KR20020039081A - Method for manufacturing memory module device - Google Patents
Method for manufacturing memory module device Download PDFInfo
- Publication number
- KR20020039081A KR20020039081A KR1020000068980A KR20000068980A KR20020039081A KR 20020039081 A KR20020039081 A KR 20020039081A KR 1020000068980 A KR1020000068980 A KR 1020000068980A KR 20000068980 A KR20000068980 A KR 20000068980A KR 20020039081 A KR20020039081 A KR 20020039081A
- Authority
- KR
- South Korea
- Prior art keywords
- spring contact
- contact pin
- circuit board
- printed circuit
- memory module
- Prior art date
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
본 발명은 메모리 모듈의 제조방법에 관한 것으로, 보다 구체적으로는, 스프링 콘택 핀을 구비하는 패키지를 이용하여 인쇄회로 기판상에 실장하는 메모리 모듈의 제조방법에 관한 것이다.The present invention relates to a manufacturing method of a memory module, and more particularly, to a manufacturing method of a memory module mounted on a printed circuit board using a package having a spring contact pin.
전기·전자 제품의 고성능화가 진행됨에 따라, 반도체 칩을 탑재하고 있는 패키지의 형태가 다양화되고 있고, 이에 대한 연구도 활발하게 진행되고 있다. 한 예로, 외부 접속 단자로서 스프링 콘택 핀을 이용한 패키지가 주목되고 있는데, 이것은 인쇄회로기판(Printed Circuit Board)과의 전기적 접속이 스프링 콘택 핀에 의해 이루어지는 바, 전기접 접속이 용이하고, 특히, 리드(lead)를 이용하는 전형적인 전기적 접속 방법에 비해서 상대적으로 짧은 상호 연결 길이를 제공하는 것에 의해 전기적 성능을 개선시킬 수 있기 때문이다.As the performance of electric and electronic products is improved, the form of a package on which semiconductor chips are mounted is diversified, and research on this is being actively conducted. As an example, a package using a spring contact pin as an external connection terminal has been noted. This is because electrical contact with a printed circuit board is made by a spring contact pin. This is because the electrical performance can be improved by providing a relatively short interconnect length compared to a typical electrical connection method using leads.
도 1a 및 도 1b는 종래의 스프링 콘택 핀 제조 방법 및 패키지와 인쇄회로 기판과의 실장방법을 설명하기 위한 단면도이다.1A and 1B are cross-sectional views illustrating a conventional spring contact pin manufacturing method and a mounting method of a package and a printed circuit board.
도 1a을 참조하면, 반도체 칩(1)을 구비하는 패키지(도시되지 않음)에 있어서, 상기 반도체 칩에 존재하는 복수 개의 패드부(2) 상부에 와이어 본딩 장비를 이용하여 스프링 콘택핀(3)을 형성한다. 상기 스프링 콘택핀(3)은 Au(금) 와이어로 형성되고, 스프링 콘택핀에 강도, 탄성 및 전도성, 내부식성을 갖게하기 위해 니켈/금 플레이팅을 실시한다.Referring to FIG. 1A, in a package (not shown) including a semiconductor chip 1, a spring contact pin 3 is formed on a plurality of pads 2 existing in the semiconductor chip by using wire bonding equipment. To form. The spring contact pin 3 is formed of Au (gold) wire, and nickel / gold plating is performed to give the spring contact pin strength, elasticity, conductivity, and corrosion resistance.
그런다음, 도 1b를 참조하면, 상기와 같이 형성된 반도체 칩(1)을 구비하는 패키지를 인쇄회로 기판에 장착하기 위해 인쇄회로 기판(4)의 패드부(5)에 솔더 페이스트(Solder Paste, 6)를 프린트한다. 그런다음, 상기 패키지의 스프링 콘택핀(3)과 솔더 페이스터가 프린트된 인쇄회로 기판(4)의 패드부(5)를 얼라인하여 리플로우함으로써 메모리 모듈을 형성한다.Next, referring to FIG. 1B, in order to mount the package including the semiconductor chip 1 formed as described above on the printed circuit board, solder paste 6 may be applied to the pad part 5 of the printed circuit board 4. )). Then, the memory module is formed by aligning and reflowing the pad contact portion 5 of the printed circuit board 4 on which the spring contact pins 3 and the solder paste of the package are printed.
그러나, 상기와 같은 종래의 메모리 모듈 형성방법은 다음과 같은 문제점이 있다.However, the conventional method of forming a memory module as described above has the following problems.
상기 스프링 콘택핀을 이용한 인쇄회로 기판 패드부와의 콘택시 상기 스프링 콘택핀의 검사방법이 용이하지 않다, 또한, 스프링 콘택핀만으로는 패키지를 인쇄회로 기판에 장착할 때 셀프 얼라인이 어려운 단점이 있다.The method of inspecting the spring contact pins is not easy when contacting the pad portion of the printed circuit board using the spring contact pins. Also, the spring contact pins alone have difficulty in self-alignment when the package is mounted on the printed circuit board. .
따라서, 본 발명은 상기와 같은 문제점을 해결하기 위해 안출된 것으로, 상기 스프링 콘택핀에 솔더 볼을 형성하여 검사 및 셀프 얼라인 향상 방법을 제공하는 데에 그 목적이 있다.Accordingly, an object of the present invention is to provide a method for improving inspection and self-alignment by forming solder balls on the spring contact pins.
도 1a 내지 도 1b는 종래의 스프링 콘택 핀 제조 방법 및 패키지와 인쇄회로 기판과의 실장방법을 설명하기 위한 단면도.1A to 1B are cross-sectional views illustrating a conventional spring contact pin manufacturing method and a mounting method of a package and a printed circuit board.
도 2a 내지 도 2e는 본 발명의 메모리 모듈장치 제조방법을 설명하기 위한 단면도.2A to 2E are cross-sectional views illustrating a method of manufacturing a memory module device of the present invention.
* 도면의 주요부분에 대한 부호설명 ** Explanation of Signs of Major Parts of Drawings *
11 : 반도체 칩 12, 17 : 패드부11 semiconductor chip 12, 17 pad portion
13 : 스프링 콘택 핀 14 : 납조13: spring contact pin 14: solder
15 : 솔더 볼 16 : 인쇄회로 기판15 solder ball 16 printed circuit board
18 : 플럭스18 flux
상기와 같은 목적을 달성하기 위하여, 본 발명은, 반도체 칩이 구비된 패키지를 인쇄회로 기판에 장착하는 메모리 모듈 제조방법에 있어서, 상기 반도체 칩상의 복수 개의 패드부에 스프링 콘택 핀을 형성하는 단계; 상기 패드부 상의 스프링 콘택 핀을 도금하는 단계; 상기 스프링 콘택 핀을 납조에 소정부분 삽입하여 상기 스프링 콘택 핀 끝단에 솔더 볼을 형성하는 단계; 상기 인쇄회로 기판 일면에 플럭스를 프린트하는 단계; 및 상기 스프링 콘택 핀이 형성된 칩을 구비하는 패키지를 인쇄회로 기판에 장착하는 단계를 포함하여 구성하는 것을 특징으로 한다.In order to achieve the above object, the present invention, a memory module manufacturing method for mounting a package equipped with a semiconductor chip on a printed circuit board, comprising the steps of: forming a spring contact pin on the plurality of pads on the semiconductor chip; Plating a spring contact pin on the pad portion; Inserting a portion of the spring contact pin into a solder bath to form a solder ball at an end of the spring contact pin; Printing a flux on one surface of the printed circuit board; And mounting a package including a chip having the spring contact pin formed thereon to a printed circuit board.
상기 스프링 콘택 핀의 도금은 니켈/금 플레이팅으로 실시하여 강도, 탄성, 전도성 및 내부식성을 향상시킬 수 있다.Plating of the spring contact pins may be performed by nickel / gold plating to improve strength, elasticity, conductivity, and corrosion resistance.
또한, 상기 솔더 볼 형성시 상기 스프링 콘택 핀의 끝단이 상기 납조에 0.2mm 정도 삽입되도록 하여 솔더 볼을 형성한다.In addition, when the solder ball is formed, an end of the spring contact pin is inserted into the lead bath by about 0.2 mm to form a solder ball.
(실시예)(Example)
이하, 첨부된 도면을 참조하여 본 발명의 메모리 모듈 형성방법에 대한 바람직한 실시예를 상세히 설명한다.Hereinafter, exemplary embodiments of a method of forming a memory module of the present invention will be described in detail with reference to the accompanying drawings.
도 2a 내지 도 2f는 본 발명의 스프링 콘택핀 제조 방법 및 패키지와 인쇄회로 기판과의 실장으로 메모리 모듈 형성을 설명하기 위한 단면도이다.2A to 2F are cross-sectional views illustrating a method of manufacturing a spring contact pin and mounting a package and a printed circuit board of the present invention to form a memory module.
먼저, 도 2a를 참조하면, 반도체 칩(11)을 구비하는 패키지(도시되지 않음)에 있어서, 상기 반도체 칩에 존재하는 복수 개의 패드부(12) 상부에 와이어 본딩 장비를 이용하여 스프링 콘택핀(13)을 형성한다. 상기 스프링 콘택핀(13)은 Au(금) 와이어로 형성되는데, 스프링 콘택핀에 강도, 탄성 및 전도성, 내부식성을 갖게하기 위하여 니켈/금 플레이팅을 실시한다.First, referring to FIG. 2A, in a package including a semiconductor chip 11 (not shown), a spring contact pin may be formed on a plurality of pads 12 in the semiconductor chip by using wire bonding equipment. 13). The spring contact pins 13 are formed of Au (gold) wire, and nickel / gold plating is performed to give the spring contact pins strength, elasticity, conductivity, and corrosion resistance.
그런다음, 도 2b 및 도 2c를 참조하면, 상기 스피링 핀(13)이 형성된 패키지를 납조(14)에 소정부분 삽입하여 스프링 콘택 핀 끝단에 솔더 볼(15)을 형성한다. 이 때, 솔더 볼 형성시 상기 스프링 콘택 핀의 끝단이 납조(14)에 0.2mm 정도 삽입되도록 하여 솔더 볼(15)을 형성한다. 이러한 솔더 볼 형성으로 인하여 이후 인쇄회로 기판에 패키지 장착시, 솔더 볼의 검사가 용이하고 기판 패드부와의 얼라인이 용이하다.Then, referring to FIGS. 2B and 2C, a solder ball 15 is formed at the end of the spring contact pin by inserting a predetermined portion of the package in which the spring pin 13 is formed into the lead bath 14. At this time, when forming the solder ball, the end of the spring contact pin is inserted into the lead tank 14 by about 0.2mm to form the solder ball 15. Due to the formation of the solder balls, when the package is mounted on the printed circuit board, the inspection of the solder balls is easy and alignment with the substrate pad part is easy.
다음 도 2d를 참조하면, 인쇄회로 기판(16)의 복수 개의 소정부분 이격된 패드부(17)에 이후 솔더링이 용이하도록 플럭스(18)를 프린트한다. 그리고나서 도 2e에 도시된 바와같이, 상기 프린트된 플럭스(18)에 스프링 콘택핀에 형성된 솔더볼(15)이 일치하도록 얼라인한다. 이어서, 상기 얼라인된 패키지와 인쇄회로기판(16)을 리플로우 공정을 수행하여 솔더링함으로써 메모리 모듈을 형성한다.Next, referring to FIG. 2D, the flux 18 is printed on the pad portions 17 spaced apart from the predetermined portions of the printed circuit board 16 to facilitate soldering. Then, as shown in FIG. 2E, the printed flux 18 is aligned so that the solder balls 15 formed on the spring contact pins coincide with each other. Subsequently, the aligned package and the printed circuit board 16 are soldered by performing a reflow process to form a memory module.
이상에서 자세히 설명한 바와같이, 상기 스프링 콘택핀 끝단에 솔더 볼을 형성하여 인쇄회로 기판에 패키지 장착시 검사가 용이하고 셀프 얼라인이 용이하다.As described above in detail, solder balls are formed at the ends of the spring contact pins to facilitate inspection and self-alignment when the package is mounted on the printed circuit board.
또한, 솔더 볼의 형성으로 인하여 인쇄회로 기판 패드부에 솔더 페이스트(Solder Paste)를 사용하지 않고 플럭스 만으로 패키지를 장착할 수 있다.In addition, due to the formation of solder balls, the package may be mounted using only flux without using solder paste on the pad portion of the printed circuit board.
따라서, 스프링 콘택핀에 솔더 볼을 형성함으로써, 신뢰성 확보 및 비용절감의 효과가 발생한다.Therefore, by forming solder balls on the spring contact pins, reliability and cost reduction effects occur.
기타, 본 발명의 요지를 벗어나지 않는 범위내에서 다양하게 변경하여 실시할 수 있다.In addition, it can implement in various changes within the range which does not deviate from the summary of this invention.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000068980A KR20020039081A (en) | 2000-11-20 | 2000-11-20 | Method for manufacturing memory module device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000068980A KR20020039081A (en) | 2000-11-20 | 2000-11-20 | Method for manufacturing memory module device |
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| Publication Number | Publication Date |
|---|---|
| KR20020039081A true KR20020039081A (en) | 2002-05-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000068980A KR20020039081A (en) | 2000-11-20 | 2000-11-20 | Method for manufacturing memory module device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7411763B2 (en) * | 2003-05-12 | 2008-08-12 | Sae Magnetics (H.K.) Ltd. | Electrical connection between a suspension flexure cable and a head stack assembly flexible circuit |
-
2000
- 2000-11-20 KR KR1020000068980A patent/KR20020039081A/en not_active Application Discontinuation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7411763B2 (en) * | 2003-05-12 | 2008-08-12 | Sae Magnetics (H.K.) Ltd. | Electrical connection between a suspension flexure cable and a head stack assembly flexible circuit |
| US7525768B2 (en) * | 2003-05-12 | 2009-04-28 | Sae Magnetics (H.K.) Ltd. | Electrical connection between a suspension flexure cable and a head stack assembly flexible circuit |
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