KR20020083273A - Anti-bacteria material sheet for manufacturing cooling pin of heat exchanger and fabrication method thereof - Google Patents

Anti-bacteria material sheet for manufacturing cooling pin of heat exchanger and fabrication method thereof Download PDF

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KR20020083273A
KR20020083273A KR1020010022707A KR20010022707A KR20020083273A KR 20020083273 A KR20020083273 A KR 20020083273A KR 1020010022707 A KR1020010022707 A KR 1020010022707A KR 20010022707 A KR20010022707 A KR 20010022707A KR 20020083273 A KR20020083273 A KR 20020083273A
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deposited
polymer layer
copper film
heat exchanger
manufacturing
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KR1020010022707A
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Korean (ko)
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KR100400398B1 (en
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하삼철
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주식회사 엘지이아이
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments

Abstract

PURPOSE: An antibacterial sheet material for manufacturing radiating pin of heat exchanger is provided which is suitable for preventing generation of malodor during operation of an air conditioner by suppressing parasitism of bacteria on a hydrophilic thin film deposited on the radiating pin, and a manufacturing method thereof is provided. CONSTITUTION: The antibacterial sheet material for manufacturing radiating pin of heat exchanger comprises a polymer layer(12) that is deposited on the surface of a metal sheet material(11) to increase hydrophilicity; a copper film(13) that is deposited on the surface of the polymer layer to restrain propagation of bacteria; and an activation layer(14) that is deposited on the surface of the copper film to increase the initial hydrophilicity, wherein the copper film is deposited on the surface of the polymer layer by sputtering in a deposition chamber equipped with a copper electrode. The manufacturing method of the antibacterial sheet material for manufacturing radiating pin of heat exchanger comprises the steps of depositing a polymer layer on the surface of a metallic material by plasma treatment; forming a copper film for restraining propagation of bacteria on the surface of the polymer layer by plasma treating the polymer layer deposited material; and forming an activation layer for increasing the initial hydrophilicity on the surface of the copper film by plasma treating the copper film formed material.

Description

열교환기 방열핀 제조용 항균판재 및 그 제조방법{ANTI-BACTERIA MATERIAL SHEET FOR MANUFACTURING COOLING PIN OF HEAT EXCHANGER AND FABRICATION METHOD THEREOF}Antibacterial plate material for heat radiation fins for heat exchanger and its manufacturing method {ANTI-BACTERIA MATERIAL SHEET FOR MANUFACTURING COOLING PIN OF HEAT EXCHANGER AND FABRICATION METHOD THEREOF}

본 발명은 열교환기 방열핀 제조용 항균판재 및 그 제조방법에 관한 것으로, 특히 열교환기의 방열핀을 제조하는 소재의 표면에 항균특성을 가진 동(Cu)막을 형성하여 열교환기가 장착되는 공조기의 사용시 악취를 발생시키는 알데히드류의 세균이 방열핀에 서식하는 것을 저지할 수 있도록 하는데 적합한 열교환기 방열핀 제조용 항균판재 및 그 제조방법에 관한 것이다.The present invention relates to an antimicrobial plate material for producing heat dissipation fins and a method of manufacturing the same, in particular, by forming a copper (Cu) film having antimicrobial properties on the surface of the material for producing the heat dissipation fins of the heat exchanger to generate odor when using an air conditioner equipped with heat exchanger. The present invention relates to an antimicrobial plate material for producing a heat exchanger heat sink fin suitable for preventing bacteria of aldehydes from inhabiting a heat sink fin and a method of manufacturing the same.

공조기용 방열핀의 소재는 친수성을 향상시키기 위한 표면처리를 실시하며, 이와 같이 표면처리를 하는 종래의 한 방법으로 습식 코팅법이 소개되고 있다.The material of the heat radiation fin for the air conditioner is subjected to a surface treatment to improve the hydrophilicity, and a wet coating method has been introduced as a conventional method of surface treatment.

이러한 습식 코팅법은 생산라인에서 소재에 친수성 막을 습식에 의하여 코팅하는 PCM(PRECOATED METAL)법으로, 이와 같이 습식에 의하여 친수처리된 소재를 이용하여 열교환기의 방열핀을 제조하는 경우에는 습기나 수분에 지속적으로 노출되면 유기물 분해균인 '슈도모나스'(PSEUDOMONAS)속이 성장하고, 이렇게 발생한 세균은 부산물로 알데히드류를 배출하여 악취발생 및 실내환경위생을 해치는 문제점이 있었다.This wet coating method is a PCM (PRECOATED METAL) method of wet coating a hydrophilic membrane on a material in a production line. When manufacturing a heat dissipation fin of a heat exchanger using a wet hydrophilic material as described above, If exposed continuously, the genus Pseudomonas (PSEUDOMONAS) grows, and the resulting bacteria emit aldehydes as a by-product, which causes the bad smell and indoor environmental hygiene.

최근에는 방열핀 소재의 친수처리 방법으로, 플라즈마를 이용한 다양한 기능성 표면개질기술이 연구되고 있는데, 이러한 플라즈마를 이용한 친수처리 방법은 저온에서 접착성이 좋은 친수성 박막을 얻을 수 있다는 점에서 습식 코팅법을 대체할 수 있는 기술로 연구자들의 연구가 지속적으로 이루어질 전망이다.Recently, various functional surface modification techniques using plasma have been studied as a hydrophilic treatment method of a heat radiating fin material. The hydrophilic treatment method using plasma replaces the wet coating method in that a hydrophilic thin film having good adhesion at low temperatures can be obtained. Researchers will continue to study the technology that can be used.

도 1은 플라즈마에 의한 친수성 박막이 증착된 일예를 보인 것으로, 도시된 바와 같이, 공조기의 방열핀 소재(1)의 표면에 플라즈마 처리에 의하여 중합 고분자층(2)이 형성되어 있고, 그 중합고분자 층(2)의 표면에 초기 친수성을 증대시키기 위한 활성화층(3)이 형성되어 있다.1 shows an example in which a hydrophilic thin film is deposited by plasma. As shown in FIG. 1, a polymer polymer layer 2 is formed on a surface of a heat radiation fin material 1 of an air conditioner by plasma treatment, and the polymer polymer layer is formed. The activation layer 3 for increasing initial hydrophilicity is formed in the surface of (2).

그런데, 이와 같이 중합 고분자 층(2)이 형성되는 공조기 방열핀 소재 역시 습기나 수분에 지속적으로 노출되는 경우에 세균의 점착 및 성장이 이루어져서 악취를 발생시키는 문제점이 있었다.However, the air conditioner heat radiation fin material in which the polymerized polymer layer 2 is formed also has a problem of generating odor due to adhesion and growth of bacteria when continuously exposed to moisture or moisture.

본 발명은 상기와 같은 문제점을 감안하여 안출된 것으로, 공조기의 방열핀 소재에 증착되어 있는 친수성 박막에 세균이 기생하는 것을 억제하여 공조기의 가동시 악취가 발생되는 것을 방지하도록 하는데 적합한 열교환기 방열핀 제조용 항균판재 및 그 제조방법을 제공함에 있다.The present invention has been made in view of the above problems, antibacterial heat exchanger fins suitable for preventing the occurrence of odor during operation of the air conditioner by suppressing the parasitic bacteria on the hydrophilic thin film deposited on the heat radiation fin material of the air conditioner It is to provide a plate and a method of manufacturing the same.

도 1은 종래 표면개질된 방열핀 소재의 단면도.1 is a cross-sectional view of a conventional surface modified heat radiation fin material.

도 2는 본 발명에 따른 열교환기 방열핀 제조용 항균판재의 단면도.Figure 2 is a cross-sectional view of the antimicrobial plate for producing a heat exchanger heat sink fin according to the present invention.

도 3은 본 발명에 따른 항균판재를 제조하기 위한 증착장치를 개략적으로 보인 단면도.Figure 3 is a schematic cross-sectional view showing a deposition apparatus for producing an antibacterial plate according to the present invention.

** 도면의 주요 부분에 대한 부호의 설명 **** Description of symbols for the main parts of the drawing **

11 : 소재12 : 중합 고분자층11: Material 12: Polymeric polymer layer

13 : 동 막14 : 활성화층13 copper film 14 active layer

26 : 동 전극26: copper electrode

상기와 같은 본 발명의 목적을 달성하기 위하여 금속판체인 소재의 표면에 친수성을 증대시키기 위한 중합고분자층이 증착되어 있고, 그 중합고분자층의 표면에 세균의 번식을 억제하기 위한 동막이 증착되어 있으며, 그 항균층의 표면에 초기 친수성을 증대시키기 위한 활성화층이 증착되어서 이루어진 열교환기 방열핀 제조용 항균판재가 제공된다.In order to achieve the object of the present invention as described above, a polymerized polymer layer for increasing hydrophilicity is deposited on the surface of a metal plate material, and a copper film for suppressing propagation of bacteria is deposited on the surface of the polymerized polymer layer. Provided is an antibacterial plate material for manufacturing a heat exchanger heat sink fin formed by depositing an activation layer for increasing initial hydrophilicity on the surface of the antibacterial layer.

또한, 금속 소재의 표면에 플라즈마 처리를 하여 중합고분자층을 증착시키는 단계와, 그 중합고분자층이 증착된 소재를 플라즈마 처리하여 중합고분자층의 표면에 세균의 번식을 억제하기 위한 동막을 증착시키는 단계와, 그 동막이 형성된 소재를 플라즈마 처리하여 동막의 표면에 초기 친수성을 증대시키기 위한 활성화층을 형성하는 단계를 순차적으로 진행하는 것을 특징으로 하는 열교환기 방열핀 제조용 항균판재의 제조방법이 제공된다.In addition, the step of depositing the polymerized polymer layer by plasma treatment on the surface of the metal material, and the step of depositing a copper film for inhibiting the growth of bacteria on the surface of the polymerized polymer layer by plasma treatment of the material on which the polymerized polymer layer is deposited And a step of sequentially forming the active layer for increasing initial hydrophilicity on the surface of the copper film by plasma-processing the material on which the copper film is formed is provided.

이하, 상기와 같은 본 발명 열교환기 방열핀 제조용 항균판재 및 그 제조방법을 첨부된 도면의 실시예를 참고하여 보다 상세히 설명하면 다음과 같다.Hereinafter, with reference to the embodiment of the accompanying drawings, the antimicrobial plate material and the method of manufacturing the heat exchanger heat dissipation fin as described above in more detail as follows.

도 2는 본 발명 열교환기 방열핀 제조용 항균판재의 실시예를 보인 단면도로서, 도시된 바와 같이, 일정 면적과 두께를 갖는 알루미늄 판체인 소재(11)의 표면에 중합 고분자 층(12)이 증착되어 있고, 그 중합고분자 층(12)의 표면에는 중합고분자 층(12)에 기생하는 세균의 번식을 억제할 수 있도록 동(Cu)막(13)이 형성되어 있으며, 그 동막(13)의 표면은 플라즈마 처리를 하여 초기 친수성을 증대시킬 수 있도록 활성화층(14)이 형성되어 있다.2 is a cross-sectional view showing an embodiment of the antimicrobial plate material for manufacturing a heat exchanger heat dissipation fin of the present invention, as shown, the polymer layer 12 is deposited on the surface of the aluminum plate body material 11 having a predetermined area and thickness, On the surface of the polymerized polymer layer 12, a copper (Cu) film 13 is formed so as to suppress propagation of bacteria parasitic in the polymerized polymer layer 12, and the surface of the copper polymer 13 is plasma The activation layer 14 is formed so that a process may increase initial hydrophilicity.

이와 같이 구성되어 있는 본 발명 열교환기 방열핀 제조용 항균판재는 도 3같은 연속증착장치(20)에서 소재(11)에 고분자 층(12)과 동막(13)을 연속적으로 증착시킨다.The antimicrobial plate material for heat exchanger heat dissipation fin manufacturing of the present invention configured as described above continuously deposits the polymer layer 12 and the copper film 13 on the material 11 in the continuous deposition apparatus 20 of FIG. 3.

즉, 언와인더(21)에서 고분자 증착챔버(22)로 공급되는 알루미늄 시트 상태의 소재(11)가 고분자 증착챔버(22)와 동 스퍼터링 챔버(23)를 지나 와인더(24)에 연속적으로 권취되도록 한다.That is, the material 11 in an aluminum sheet state supplied from the unwinder 21 to the polymer deposition chamber 22 is continuously passed through the polymer deposition chamber 22 and the copper sputtering chamber 23 to the winder 24. Allow it to be wound.

그와 같은 상태에서 고분자 증착챔버(22)의 내부에 탄화수소계 가스와 비반응가스를 공급함과 아울러 전극(25)에 전원을 공급하면 챔버(22)의 내부에 플라즈마가 발생되며 소재(11)의 표면에 중합고분자 층(12)이 증착된다.In such a state, when the hydrocarbon-based gas and the non-reactive gas are supplied to the inside of the polymer deposition chamber 22, and the power is supplied to the electrode 25, plasma is generated inside the chamber 22 and the material 11 is formed. The polymerized polymer layer 12 is deposited on the surface.

그와 같이 중합고분자 층(12)이 증착된 소재(11)는 연속적으로 동 스퍼터링 챔버(23)를 지나게 되는데, 이때 챔버(23)의 내부로 반응가스를 주입하는 상태에서 동전극(26)에 전원을 인가하면 플라즈마가 발생되며 스퍼터링에 의하여 동입자가 동전극(26)에서 떨어져서 소재(11)의 표면에 증착이 이루어진다.As such, the material 11 having the polymerized polymer layer 12 deposited thereon continuously passes through the copper sputtering chamber 23, in which the reaction gas is injected into the chamber 26 in the state of injecting the reaction gas into the chamber 23. When power is applied, plasma is generated, and copper particles are separated from the coin electrode 26 by sputtering, and deposition is performed on the surface of the material 11.

상기와 같은 상태에서, 동막(13)이 형성된 소재(11)를 다시 플라즈마 처리를 위한 별도의 공정 챔버 내부에 넣고, 비반응가스를 공정 챔버의 내부로 주입하는 상태에서 소재(11)와 전극에 전원을 인가하여 플라즈마를 발생시킴으로써, 동막(13)의 표면에 초기 친수성을 향상시키기 위한 활성화층(14)이 형성되어 진다.In the above state, the material 11 on which the copper film 13 is formed is put back into a separate process chamber for plasma treatment, and the non-reacted gas is injected into the process chamber to the material 11 and the electrode. By applying a power source to generate plasma, an activation layer 14 for improving initial hydrophilicity is formed on the surface of the copper film 13.

이상에서 상세히 설명한 바와 같이, 본 발명 열교환기 방열핀 제조용 항균판재 및 그 제조방법에 의하면 소재에 친수성을 향상시키기 위하여 증착된 중합 고분자 층의 표면에 동 막을 형성시켜서, 공조기의 사용시 습기나 수분에 지속적으로 노출되어 중합고분자 층에 발생되는 세균의 번식이 동 막에 의하여 억제되도록 함으로써, 세균번식에 따른 악취발생을 방지하는 효과가 있다.As described in detail above, according to the present invention, the antimicrobial plate material for heat dissipation fins and the method of manufacturing the same are used to form a copper film on the surface of the polymerized polymer layer deposited in order to improve hydrophilicity of the material, thereby continuously maintaining moisture and moisture when using the air conditioner. By suppressing the propagation of bacteria generated in the polymerized polymer layer exposed by the copper membrane, there is an effect of preventing the generation of odor due to bacterial propagation.

Claims (3)

금속판체인 소재의 표면에 친수성을 증대시키기 위한 중합고분자막이 증착되어 있고, 그 중합고분자 층의 표면에 세균의 번식을 억제하기 위한 동 막이 증착되어 있으며, 그 동 막의 표면에 초기 친수성을 증대시키기 위한 활성화층이 증착되어서 이루어진 열교환기 방열핀 제조용 항균판재.A polymerized polymer film is deposited on the surface of the metal plate material to increase hydrophilicity, and a copper film is deposited on the surface of the polymerized polymer layer to suppress the propagation of bacteria. Antibacterial plate material for manufacturing heat exchanger heat sink fins by depositing layers. 금속 소재의 표면에 플라즈마 처리를 하여 중합고분자막을 증착시키는 단계와, 그 중합고분자 층이 증착된 소재를 플라즈마 처리하여 중합고분자 층의 표면에 세균의 번식을 억제하기 위한 동 막을 형성하는 단계와, 그 동 막이 형성된 소재를 플라즈마 처리하여 동 막의 표면에 초기 친수성을 증대시키기 위한 활성화층을 형성하는 단계를 순차적으로 진행하는 것을 특징으로 하는 열교환기 방열핀 제조용 항균판재의 제조방법.Plasma treatment of the surface of the metal material to deposit a polymerized polymer film; plasma treatment of the material on which the polymerized polymer layer is deposited to form a copper film on the surface of the polymerized polymer layer to suppress bacterial growth; Plasma-processing the material on which the copper film is formed to form an activation layer for increasing initial hydrophilicity on the surface of the copper film, characterized in that the step of sequentially proceeding to produce an antimicrobial plate material for producing a heat-radiating heat sink fin. 제 1항에 있어서, 상기 동 막은 동 전극이 구비된 증착챔버에서 스퍼터링에 의하여 증착되는 것을 특징으로 하는 열교환기 방열핀 제조용 항균판재의 제조방법.The method of claim 1, wherein the copper film is deposited by sputtering in a deposition chamber equipped with a copper electrode.
KR10-2001-0022707A 2001-04-26 2001-04-26 Anti-bacteria material sheet for manufacturing cooling pin of heat exchanger and fabrication method thereof KR100400398B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030067357A (en) * 2002-02-08 2003-08-14 엘지전자 주식회사 Air conditioner evaporator offer method for using the inorganic antibaterial agency
WO2005098076A1 (en) * 2004-04-06 2005-10-20 Lg Electronics, Inc. Ultra-hydrophilic and antibacterial thin film coated metal product, and it’s manufacturing method
CN110438455A (en) * 2018-05-02 2019-11-12 南京理工大学 The preparation method of polylactic acid base Ciprofloxacin antibacterial film

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030067357A (en) * 2002-02-08 2003-08-14 엘지전자 주식회사 Air conditioner evaporator offer method for using the inorganic antibaterial agency
WO2005098076A1 (en) * 2004-04-06 2005-10-20 Lg Electronics, Inc. Ultra-hydrophilic and antibacterial thin film coated metal product, and it’s manufacturing method
US7901786B2 (en) 2004-04-06 2011-03-08 Lg Electronics, Inc. Method for manufacturing ultra-hydrophilic thin film coated metal product, and ultra-hydrophilic thin film coated metal product
US8043710B2 (en) 2004-04-06 2011-10-25 Lg Electronics Inc. Ultra-hydrophilic and antibacterial thin film coated metal product, and it's manufacturing method
CN110438455A (en) * 2018-05-02 2019-11-12 南京理工大学 The preparation method of polylactic acid base Ciprofloxacin antibacterial film

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