KR20020080067A - OELD with a multi-sealing layer and a manufacturing method thereof - Google Patents
OELD with a multi-sealing layer and a manufacturing method thereof Download PDFInfo
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- KR20020080067A KR20020080067A KR1020010019205A KR20010019205A KR20020080067A KR 20020080067 A KR20020080067 A KR 20020080067A KR 1020010019205 A KR1020010019205 A KR 1020010019205A KR 20010019205 A KR20010019205 A KR 20010019205A KR 20020080067 A KR20020080067 A KR 20020080067A
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- glass substrate
- light emitting
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 238000007789 sealing Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000011521 glass Substances 0.000 claims abstract description 25
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 10
- 239000003960 organic solvent Substances 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000001301 oxygen Substances 0.000 claims abstract description 9
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 24
- 238000002161 passivation Methods 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 238000010521 absorption reaction Methods 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 4
- 229910010272 inorganic material Inorganic materials 0.000 claims description 4
- 239000011147 inorganic material Substances 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011368 organic material Substances 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 2
- 239000010419 fine particle Substances 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 9
- 238000004020 luminiscence type Methods 0.000 abstract description 5
- 239000010409 thin film Substances 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 238000005401 electroluminescence Methods 0.000 abstract description 2
- 230000035515 penetration Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 65
- 230000008569 process Effects 0.000 description 12
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000002745 absorbent Effects 0.000 description 3
- 239000002250 absorbent Substances 0.000 description 3
- 239000003463 adsorbent Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 229910004205 SiNX Inorganic materials 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- UBXAKNTVXQMEAG-UHFFFAOYSA-L strontium sulfate Chemical compound [Sr+2].[O-]S([O-])(=O)=O UBXAKNTVXQMEAG-UHFFFAOYSA-L 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004965 Silica aerogel Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910001570 bauxite Inorganic materials 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 230000000415 inactivating effect Effects 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
본 발명은 외부로부터 수분이 침투되지 못하도록 유기 EL소자의 유리 기판 및 유기발광층의 상부에 복수의 박막층(THIN FILM)을 형성하여 유기 EL소자가 밀봉되도록 한 복수의 밀봉층을 가지는 유기 전계발광 표시소자 및 그 제조 방법에 관한 것이다.The present invention provides an organic electroluminescence display device having a plurality of sealing layers formed by sealing a plurality of thin film layers (THIN FILM) on the glass substrate of the organic EL device and the organic light emitting layer so that moisture does not penetrate from the outside. And a method for producing the same.
도 1은 종래의 일반적인 유기 전계발광 표시소자의 공정을 보인 단면도이다.1 is a cross-sectional view showing a process of a conventional organic electroluminescent display device.
이에 도시한 바와 같이, 먼저 유리기판(1)의 상부에 양극전극으로 사용될 수 있는 투명전극(2)을 형성하고, 상기 투명전극(2)위에 인접하는 전극라인과의 분리를 위하여 역 사다리꼴로 형성된 음극 분리격벽(Cathod Separator)(3)을 형성하고, 그 상부에 발광물질이 포함된 유기막(4)을 증착한다.As shown in the drawing, first, a transparent electrode 2 which can be used as an anode electrode is formed on the glass substrate 1, and formed in an inverted trapezoid for separation from an electrode line adjacent to the transparent electrode 2. A cathode separator 3 is formed, and an organic layer 4 including a light emitting material is deposited on the cathode separator 3.
그리고 나서 상기 유기 발광층(4)의 상부에 음극전극(Cathod)(5)을 형성하고, 상기 음극전극(5)위에 외부에서 발생된 수분과 산소의 영향을 방지하기 위하여 밀봉층(Encapsulation)(6)이 형성되고, 마지막으로 상기 밀봉층(6)의 계면에 산소나 수분등을 흡습하기 위한 흡습층(7)이 형성된다.Then, a cathode electrode 5 is formed on the organic light emitting layer 4, and an encapsulation layer 6 is formed on the cathode electrode 5 to prevent the influence of moisture and oxygen generated from the outside. ) Is formed, and finally, a moisture absorbing layer 7 for absorbing oxygen, moisture, or the like is formed at the interface of the sealing layer 6.
이와 같이 구성된 유기 전계발광 표시소자는 발광 메카니즘의 특성상 외부로부터의 수분이 유입될 경우에 소자 수명의 단축이나 발광효율의 저하 및 발광색의 변질등과 같은 문제점이 발생한다. 그러므로 소자 내부로 수분이 침투되지 못하도록 소자를 외부로부터 격리하여 보호하는 밀봉처리(SEALING)하는 방법이 사용되어왔다.The organic electroluminescent display device configured as described above has problems such as shortening of device life, deterioration of luminous efficiency, and deterioration of emission color when moisture is introduced from the outside due to the nature of the light emitting mechanism. Therefore, a sealing method has been used to isolate and protect the device from the outside to prevent moisture from penetrating into the device.
상기 밀봉처리 방법은 캐소드(5)의 상부에 커버를 위치시키고 내부에 질소가스를 충진시킨 후 테두리를 에폭시와 같은 밀봉재로 캡슐봉함(CAPSULATION)하는 방법이 주종을 이루어 왔으나, 이러한 방법은 유리기판과 캡(CAP)의 밀착성이나 밀봉재 도포시의 정밀성을 도모하기가 쉽지 않을 뿐만 아니라, 유기 발광소자의 발광열이 유기 EL패널의 전도층으로 전달되어 소자의 열화 및 변질을 초래하는 문제점이 발생하였다.The sealing treatment method has been mainly made of a method of capturing the cap with a sealing material such as epoxy after placing the cover on the top of the cathode (5) and filling nitrogen gas therein, such a method and the glass substrate Not only is it difficult to achieve the adhesion of the CAP and the precision when the sealing material is applied, but also the heat of luminescence of the organic light emitting element is transferred to the conductive layer of the organic EL panel, resulting in deterioration and deterioration of the element.
이에 본 발명은 상기한 바와 같은 종래의 문제점을 해소시키기 위하여 창안된 것으로, 유리 기판 및 유기 발광층의 상부에 다층 박막(multi layer)을 형성하여 유기 EL 소자가 상기 다층 박막으로 밀봉(sealing)되도록 함으로써 외부로부터 유입되는 수분을 방지하고 유기 발광소자의 고온환경에 의한 소자 열화등을 극복할 수 있도록 하는 것을 목적으로 한다.Accordingly, the present invention was devised to solve the above-described problems, and by forming a multilayer on the glass substrate and the organic light emitting layer, the organic EL device is sealed with the multilayer thin film. An object of the present invention is to prevent moisture from flowing from the outside and to overcome device deterioration due to a high temperature environment of an organic light emitting device.
이러한 상기 목적을 달성하기 위한 본 발명의 복수의 밀봉층을 가지는 유기 전계발광 표시소자는, 양극전극인 투명전극과, 음극분리격벽, 발광층인 유기막, 음극전극인 캐소드가 순차적으로 형성되어 이루어진 유기 발광층 및 유리 기판(substrate)의 상부에 소수성(HYDORPHOBIC)의 무기물 다공성 미세분말이 포함된 용액으로 도포건조한 무기물층과 상기 무기물층의 상부에 유기 발광층 및 유기물에서 발생되는 산소 및 수분의 흡착을 위하여 형성된 흡습층과 상기 유리기판 상부의 유기발광층, 무기물층 및 흡습층을 외부와의 차단을 위해 불활성화 보호막으로 입힌 페시베이션층으로 이루어진다.An organic electroluminescent display device having a plurality of sealing layers of the present invention for achieving the above object is an organic organic light-emitting display device is formed by sequentially forming a transparent electrode as an anode electrode, a cathode separation barrier, an organic film as a light emitting layer, and a cathode as a cathode electrode. It is formed for the adsorption of oxygen and moisture generated from the organic light emitting layer and the organic material on the top of the light emitting layer and the glass substrate (hydrophobic (HYDORPHOBIC) inorganic porous fine powder on the upper substrate and the inorganic layer A moisture absorption layer and an organic light emitting layer, an inorganic material layer and a moisture absorption layer on the glass substrate are made of a passivation layer coated with an inactivation protective film to block the outside.
도 1 은 일반적인 유기 전계발광 표시소자의 공정을 보인 단면도.1 is a cross-sectional view showing a process of a general organic electroluminescent display device.
도 2 는 본 발명에 따라 유기 기판위에 유기발광층을 증착하는 공정을 보인 단면도.2 is a cross-sectional view showing a process of depositing an organic light emitting layer on an organic substrate according to the present invention.
도 3 은 본 발명에 따라 유기 발광층 및 유리기판위에 무기물층이 형성되는 공정을 보인 단면도.3 is a cross-sectional view illustrating a process of forming an inorganic layer on an organic light emitting layer and a glass substrate according to the present invention.
도 4 는 본 발명에 따라 무기물층위에 흡습층을 형성하는 공정을 보인 단면도.Figure 4 is a cross-sectional view showing a step of forming a moisture absorption layer on the inorganic layer in accordance with the present invention.
도 5 는 본 발명에 따라 유기 EL소자 전체를 페시베이션층으로 밀봉하는 공정을 보인 단면도.5 is a cross-sectional view showing a process of sealing the entire organic EL device with a passivation layer according to the present invention.
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
1 : 유리기판 2 : 투명전극1 glass substrate 2 transparent electrode
3 : 음극 전극 분리기 4 : 유기막3: cathode electrode separator 4: organic membrane
5 : 음극전극 6 : 밀봉층5 cathode electrode 6 sealing layer
7,17 : 흡습층 16 : 무기물층7, 17: moisture absorption layer 16: inorganic layer
18 : 페시베이션층18: passivation layer
이하 도 2 내지 도 5를 참조하여 본 발명에 따른 복수 밀봉층을 가지는 유기 전계발광 표시소자 및 그 제조방법을 상세히 설명하면 하기와 같다.Hereinafter, an organic electroluminescent display device having a plurality of sealing layers and a manufacturing method thereof according to the present invention will be described in detail with reference to FIGS. 2 to 5.
먼저 도 2에 도시한 바와 같이, 유리기판(1)위에 양극전극인 투명전극(2)과, 음극분리격벽(3), 발광층인 유기막(4), 음극전극인 캐소드(5)가 순차적으로 형성되어 이루어진 유기 발광층(10)을 증착한다.First, as shown in FIG. 2, the transparent electrode 2 as the anode electrode, the cathode separation partition 3, the organic layer 4 as the light emitting layer, and the cathode 5 as the cathode electrode are sequentially formed on the glass substrate 1. The formed organic light emitting layer 10 is deposited.
그리고 나서 도 3에 도시한 바와 같이, 유기 EL소자의 1차 보호막역할을 하는 무기물층(16)을 상기 유기 발광층(10) 및 유리 기판(substrate)(1)의 상부에 도포건조한다.Then, as shown in FIG. 3, an inorganic material layer 16 serving as a primary protective film of the organic EL device is applied and dried on the organic light emitting layer 10 and the glass substrate 1.
상기 무기물층(16)은 외부에서 발생한 수분이 소자 내부로 유입되는 것을 방지하기 위하여 소수성(HYDORPHOBIC)의 무기물 다공성 미세분말을 유기용매에 분산시킨 용액으로 도포한 후 80℃ 미만에서 건조하여 형성시킨 것이다.The inorganic layer 16 is formed by applying a solution of the inorganic porous fine powder of hydrophobic (HYDORPHOBIC) dispersed in an organic solvent in order to prevent the moisture generated from the outside into the device and dried at less than 80 ℃ .
또한 상기 무기물 다공성 미세분말은 균일한 크기의 기공이 잘 발달되고 비표면적이 높은 다공성 분말로서 높은 이온교환능과 분자 흡착능을 가져야 하는데 기존의 A- type제올라이트와 같은 합성 제올라이트계나 실리카계통의 첨가제를 사용할 수 있다.In addition, the inorganic porous fine powder is a porous powder with a well-developed pore size and a high specific surface area, and should have high ion exchange capacity and molecular adsorption capacity. Synthetic zeolite or silica-based additives such as A-type zeolite can be used. have.
이러한 무기물 다공성 미세분말을 벤젠이나 톨리엔, 실레넨(BTX)등과 같은유기용매에 용해시켜 이루어진 용액으로 유기 EL패널을 구성하는 유리기판(1)위를 도포건조하여 본 발명이 적용되는 상기 무기물층(16)을 구성한다.The inorganic layer to which the present invention is applied by coating and drying the glass substrate 1 constituting the organic EL panel with a solution obtained by dissolving such inorganic porous fine powder in an organic solvent such as benzene, tolyene, and silenene (BTX). Configure 16.
또한 상기 무기물층(16)은 흡습성이 좋은 실리카에어로겔의 표면을 소수성(HYDORPHOBIC)으로 개질한 후 유기용매내에서 용해시켜 이루어진 용액으로 상기 유리기판(1) 및 유기발광층(10)의 상부에 도포 및 건조하여 형성할 수도 있다.In addition, the inorganic layer 16 is a solution formed by modifying the surface of the silica aerogel with good hygroscopicity (HYDORPHOBIC) and then dissolved in an organic solvent and applied to the upper portion of the glass substrate (1) and the organic light emitting layer (10) It may be formed by drying.
상기 실리카 에어로겔은 무기 다공성 고체로서 기체건조 공정에 사용되는 흡착제로서 이는 본 발명이 적용되는 흡착제의 일예에 불과하며 이외에도 황산스트론 티윰이나 보오크 사이트, 알루미나와 같이 기공이 많고, 내부 표면적이 넓으며, 흡착되는 물질과 반응성이 없는 다양한 흡착제들을 본 발명이 적용되는 공정특성에 따라 달리 사용할 수 있다.The silica airgel is an inorganic porous solid, which is an adsorbent used in the gas drying process, which is just one example of the adsorbent to which the present invention is applied. In addition, the silica airgel has a lot of pores, such as strontium sulfate, bauxite, and alumina, and has a large internal surface area. Various adsorbents that are not reactive with the adsorbed material may be used differently depending on the process characteristics to which the present invention is applied.
상기와 같이 외부로부터의 수분 유입을 방지하기 위한 기존의 캡슐밀봉(Encapsulation)층(6)을 상기 무기물층(16)으로 대체함으로써 종래 유기패널상에서 발생한 유리기판과 캡슐의 밀착성 및 봉함제 도포시의 정밀성 문제를 해결하였을 뿐만 아니라, 유기 발광소자의 고온환경에 의한 소자 열화등을 극저의 열전도도를 갖는 무기물 다공성 미세분말을 통해 극복할 수 있다.As described above, by replacing the existing encapsulation layer 6 with the inorganic layer 16 to prevent the inflow of moisture from the outside, the adhesion between the glass substrate and the capsule generated on the conventional organic panel and the application of the sealant In addition to solving the precision problem, it is possible to overcome the deterioration of the device due to the high temperature environment of the organic light emitting device through the inorganic porous fine powder having extremely low thermal conductivity.
다음에는 도 4 에 도시한 바와 같이 상기 무기물층위에 산소 및 수분 흡습을 위한 흡습층(17)을 증착한다.Next, as shown in FIG. 4, a moisture absorbing layer 17 for absorbing oxygen and moisture is deposited on the inorganic layer.
도 4 는 유기 발광층(10) 및 유기물에서 발생되는 산소 및 수분의 흡착을 위하여 상기 무기물층(16)위에 흡습층(17)을 증착하는 공정을 보인 단면도로서 흡습제로는 바륨 옥시드나 실리카겔, 염화구리화합물에서 일산화탄소가 흡착된 포화탄소와 같은 흡습제등이 사용될 수 있을 것이다.4 is a cross-sectional view illustrating a process of depositing a moisture absorbing layer 17 on the inorganic layer 16 to adsorb oxygen and moisture generated from the organic light emitting layer 10 and the organic material. Examples of the absorbent include barium oxide, silica gel, and copper chloride. In the compound, an absorbent such as saturated carbon to which carbon monoxide is adsorbed may be used.
이러한 산소 및 수분 흡습을 위한 흡습층 형성공정이 종료되면 소자를 외부로부터 차단하기 위하여 상기 흡습층(17)위에 불활성화 보호막을 입히는 공정으로 진행한다.When the moisture absorption layer forming process for absorbing oxygen and moisture is finished, the process proceeds to a process of applying an inert protective film on the moisture absorption layer 17 to block the device from the outside.
도 5 는 유기 EL소자를 외부로부터 완전히 차단하기 위하여 상기 흡습층(17)위에 페시베이션층(불활성화 보호막)(18)으로 봉함하는 단계로서, 상기 페시베이션층(18)은 유기 EL을 구성하는 디바이스들을 수분이나 이온등의 오염에 대하여 불활성화시킴으로써 각 파라미터의 드리프트등을 방지할 수 있도록 한 것이다.FIG. 5 is a step of sealing an organic EL element with a passivation layer (deactivation protective film) 18 on the moisture absorption layer 17 to completely block the external from the outside, wherein the passivation layer 18 constitutes an organic EL. By inactivating the devices against contamination such as moisture or ions, drift of each parameter can be prevented.
상기 페시베이션층(18)을 형성하는 유리질 재료로는 실리콘 산화막보다 조직이 치밀하고 경도가 높아 일반적으로 반도체 표면의 최종 보호막으로 주로 사용되는 실리콘나이트라이드(SiNx, x는 1, 2, 3....의 정수임)등의 사용이 가능하다.As the glassy material for forming the passivation layer 18, the silicon nitride film has a finer structure and higher hardness than the silicon oxide film, and is generally used as a final protective film on the semiconductor surface (SiNx, where x is 1, 2, and 3.). Is an integer of ..).
상기 실리콘 나이트라이드(SiNx)는 SiH4와NH3를 사용하여 약 400℃이하에서 플라즈마 화학 증착법을 통해 상기 흡습층(17)위에 증착된다. 즉 상기 페시베이션층(18)은 하부의 흡습층(17)이 포함된 유기 EL패널상의 전도층들과 연결하기 위하여 상기 페시베이션층(18)을 구성하는 절연물(여기서는 실리콘 나이트라이드)에 다공을 만들어 상기 흡습층(17)에 접촉시킨다.The silicon nitride (SiNx) is deposited on the moisture absorbing layer 17 by plasma chemical vapor deposition at about 400 ° C. or less using SiH 4 and NH 3 . That is, the passivation layer 18 is porous to the insulator (here, silicon nitride) constituting the passivation layer 18 in order to connect with conductive layers on the organic EL panel including the lower moisture absorption layer 17. And make contact with the moisture absorbing layer 17.
이러한 상기 플라즈마 화학 진공 증착법은 상기 페시베이션층(18)을 흡습층(17)위에 증착하는 방법의 일예에 불과하며, 다양한 화학 기상증착법(CVD)이나 진공 증착법이 상기 무기물층(16)에 적용되는 소수성(HYDORPHOBIC)/ 다공성 무기물이나 바륨옥시드와 같은 흡습제에 따라 달리 적용될 수 있을 것이다.The plasma chemical vacuum deposition method is just one example of a method of depositing the passivation layer 18 on the moisture absorption layer 17, and various chemical vapor deposition (CVD) or vacuum deposition methods are applied to the inorganic layer 16. Hydrophobic (HYDORPHOBIC) / may be applied differently depending on the absorbents such as porous minerals or barium oxide.
또한 전술한 공정방법외에도 상기 페시베이션층(18)은 실리카에어로겔을 소수성(HYDORPHOBIC)으로 표면개질(SURFACE MODIFICATION)한 후 톨루엔이나 벤젠등과 같은 유기용매내에서 분쇄 및 분산을 하여 제조된 용액을 흡습층(17)위에 도포하여 형성될 수 도 있을 것이다.In addition to the above-described process method, the passivation layer 18 is a hydrophobic (HYRFRPHOBIC) surface modification (SURFACE MODIFICATION) of the silica air gel and then pulverized and dispersed in an organic solvent such as toluene or benzene to absorb moisture It may be formed by applying over layer 17.
또한 상기와 같은 고온의 화학 기상 증착법(CVD)이 유기EL패널상에서 응용될 수 있는 것은 도 3 에 도시한 바와 같이 유리기판(1) 및 유기발광층(10)위에 다공성 무기물을 도포하여 소자내에서 발생되는 열전도도를 현저히 낮춤으로써 가능해진 것으로, 이는 보다 치밀한 소자의 격리 및 보호를 가능하게 하는 효과를 부가적으로 발생시킨다.In addition, the high-temperature chemical vapor deposition (CVD) may be applied on an organic EL panel, as shown in FIG. 3, by applying a porous inorganic material on the glass substrate 1 and the organic light emitting layer 10 to generate the same in the device. This has been made possible by significantly lowering the thermal conductivity, which additionally has the effect of enabling isolation and protection of more dense devices.
이상에서 상세히 설명한 바와 같이 본 발명에 따른 복수의 밀봉층을 가지는 유기 전계발광 표시소자 및 그 제조방법은 밀봉제의 접착성 문제로 인한 SEALING FAIL이 사라지고 고온공정이 필요한 화학 진공 증착등과 같은 방법의 채용이 다공성 무기물층의 채택으로 인하여 가능해져 종래보다 치밀한 소자의 격리 및 보호가 가능해질 수 있는 효과가 있다.As described in detail above, the organic electroluminescent display device having the plurality of sealing layers and the method of manufacturing the same according to the present invention have a method such as chemical vacuum deposition, in which sealing seals disappear due to adhesive problems of the sealant and high temperature processes are required. Adoption is possible due to the adoption of a porous inorganic layer has the effect that it is possible to isolate and protect the more dense device than the conventional.
본 발명은 기재된 구체적인 예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the invention has been described in detail only with respect to the specific examples described, it will be apparent to those skilled in the art that various modifications and variations are possible within the spirit of the invention, and such modifications and variations belong to the appended claims.
Claims (5)
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030096517A (en) * | 2002-06-12 | 2003-12-31 | 주식회사 엘리아테크 | An organic EL device |
| KR100428447B1 (en) * | 2001-06-07 | 2004-04-27 | 주식회사 엘리아테크 | An organic EL panel capable of preventing infiltration of oxygen or moisture and manufacturing method therefor |
| KR101009413B1 (en) * | 2003-12-09 | 2011-01-19 | 삼성모바일디스플레이주식회사 | Organic electroluminescence device and manufacturing method thereof |
| US8686444B2 (en) | 2009-11-25 | 2014-04-01 | Samsung Display Co., Ltd. | Organic light emitting device and method of manufacturing the same |
| KR101420332B1 (en) * | 2012-11-14 | 2014-07-16 | 삼성디스플레이 주식회사 | Organic light emitting display apparatus |
| US9070889B2 (en) | 2011-04-11 | 2015-06-30 | Samsung Display Co., Ltd. | OLED display having organic and inorganic encapsulation layers, and manufacturing method thereof |
| US9257674B2 (en) | 2011-04-05 | 2016-02-09 | Samsung Display Co., Ltd. | Organic light emitting diode display and manufacturing method thereof |
| KR20210151544A (en) * | 2020-06-05 | 2021-12-14 | 한화솔루션 주식회사 | Solar cell with improved stability against moisture and long-term stability |
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| US5264714A (en) * | 1989-06-23 | 1993-11-23 | Sharp Kabushiki Kaisha | Thin-film electroluminescence device |
| KR100266532B1 (en) * | 1997-02-03 | 2000-09-15 | 가네꼬 히사시 | Organic electroluminescent device |
| JP3817081B2 (en) * | 1999-01-29 | 2006-08-30 | パイオニア株式会社 | Manufacturing method of organic EL element |
| KR100590244B1 (en) * | 2000-08-17 | 2006-06-15 | 삼성에스디아이 주식회사 | Organic electro luminescent device assembly and method for assembling thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100428447B1 (en) * | 2001-06-07 | 2004-04-27 | 주식회사 엘리아테크 | An organic EL panel capable of preventing infiltration of oxygen or moisture and manufacturing method therefor |
| KR20030096517A (en) * | 2002-06-12 | 2003-12-31 | 주식회사 엘리아테크 | An organic EL device |
| KR101009413B1 (en) * | 2003-12-09 | 2011-01-19 | 삼성모바일디스플레이주식회사 | Organic electroluminescence device and manufacturing method thereof |
| US8686444B2 (en) | 2009-11-25 | 2014-04-01 | Samsung Display Co., Ltd. | Organic light emitting device and method of manufacturing the same |
| US9257674B2 (en) | 2011-04-05 | 2016-02-09 | Samsung Display Co., Ltd. | Organic light emitting diode display and manufacturing method thereof |
| US9070889B2 (en) | 2011-04-11 | 2015-06-30 | Samsung Display Co., Ltd. | OLED display having organic and inorganic encapsulation layers, and manufacturing method thereof |
| KR101420332B1 (en) * | 2012-11-14 | 2014-07-16 | 삼성디스플레이 주식회사 | Organic light emitting display apparatus |
| US9252388B2 (en) | 2012-11-14 | 2016-02-02 | Samsung Display Co., Ltd. | Organic light emitting diode (OLED) display |
| KR20210151544A (en) * | 2020-06-05 | 2021-12-14 | 한화솔루션 주식회사 | Solar cell with improved stability against moisture and long-term stability |
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