KR20020077599A - Arc welding wire - Google Patents

Abstract

PURPOSE: An uncovered wire is provided which improves feedability by forming minute pores on the surface of the uncovered wire so that distribution density of the minute pores is controlled to 100 to 600 pores/cm¬2. CONSTITUTION: The solid wire for arc welding is characterized in that minute pores are formed on the surface of the solid wire in distribution density of 100 to 600 pores/cm¬2. In a method for forming minute pores on the surface of the solid wire for arc welding, the method is characterized in that the solid wire passes through one or more pairs of changgu shaped rollers(1) on the surface of a body part(5) on which minute irregularities(2) are formed, and on a circumference part of both sides of which screw threads(4) are formed so that the rollers(1) are rotated with being engaged with each other by the screw threads(4), wherein the rotating pairs of changgu shaped rollers(1) are combination of two pairs of rollers which are spaced apart from each other in a certain distance, and rotation shafts of the two pairs of rollers are perpendicular to each other.

Description

Solid wire for arc welding {Arc welding wire}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire used for gas arc welding, and more particularly, to a non-plated wire for gas arc welding, which has been subjected to a surface treatment in order to improve wire feeding properties.

In recent years, as welding is semi-automated or automated, the demand for wires for gas arc welding is rapidly increasing, and is widely used in steel, automobile, shipbuilding, construction materials industries, and the like. Thus, copper plating is given to the surface of the gas arc welding wire used in large quantities. Since the purpose of performing such copper plating is to facilitate the energization during arc welding, the copper plating layer has been recognized as necessary. However, the following problems have been steadily raised due to the formation of a copper plating layer on the wire surface.

First, when the copper plating layer is formed on the surface of the wire and then drawn, a portion of the copper plating layer is dropped to generate minute copper, and the generated minute copper remains in minute uneven portions of the wire surface. The remaining micropowder is removed again from the fine concavo-convex portion of the wire surface as the wire and the inner wall of the tip friction in the welding tip, and the thus removed microcopper remains inside the tip to cause clogging. In addition, the microblocking of the tip causes problems such as the wire feeding ability as well as instability of the welding arc.

In addition, even if the above minute copper powder does not exist, there is a problem that copper plating is easily peeled off due to the characteristics of copper itself. That is, the copper-plated welding wire is dropped by friction with the welding tip, which makes it difficult to achieve a predetermined purpose of improving the electrical conductivity. Since the melting point of copper is as low as 1083 ° C, it is easy to be gasified at high temperature in the welding arc, resulting in many welding fumes. It also has a weakness.

In addition, in order to form a copper plating layer on the surface of the wire to go through the plating process, the plating solution causes a serious problem in terms of the environment and the equipment used in the plating process also contributes to increase the production cost. In order to cope with such environmental regulations, it is advantageous in many aspects to omit the plating process.

In order to solve this drawback, the unplated wire appeared, but this did not solve all the problems easily. In other words, the non-plating wire is relatively unstable compared to the plating wire, the arc becomes unstable during arc welding, thereby increasing the time required for welding, which is a problem that normal welding is difficult.

Accordingly, attempts have been made to improve the supplyability of the non-plated wire by performing various surface treatments on the surface of the non-plated wire.

The present invention has been made to solve the above problems, and an object thereof is to provide a non-plating wire for welding having excellent feeding properties.

Another object of the present invention is to provide a method for producing a non-plating wire for welding having excellent feeding properties.

Still another object of the present invention is to provide an apparatus for manufacturing a non-plating wire for welding having excellent feedability.

Fig. 1A is a schematic diagram showing a roller for applying fine pores used in the present invention.

1B is an exemplary view showing a method of manufacturing an embodiment of the present invention.

2 is a graph showing a welding result of a wire according to the present invention.

3 is a view showing an average fume generation amount of the embodiment of the present invention and the conventional wire.

4 is a view showing the average weld tip clogging generation amount of the embodiment of the present invention and the conventional wire.

The object of the present invention as described above is achieved by the unplated wire formed by forming micropores on the surface of the unplated wire, and having a density of 100 to 600 micropores per 1 cm 2 of the unplated wire.

Hereinafter, the present invention will be described in detail based on the technical spirit described above.

The non-plating wire for welding applied to the present invention will be described with reference to FIGS. 1A and 1B as being characterized by the following surface processing. After the last step of the drawing process, as shown in Figure 1a of the long-rolled roller (1) is given a fine concavo-convex (2) to the body portion 5 as shown in Figure 1b of the unplated wire 10 The micropores 11 are imparted to the surface. The pair of rollers 1 are engaged by the cogwheel threads 4 and rotate to advance the unplated wire 10 to the unplated wire through hole 3. Although the number of roller pairs is not limited, the number of rollers 1 arranged around the unplated wire 10 may be one to two pairs, and when the two pairs of rollers 1 are arranged, each pair of rollers It is preferable to make a 90 degree angle with each other. In addition to the above-described method, there is no limitation on the method of imparting the micropores 11 to the surface of the unplated wire 10. On the other hand, the applicant of the present invention repeated several experiments, the size of the fine concavo-convex (2) imparted to the roller (1) was found to be independent of the supply of the unplated wire, It was shown that the feedability of the unplated wire was affected by the distribution density of the micropores 11 applied to the surface of the unplated wire 10 by the unevenness 2.

Hereinafter, the following examples will be described in more detail with reference to the following examples which affect the supplyability according to the distribution density of the micropores provided on the surface of the unplated wire, but the present invention is not limited thereto. Table 1 shows the specifications of the unplated wire used in the present invention in weight percent, and Table 2 shows the welding workability of the unplated wire provided with micropores according to the present invention, that is, the welding workability of the embodiment and the conventional unplated wire. Welding workability, that is, welding workability of the comparative example.

In addition, the following two methods are generally used for the production of unplated wire, and the unplated wire used in the test of the present invention was prepared by forming micropores in the second method.

The first method is wire rod → pickling or mechanical descaling → fresh → degreasing → winding (finished product). The second method is wire rod → pickling or mechanical scaling → fresh wire → stripping → skin pass → winding (finished product). )

C Si Mn P S Cu Fe 0.06 0.86 1.55 0.016 0.011 0.25 Balance

division Fine pore diameter (mmφ) Micropore Density (pieces / ㎠) Metal blockage in the tip (mg / 100㎏) Copper fume generation amount (mg / min) Spatter number of 1mm or more (piece / 100㎠) Oscillation width (A) of welding medium current Bead meandering Comparative example One 1.0 30 8 0 38 20 Trace occurrence Comparative example 2 60 9 0 27 18 Trace occurrence Comparative example 3 80 6 0 19 14 Trace occurrence Example 4 100 8 0 11 11 none Comparative example 5 0.5 30 6 0 50 28 Slightly Comparative example 6 50 5 0 38 25 Trace occurrence Comparative example 7 80 8 0 30 21 Trace occurrence Example 8 100 7 0 11 11 none Example 9 300 7 0 11 12 none Example 10 390 6 0 12 11 none Comparative example 11 0.35 40 8 0 70 37 Large quantities Comparative example 12 60 6 0 40 32 Slightly Comparative example 13 85 8 0 30 28 Trace occurrence Example 14 100 6 0 12 11 none Example 15 400 6 0 11 12 none Example 16 500 8 0 11 11 none Example 17 600 8 0 12 11 none Comparative example 18 620 9 0 29 18 Trace occurrence Comparative example 19 700 8 0 44 35 Slightly Comparative example 20 800 6 0 79 50 Large quantities Comparative example 21 0.25 30 7 0 90 52 Maximum occurrence Comparative example 22 50 7 0 70 40 Large quantities Comparative example 23 80 6 0 39 35 Slightly Example 24 100 8 0 11 12 none Example 25 480 8 0 12 11 none Example 26 600 6 0 11 11 none Comparative example 27 620 5 0 38 25 Trace occurrence Comparative example 28 750 6 0 82 59 Large quantities Comparative example 29 800 6 0 110 72 Maximum occurrence Comparative example 30 830 8 0 125 79 Maximum occurrence Copper plated wire 31 - - 42 6.8 12 14 none

Referring to Table 2, in Examples 4, 8, 9, 10, 14, 15, 16, 17, 24, 25, and 26, the amount of clogging of the metal powder in the welding tip was small, and the amount of current consumed for arc generation during welding was low. The change in vibration width was small and there was no problem in meandering of beads. The above embodiments are all provided with micropores on the surface of the unplated wire using the roller with the unevenness according to the present invention, the size of the micropores are 1.0, 0.5, 0.35 and 0.25mmφ, respectively, but the density of the micropores Are embodiments controlled to 100 to 600 / cm 2. On the other hand, the comparative example was given a fine hole on the surface of the non-plated wire using a roller having the same unevenness as the Example to the unplated wire of the same specification as the Example, but the density of the fine hole is outside the scope of the present invention As a result, the density control of the fine pores is said to be an important factor that can improve the feedability of the unplated wire. The supplyability of the wire can be evaluated by the vibration width of the current during welding in Table 1, and it can be said that the smaller the vibration width of the current during welding, the better the supplyability of the wire. The correlation between the oscillation width of the electric current during welding and the wire feeding ability is that when the wire feeding ability decreases during welding, a long and short length of arc length occurs and thus the amount of current during welding is continuously changed. By measuring the vibration width of the wire can be evaluated for supplyability. In addition, if the amount of current continuously changes during welding, the amount of spatter generated increases, and if the amount of wire feeding is not constant, the phenomenon of partial shortage of wire occurs, thereby forming a partially thinned bead. This causes meandering of the welding defect.

Figure 2 is a graph so that the above results can be seen at a glance, the formation of meander beads according to the distribution density of micropores regardless of the size of the micropores, the oscillation width of the current during welding and the amount of spatter generated more than 1 mm It can be seen that this is affected. By satisfying the range of the distribution density of the micro-pores proposed by the present invention in the range of 100 to 600 pieces / cm 2, stable supplyability is ensured, and thus, overall welding workability and welding failure are reduced.

On the other hand, when the amount of fume generated during the welding operation of the non-plated wire according to the present invention and the conventional copper plating wire, it was possible to obtain the result as shown in FIG. In other words, when compared with copper plating wire, the amount of fume generated during welding operation was found to be less because it is unplated wire. In addition, after welding 100kg of unplated wire and 100kg of copper plating wire using respective welding tips, the result of comparing the degree of clogging of the welding tip is shown in FIG. 4. 4, it can be seen that the degree of blockage of the unplated wire is significantly reduced compared to the degree of blockage of the copper plated wire.

As described above, the present invention provides fine pores to the surface of the non-plated wire, but controls the distribution density of the fine pores, thereby making it possible to create a pleasant working environment without generating fumes by copper, and also excellent in the unplated wire for welding. As the supplyability is secured, there is a practical effect of improving welding workability and greatly reducing welding defects.

Claims (3)

A welding wire which is not plated, wherein the wire has 100 to 600 micropores per square centimeter of the surface of the unplated wire. In the method for forming micropores on the surface of the welding wire which is not plated, fine concavities and convexities (2) are formed on the surface of the trunk portion (5) and are formed by the threads (4) formed on the circumferential portions on both sides. A method for forming micropores in a non-plated welding wire, characterized in that the wire (10) is passed through at least one pair of long rollers (1) rotated in engagement with each other. The method of claim 2, wherein the pair of long-rolled rollers rotating in a pair is a combination of the two pairs of rollers spaced at a predetermined distance, the rotation axis of the two pairs of rollers of the non-plated welding wire, characterized in that perpendicular to each other Micropore formation method.