KR20020035737A - Wafer Carrier, Substrate Processing Device, Substrate Processing System, Substrate Processing Method and Semiconductor Device - Google Patents

Abstract

PURPOSE: To obtain a highly reliable substrate processing system, by suppressing dust from being generated from its wafer carrier. CONSTITUTION: In the substrate processing system, by applying a negative pressure to the inside of a carrier door 2 of a wafer carrier through a hole 23 provided in the carrier door 2 or through latch-key holes 5, foreign matters are so sucked as to prevent them from going out from latch opening portions to the external.

Description

Wafer Carrier, Substrate Processing System, Substrate Processing System, Substrate Processing System, Substrate Processing Method and Semiconductor Device

This invention relates to the wafer carrier which accommodates and carries a board | substrate, the substrate processing apparatus using this wafer carrier in combination, the substrate processing system and substrate processing method which combined these.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hermetically sealed wafer carrier for wafer storage during semiconductor manufacturing and a load port mechanism for opening and closing the same.

Fig. 10 is a perspective view for explaining a conventional side door integrated wafer carrier (substrate storage jig) used in semiconductor manufacturing. This is described, for example, in the catalog manufactured by FLUOROWARE (Fluoroware). This type is SEMI standard and is called FOUP. FOUP stands for Front Opening Unified Pod. Detailed dimensions and other information are described in SEMI standards E57, E1.9, E47.1 and the like.

In Fig. 10, P100 represents a wafer carrier, P1 represents a carrier shell of the wafer carrier, and P2 represents a carrier door in which part of the surface is cut out. Unlike the conventionally used open cassette (SEMI standard E1.9 other 8 inches or older), the wafer carrier P100 holds the wafer in a sealed space to protect the wafer from foreign matter or chemical contamination in the air. .

The carrier shell 1 is provided with a wafer tooth P18 for seating the wafer therein. In addition, the carrier door P2 has a latch key hole P5 for capturing it, a sealing material (packing) P8 for maintaining hermeticity with the carrier shell 1, and a door clamping mechanism for engaging the carrier shell. (Stopper mechanism) P9, wafer pressing retainer P10, and the like.

In such a wafer carrier P100, the door clamping mechanism P9 (stopper mechanism) is required to fix the carrier door P2 to the carrier shell P1. Therefore, the wafer carrier P100 has a complicated structure and a hole in the door needs to be drilled. there was. Moreover, the hole to be clamped, the thickness part, and the sealing part for door fixing also needed to the carrier shell P1 side.

On the other hand, in order to stop such a wafer carrier in the part of a substrate processing apparatus (semiconductor manufacturing apparatus), open and close a carrier door, and load and unload a wafer, a load port having a FIMS surface defined in the SEMI standard is required. Here, FIMS is an abbreviation of front opening interface mechanical standard.

The load port has a wall surface (housing surface) for separating the mini environment in the substrate processing apparatus from the outside, a kinematic pin for positioning the wafer carrier on the load port base, and a substrate processing at the same time after the door opening operation and the door opening operation. It has a load port door (FIMS door) that is blown into the mini environment of the device. Among the wall surfaces of the substrate processing apparatus of the load port which stops the wafer carrier, the surface which contacts with the sealing surface (FOUP sealing surface) of a carrier shell and hold | maintains airtightness is called FIMS sealing surface.

In actual production sites, a plurality of types of substrate processing apparatus (hence, a plurality of load ports) and a plurality of types of wafer carriers are used in combination. Therefore, the dimensional accuracy required for them must also be high, and minute deformation also has a great influence on the opening and closing reliability of the wafer carrier.

The inventor of the present invention evaluated the wafer carrier and the load port system using the wafer carrier (FOUP) as described above, and as a result, the friction of the opening / closing mechanism inside the carrier door from the opening of the clamping mechanism when opening and closing the carrier door (FIMS door) The foreign matter resulting from this was clarified to adhere to the wafer inside the wafer carrier. The present invention seeks to solve this problem.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, a wafer carrier which solves the problem of foreign matters generated inside the carrier door coming out from the opening of the clamping mechanism, a substrate processing apparatus used in combination with the wafer carrier, An object of the present invention is to obtain a substrate processing system and a substrate processing method, thereby achieving a highly reliable production method with low generation of foreign substances.

In addition, in this specification, the board | substrate accommodation jig | tool including F0UP is called a wafer carrier, the housing part is a carrier shell, and the door is called a carrier door. In addition, on the substrate processing apparatus (semiconductor manufacturing apparatus) side, the table which receives a wafer carrier is called a load port door which introduces a wafer into a substrate processing apparatus including a load port base and a FIMS door. In addition, it will be referred to as a load port including a load port base and a load port door. In addition, it is called a substrate processing system (or load port system) including the substrate processing apparatus which has a load port, and a wafer carrier.

1 is an appearance configuration diagram for explaining a carrier shell portion of a wafer carrier according to a first embodiment of the present invention.

Fig. 2 is a diagram showing an inside configuration of a carrier door in the wafer carrier shown in Fig. 1;

Fig. 3 is a diagram explaining a positioning operation by kinematic pins and V grooves in a wafer carrier.

4 is a configuration diagram showing a positional relationship between a wafer and a wafer tooth;

Fig. 5 is a cross-sectional view of the wafer carrier coupled to the load port of the substrate processing apparatus, and illustrating a method of opening and closing the carrier door of the wafer carrier.

6 is a cross-sectional view of one example for explaining vacuum suction of a carrier door from a load port door surface;

Fig. 7 is a sectional view showing an example of the vacuum suction means of the load port door.

8 is a schematic diagram of automatic transfer of a wafer carrier by an OHT unit.

Fig. 9 is a sectional view of another example for explaining vacuum suction of the carrier door from the load port door surface.

Fig. 10 is a perspective view for explaining a conventional horizontal door integrated substrate storage jig (wafer carrier).

<Explanation of symbols for the main parts of the drawings>

100: wafer carrier

200: substrate processing apparatus

1: carrier shell

2: carrier door

3: Mushroom

4: registration pin hole

5: latch key hole

6: manual handle

7: side rail

8: sealing material (packing)

9: door clamping mechanism

9A: Joining Piece

9B: Drive part

10: retainer

11: V groove

12: kinematic pin (reference pin)

13: load port base

14: load port door (FIMS side)

15: latch key

16: load port door opening and closing mechanism

17: wafer

18: wafer tooth

19: OHT

20: hoist mechanism

21: Mini Environment of Substrate Processing Unit

22: vacuum port of the load port door surface

23: carrier door suction hole

24: wall surface (FIMS sealing surface)

25: wafer carrier sealing surface

The wafer carrier according to the invention of claim 1 is provided with a hole in the carrier door so that air inside the door can be sucked from the hole.

A wafer carrier according to the invention of claim 2 includes a housing having an open surface on one surface, and a carrier door fitted to the housing on the open surface, and the housing has a coupling hole on a surface that engages with the carrier door. And the carrier door has a joining portion formed therein and having a coupling piece extending from the inside of the door to the outside when engaging with the housing and engaging with the engagement hole of the housing. The hole part which communicates is formed, and the air in the said cavity can be sucked from this hole part.

A substrate processing apparatus according to a third aspect of the invention is a substrate processing apparatus having a load port door, wherein the inside of the carrier door is formed in the load port door from a hole in a carrier door of a wafer carrier docked to the load port door. The suction means which can suck air is provided.

A substrate processing apparatus according to claim 4 is a substrate processing apparatus having a load port door, wherein the load port door captures and moves a carrier door of a wafer carrier docked to the load port door. And suction means capable of sucking air in the inside of the carrier door in combination with the hole of the carrier door.

In the substrate processing apparatus of Claim 5, the substrate processing apparatus of Claim 4 arrange | positions and suctions the suction pad around the part which the said suction means engages with the hole part of the said carrier door on the surface of the said load port door. It is to form a passage.

A substrate processing system according to claim 6 includes a substrate processing apparatus having a load port including a load port door, and a wafer carrier loaded on the load port and docked with the substrate processing apparatus. In the capturing and moving of the carrier door of the wafer carrier, the load port door is provided with suction means capable of sucking air in the carrier door by engaging with the hole of the carrier door.

A substrate processing method according to the invention of claim 7 includes a suction means provided with a wafer carrier having a carrier door and a substrate processing apparatus having a load port door so as to face the carrier door and the load port door so as to be disposed on the load port door. In this way, the carrier door is captured by the load port door and the opening and closing of the carrier door is performed while sucking air in the carrier door from the hole of the carrier door.

The substrate processing method according to the invention of claim 8 uses the independent hole portion provided in the carrier door or the hole for capturing the carrier door in the method of claim 7 as the hole portion.

The semiconductor device according to the invention of claim 9 is manufactured using the substrate processing system according to claim 6.

The semiconductor device according to the invention of claim 10 is manufactured using the substrate processing method of claim 7 or 8.

EMBODIMENT OF THE INVENTION Below, embodiment of this invention is described with reference to drawings. In addition, the same code | symbol is attached | subjected to the same or equivalent part in drawing, and the description is abbreviate | omitted suitably or abbreviate | omitted.

<First Embodiment>

First, the outline of this first embodiment will be described. In this first embodiment, a hole is provided in the carrier door surface, and the inside of the carrier door is made into negative pressure by vacuum suction from the load port door surface side through this hole. As a result, since foreign matters generated inside the carrier door are removed by vacuum suction, foreign matters generated near the opening of the clamping mechanism do not come out from the opening due to the influence of air flow.

EMBODIMENT OF THE INVENTION Hereinafter, 1st Embodiment of this invention is described in detail with reference to FIGS.

1 is an external perspective view of a wafer carrier according to the present invention, wherein 1 is a carrier shell, 2 is a carrier door 2 in a state where the open surface of the carrier shell 1 is closed, and a wafer carrier 100 is formed by both. ).

The structure of this carrier shell 1 is not particularly different from the conventional one. 3 represents a mushroom, 6 a manual handle, and 7 a side rail.

In the carrier door 2, 4 is a registration pin hole and 5 is a latch key hole, which is the same as the conventional one, but 23 shows a suction hole on the carrier door surface newly established in this embodiment.

Fig. 2 is a perspective view of the carrier door 2 separated from the carrier shell 1, seen from the back side. In Fig. 2, 8 is a sealing material (packing), 9A is a joining piece of the door clamping mechanism, and 10 is a retainer.

The mushroom 3 of the carrier shell 1 is for gripping and hanging by the OHT 19 described later in FIG. In addition, OHT means overhead hoist transfer.

The registration pin hole 4 of the carrier door 2 is for positioning the wafer carrier 100 with the registration pin 12 protruding from the load port base 13 described later in FIG. 5 being inserted. The latch key hole 5 is for opening and closing the carrier door 2 with the latch key 15 (mechanical opening and closing mechanism) described later in FIG. 5 being inserted, and the side rail 7 is a wafer carrier ( It is for carrying out 100).

Moreover, the sealing material 8 (packing) of the carrier door 2 is provided in the surface which the carrier door 2 contacts the carrier shell 1, and is for maintaining the sealing property with the carrier shell 1, The engaging piece 9A of the door clamping mechanism is for engaging the engaging hole (not shown) of the carrier shell 1 to fix the carrier door 2 to the shell 1 in a fitted state, and retainer 10 ) Is for holding a wafer housed therein.

3 is a view for explaining the principle for positioning the wafer carrier 100 on the load port base 13 shown in FIG.

As shown in Fig. 3A, the V-groove 11 in which the kinematic pin 12 (reference pin) provided on the upper surface of the load port base 13 is provided on the bottom surface of the wafer carrier 100. ), The position of the wafer carrier 100 is determined by being fitted into the (V group portion) (not shown in FIG. 1). Fig. 3B is a diagram showing a positioning state by three sets of kinematic pins 12 and V grooves 11.

4 is a view for explaining a state of the wafer accommodated in the carrier shell 1. The wafer tooth 18 is provided inside the carrier shell 1, and the wafer tooth 18 has a shelf structure using convex portions provided on the wall at regular intervals, and the wafer 17 is loaded on the upper surface of the convex portion. . Since the convex portions are provided at regular intervals on the wall surface, the wafers 17 can be stored spaced apart by a plurality of constant intervals.

Fig. 5 is a sectional view showing a state where the wafer carrier is docked at the load port of the substrate processing apparatus. Fig. 6 is an enlarged cross-sectional view showing portions of the load port door and the carrier door. In Fig. 5, the details of the vacuum suction means and the door clamping mechanism inside the carrier door described later in Fig. 6 are omitted for simplicity.

In Fig. 5, 100 is a wafer carrier, 1 is a carrier shell, 2 is a carrier door, 5 is a latch key hole, 9A is an engagement piece of a door clamping mechanism, 11 is a V groove, and 17 is a wafer. 25 shows a wafer carrier sealing surface.

In addition, 200 is a substrate processing apparatus having a load port, 12 is a kinematic pin, 13 is a load port base, 14 is a load port door (a part of the FIMS side of the load port), 15 is a latch key, and 16 is a load port. The door opening and closing mechanism is shown. In addition, 21 shows the mini environment of a substrate processing apparatus, 24 has shown the wall surface (FIMS sealing surface) of a substrate processing apparatus.

A kinematic pin (reference pin) 12 is installed on an upper surface of the load port base 13, and a V groove (V group part) 11 is installed on a bottom surface of the carrier shell 1, and a kinematic pin 12 ) And the V-groove 11 are fitted together to position the wafer carrier 100.

The latch key 15 is installed on the surface of the load port door 14 and the carrier door 2 is inserted into the latch key hole 5 (see Fig. 1) for opening and closing the carrier door 2. It is used to open and close).

The load port door 14 is an inlet for moving the carrier door 2 and the wafer 17 into the substrate processing apparatus 21. The wall surface 24 and the wafer carrier sealing surface 25 of the substrate processing apparatus are provided. In the contacted state, the load port door 14 is moved by the load port door opening and closing mechanism 16, and the carrier door 2 is captured and moved through the load port door 14.

FIG. 6 is an enlarged cross-sectional view of the surrounding of the load port of FIG. In Fig. 6, a cavity is formed inside the carrier door 2, 9 is a door clamping mechanism, 9A is a fitting piece thereof, and 9B is a driving part thereof. The drive part 9B of the door clamping mechanism 9 is driven by the latch key 15 from the load port door 14 side, which causes the engaging piece 9A to extend from the inside to the outside of the carrier door 2. Or retract to engage or release engagement of the engagement piece 9A and the engagement hole 1B of the housing.

22 shows the vacuum suction part provided in the load port door 14, and 23 shows the suction hole provided in the carrier door 2. As shown in FIG.

When the vacuum suction portion 22 of the load port door 14 and the suction hole 23 of the carrier door 2 are combined and vacuum sucked, the inside of the carrier door 2 becomes negative pressure, and the carrier door 2 and Air flows in from the gap of the door clamping mechanism 9 and flows out in the direction of the vacuum suction portion 22 of the load port door 14.

The load port door 14 has a vacuum suction unit 22 as a component and is provided with vacuum suction means coupled thereto.

7 is a sectional view showing an example of the vacuum suction means. In Fig. 7, the load port door 14 moves together with the load port door opening and closing mechanism 16. A suction port 16A is provided in the load port door 14, and the sucked air is loaded into the load port door opening and closing mechanism. It passes through the suction pipe 16B arrange | positioned inside 16, and it reaches | attains the opening-closing valve 16C, and is made to suck | suck to a vacuum pump or a factory exhaust facility again.

Fig. 8 is a schematic view for explaining an automatic conveyance method of the wafer carrier 100 at a production site in which a plurality of substrate processing apparatuses are installed, and the wafer carrier 100 by OHT (Overhead Hoist Transfer) is shown. An automatic conveying mechanism is shown.

In Fig. 8, reference numeral 13 denotes a load port base, 19 denotes an OHT, 20 denotes a hoist mechanism, 21 denotes a substrate processing apparatus, and 100 denotes a wafer carrier.

Referring to Fig. 8, OHT 19 is a representative automatic conveying device of wafer carrier 100 in a bay of a semiconductor factory. Each of the plurality of substrate processing apparatuses 21 arranged side by side is provided with a load port base 13, and is configured such that the wafer carrier 100 conveyed using the hoist mechanism 20 is loaded.

Next, the conveyance method of the wafer carrier 100 is demonstrated. In the semiconductor factory, the wafers 17 subjected to various processes move between the substrate processing apparatuses 21 in a state of being accommodated in the wafer carrier 100. Since the wafer carrier 100 containing the 300 mm diameter wafer 17 has a weight of 8 kg or more, conveyance by human hands is difficult to consider for safety reasons, and an automatic transfer device such as the OHT 19 is used.

In the example of FIG. 8, the wafer carrier 100 containing the wafer 17 to be processed is conveyed to the substrate processing apparatus 21 by the OHT 19 from the stocker provided in the process.

Subsequently, the wafer carrier 100 is lowered onto the load port base 13 of the substrate processing apparatus 21 using the hoist mechanism 20 and mounted at a predetermined position. Subsequently, the V-groove 11 provided on the lower surface of the wafer carrier 100 is guided onto the kinematic pin 12 on the load port base 13 and fixed at a predetermined accommodation position (see FIG. 3).

Subsequently, the hoist mechanism 20 is separated from the wafer carrier 100 to leave the wafer carrier 100 on the load port base 13. Thereafter, the wafer carrier 100 is advanced and docked on the wall surface 24 and the load port door 14 (see FIG. 5) of the substrate processing apparatus. The wafer carrier 100 is advanced so that the carrier door 2 is in contact with the wall surface (FIMS sealing surface of the load port) of the substrate processing apparatus. Here, vacuum suction is started.

Subsequently, by rotating the latch key 15 (see Fig. 5), the engaging piece 9A of the door clamping mechanism 9 of the carrier door 2 is separated from the carrier shell 1, and the carrier door 2 ) To the load port door 14. At the time of the rotation operation of the latch key 15, the mechanical parts of the drive part 9B of the clamping mechanism 9 rub against each other inside the carrier door 2 to generate foreign substances. In addition, the engagement piece 9A of the clamping mechanism 9 rubs against the shell to generate foreign matters in the same manner.

At this time, the suction means provided in the load port door 14 vacuum sucks the inside of the carrier door 2, so that foreign matters generated in the inside of the carrier door 2 are removed together with the suction air and clamped. The foreign matter generated near the engagement piece 9A of the mechanism 9 is sucked into the carrier door 2. As a result, the foreign matter resulting from the door opening and closing operation does not scatter to the outside, and therefore, the wafer 17 is kept in a clean state because it is not attached to the wafer 17 in the shell 1.

Subsequently, the load port door opening / closing mechanism 16 is driven to separate the carrier door 2 from the carrier shell 1 and to move the lower portion in the substrate processing apparatus 21. The wafer 17 is taken out from the front surface of the wafer carrier 100 in a state in which the carrier door 2 is separated, and the wafer 17 is substrated by a wafer transfer robot (not shown) in the substrate processing apparatus 21. It transfers to the processing part (not shown) inside the processing apparatus 21, and performs a necessary process.

Subsequently, after completion of the processing, the processed wafer 17 is returned to the wafer carrier 100 by using a wafer transfer robot. In this way, after performing necessary processing on each of the wafers 17 contained in the wafer carrier 100, the load port door opening and closing mechanism 16 is driven to dock the carrier door 2 with the carrier shell 1. The door clamping mechanism 9 is operated by rotating the latch key 15 to fix the carrier door 2 to the carrier shell 1. At this time, by performing vacuum suction, foreign matters caused by friction can be removed.

Thereafter, the wafer carrier 100 is retracted and moved to the movable loading position. According to the conveyance request, the empty OHT 19 is stopped on the load port base 13 on which the wafer carrier 100, which is the object of the conveyance request, is placed, and the hand of the robot of the hoist mechanism 20 (not shown). ), The mushroom room (3) is sandwiched and raised.

Then, after conveying the wafer carrier 100 to the stocker by OHT 19 and temporarily storing it, the wafer carrier 100 is conveyed to a next process process (for example, an ashing process etc.). By repeating this flow, a desired circuit is formed on the wafer 17.

As described above, in this embodiment, the inside of the carrier door is made into negative pressure by vacuum suction from the load port door face side through the hole provided in the carrier door face. As a result, foreign matters generated in the interior of the carrier door are removed by vacuum suction, while foreign matters generated near the opening of the clamping mechanism are blown into the door from the opening under the influence of the air flow and do not come out. Thereby, it becomes possible to reduce foreign substances adhering on the wafer with the opening / closing operation of the carrier door. Therefore, it is possible to keep the wafer at a high cleanness and to produce an integrated circuit or the like with a high yield.

In the above description, an example in which the OHT 19 is used as the automatic conveying means has been described. However, the present invention is not particularly limited to this. You may use manual conveyance, such as).

<2nd embodiment>

9 is a diagram for explaining the substrate processing system according to the second embodiment, and shows a modification of the first embodiment. In addition, this figure is corresponding to FIG. 6 of 1st Embodiment, and is sectional drawing which expanded and showed the load port periphery in detail.

In FIG. 9, 22 is a vacuum suction part provided in the load port door 14, and the latch key of the carrier door 2 is provided in the position which opposes the hole 5. As shown in FIG. Although not shown in the vacuum suction section 22 of the load port door 14, vacuum suction means are also coupled.

When the vacuum suction portion 22 of the load port door 14 and the latch key hole 5 of the carrier door 2 are combined and vacuum sucked, the inside of the carrier door 2 becomes negative pressure, and the carrier door 2 Air flows in from the gap between the door clamping mechanism 9 and the outflow of the vacuum suction portion 22 of the load port door 14.

As a method of joining the vacuum suction portion 22 and the latch key hole 5 of the load port door 14 for vacuum suction, vacuum suction is performed around the vacuum suction portion 22 on the surface of the load port door 14. Place the pad. For example, an elastic plate-shaped and annular member may be attached to maintain the airtightness between the load port door 14 and the carrier door 2.

As described above, the vacuum suction hole provided on the carrier door surface may be a hole provided exclusively for the purpose as in the first embodiment, or the latch key hole 5 may be used as in the second embodiment. It doesn't matter if you use it for

Also in this embodiment, by suctioning the inside of the carrier door 2 by the suction means provided in the load port door 14, the foreign substance which arose in the inside of the carrier door 2 is removed with suction air, The foreign matter generated near the engagement piece 9A of the clamping mechanism 9 is sucked into the carrier door 2. As a result, the foreign matter caused by the door opening and closing operation does not scatter to the outside and is not attached to the wafer 17 in the shell 1, so that the wafer 17 is kept in a clean state. Therefore, it becomes possible to keep a wafer high. Thereby, production of an integrated circuit etc. can be performed with high yield.

In each of the above embodiments, what is called a wafer carrier corresponds to a FOUP as a horizontal door-integrated substrate storage jig, which is typically defined by the SEMI standard.

In addition, in each said embodiment, what was described as a wafer (substrate) is not specifically limited to the wafer used for a semiconductor device, Comprising: It includes the board | substrate of the wide meaning containing substrates, such as a glass substrate, a magnetic substrate, a resin substrate, etc. .

In addition, it is clear that this invention is not limited to each said embodiment, It can be extended and changed suitably in the range of the technical idea of this invention.

As described above, in the present invention, the inside of the carrier door is made into negative pressure by vacuum suction from the load port door face side through the hole provided on the carrier door face of the wafer carrier or the latch key hole of the wafer carrier. Thereby, foreign matters generated inside the carrier door are removed by vacuum suction, while foreign matters generated near the openings of the clamping mechanism do not come out from the openings under the influence of the air flow. As a result, the wafer can be maintained at a high cleanness, and the integrated circuit and the like can be manufactured at a high yield.

Claims (10)

A wafer carrier is provided in the carrier door of the wafer carrier, and the air in the door can be sucked from this hole. A housing having an open surface on one surface, and a carrier door fitted on the housing on the open surface, the housing having a coupling hole on a surface engaging with the carrier door, and the carrier door having a cavity formed therein; And having a joining piece capable of drawing from the inside of the door to the outside when engaging with the housing and engaging with the engaging hole of the housing, wherein the carrier door forms a hole communicating with the cavity. A wafer carrier characterized by being capable of sucking air in the cavity from the air. A substrate processing apparatus having a load port door, wherein the load port door is provided with suction means capable of sucking air in the carrier from a hole in a carrier door of a wafer carrier docked to the load port door. The substrate processing apparatus made into it. A substrate processing apparatus having a load port door, wherein the load port door is coupled to a hole portion of the carrier door in the load port door in capturing and moving a carrier door of a wafer carrier docked to the load port door. And suction means capable of sucking air inside the carrier door. 5. The substrate processing according to claim 4, wherein a suction pad is disposed on a surface of the load port door so as to form a suction passage around a portion where the suction means engages with a hole of the carrier door. Device. A substrate processing apparatus having a load port including a load port door, and a wafer carrier loaded on the load port and docked to the substrate processing apparatus, wherein the load port door captures a carrier door of the wafer carrier, The substrate processing system according to claim 1, wherein the load port door is provided with suction means capable of sucking air in the carrier door in combination with a hole in the carrier door. A wafer carrier having a carrier door and a substrate processing apparatus having a load port door are docked so that the carrier door and the load port door face each other, and are sucked from the hole of the carrier door by suction means provided in the load port door. A substrate processing method characterized in that the carrier door is captured by the load port door while sucking the air inside the door to open and close the carrier door. 8. The substrate processing method according to claim 7, wherein as the hole portion, an independent hole portion provided in the carrier door or a hole for capturing the carrier door is used. It was manufactured using the substrate processing system of Claim 6. The semiconductor device characterized by the above-mentioned. The semiconductor device manufactured using the substrate processing method of Claim 7 or 8.