening 3112 or the primary side opening 3113 so as to be a second circuit module. 32 or the first circuit module 33 is correspondingly moved in the direction of the magnetic core column 3111. Thereby, the core loss can be reduced, and the leakage inductance formed by the secondary side or the primary side outlet circuit can be reduced. Therefore, in this embodiment, at least a portion of the second circuit module 32 or the first circuit module 33 can be placed in the core group 311 to make the first circuit module 33 or the second circuit module 32 There is an overlap with the vertical projection area of the core group 311 in the first plane.

Ninth embodiment:

Referring to Fig. 11, Fig. 11 is a view showing the configuration of an electronic apparatus according to a ninth embodiment of the present invention.

The difference between this embodiment and the third embodiment is that one secondary side outlet The hole 314a is disposed in an outer region of the second winding 312a, and the other secondary outlet hole 314 is disposed in a region of the second winding 312a to facilitate preparation of the secondary side outlet.

Tenth embodiment:

Referring to Fig. 12A, Fig. 12A is a view showing the configuration of an electronic apparatus according to a tenth embodiment of the present invention.

In this embodiment, the second circuit module 32 is divided into two circuit modules 32a, 32b, and the circuit module 32a includes components sensitive to leakage inductance. In some embodiments, the leakage sensitive component includes a circuit module formed by the switch module and the capacitor module. Alternatively, in other embodiments, when the circuit module 32a includes a plurality of capacitors and other components in parallel, the leakage sensitive component includes a loop portion formed by the capacitor and the winding closest to the winding. Included in the circuit module 32b is an element that is insensitive to leakage inductance. The circuit module 32a is arranged on the side of the secondary side outlet hole 314 in the direction of the core group 31, for example, the switch tube, the capacitor, etc. are arranged on the side close to the core group 31, and the circuit module 32b is arranged in the circuit module 32b. It is away from the side of the core group 31.

As shown in the thirteenth figure, the switching device D and the capacitor C are connected to the winding Ns, and the switch Q is connected to the winding Np. The switching device D, the switch Q and the capacitor C are all components sensitive to leakage inductance, and therefore should be arranged in The corresponding outlet hole is close to the side of the magnetic core column. For example, the switch Q should be arranged on the side of the primary side outlet hole in the direction of the magnetic core column, and the switching device D and the capacitor C should be arranged on the side of the secondary side outlet hole in the direction of the magnetic core column.

Alternatively, as shown in the full-wave rectification circuit shown in FIG. 14A, the switches SW1 and SW2 and the plurality of parallel output capacitors C1 and C2 are connected to the winding. The group 312d, wherein the leakage sensitive component comprises the first switch module SW11, the second switch module SW2, and one of the placement positions and the first switch module SW1, the second switch module SW2 or the winding 312d The closest capacitor, such as capacitor C1. These components should be placed on the side of the corresponding winding side outlet hole near the core column. The capacitor C2 is in a parallel relationship with the capacitor C1 and its layout position is relatively far from the first switch module SW1 and the second switch module SW2, and is an element relatively sensitive to leakage inductance.

Referring again to FIG. 12B, FIG. 12B is a schematic diagram showing the principle of the secondary side outlet of the electronic device shown in FIG. 12A.

As shown in Fig. 12B, the secondary outer layer outgoing line 321 is parallel to the secondary inner layer outgoing line 313. Since the current flowing in the secondary side is equal in magnitude and opposite in direction, the generated magnetic fields cancel each other, thereby greatly reducing the secondary The effect of leakage on the sideline.

Especially when the magnetic core group 31 is the magnetic core group of the third, fourth, fifth, sixth, seventh or eighth embodiment, the effect is more remarkable. The experiment proves that for a specific planar transformer, the structure in Figure 12A has a total leakage inductance of 1.13uH, and the total leakage inductance is composed of the leakage inductance in the window and the leakage inductance of the secondary side. Sense) is 0.72uH. With this embodiment, the total leakage inductance is reduced to 0.77 uH. That is, the leakage inductance of the secondary side outlet is reduced from 0.41 uH to 0.05 uH, and the leakage inductance generated by the secondary side outlet is almost eliminated.

It should be noted that the above embodiments mainly improve the layout of the second circuit module 32 so as to have an overlapping portion with the projection area of the winding 312 on the first plane, but in other embodiments, it may be similar. Processing the first circuit module 33 to make it with the winding 312 or the core group 311 The projected area on the first plane has overlapping portions.

Eleventh embodiment:

Referring to Figure 13, Figure 13 is a circuit diagram showing a transformer of an eleventh embodiment of the present invention.

As shown in Fig. 13, the primary side circuit includes a primary winding Np and a switch Q, and the secondary circuit includes a secondary winding Ns, a switching device D (such as a switching diode), and a capacitor C.

The first to tenth embodiments are more suitable for the flyback converter shown in Fig. 13. Since the leakage inductance is reduced, the efficiency of the flyback transformer can be more effectively improved, the voltage spike of the switch Q on the primary side during turn-off is reduced, and the primary side switch Q is prevented from being broken down. However, the electronic device shown in the first to tenth embodiments is not limited to this converter, and those skilled in the art can adapt to the replacement according to the actual application.

Please refer to FIG. 14A. FIG. 14A is a schematic diagram of a center-tapped full-wave rectification circuit.

As shown in FIG. 14A, the second circuit module 32 in the center-tapped full-wave rectification circuit 1400 includes a first switch module SW1, a second switch module SW2, a first capacitor module C1, and a second capacitor module. C2. The first switch module SW1 is coupled to the first sub-winding portion 312c of the first capacitor module C1 and the second winding (eg, the secondary winding) 312a, and the second switch module SW2 and the second capacitor module are coupled. C2 is coupled to the second secondary winding portion 312d of the second winding 312a.

Further embodiments will be presented in the following paragraphs, which can be used to implement the center tap shown in FIG. 14A by applying the connection structure described above for the electronic device 3. The full-wave rectification circuit 1400, but the present invention is not limited to the following embodiments.

Twelfth embodiment:

Referring to FIG. 14A and FIG. 14B together, FIG. 14B is an exploded view of the electronic device of the twelfth embodiment of the present invention.

The first winding (e.g., primary winding) 312b of the center-tapped full-wave rectifying circuit 1400 of Fig. 14B is divided into a first primary winding portion 312e and a second primary winding portion 312f. For example, the first primary winding portion 312e and the second primary winding portion 312f may be planar windings formed by circular wires, and the second winding of the center-tapped full-wave rectifier circuit 1400 (eg, secondary winding) 312a may be a winding structure of a two-layer PCB board, the winding of the upper PCB board is the first secondary winding portion 312c, and the winding of the lower PCB board is the second secondary winding portion 312d.

Please refer to FIG. 14C, FIG. 14D and FIG. 14E together, FIG. 14C is a top view of the second winding in FIG. 14B, and FIG. 14D is a second secondary winding in FIG. 14B. A top view of the portion, and Fig. 14E shows a side view of the second winding in Fig. 14B.

As shown in the 14C and 14D, the first switch module SW1 and the first capacitor module C1 are disposed on the upper surface of the first secondary winding portion, and the first secondary winding portion 312c and the first switch module SW1 The first capacitor module C1 is coupled to each other and constitutes a first AC circuit 1420, and the second switch module SW2 and the second capacitor module C2 are disposed on a lower surface of the second secondary winding portion, and the second secondary winding portion 312d and the second switch module SW2 and the second capacitor module C2 are coupled to each other to form a second AC circuit 1422, and the aforementioned AC circuit All of them contain a large amount of alternating current components, so they are defined as an alternating current loop, and the arrangement structure of the two loops is as shown in FIG. 14E, wherein the first capacitor module C1 and the second capacitor module C2 are correspondingly arranged.

By means of the arrangement shown in FIG. 14B or FIG. 14E, the second circuit module 32 and the second winding 312a or the core group 311 can have overlapping portions in a vertical projection area on the first plane, so that the center tap type The full wave rectification circuit 1400 can have a lower volume.

Referring to FIG. 14B, FIG. 14C and FIG. 14D together, the vertical projection area of the first primary winding portion 312e and its AC circuit (not shown) on the first plane is defined as a first projection surface. The vertical projection area of the second primary winding portion 312f and its alternating current loop (not shown) on the first plane is defined as a second projection surface, and the vertical projection area of the aforementioned first alternating current loop 1420 on the first plane It is defined as a third projection surface, and the vertical projection area of the aforementioned second AC circuit 1422 on the first plane is defined as a fourth projection surface. In FIG. 14B, the area ratio of the overlapping portion of the third projection surface and the first, second, third, and fourth projection surfaces ranges from 1 to 1.2, and the fourth projection surface is first, second, and The area ratio of the overlapping portions of the third and fourth projection surfaces ranges from 1 to 1.2. In other words, in this embodiment, the area of the vertical projection area on the first plane of any of the alternating current loops on the same magnetic core column and all the loops on the same magnetic core column coupled in the magnetic core group are The ratio of the areas of the overlapping portions of the vertical projection areas on the first plane ranges from 1 to 1.2.

Therefore, in terms of structure, the present embodiment cuts off any position of the planar winding magnetic element and uses a connection relationship with the circuit. The circuit modules are connected to each other, further shortening the length of the circuit loop and the volume of the whole component, and further reducing the coupling between the winding and the winding, thereby reducing the leakage inductance between the windings and the equivalent resistance and parasitic on the loop. inductance. In addition, the second circuit module 32 in this embodiment is composed of the first switch module SW1, the first capacitor module C1, or the second switch module SW2 and the second capacitor module C2, but Without limitation, the second circuit module 32 can be a variety of rectifier circuit modules, and those skilled in the art can be elastically replaced.

Furthermore, the element structure in this embodiment is also applicable to a full-wave rectifying circuit using only one capacitor. For example, the first capacitor module C1 can be disposed on the upper surface of the first secondary winding portion 312c and coupled to the first switch module SW1, and the second switch module SW2 can be disposed in the first The second switching module SW2 can be coupled to the first capacitor module C1 by providing a connection structure of the via holes on the secondary side group 312b.

In addition, the first switch module SW1 or the second switch module SW2 in this embodiment may be a wafer, and the chip is disposed inside the PCB. The first capacitor module C1 or the second capacitor module C2 can be directly operated by using a capacitor element or can be formed by doping a dielectric material on a substrate of the PCB to further reduce the component volume. In addition, the winding structure of the embodiment is not limited to the arrangement of "primary side - secondary side - secondary side - primary side", and those skilled in the art may also be correspondingly changed, such as "secondary side - primary side" - primary side - secondary side".

Thirteenth embodiment:

Referring to FIG. 15A, FIG. 15A is a schematic structural view of an electronic device according to a thirteenth embodiment of the present invention. As shown in Figure 15A, in this In an embodiment, the vertical projection area of the core group 311 and the second circuit module 32 on the first plane has overlapping portions.

Please refer to FIG. 15B, and FIG. 15B is a schematic structural view of the magnetic core group in FIG. 15A. When the width of the second circuit module 32 is large enough to be placed in the core group 311, as shown in FIG. 15B, the secondary side opening 3112 of the core group 311 is opposite to the primary side opening 3113. In the case where the magnetic core column 3111 is asymmetrical and the second circuit module 32 is disposed in the larger one of the primary side opening 3113 or the secondary side opening 3112, the second circuit module is taken as an example in FIG. 15B. 32 can be placed in the secondary side opening 3112. Through this arrangement, the area of the vertical projection area of the aforementioned AC circuit on the first plane overlaps with the vertical projection area of all the loops on the same core column coupled to the core group on the first plane. The ratio of the area of the portion may range from less than 1.2.

Fourteenth embodiment:

Referring to FIG. 16A, FIG. 16A is a schematic structural view of an electronic device according to a fourteenth embodiment of the present invention. As shown in FIG. 16A, in the present embodiment, the second core member 311b falls into the vertical projection area of the core cover 3119 of the first core member 311a in the vertical plane of the first plane in the first plane. . The structure of the present embodiment is suitable for the second circuit module 32 to be placed through the second core member 311b of the cut portion when the height of the second circuit module 32 exceeds the height that the core group 311 can set. So that the second circuit module 32 and the first core member 311a have overlapping portions in the vertical projection area on the first plane. Alternatively, please refer to FIG. 16B and FIG. 16C. In this embodiment, the upper and lower covers can also be cut off. The second circuit module 32 is placed in a partial cover manner.

Similarly, in this embodiment, the side faces of the first core member 311a and the second core member 311b form a stepped structure 3116a, and the second circuit module 32 is disposed in the stepped structure 3116a.

Fifteenth embodiment:

Referring to FIG. 16D, FIG. 16D is a schematic structural view of an electronic device according to a fifteenth embodiment of the present invention. The difference between the fifteenth embodiment and the fourteenth embodiment is that the thickness Tb of the second core member 311b is larger than the thickness Ta of the core cover 3119 of the first core member 311a. Since cutting off part of the second core member 311b in the fourteenth embodiment increases the core loss, the thickness Tb of the second core member 311b is increased in the fifteenth embodiment to reduce the core loss.

Sixteenth embodiment:

Referring to FIG. 10, FIG. 10 is a schematic structural view of an electronic device according to a sixteenth embodiment of the present invention. When the height or width of the second circuit module 32 exceeds the space that the magnetic core group 311 can set, as shown in FIG. 10, the first core member 311a and the second core member 311b are along the secondary side opening 3112 or the original The side opening 3113 is inwardly curved so as to set at least a portion of the second circuit module 32 in the recessed arcuate region, so that the second circuit module 32 and the first or second core member are at the first The vertical projection area on the plane has overlapping portions.

Seventeenth embodiment:

Referring to FIG. 17, FIG. 17 is a schematic structural view of an electronic device according to a seventeenth embodiment of the present invention. At the height of the second circuit module 32 When the width exceeds the space that the magnetic core group 311 can set, the housing portion can be disposed through the magnetic core group 311 to accommodate the second circuit module 32. As shown in FIG. 17, the receiving portion is a groove which can be disposed on the first core member 311a or the second core member 311b and at least a portion of the second circuit module 32 is recessed. The slot has an overlap portion between the second circuit module 32 and the vertical projection area of the first or second core member on the first plane. Alternatively, the structure of FIG. 9 may be used to adjust the magnetic core group to accommodate the circuit module.

Eighteenth embodiment:

Referring to FIG. 18, FIG. 18 is a schematic structural view of an electronic device according to an eighteenth embodiment of the present invention. Similar to the seventeenth embodiment, when the height or width of the second circuit module 32 exceeds the space that the magnetic core group 311 can set, the housing portion can be disposed through the magnetic core group 311 to accommodate at least a portion of the second circuit module 32. . As shown in FIG. 18, the magnetic core post 3111 of the magnetic core group 311 can be cut off to accommodate the second circuit module 32, that is, the receiving portion is disposed on the side of the magnetic core post 3111 near the second circuit module 32. .

In other words, as shown in Fig. 18, the magnetic core post 3111 has a first diameter b1 and a second diameter b2, wherein the second diameter b2 is smaller than the first diameter b1. The receiving portion may be disposed on one side of the magnetic core post 3111 along a direction of the smaller second diameter b2 to place the second circuit module 32.

19th embodiment:

Referring to FIG. 19, FIG. 19 is a schematic structural view of an electronic device according to a nineteenth embodiment of the present invention. When the width of the second circuit module 32 exceeds the space that the magnetic core group 311 can set, as shown in FIG. 18, the core side leg 3114 or 3115 of the magnetic core group 311 can be cut off to accommodate the first portion. At least a portion of the two circuit modules 32, that is, the receiving portion, is disposed on a side of the core side leg 3114 or the core side leg 3115 adjacent to the second circuit module 32. Through this arrangement, the vertical projection area of the core group 311 and the second circuit module 32 on the first plane can be overlapped. In this embodiment, the area of the vertical projection area on the first plane of any of the alternating current loops on the same magnetic core column and all the loops on the same magnetic core column coupled in the magnetic core group are in the first plane. The ratio of the ratio of the areas of the overlapping portions of the vertical projection areas on the range is close to one. Alternatively, the structure of Figure 7 can be used to adjust the core side post to accommodate the circuit module.

As shown in Fig. 19, the width w1 of one side of the core side post 3114 is smaller than the width w2 of one side of the core side post 3115, so that the receiving portion can be disposed on the core side post 3114 having a smaller width w1. One side of the second circuit module 32 (or the first circuit module 33).

20th embodiment:

Referring to FIG. 20A and FIG. 20B, FIG. 20A is a schematic structural view of an electronic device according to a twentieth embodiment of the present invention, and FIG. 20B is a schematic structural view of the magnetic core group of FIG. 20A. Taking the EQ type magnetic core as an example, the U-shaped magnetic core is exemplified in the present embodiment. The magnetic core group 311 of the present embodiment includes a first magnetic core cover 2020, a second magnetic core cover 2022 and a plurality of magnetic core columns 2040. In this embodiment, two magnetic core columns are taken as an example. The plurality of magnetic core posts 2040 are coupled to the first magnetic core cover 2020 and the second magnetic core cover 2022 to form a closed magnetic path. As shown in FIG. 20A, the first core cover 2020 or the second core cover 2022 overlaps with at least a portion of the second circuit module 32 in a vertical projection area of the first plane. Also That is to say, in this embodiment, the second circuit module 32 (or the first circuit module 33) and the vertical projection area of the core group 311 on the first plane have overlapping portions by such an arrangement. , so that the overall volume can be reduced.

For a clearer description, referring to FIG. 20B, the area of the vertical projection area on the first plane of any of the alternating current loops surrounding the same magnetic core column in this embodiment is the same as the coupling in the magnetic core group. The ratio of the area of the overlapping portion of the vertical projection area of all the loops on the first core in the first plane may range from 1 to 1.2, and the second core cover 2022 may cover the second circuit module 32. That is, the second circuit module 32 has an overlapping portion with the projection of the magnetic core.

Furthermore, as shown in FIG. 20B, the shape of the cross section of the plurality of magnetic core pillars 2040 in the U-shaped magnetic core in this embodiment is circular, but the disclosure is not limited thereto. Referring to FIGS. 20C to 20F, FIGS. 20C to 20F are schematic views respectively showing a plurality of shapes of a cross section of the magnetic core column of FIG. 20A. The plurality of magnetic core columns 2040 in this embodiment may be more racetrack-shaped (as shown in FIG. 20C), rectangular (as shown in FIG. 2D), and a rectangular rectangle (as shown in FIG. 2E). Elliptical (as shown in Figure 20F). The above is merely an example, and those skilled in the art can adjust the cross-sectional shape of the magnetic core column in the U-shaped magnetic core.

21st embodiment:

Referring to FIG. 21, FIG. 21 is a block diagram showing the structure of an electronic device according to a twenty-first embodiment of the present invention. As shown in FIG. 21, when a plurality of circuit modules need to be connected to the magnetic core group, the number of side columns of the magnetic core group 311 can be adjusted to place the circuit module, for example, the magnetic core group 311 and the circuit module. 2100, 2102, 2104, 2106 are connected, and a plurality of side posts 2110, 2112, 2114, 2116 can be disposed around the magnetic core column 3111, and the first magnetic core cover and the second magnetic core of the plurality of side columns and the magnetic core group After the cover is connected, a plurality of side openings are formed to be connected to the PCB board. When the circuit module is set more, the corresponding winding length is shorter, and the core loss is also less. In addition, considering the heat dissipation and alignment considerations of the circuit module, the arrangement of the plurality of core side pillars can also be adjusted correspondingly.

It is to be noted that the fourteenth to twenty-first embodiments are mostly exemplified by the center-tapped full-wave rectifying circuit 1400 of FIG. 14A, and the magnetic core group of the connecting structure of the fourteenth to twenty-first embodiments can be used to: The overlap of the area of the vertical projection area on the first plane of any AC loop on the same core column with the vertical projection area of all loops on the same core column coupled in the core group on the first plane The ratio of the area of the portion may range from 1 to 1.2, and the above embodiments may also be applied to different circuits, and the first circuit module 33 coupled to the first winding (eg, the primary winding) 312b may also be applicable. In the above various connection structures. In addition, the above embodiment takes an EQ type magnetic core and a U-shaped magnetic core as an example, but the present invention can also be applied to an EE type magnetic core, an EI type magnetic core, an EFD type magnetic core, an RM type magnetic core, a can core or The PJ type magnetic core and the circuit module are not limited by the above-mentioned switch module or capacitor module, and those skilled in the art can adjust the structure of various magnetic cores and the corresponding circuit module structure.

In addition, in various embodiments of the present invention, any edge on the first circuit module 33 or the second circuit module 32 and the edge of the magnetic core post 3111 or the core side pillars 3114, 3115 distance. By the present invention The disclosed arrangement can be set to be less than about 2 millimeters (mm) in a minimum of a plurality of distances.

Taking the circuit module 2106 in FIG. 21 as an example, the edge 2106a of the circuit module 2106 has a plurality of distances d1, d2, and d3 from the edge 3111a of the magnetic core post 3111, wherein the distance d2 is a plurality of distances d1 to d3. The smallest one. In this embodiment, the minimum distance d2 between the circuit module 2106 and the magnetic core post 3111 can be set to be less than about 2 millimeters (mm).

Alternatively, in another embodiment, the edge 2106b of the circuit module 2106 and the edge 2116a of the core leg 2116 have a plurality of distances d4, d5, d6, wherein the distance d5 is the smallest of the plurality of distances d4 to d6. In this embodiment, the minimum distance d5 between the circuit module 2106 and the core side post 2116 can also be set to be less than about 2 millimeters (mm).

The above description only uses the circuit module 2106, the magnetic core post 3111 and the magnetic core side post 2116 as an example, but the same arrangement can be used at any edge of any of the circuit modules 2100, 2102, 2104, 2106. Adjacent magnetic core leg or any edge of the magnetic core post 3111.

22nd embodiment:

Referring to FIG. 22A, FIG. 22A is a schematic diagram showing a full bridge rectifier circuit in a twenty-second embodiment of the present invention. The first circuit module 33 or the second circuit module 32 of each embodiment of the present invention may be a full bridge circuit, as compared with the half bridge circuit structure shown in FIG. 14A.

As shown in FIG. 22A, taking the second circuit module 32 as an example, the full bridge circuit 2200 includes a first bridge arm 2202, a second bridge arm 2204, and a capacitor module C, wherein the first bridge arm 2202 includes a first switch mode. Group SW1 and second switch The module SW2 and the second bridge arm 2204 include a third switch module SW3 and a fourth switch module SW4.

As shown in FIG. 22A, the first end of the first switch module SW1 is electrically coupled to the first end of the third switch module SW3 and the first end of the capacitor module C, and the first switch module SW1 The first end of the second end of the second switch module SW2 is electrically coupled to the first end of the second winding 312a. The second end of the third switch module S3 is electrically coupled to the second end of the second winding 312a and the first end of the fourth switch module SW4, and the second end of the fourth switch module SW4 is electrically coupled to The second end of the second switch module SW2 and the second end of the capacitor module C.

Further embodiments will be presented in the following paragraphs, and the full bridge circuit 2200 shown in Fig. 22A can be implemented by applying the connection structure described above for the electronic device 3, but the present invention is not limited to the following embodiments.

23rd embodiment:

Referring to FIG. 22A and FIG. 22B together, FIG. 22B is a schematic diagram showing the planar structure of the full bridge circuit of the 22nd embodiment of the present invention. In this embodiment, the capacitor module C includes at least a capacitor C1 and a capacitor C2. The first switch module SW1, the fourth switch module SW4, and the capacitor C1 are disposed on the first side of the second winding 312a close to the magnetic core column ( That is, the inner side of the second winding 312a, and the second switch module SW2, the third switch module SW3 and the capacitor C2 are disposed on the second side 312a with respect to the second side of the first side (ie, the second winding) Outside of 312a). As shown in FIG. 22B, in some embodiments, additional wires may be used to electrically connect the positive terminals of the capacitor modules C (ie, the capacitors C1 and C2) to the first open switch modules SW1 and III. Switch module SW3, and negative of capacitor module C (ie capacitor C1 and capacitor C2) The terminal is electrically connected to the second switch module SW2 and the fourth switch module SW4.

Moreover, in some embodiments, the components of the full bridge circuit 2200 described above can be placed on the same surface of the second winding 312a (as shown in FIG. 22B) or on different surfaces. For example, the first switch module SW1 and the second switch module SW2 can be placed on the upper surface of the second winding 312a, and the third switch module SW3 and the fourth switch module SW4 can be placed on the second winding 312a. lower surface. At this time, the capacitor C1 and the capacitor C2 may be disposed on any surface of the second winding 312a. In still other embodiments, when the second winding 312a is a single winding portion or a plurality of winding portions connected in parallel, the capacitor module C (ie, the capacitor C1 and the capacitor C2) may be optionally disposed on any of the second windings 312a. The surface or arrangement is traversed by the second winding 312a.

24th embodiment:

Referring to FIG. 22A and FIG. 22C together, FIG. 22C is a schematic plan view showing the full-bridge circuit of the twenty-second embodiment of the present invention. Compared with the 23rd embodiment, as shown in FIG. 22C, the capacitor module C includes at least one capacitor C1, and the position of the third switch module SW3 and the position of the fourth switch module SW4 are interchanged with each other. That is, in this example, the first switch module SW1 and the third switch module SW3 are disposed inside the second winding 312a, and the second switch module SW2 and the fourth switch module SW4 are disposed on the second winding. Outside of 312a.

Similarly, in this embodiment, the components of the full bridge circuit 2200 described above may also be placed on the same surface of the second winding 312a (as shown in FIG. 22C) or on different surfaces. For example, the first switch module SW1 and the second switch module SW2 can be placed on the upper surface of the second winding 312a, and the third switch The module SW3 and the fourth switch module SW4 can be placed on the lower surface of the second winding 312a. At this time, the capacitor C1 may be disposed on any surface of the second winding 312a. In still other embodiments, when the second winding 312a is a single winding portion or a multi-gate parallel winding portion, the capacitor module C (ie, the capacitor C1) may be selectively disposed on any surface of the second winding 312a or disposed to Crossing the second winding 312a.

25th embodiment:

Referring to FIG. 22A, FIG. 22D and FIG. 22E together, FIG. 22D is a schematic diagram showing the first surface structure of the full-bridge circuit of the twenty-second embodiment of the present invention, which is disposed on the second winding, and FIG. 22E shows In a twenty-second embodiment of the present invention, a full-bridge circuit is disposed on a second surface structure of the second winding. As shown in FIG. 22D, the first switch module SW1 and the fourth switch module SW4 are disposed on the first surface of the second winding 312a (for example, the front surface of the second winding 312a). Similarly, as shown in FIG. 22E, the second switch module SW2 and the third switch module SW3 are disposed on the second surface of the second winding 312a (eg, the reverse side of the second winding 312a). In this embodiment, the capacitor module C may include one or more capacitors and may be disposed on any surface of the second winding 312a. When the capacitor module C is disposed on the first surface, the second switch module SW2 and the third switch module SW3 can be coupled through the via. Alternatively, when the capacitor module C is disposed on the second surface, the first switch module SW1 and the fourth switch module SW4 may also be coupled through the via.

Referring to FIG. 22F, FIG. 22F is a cross-sectional structural view showing the full bridge circuit of the 22nd embodiment of the present invention. Compared with the 22D or 22E, in this example, the capacitor module C is disposed to cross the second winding. 312a.

Furthermore, in an embodiment, in the 22B to 22E, the area of the vertical projection area of the AC circuit formed by the second winding 312a and the second circuit module 32 on the first plane is coupled to the magnetic field. The ratio of the areas of the overlapping portions of the vertical projection areas of all the loops on the same core in the core group in the core group ranges from 1 to 1.2. In other words, by any of the above arrangements, the vertical projection area of the full bridge circuit 2200 and the core group on the first plane may have overlapping portions, so that the volume of the electronic device is reduced.

The above description only takes the second circuit module 32 and the second winding 312a as an example, but the invention is not limited thereto. In different embodiments, the circuit structure and related arrangement of the full bridge circuit 2200 can also be applied to the first circuit module 33 and the first winding 312b. For example, when the full bridge circuit 2200 is applied to the first circuit module 33, it may be an inverter circuit module. When the full bridge circuit 2200 is applied to the second circuit module 32, it can be a rectifier circuit module. The above is only an example, and those skilled in the art can select the setting mode of the full bridge circuit 2200 according to actual needs.

It can be seen from the above that the electronic device proposed by the present invention reduces the secondary outlet circuit and the original by changing the outgoing structure of the first circuit module, the second circuit module and the magnetic component, and changing the structure of the magnetic core group. The energy stored in the magnetic field generated by the side outlet circuit reduces the leakage inductance of the secondary side outlet circuit and the primary side outlet circuit. Furthermore, the foregoing structure can cut off the structure of the magnetic core group at any position, and is connected by using a circuit module connected to the circuit, so that the first circuit module or the second circuit module and the magnetic core group or The vertical projection area of the winding has overlapping portions, thereby reducing the volume of the component Leakage inductance between the windings.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

3‧‧‧Electronic devices

311‧‧‧Magnetic core group

311a‧‧‧First core part

3111‧‧‧ magnetic core column

3112‧‧‧Second side opening

3113‧‧‧ original side opening

3119‧‧‧Magnetic core cover

311b‧‧‧second core component

312‧‧‧ winding

312a‧‧‧second winding

312b‧‧‧First winding

313‧‧‧Separate side inner line

314‧‧‧Second side outlet

315‧‧‧The inner side of the original line

316‧‧‧ original side outlet

32‧‧‧Second circuit module

321‧‧‧ Deputy side outer outlet

33‧‧‧primary circuit module

331‧‧‧ original outer layer outlet

Claims (95)

An electronic device comprising: a magnetic component comprising a magnetic core group and a winding, the winding comprising a first winding and a second winding, and the winding is assembled on the magnetic core group; a first circuit module, The first winding is coupled to the magnetic component; and a second circuit module is coupled to the second winding of the magnetic component; wherein the first circuit module or/and the second circuit module The vertical projection area of the winding of the magnetic element on a first plane has an overlap portion, the first plane being a plane in the horizontal direction of the winding. The electronic device of claim 1, wherein the magnetic component is a transformer module, and the first winding is a primary winding and the second winding is a secondary winding. The electronic device of claim 2, wherein the transformer module is a planar transformer. The electronic device of claim 2, wherein the magnetic core group comprises a first core component and a second core component corresponding thereto, the first core component having a magnetic core post and a magnetic core cover a first side column, a second side column, a primary side opening and a side opening, the primary side opening and the secondary side opening being located at the first side column and the second side column At both ends, the winding is assembled between the first core member and the second core member, and is sleeved On the magnetic core column. The electronic device of claim 4, wherein the first core member or the second core member has a stepped structure, at least a portion of the first circuit module or at least a portion of the second circuit module Placed in the stepped structure. The electronic device of claim 4, wherein a vertical projection area of the first core member or the second core member on the first plane and a vertical projection region of the winding on the first plane exist At least one non-covered area such that at least a portion of the first circuit module or/and the second circuit module are vertically projected in the non-covered area and overlap with a vertical projection area of the winding on the first plane section. The electronic device of claim 6, wherein the magnetic core cover of the first magnetic core member is when the first magnetic core member and the vertical projection area of the winding on the first plane have at least one non-covered area The thickness of the plate is greater than the thickness of the second core member. The electronic device of claim 6, wherein the core cover of the first core member is when the second core member and the vertical projection area of the winding on the first plane have at least one non-covered area The thickness of the plate is less than the thickness of the second core member. The electronic device of claim 4, wherein the primary side opening and the secondary side opening are asymmetric with respect to the magnetic core post. The electronic device of claim 4, wherein a vertical projection area of the first core member and the second core member on the first plane is present between the vertical projection region of the winding and the first plane At least one non-covered area such that at least a portion of the first circuit module or/and the second circuit module are vertically projected in the non-covered area and have an overlapping portion with a vertical projection of the winding on the first plane . The electronic device of claim 10, wherein the first magnetic core component and the vertical projection area of the second magnetic core component on the first plane do not overlap. The electronic device of claim 10, wherein the first core member overlaps a vertical projection area of the second core member on the first plane. The electronic device of claim 12, wherein the first side leg and the second side leg are asymmetrical with respect to the magnetic core leg. The electronic device of claim 13, wherein a length of the first side leg between the primary side opening and the secondary side opening is greater than a length of the second side leg. The electronic device according to claim 12, wherein the first core member and the second core member are inwardly curved along the primary side opening or the secondary side opening. The electronic device of claim 4, wherein the vertical projection areas of the first core member and the second core member on the first plane cover a vertical projection area of the winding on the first plane, wherein The first core member or the second core member has a recess having an overlapping portion with a vertical projection area of the winding on the first plane, at least a portion of the first circuit module or the At least a portion of the second circuit module is received in the recess. The electronic device according to claim 4, wherein both ends of the primary winding are coupled to the first circuit module through a primary output, and the primary output includes a primary inner layer a line, a primary side outlet hole and a primary outer layer outlet line, wherein the primary side inner layer outlet line is electrically connected to the primary side outer layer outlet line through the primary side outlet hole; both ends of the secondary side winding Each of the secondary side outlets is coupled to the second circuit module, and the secondary side outlet line includes a pair of inner side outlet lines, a pair of side outlet lines, and a pair of outer side outlet lines, wherein the secondary side The inner layer outlet line is electrically connected to the secondary outer layer outlet line through the secondary side outlet hole. The electronic device according to claim 17, characterized in that: The primary side outlet hole is disposed in a region between the primary winding and the magnetic core post, a region of the primary winding or an outer region of the primary winding; the secondary outlet hole is disposed in the secondary winding A region between the magnetic core legs, a region of the secondary winding, or an outer region of the secondary winding. The electronic device of claim 18, wherein when the primary side outlet hole is disposed in an outer region of the primary winding, the leakage sensitive component of the first circuit module is disposed on the primary side The outlet hole is adjacent to a side of the magnetic core column; when the secondary side outlet hole is disposed at an outer region of the secondary winding, the leakage sensitive component of the second circuit module is disposed on the secondary side The line hole is adjacent to one side of the magnetic core column. The electronic device according to claim 2, wherein the winding is a planar winding formed by a PCB winding or a circular wire. The electronic device of claim 2, wherein the electronic device is a flyback converter. The electronic device of claim 2, wherein the second circuit module is a rectifier circuit module. The electronic device of claim 1, wherein at least one of the first circuit module and the second circuit module is corresponding to The winding constitutes an alternating current loop, wherein an area of the vertical projection area of the alternating current loop on the first plane and a vertical projection area of all loops on the same magnetic core column coupled to the first core plane in the first core plane The ratio of the areas of the overlapping portions ranges from 1 to 1.2. The electronic device of claim 1, wherein the first winding is a primary winding, the first circuit module and the primary winding form an AC loop, wherein the AC loop is on the first plane The ratio of the area of the vertical projection area to the area of the overlapping portion of the vertical projection area of all the loops on the same magnetic core coupled to the core group in the core group ranges from 1 to 1.2. The electronic device of claim 1, wherein the second winding is a secondary winding, the second circuit module and the secondary winding form an AC circuit, wherein the AC circuit is on the first plane The ratio of the area of the vertical projection area to the area of the overlapping portion of the vertical projection area of all the loops on the same magnetic core coupled to the core group in the core group ranges from 1 to 1.2. The electronic device of claim 25, wherein the second circuit module is a rectifier circuit module. The electronic device according to claim 26, wherein the secondary winding comprises a first secondary winding portion and a second secondary winding portion, and The rectifier circuit module includes: a first switch module; a first capacitor module coupled to the first switch module and the first switch module, and the first switch module and the first The capacitor module is disposed on the upper surface of the first secondary winding portion; a second switching module; and a second capacitor module coupled to the second switching module and coupled to the second secondary winding portion, and The second switch module and the second capacitor module are disposed on a lower surface of the second secondary winding portion. The electronic device of claim 26, wherein the secondary winding comprises a first secondary winding portion and a second secondary winding portion, and the rectifier circuit module comprises: a first switching module, The first sub-side winding portion is coupled to the first sub-side winding portion, and the first switch module is disposed on the upper surface of the first sub-side winding portion; and a second The switch module is disposed on the lower surface of the second secondary winding portion, and the second switch module is coupled to the capacitor module through a via. The electronic device of claim 28, wherein the first switch module, the second switch module or the capacitor module is disposed inside a PCB. An electronic device according to claim 27, characterized in that The first switch module, the first capacitor module, the second switch module or the second capacitor module are disposed inside a PCB. The electronic device of claim 27 or 28, wherein the first switch module or the second switch module is a chip, and the chip is disposed inside a PCB board. The electronic device according to claim 27 or 28, wherein the capacitor module is formed by doping a dielectric material on a substrate of a PCB. The electronic device of claim 23, wherein the magnetic core group and the first circuit module or the second circuit module have overlapping portions in a vertical projection area on the first plane. The electronic device according to claim 33, wherein the magnetic core group comprises a first core member and a second core member corresponding thereto, the first core member having a magnetic core column and a core a magnetic core cover, a first side pillar, a second side pillar, a primary side opening and a side opening, the primary side opening and the secondary side opening being located at the first side pillar, the second The two ends of the side column are assembled between the first core member and the second core member and sleeved on the magnetic core column. An electronic device according to claim 34, characterized in that The primary side opening and the secondary side opening are asymmetric with respect to the magnetic core post, and the width of the first or second circuit module disposed between the primary side opening and the secondary side opening is larger By. The electronic device of claim 34, wherein the second core member falls vertically in the first plane of the core cover of the first core member in a vertical projection region of the first plane Projection area. The electronic device of claim 36, wherein the thickness of the second core member is greater than the thickness of the core cover of the first core member. The electronic device according to claim 34, wherein the first core member and the second core member are recessed along the primary side opening or the secondary side opening, and the first circuit At least a portion of the module or at least a portion of the second circuit module is disposed in the recessed arcuate region. The electronic device of claim 34, wherein the magnetic core group further comprises a receiving portion for receiving the first circuit module or the second circuit module. The electronic device according to claim 39, wherein the receiving portion is a groove, the groove is disposed on the first core member or the second core member, and the first circuit module is at least Part or the second circuit At least a portion of the module is received within the recess. The electronic device according to claim 39, wherein the receiving portion is disposed on a side of the magnetic core column adjacent to the first circuit module or the second circuit module. The electronic device according to claim 41, wherein the magnetic core column has a first diameter and a second diameter, wherein the second diameter is smaller than the first diameter, and the receiving portion is disposed on the magnetic core column One side of the direction of the second diameter. The electronic device of claim 39, wherein the receiving portion is disposed on a side of the first side pillar or the second side pillar adjacent to the first circuit module or one of the second circuit modules side. The electronic device of claim 43, wherein the width of the first side pillar is smaller than the width of the second side pillar, and the receiving portion is disposed on the first side pillar adjacent to the first circuit module. Side or side of the second circuit module. The electronic device according to claim 33, wherein the magnetic core group further comprises a first core cover, a second core cover and a plurality of magnetic cores, and the magnetic cores The first core cover is coupled to the second core cover to form a closed magnetic path. The electronic device of claim 33, wherein the core set further comprises: a first core cover; a second core cover; and a plurality of side legs surrounding the core set A magnetic core column is disposed, wherein the side pillars are connected to the first core cover and the second core cover to form a plurality of side openings. The electronic device according to claim 23, wherein the magnetic core group comprises an EQ type magnetic core, a U-shaped magnetic core, an EE type magnetic core, an EI type magnetic core, an EFD type magnetic core, and a RM core, a can core or a PJ core. The electronic device according to claim 47, wherein the shape of a cross section of the U-shaped magnetic core comprises a circular shape, a racetrack shape, a rectangular shape, a curved rectangular shape or an elliptical shape. The electronic device of claim 1, wherein the second circuit module comprises: a first bridge arm, comprising a first switch module and a second switch module, wherein the first switch module includes a first One end and a second end, the second switch module includes a first end and a second end, and the second end of the first switch module is coupled to the first end of the second switch module On the second winding a second bridge arm includes a third switch module and a fourth switch module, wherein the third switch module includes a first end and a second end, the fourth switch mode The first end and the second end of the third switch module are coupled to the first end of the first switch module, and the second end of the third switch module is coupled Connected to a second end of the second winding, the first end of the fourth switch module is coupled to the second end of the third switch module, and the second end of the fourth switch module The second end of the second switch module is coupled to the second end of the fourth switch module; and a capacitor module is coupled between the first end of the third switch module and the second end of the fourth switch module. The electronic device of claim 23, wherein the second circuit module comprises: a first bridge arm, comprising a first switch module and a second switch module, wherein the first switch module includes a first The second switch module includes a first end and a second end, and the second end of the first switch module is coupled to the first end of the second switch module a first end of the second winding; a second bridge arm comprising a third switch module and a fourth switch module, wherein the third switch module includes a first end and a second end, The fourth switch module includes a first end and a second end, the first end of the third switch module is coupled to the first end of the first switch module, and the third switch module The second end is coupled to a second end of the second winding, the fourth opening The first end of the second switch module is coupled to the second end of the third switch module, and the second end of the fourth switch module is coupled to the second end of the second switch module; And a capacitor module coupled between the first end of the third switch module and the second end of the fourth switch module. The electronic device of claim 49 or 50, wherein the capacitor module includes a first capacitor and a second capacitor, wherein the first switch module, the fourth switch module, and the first capacitor are disposed in the The second winding is adjacent to a first side of a magnetic core column, and the second switching module, the third switching module and the second capacitor are disposed on the second winding with respect to a second side of the first side side. The electronic device of claim 51, wherein the first switch module and the second switch module are disposed on a first surface of the second winding, and the third switch module and the fourth switch module are disposed And the first surface or a second surface of the second winding. The electronic device of claim 49 or 50, wherein the first switch module and the third switch module are disposed on the first side of the second winding adjacent to a magnetic core column, the second switch module And the fourth switch module is disposed on the second side of the second winding relative to the first side. The electronic device of claim 53, wherein the first switch mode The third switch module is disposed on a first surface of the second winding, and the second switch module and the fourth switch module are disposed on the first surface or a second surface of the second winding. The electronic device of claim 49 or 50, wherein the first switch module and the fourth switch module are disposed on a first surface of the second winding, and the second switch module and the third switch The module is disposed on a second surface of the second winding. The electronic device of claim 55, wherein the capacitor module comprises at least one capacitor, and when the at least one capacitor is disposed on the first surface, the at least one capacitor is coupled to the second switch module through a via The third switch module, when the at least one capacitor is disposed on the second surface, the at least one capacitor is coupled to the first switch module and the fourth switch module through the via. The electronic device of claim 49 or 50, wherein the capacitor module is disposed on a first surface or a second surface of the second winding. The electronic device of claim 49 or 50, wherein the capacitor module is further disposed to traverse the second winding when the second winding is a plurality of parallel winding portions or a single winding portion. The electronic device of claim 4, wherein the edge of the first circuit module or the second circuit module and the magnetic core column, the first There is a plurality of distances between either side of the side post or the second side leg, and a minimum of the distances is less than 2 mm. An electronic device comprising: a magnetic component comprising a magnetic core group and a winding, the winding being assembled on the magnetic core group; and a first circuit module coupled to the winding of the magnetic component; wherein The first circuit module and the magnetic core group of the magnetic element have an overlapping portion in a vertical projection area on a first plane, the first plane being a plane in a horizontal direction of the winding. The electronic device of claim 60, wherein the magnetic core group comprises a first core component and a second core component corresponding thereto, the first core component having a magnetic core post and a magnetic core cover a plate, the winding is sleeved on the magnetic core column. The electronic device of claim 61, wherein the first core member comprises at least one side post disposed about the core post to form at least one side opening. The electronic device of claim 62, wherein the first circuit module is disposed on the at least one side opening. The electronic device of claim 63, wherein the second magnetic core a vertical projection area of the component on the first plane falls into a vertical projection area of the first core component on the first plane, and the first circuit module and the first core component are on the first plane The vertical projection area has overlapping portions. The electronic device of claim 63, wherein the vertical projection area of the second core member on the first plane overlaps with the vertical projection area of the first core member on the first plane. The electronic device of claim 63, wherein the second core component comprises a core cover, wherein a thickness of the core cover of the second core component is greater than or equal to the first core component The thickness of the core cover. The electronic device of claim 61, wherein the first core member or the second core member has a recess in which at least a portion of the first circuit module is received. The electronic device of claim 61, wherein the first core member or the second core member has a stepped structure, at least a portion of the first circuit module being received in the stepped structure. The electronic device of claim 61, wherein the magnetic core column has a first diameter and a second diameter, wherein the second diameter is smaller than the first diameter, and the first circuit module is disposed on the magnetic core column The second diameter One side of the direction. The electronic device of claim 61, wherein the first core member comprises a first side pillar and a second side pillar, the first side pillar and the second side pillar form a first side opening and a first Two side openings. The electronic device of claim 70, wherein the width of the first side pillar is smaller than the width of the second side pillar, and the first circuit module is disposed on a side close to the first side pillar. The electronic device of claim 70, wherein the first side opening and the second side opening are asymmetrical with respect to the magnetic core post. The electronic device of claim 70, wherein the first side leg and the second side leg are asymmetrical with respect to the magnetic core leg. The electronic device of claim 73, wherein the length of the first side leg is greater than the length of the second side leg. The electronic device of claim 70, wherein the first core member or the second core member is inwardly curved along the first side opening or the second side opening. The electronic device of claim 61, wherein the magnetic core package The invention comprises an EQ core, a U core, an EE core, an EI core, an EFD core, a RM core, a can core or a PJ core. The electronic device of claim 76, wherein the shape of a section of the U-shaped core comprises a circle, a racetrack shape, a rectangle, a lead rectangle or an ellipse. The electronic device of claim 61, wherein the two ends of the winding are coupled to the first circuit module through an outgoing line, the outgoing line includes an inner layer outgoing line, an outgoing line hole and an outer outer line. The inner layer outlet is electrically connected to the outer layer outlet line through the outlet hole. The electronic device of claim 78, wherein the outlet aperture is disposed in a region between the winding and the magnetic core post, a region of the winding, or an outer region of the winding. The electronic device of claim 79, wherein when the outlet hole is disposed in an outer region of the winding, the leakage sensitive component of the first circuit module is disposed in the outlet hole near the magnetic core column One side. The electronic device of claim 60, wherein the electronic device further comprises a second circuit module, and the second circuit module is a rectifier circuit a module, and the winding includes a first winding and a second winding. The electronic device of claim 81, wherein the second winding is a secondary winding, the secondary winding includes a first secondary winding portion and a second secondary winding portion, and the rectifier circuit module comprises: a first switch module, a first capacitor module coupled to the first switch module, and the first switch module and the first capacitor module are disposed on the first capacitor module An upper surface of the side winding portion; a second switching module; and a second capacitor module coupled to the second switching module and the second switching module, and the second switching module The second capacitor module is disposed on a lower surface of the second secondary winding portion. The electronic device of claim 81, wherein the second winding is a secondary winding, the secondary winding includes a first secondary winding portion and a second secondary winding portion, and the rectifier circuit module comprises: a first switching module is coupled to the first secondary winding portion; a capacitor module coupled to the first switching module, and the first switching module is disposed on the first secondary winding portion The second switch module is disposed on the lower surface of the second secondary winding portion, and the second switch module is coupled to the capacitor module through a via. The electronic device of claim 60, wherein the first circuit The module includes: a first bridge arm, including a first switch module and a second switch module, wherein the first switch module includes a first end and a second end, and the second switch module includes a first end and a second end, the second end of the first switch module and the first end of the second switch module are coupled to a first end of the winding; a second bridge arm, The third switch module includes a first end and a second end, and the fourth switch module includes a first end and a second end. The first end of the third switch module is coupled to the first end of the first switch module, and the second end of the third switch module is coupled to a second end of the winding. The first end of the fourth switch module is coupled to the second end of the third switch module, and the second end of the fourth switch module is coupled to the second end of the second switch module And a capacitor module coupled between the first end of the third switch module and the second end of the fourth switch module. The electronic device of claim 84, wherein the capacitor module comprises a first capacitor and a second capacitor, wherein the first switch module, the fourth switch module and the first capacitor are disposed adjacent to the winding The second switch module, the third switch module and the second capacitor are disposed on a second side of the winding relative to the first side. The electronic device of claim 85, wherein the first switch The module and the second switch module are disposed on a first surface of the winding, and the third switch module and the fourth switch module are disposed on the first surface or a second surface of the winding. The electronic device of claim 84, wherein the first switch module and the third switch module are disposed on the first side of the winding adjacent to a magnetic core post, the second switch module and the fourth The switch module is disposed on the winding on a second side of the first side. The electronic device of claim 87, wherein the first switch module and the third switch module are disposed on a first surface of the winding, and the second switch module and the fourth switch module are disposed on the first switch module The first surface or a second surface of the winding. The electronic device of claim 84, wherein the first switch module and the fourth switch module are disposed on a first surface of the winding, and the second switch module and the third switch module are disposed on the first switch module a second surface of the winding. The electronic device of claim 89, wherein the capacitor module comprises at least one capacitor, and when the at least one capacitor is disposed on the first surface, the at least one capacitor is coupled to the second switch module through a via The third switch module, when the at least one capacitor is disposed on the second surface, the at least one capacitor is coupled to the first switch module and the fourth switch module through the via. The electronic device of claim 84, wherein the capacitor module is disposed on a first surface or a second surface of the winding. The electronic device of claim 84, wherein the capacitor module is further disposed to traverse the winding when the winding is a plurality of parallel winding portions or a single winding portion. The electronic device of claim 61, wherein the magnetic core group further comprises: a first magnetic core cover; a second magnetic core cover; and a plurality of side posts surrounding a magnetic core in the magnetic core group And a column arrangement, wherein the side pillars are connected to the first core cover and the second core cover to form a plurality of side openings. The electronic device of claim 62, wherein a distance between any edge of the first circuit module and either edge of the magnetic core post or the at least one side pillar, a minimum of the distances Less than 2 mm. The electronic device of any one of claims 60 to 94, wherein the first circuit module and the winding form an alternating current loop, wherein an area and a coupling of a vertical projection area of the alternating current loop on the first plane All circuits on the same magnetic core column in the core group are on the first plane The ratio of the areas of the overlapping portions of the vertical projection regions ranges from 1 to 1.2.